CN108861571B - Double-vortex type wafer suction nozzle assembly - Google Patents
Double-vortex type wafer suction nozzle assembly Download PDFInfo
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- CN108861571B CN108861571B CN201810789649.4A CN201810789649A CN108861571B CN 108861571 B CN108861571 B CN 108861571B CN 201810789649 A CN201810789649 A CN 201810789649A CN 108861571 B CN108861571 B CN 108861571B
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- suction nozzle
- nozzle cap
- air blocking
- blocking block
- suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a double-vortex type wafer suction nozzle assembly which comprises a gas blocking block and a suction nozzle cap, wherein the upper surface of the gas blocking block is provided with gas blocking plates distributed in a double-vortex manner, the height of the gas blocking plates is gradually increased from the center to the outside, the surface of the suction nozzle cap is provided with double-vortex type suction slots corresponding to the positions and the sizes of the gas blocking plates, the side wall of the suction nozzle cap is provided with a suction port connected with vacuum pumping equipment, the suction nozzle cap is sleeved above the gas blocking block and forms a negative pressure cavity with a suction nozzle, and the gas blocking block can move up and down along the suction nozzle cap to enable the peripheral gas blocking plates to be gradually clamped into or separated from the suction slots so as to adjust the surface adsorption size of the suction nozzle cap and adapt to the adsorption of wafers with different. The invention adopts a double-vortex type suction nozzle distribution structure, and the size of the adsorption surface is gradually reduced along with the extension of the air blocking plate, so that the adsorption device is suitable for the adsorption of wafers with different sizes.
Description
Technical Field
The present invention relates to a nozzle assembly, and more particularly, to a dual-vortex wafer nozzle assembly.
Background
In the post-packaging process of the semiconductor manufacturing process, a die bonder is often used to bond the wafer, for example, the wafer is lifted up from the adsorption blue film by a thimble to separate the wafer from the blue film, and then a wafer picking manipulator of the die bonder is driven by a driving mechanism to pick up the wafer from the wafer ring by a suction nozzle at the front end of the wafer picking manipulator, and the wafer is placed at a designated position by the rotary transportation of the wafer picking manipulator.
Because present suction nozzle all is single suction nozzle structure, must adsorb to wafer central point at the absorption formula and just can ensure steadily, and do not lead to the wafer to warp, this has increased the absorption degree of difficulty undoubtedly, and the size of wafer has greatly simultaneously, just need change different suction nozzle sizes when different batch processing, and this increases cost and change time undoubtedly, has reduced machining efficiency.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a double-vortex wafer suction nozzle assembly, which adopts a double-vortex suction slot opening distribution structure to match with a double-turbine air blocking plate, and gradually reduces the size of an adsorption surface along with the extension of the air blocking plate so as to adapt to the adsorption of wafers with different sizes.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a two vortex formula wafer suction nozzle subassembly, includes stifled gas piece and suction nozzle cap, wherein stifled gas piece upper surface is equipped with the stifled gas board that is two vortex formula distributions, and the height of stifled gas board is outwards progressively increased by the center, the two vortex formula notch of breathing in that corresponds with stifled gas board position and size is seted up on the suction nozzle cap surface, and has seted up the induction port on the lateral wall and connect evacuation equipment, and the suction nozzle cap suit forms the negative pressure chamber between stifled gas piece top and suction nozzle, and the stifled gas piece can follow the suction nozzle cap and reciprocate to make peripheral stifled gas board progressively block in or break away from the notch of breathing in to adjust suction nozzle cap surface adsorption size, the wafer of adaptation different diameters adsorbs.
Preferably, the suction nozzle cap is in sliding fit with the air blocking block, a plurality of sliding grooves are formed in the side wall of the air blocking block and communicated to the upper surface of the air blocking block, and sliding blocks are correspondingly arranged on the inner wall of the suction nozzle cap, so that the suction nozzle cap can be clamped into the sliding grooves through the sliding blocks to slide up and down.
Preferably, the air blocking block is internally provided with a threaded hole extending to the bottom surface of the air blocking block, a screw rod is arranged in the threaded hole, the end part of the screw rod is connected with a motor, and the motor drives the screw rod to rotate, so that the air blocking block moves up and down linearly.
Preferably, the inner wall of the nozzle cap is provided with an annular groove, and an O-shaped ring is embedded inside the annular groove.
Compared with the prior art, the double-vortex type wafer suction nozzle assembly disclosed by the invention has the following beneficial effects:
the suction slots distributed in a double-vortex manner are adopted to increase the whole adsorption area, the adsorption form is changed from point adsorption to surface adsorption, the adsorption difficulty is reduced, the stable adsorption of the wafer can be ensured, and the adsorption reliability is improved;
the gas blocking plates distributed in a double-vortex mode are adopted, so that the height of the gas blocking plates is gradually increased from the center to the outside, and the peripheral gas blocking plates gradually protrude out of the suction nozzle cap along with the extension of the gas blocking plates, so that the adsorption surface is gradually reduced, the adsorption of wafers with different diameters is adapted, and the extended sizes are adjusted only according to the sizes of the wafers;
to the cooperation of stifled gas piece and suction nozzle cap, adopt the structure of spout cooperation slider to realize the reciprocating of stifled gas piece, ensure stifled gas board and the accurate alignment of the notch of breathing in, in order to promote the adsorption affinity in the negative pressure intracavity, set up O type circle on suction nozzle cap inner wall, increase the sealing performance of below, promote the adsorption affinity.
Drawings
FIG. 1 is a side cross-sectional view of a first state of a first embodiment of the present invention;
FIG. 2 is a side cross-sectional view of the first embodiment of the present invention in a second state;
fig. 3 is a plan view of a nozzle cap according to a first embodiment of the present invention.
Detailed Description
The technical solution of the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.
As shown in fig. 1 to 3, the dual-vortex wafer suction nozzle assembly disclosed in this embodiment is installed on the suction pipe at the front end of the wafer picking robot, and includes a gas blocking block 1 and a suction nozzle cap 2 sleeved above the gas blocking block, and the suction nozzle cap can move up and down.
Specifically, the upper surface of the air blocking block is provided with a double-vortex-type distributed air blocking plate 3, a plurality of sliding grooves 4 are vertically arranged on the side wall of the suction nozzle, the upper ends of the sliding grooves 4 are communicated with the upper surface of the suction nozzle, the inner part of the air blocking block is provided with a threaded hole 5 which extends to the lower surface of the air blocking block, a screw rod 6 is arranged in the air blocking block, and the end part of the air blocking block is connected with a motor.
The two gas blocking plates on the upper surface of the gas blocking block are distributed in a double-vortex mode, and the height and the width of the two gas blocking plates are gradually increased from the center to the periphery.
The suction nozzle cap surface has a plurality of suction slot openings 8 that correspond with suction nozzle position and size, and be equipped with a plurality of sliders 9 on the suction nozzle cap inner wall, the suction nozzle cap passes through the slider card and goes into slide fit about realizing in the spout of suction nozzle lateral wall, simultaneously and form the negative pressure chamber between the gas blockage piece, in order to concentrate the adsorption affinity in negative pressure chamber directly over, be equipped with the ring channel on the suction nozzle cap inner wall, inside inlays and is equipped with O type circle 10, thereby can effectively prevent to form the adsorption affinity between suction nozzle and the suction nozzle cap lateral wall, ensure that the adsorption affinity is all directly over the suction nozzle, and suction nozzle cap lateral wall induction port 11, connect evacuation equipment through the trachea.
Therefore, the scope of the present invention should not be limited to the disclosure of the embodiments, but includes various alternatives and modifications without departing from the scope of the present invention, which is defined by the claims of the present patent application.
Claims (2)
1. A double-vortex wafer suction nozzle component is characterized in that: the suction nozzle comprises an air blocking block and a suction nozzle cap, wherein the upper surface of the air blocking block is provided with a double-vortex-type distributed air blocking plate, the height of the air blocking plate is gradually increased from the center to the outside, the surface of the suction nozzle cap is provided with a double-vortex-type air suction groove opening corresponding to the position and the size of the air blocking plate, the side wall of the suction nozzle cap is provided with an air suction port connected with vacuum pumping equipment, the suction nozzle cap is sleeved above the air blocking block and forms a negative pressure cavity with a suction nozzle, and the air blocking block can move up and down along the suction nozzle cap to enable the surrounding air blocking plate to be gradually clamped into or separated from the air suction groove opening so as to adjust the surface adsorption size of the suction;
the suction nozzle cap is in sliding fit with the air blocking block, a plurality of sliding grooves are formed in the side wall of the air blocking block and communicated to the upper surface of the air blocking block, and sliding blocks are correspondingly arranged on the inner wall of the suction nozzle cap, so that the suction nozzle cap is clamped into the sliding grooves through the sliding blocks to realize vertical sliding;
the air blocking block is internally provided with a threaded hole extending to the bottom surface of the air blocking block, a screw rod is arranged in the threaded hole, the end part of the screw rod is connected with a motor, and the motor drives the screw rod to rotate, so that the air blocking block can move up and down linearly.
2. The dual vortex wafer nozzle assembly of claim 1, wherein: the inner wall of the suction nozzle cap is provided with an annular groove, and an O-shaped ring is embedded inside the annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810789649.4A CN108861571B (en) | 2018-07-18 | 2018-07-18 | Double-vortex type wafer suction nozzle assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810789649.4A CN108861571B (en) | 2018-07-18 | 2018-07-18 | Double-vortex type wafer suction nozzle assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108861571A CN108861571A (en) | 2018-11-23 |
| CN108861571B true CN108861571B (en) | 2020-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810789649.4A Active CN108861571B (en) | 2018-07-18 | 2018-07-18 | Double-vortex type wafer suction nozzle assembly |
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| Country | Link |
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| CN (1) | CN108861571B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637623A (en) * | 2012-04-18 | 2012-08-15 | 吴晓 | LED (light-emitting diode) chip carrier positioning and absorbing device |
| CN202549910U (en) * | 2012-04-18 | 2012-11-21 | 吴晓 | Absorbing device for locating LED chip carrier |
| CN202914510U (en) * | 2012-10-08 | 2013-05-01 | 梁添贵 | Vacuum chuck with adjustable adhesion area |
| CN203181420U (en) * | 2013-04-09 | 2013-09-04 | 阳程（佛山）科技有限公司 | Sucker of reinforcing surface mounting machine |
| CN203387843U (en) * | 2013-07-30 | 2014-01-08 | 东莞市华恒工业自动化集成有限公司 | Novel sucker |
| CN107324002A (en) * | 2017-07-29 | 2017-11-07 | 贵州仁信农业开发有限公司 | A kind of myotonin conveying device |
-
2018
- 2018-07-18 CN CN201810789649.4A patent/CN108861571B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637623A (en) * | 2012-04-18 | 2012-08-15 | 吴晓 | LED (light-emitting diode) chip carrier positioning and absorbing device |
| CN202549910U (en) * | 2012-04-18 | 2012-11-21 | 吴晓 | Absorbing device for locating LED chip carrier |
| CN202914510U (en) * | 2012-10-08 | 2013-05-01 | 梁添贵 | Vacuum chuck with adjustable adhesion area |
| CN203181420U (en) * | 2013-04-09 | 2013-09-04 | 阳程（佛山）科技有限公司 | Sucker of reinforcing surface mounting machine |
| CN203387843U (en) * | 2013-07-30 | 2014-01-08 | 东莞市华恒工业自动化集成有限公司 | Novel sucker |
| CN107324002A (en) * | 2017-07-29 | 2017-11-07 | 贵州仁信农业开发有限公司 | A kind of myotonin conveying device |
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| Publication number | Publication date |
|---|---|
| CN108861571A (en) | 2018-11-23 |
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