CN108857862B - Semiconductor silicon wafer grinding processing system - Google Patents
Semiconductor silicon wafer grinding processing system Download PDFInfo
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- CN108857862B CN108857862B CN201810603285.6A CN201810603285A CN108857862B CN 108857862 B CN108857862 B CN 108857862B CN 201810603285 A CN201810603285 A CN 201810603285A CN 108857862 B CN108857862 B CN 108857862B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor silicon wafer grinding processing system which comprises a box body, a first pneumatic cylinder, an upper grinding disc, a grinding module, a control module and a collecting box, wherein the first pneumatic cylinder is arranged on the box body; the grinding module comprises a first grinding module and a second grinding module, and the first grinding module and the second grinding module have the same structure; the first grinding module is arranged on the control module; the second grinding module is positioned below the first grinding module, and the control module is positioned in the middle of the box body; the collecting box is fixedly arranged at the bottom of the box body; the swinging balls sequentially pass through the circular grooves with different sizes when rotating, so that the lower grinding disc is extruded by the swinging balls and inclines to one side, and the contact area between the wafer and the upper grinding disc is increased; meanwhile, the swinging ball is subjected to the combined action of the elastic force of the first plate and the centrifugal force, so that the swinging ball impacts the lower grinding disc, the lower grinding disc is rocked, and the grinding efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor silicon wafer grinding processing system.
Background
The silicon wafer must be polished after being cut, the quality of the polished silicon wafer is mainly determined by the cutting shape, and the polishing efficiency is very low although the polishing can be completed when the silicon wafer with an irregular shape is polished.
In a conventional silicon wafer polishing apparatus, a silicon wafer to be polished is held by a silicon wafer holding plate (carrier) of a polishing head, the surface of the silicon wafer is brought into contact with a polishing cloth attached on the upper surface of the polishing plate, and the polishing plate and the polishing head are moved relative to each other in a state where a polishing liquid is supplied onto the polishing cloth, so that the surface of the silicon wafer can be polished.
Some technical solutions for polishing silicon wafers have been proposed in the prior art, and for example, a chinese patent with application number 201310641959.9 discloses a wafer polishing apparatus including a polishing plate, a polishing head capable of holding a wafer, and a polishing liquid supply portion. The abrasive plate includes: a plurality of concentric polishing zones, each polishing zone having a prescribed width for polishing a wafer and having a polishing cloth attached thereto; and grooves for discharging the polishing liquid, the grooves being formed between the polishing zones. A head cleaning portion for cleaning the polishing head or a wafer cleaning portion for cleaning the polished wafer is provided to a central portion of the polishing plate and located in an innermost polishing zone.
The technical scheme can ensure the grinding and cleaning of the silicon wafer; however, this solution is not effective for silicon wafers with different regular shapes, when the end of the silicon wafer is cut obliquely, the conventional polishing means is used, and the silicon wafer needs to be polished downward from the top little by little, so that the polishing efficiency is low, and this solution is limited.
Disclosure of Invention
In order to make up for the defects of the prior art, the semiconductor silicon wafer grinding processing system provided by the invention has the advantages that after the first grinding module and the second grinding module are turned over, the first rod or the second rod is supported by the supporting seat in the first wheel, so that the first grinding module and the second grinding module are respectively ground or cleaned.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention provides a semiconductor silicon wafer grinding processing system which comprises a box body, a first pneumatic cylinder and an upper grinding disc, wherein the first pneumatic cylinder is arranged on the box body; the grinding device also comprises a grinding module, a control module and a collecting box; the first pneumatic cylinder is fixedly arranged at the top of the box body, the bottom of the first pneumatic cylinder is fixedly provided with an upper grinding disc, and the first pneumatic cylinder is used for controlling the upper grinding disc to be matched with the grinding module to grind the semiconductor silicon wafer; the grinding module comprises a first grinding module and a second grinding module, and the first grinding module and the second grinding module have the same structure; the first grinding module is arranged on the control module; the second grinding module is positioned below the first grinding module; the first grinding module is used for grinding a semiconductor silicon wafer in cooperation with the upper grinding disc; the control module is positioned in the middle of the box body and is used for controlling the first grinding module and the second grinding module to turn over; the collecting box is fixedly arranged at the bottom of the box body and is used for collecting dust after the semiconductor silicon wafer is cleaned; wherein the content of the first and second substances,
the control module comprises a first motor, a first rotating plate, a first rod and a second rod; the first motor is fixed on the side wall of the box body; the first motor rotating shaft is fixedly connected with a first rotating plate; the first rod penetrates through the first rotating plate and is fixedly connected with the first rotating plate, two ends of the first rod are respectively slidably installed in the annular grooves in the side wall of the box body, and the second rod and the first rod are symmetrically arranged through a rotating shaft of the first motor; during operation, a grinding module grinds the completion back, a pneumatic cylinder drives the runner stone rebound, open first motor switch, the rotor plate of first motor rotates, a rotor plate drives a grinding module and two numbers grinding module through a pole and No. two poles and overturns, a grinding module overturns the below, the silicon wafer dust that the grinding produced drops to the collection incasement, realize the clearance to grinding the back grinding module, prepare for the grinding of next round, and then improve grinding efficiency.
The first grinding module comprises a lower grinding disc, a first telescopic rod, a second rotating disc and a second motor; the second motor of the first grinding module is fixedly arranged on the first rod, and the second motor of the second grinding module is fixedly arranged on the second rod; the output shaft of the second motor is fixedly connected with the second rotating disc; the second rotating disc is arranged on the lower grinding disc through a group of parallel first telescopic rods; a fixed block is arranged at the top of the second rotating disc and fixedly connected with a swinging ball through a spring; the second grinding module and the first grinding module are symmetrically arranged; the bottom of the lower grinding disc is provided with a group of circular grooves which are horizontally arranged and have the circle centers positioned on the same horizontal line, and the diameters of the group of circular grooves are sequentially reduced towards the outer side of the lower grinding disc; and a circular groove matched with the lower grinding disc is arranged at the top of the second rotating disc. When the silicon wafer grinding machine works, a silicon wafer is placed in the lower grinding disc, the second motor is started, the second motor drives the second rotating disc to rotate, and the second rotating disc drives the lower grinding disc to rotate through a group of first telescopic rods connected in parallel; the lower grinding disc is matched with the upper grinding disc to grind the silicon wafer; meanwhile, in the rapid rotation of the second rotating disc, the swinging ball moves to the outer side of the second rotating disc under the action of centrifugal force, the swinging ball moves from a large circular groove to a small circular groove, when the swinging ball moves to the smallest circular groove, the lower grinding disc inclines to one side, the contact area between the lower grinding disc and the upper grinding disc is increased in the back-and-forth swinging of the silicon wafer, and the grinding efficiency of the silicon wafer is improved.
Preferably, the first motor is fixed on the side wall of one side of the box body, and the end of a rotating shaft of the first motor is fixedly connected with a first rotating plate; a third motor is fixedly arranged on the side wall of the other side of the box body, the end of a rotating shaft of the third motor is fixedly connected with a first wheel, and a supporting seat is fixedly connected to the outer side of the first wheel; the first rotating plate consists of two second rotating plates and two third rotating plates; the two second rotating plates are fixedly connected with the first motor rotating shaft and are symmetrically distributed; the third rotating plate is inserted on the second rotating plate; the first rod is fixedly connected with the third rotating plate; no. two poles and No. three rotor plate fixed connection, the ring channel top is equipped with dodges the groove of dodging of a pole and No. two poles. During operation, after the first grinding module and the second grinding module are turned over, when the first grinding module is arranged above, the third motor drives the first wheel to rotate, the first rod is supported by the supporting seat in the first wheel, the second rotating plate and the third rotating plate are separated and the first grinding module is made to be static, the second grinding module below the first motor can be driven to swing through the first motor, and grinding dust of the second grinding module falls into the collecting box.
Preferably, air outlet pipes are arranged on two sides of the lower grinding disc, and a first groove is formed in the lower grinding disc; a blocking block is arranged in the first groove, the first groove is communicated with the bottom of the circular groove, an elastic sheet is arranged at the bottom of the circular groove, one side of the first groove is connected with the air outlet pipe, and the swing ball can extrude the elastic sheet and spray air flow through the air outlet pipe. When the grinding module rotates to the lower part, the stop block in the grinding module moves downwards under the action of gravity, the first groove is communicated with the circular groove, the swing ball extrudes the elastic sheet at the bottom of the circular groove and sprays airflow through the air outlet pipe, and the airflow sprayed by the air outlet pipe blows to the silicon wafer to remove grinding dust.
Preferably, an arc plate is rotatably installed between two circular grooves in the second rotating disc and consists of a first plate and a second plate, the first plate is located in one circular groove, the second plate is located in the circular groove adjacent to the first plate, and the first plate and the second plate are connected with the second rotating disc through springs respectively. When the swing ball moves to the outer side of the second rotating disc under the action of centrifugal force, on one hand, when the swing ball hits the first plate, the second plate rotates upwards, and the first plate is forced upwards by the spring, so that the swing ball moves from one circular groove to the other circular groove more quickly; on the other hand, in the process that the swinging ball bounces from the circular groove, the swinging ball is impacted on the lower grinding disc under the combined action of centrifugal force and the elastic force of the first plate, the inclination angle of the lower grinding disc is increased to swing up and down, so that the silicon wafer and the upper grinding disc are sufficiently ground, and the grinding efficiency of the silicon wafer is improved.
Preferably, a soft plate is arranged in the air outlet pipe; the soft board one end is equipped with the brush hair, and the other end of soft board is equipped with spherical piston, spherical piston slidable mounting is in the outlet duct. When the cleaning device works, the swinging ball extrudes the elastic sheet at the bottom of the circular groove and sprays airflow through the air outlet pipe to push the flexible board to extend out of the air outlet pipe, and the bristles at the end of the flexible board clean the lower grinding disc, so that the cleaning efficiency is improved.
The invention has the following beneficial effects:
1. according to the semiconductor silicon wafer grinding processing system, after the first grinding module and the second grinding module are turned over, the first rod or the second rod is supported through the support seat in the first wheel, and the first grinding module and the second grinding module are respectively ground or cleaned.
2. According to the semiconductor silicon wafer grinding processing system, the circular grooves, the first plate and the second plate are matched with each other, so that on one hand, under the action of the first plate and the second plate, the swing ball can quickly move from one circular groove to the other circular groove, and the lower grinding disc is inclined; on the other hand, the centrifugal force generated when the swinging ball rotates and the spring force in the first plate are interacted, so that the swinging ball impacts the lower grinding disc, the inclination angle of the lower grinding disc is increased to shake, the contact area between the wafer and the upper grinding disc is increased, and the wafer grinding efficiency is improved.
3. According to the semiconductor silicon wafer grinding treatment system, the air flow is sprayed out of the air outlet pipe through the blocking block, the air outlet pipe and the soft plate, the soft plate is pushed to extend out of the air outlet pipe, and the bristles at the end of the soft plate clean the lower grinding disc, so that the cleaning efficiency is improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view A-A of FIG. 1;
FIG. 3 is a cross-sectional view B-B of FIG. 1;
FIG. 4 is a schematic structural diagram of a first polishing module and a second polishing module according to the present invention;
FIG. 5 is a cross-sectional view taken along line D-D of FIG. 1;
in the figure: the grinding device comprises a box body 1, a first pneumatic cylinder 2, an upper grinding disc 3, a grinding module 4, a first grinding module 7, a lower grinding disc 71, an air outlet pipe 711, a first groove 712, a blocking block 713, an elastic sheet 714, a soft plate 715, a first telescopic rod 72, a second rotary disc 73, a swinging ball 731, an arc-shaped plate 732, a first plate 733, a second plate 734, a second motor 74, a second grinding module 8, a control module 5, a first motor 51, a first wheel 521, a supporting seat 522, a first rotary plate 54, a second rotary plate 541, a third rotary plate 542, a first rod 55, a second rod 56, a collecting box 6, a circular groove 9, a third motor 91 and an annular groove 92.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, a semiconductor silicon wafer polishing system according to the present invention includes a box 1, a first pneumatic cylinder 2, and an upper polishing disc 3; the grinding device also comprises a grinding module 4, a control module 5 and a collecting box 6; the first pneumatic cylinder 2 is fixedly arranged at the top of the box body 1, the upper grinding disc 3 is fixedly arranged at the bottom of the first pneumatic cylinder 2, and the first pneumatic cylinder 2 is used for controlling the upper grinding disc 3 to be matched with the grinding module 4 to grind the semiconductor silicon wafer; the grinding module 4 comprises a first grinding module 7 and a second grinding module 8, and the first grinding module 7 and the second grinding module 8 have the same structure; the first grinding module 7 is arranged on the control module 5; the second grinding module 8 is positioned below the first grinding module 7; the first grinding module 7 is used for grinding a semiconductor silicon wafer by matching with the upper grinding disc 3; the control module 5 is positioned in the middle of the box body 1, and the control module 5 is used for controlling the turning of the first grinding module 7 and the second grinding module 8; the collecting box 6 is fixedly arranged at the bottom of the box body 1, and the collecting box 6 is used for collecting dust after the semiconductor silicon wafer is cleaned; wherein the content of the first and second substances,
the control module 5 comprises a first motor 51, a first rotating plate 54, a first rod 55 and a second rod 56; the first motor 51 is fixed on the side wall of the box body 1; the first motor 51 is fixedly connected with a first rotating plate 54 through a rotating shaft; the first rod 55 penetrates through the first rotating plate 54 and is fixedly connected with the first rotating plate 54, two ends of the first rod 55 are respectively slidably installed in annular grooves 92 in the side wall of the box body 1, and the second rod 56 and the first rod 55 are symmetrically arranged by a rotating shaft of the first motor 51; during operation, No. 7 grinding of grinding module are accomplished the back, a pneumatic cylinder 2 drives the upward movement of millstone 3, open first motor 51 switch, a rotor plate 54 of first motor 51 rotates, a rotor plate 54 drives grinding module 7 and No. two grinding module 8 through a pole 55 and No. two poles 56 and overturns, grinding module 7 overturns to the below, the silicon wafer dust that grinds the production drops to collection box 6 in, the realization is to grinding the clearance of No. 7 of back, prepare for the grinding of next round, and then improve grinding efficiency.
The first grinding module 7 comprises a lower grinding disc 71, a first telescopic rod 72, a second rotating disc 73 and a second motor 74; the second motor 74 of the first grinding module 7 is fixedly arranged on the first rod 55, and the second motor 74 of the second grinding module 8 is fixedly arranged on the second rod 56; an output shaft of the second motor 74 is fixedly connected with a second rotating disc 73; the second rotating disc 73 is arranged on the lower grinding disc 71 through a group of parallel first telescopic rods 72; a fixed block is arranged at the top of the second rotating disc 73 and is fixedly connected with a swinging ball 731 through a spring; the second grinding module 8 and the first grinding module 7 are symmetrically arranged; the bottom of the lower grinding disc 71 is provided with a group of circular grooves 9 which are horizontally arranged and have the centers of circles positioned on the same horizontal line, and the diameters of the group of circular grooves 9 are sequentially reduced towards the outer side of the lower grinding disc 71; and a circular groove 9 matched with the lower grinding disc 71 is formed in the top of the second rotating disc 73. When the silicon wafer grinding machine works, a silicon wafer is placed in the lower grinding disc 71, the second motor 74 is started, the second motor 74 drives the second rotating disc 73 to rotate, and the second rotating disc 73 drives the lower grinding disc 71 to rotate through the group of first telescopic rods 72 connected in parallel; the lower millstone 71 is matched with the upper millstone 3 to grind the silicon wafer; meanwhile, in the rapid rotation of the second rotating disc 73, the swinging ball 731 moves to the outer side of the second rotating disc 73 under the action of centrifugal force, the swinging ball 731 moves from the large circular groove 9 to the small circular groove 9, when the swinging ball 731 moves to the minimum circular groove 9, the lower grinding disc 71 inclines to one side, and the contact area between the lower grinding disc and the upper grinding disc 3 is increased in the back-and-forth swinging of the silicon wafer, so that the grinding efficiency of the silicon wafer is improved.
As an embodiment of the present invention, the first motor 51 is fixed on a side wall of one side of the box body 1, and a first rotating plate 54 is fixedly connected to an end of a rotating shaft of the first motor 51; a third motor 91 is fixedly installed on the side wall of the other side of the box body 1, the end of a rotating shaft of the third motor 91 is fixedly connected with a first wheel 521, and a supporting seat 522 is fixedly connected to the outer side of the first wheel 521; the first rotating plate 54 consists of two second rotating plates 541 and two third rotating plates 542; the two second rotating plates 541 are fixedly connected with the rotating shaft of the first motor 51, and the two second rotating plates 541 are symmetrically distributed; the third rotating plate 542 is inserted into the second rotating plate 541; the first rod 55 is fixedly connected with a third rotating plate 542; no. two pole 56 and No. three rotating plate 542 fixed connection, the annular groove 92 top is equipped with dodges the groove of dodging of a pole 55 and No. two poles 56. During operation, after the first grinding module 7 and the second grinding module 8 are turned over, when the first grinding module 7 is located above, the third motor 91 drives the first wheel 521 to rotate, the first rod 55 is supported by the supporting seat 522 in the first wheel 521, the second rotating plate 541 and the third rotating plate 542 are separated from each other, the first grinding module 7 is stationary, at this time, the second grinding module 8 below can be driven to swing by the first motor 51, and grinding dust of the second grinding module 8 falls into the collecting box 6.
As an embodiment of the present invention, the air outlet pipes 711 are arranged on both sides of the lower grinding disc 71, and the first groove 712 is arranged inside the lower grinding disc 71; the first groove 712 is internally provided with a blocking block 713, the first groove 712 is communicated with the bottom of the circular groove 9, the bottom of the circular groove 9 is provided with an elastic sheet 714, one side of the first groove 712 is connected with an air outlet pipe 711, and the swing ball 731 can extrude the elastic sheet 714 and spray air flow through the air outlet pipe 711. When the grinding module 7 works, when the first grinding module 7 grinds a silicon wafer, the blocking block 713 in the first groove 712 cuts off the communication between the first groove 712 and the circular groove 9 under the action of gravity, when the first grinding module 7 is turned to the lower part, the blocking block 713 in the first grinding module 7 moves downwards under the action of gravity, the first groove 712 is communicated with the circular groove 9, the swinging ball 731 extrudes the elastic sheet 714 at the bottom of the circular groove 9 and sprays airflow through the air outlet pipe 711, and the airflow sprayed by the air outlet pipe 711 is blown to the silicon wafer to remove grinding dust.
In one embodiment of the present invention, an arc plate 732 is rotatably mounted between two circular grooves 9 in the second rotating disk 73, the arc plate 732 is composed of a first plate 733 and a second plate 734, the first plate 733 is located in one circular groove 9, the second plate 734 is located in the adjacent circular groove 9 of the first plate 733, and the first plate 733 and the second plate 734 are respectively connected to the second rotating disk 73 through springs. In operation, the swinging ball 731 moves to the outside of the second rotating disk 73 under the action of centrifugal force, on one hand, when the swinging ball 731 hits the first plate 733, the second plate 734 rotates upwards, and the first plate 733 is forced upwards by the spring, so that the swinging ball 731 moves from one circular groove 9 to the other circular groove 9 more quickly; on the other hand, in the process that the swinging ball 731 bounces from the circular groove 9, the swinging ball 731 is impacted on the lower grinding disc 71 under the combined action of the centrifugal force and the elastic force of the first plate 733, the inclination angle of the lower grinding disc 71 is increased to perform vertical shaking, so that the silicon wafer and the upper grinding disc 3 are sufficiently ground, and the silicon wafer grinding efficiency is improved.
As an embodiment of the present invention, a soft plate 715 is disposed in the outlet duct 711; one end of the soft plate 715 is provided with bristles, and the other end of the soft plate 715 is provided with a spherical piston which is slidably arranged in the air outlet pipe 711. When the cleaning device works, the swinging ball 731 extrudes the elastic sheet 714 at the bottom of the circular groove 9 and sprays air flow through the air outlet pipe 711 to push the soft plate 715 to extend out of the air outlet pipe 711, and bristles at the end of the soft plate 715 clean the lower grinding disc 71, so that the cleaning efficiency is improved.
During operation, after the first grinding module 7 finishes grinding, the first pneumatic cylinder 2 drives the upper grinding disc 3 to move upwards, a switch of the first motor 51 is turned on, the first motor 51 rotates the first rotating plate 54, the first rotating plate 54 drives the first grinding module 7 and the second grinding module 8 to turn over through the first rod 55 and the second rod 56, the first grinding module 7 turns over to the lower part, and silicon wafer dust generated by grinding falls into the collection box 6, so that the first grinding module 7 after grinding is cleaned, and preparation is made for the next round of grinding; when the first grinding module 7 grinds, the second motor 74 drives the second rotary disc 73 to rotate, and the second rotary disc 73 drives the lower grinding disc 71 to rotate through the group of parallel first telescopic rods 72; the lower millstone 71 is matched with the upper millstone 3 to grind the silicon wafer; meanwhile, in the rapid rotation of the second rotating disc 73, the swinging ball 731 moves to the outer side of the second rotating disc 73 under the action of centrifugal force, the swinging ball 731 moves from the large circular groove 9 to the small circular groove 9, when the swinging ball 731 moves to the minimum circular groove 9, the lower grinding disc 71 inclines to one side, the contact area between the lower grinding disc and the upper grinding disc 3 is increased in the back-and-forth swinging of the silicon wafer, and the grinding efficiency of the silicon wafer is improved; after the first grinding module 7 and the second grinding module 8 are turned over, when the first grinding module 7 is positioned above, the third motor 91 drives the first wheel 521 to rotate, the first rod 55 is supported by the supporting seat 522 in the first wheel 521, the second rotating plate 541 and the third rotating plate 542 are separated, the first grinding module 7 is made to be static, the second grinding module 8 below can be driven to swing by the first motor 51, and grinding dust of the second grinding module 8 falls into the collecting box 6; meanwhile, when the first grinding module 7 is turned to the lower side, the blocking block 713 in the first grinding module 7 moves downwards under the action of gravity, the first groove 712 is communicated with the circular groove 9, the swinging ball 731 extrudes the elastic sheet 714 at the bottom of the circular groove 9 and sprays air flow through the air outlet pipe 711 to push the soft plate 715 to extend out of the air outlet pipe 711, and bristles at the end of the soft plate 715 clean the lower grinding disc 71, so that the cleaning efficiency is improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A semiconductor silicon wafer grinding processing system comprises a box body (1), a first pneumatic cylinder (2) and an upper grinding disc (3); the method is characterized in that: the grinding device also comprises a grinding module (4), a control module (5) and a collecting box (6); the first pneumatic cylinder (2) is fixedly arranged at the top of the box body (1), the bottom of the first pneumatic cylinder (2) is fixedly provided with an upper grinding disc (3), and the first pneumatic cylinder (2) is used for controlling the upper grinding disc (3) to be matched with the grinding module (4) to grind the semiconductor silicon wafer; the grinding module (4) comprises a first grinding module (7) and a second grinding module (8), and the first grinding module (7) and the second grinding module (8) have the same structure; the first grinding module (7) is arranged on the control module (5); the second grinding module (8) is positioned below the first grinding module (7); the first grinding module (7) is used for grinding a semiconductor silicon wafer by matching with the upper grinding disc (3); the control module (5) is positioned in the middle of the box body (1), and the control module (5) is used for controlling the turning of the first grinding module (7) and the second grinding module (8); the collecting box (6) is fixedly arranged at the bottom of the box body (1), and the collecting box (6) is used for collecting dust after semiconductor silicon wafers are cleaned; wherein the content of the first and second substances,
the control module (5) comprises a first motor (51), a first rotating plate (54), a first rod (55) and a second rod (56); the first motor (51) is fixed on the side wall of the box body (1); the rotating shaft of the first motor (51) is fixedly connected with a first rotating plate (54); the first rod (55) penetrates through the first rotating plate (54) and is fixedly connected with the first rotating plate (54), two ends of the first rod (55) are respectively installed in an annular groove (92) in the side wall of the box body (1) in a sliding mode, and the second rod (56) and the first rod (55) are symmetrically arranged through a rotating shaft of the first motor (51);
the first grinding module (7) comprises a lower grinding disc (71), a first telescopic rod (72), a second rotating disc (73) and a second motor (74); a second motor (74) of the first grinding module (7) is fixedly arranged on the first rod (55), and a second motor (74) of the second grinding module (8) is fixedly arranged on the second rod (56); an output shaft of the second motor (74) is fixedly connected with a second rotating disc (73); the second rotating disc (73) is arranged on the lower grinding disc (71) through a group of parallel first telescopic rods (72); a fixed block is arranged at the top of the second rotating disc (73), and the fixed block is fixedly connected with a swinging ball (731) through a spring; the second grinding module (8) and the first grinding module (7) are symmetrically arranged; the bottom of the lower grinding disc (71) is provided with a group of circular grooves (9) which are horizontally arranged and have the circle centers positioned on the same horizontal line, and the diameters of the group of circular grooves (9) are sequentially reduced towards the outer side of the lower grinding disc (71); the top of the second rotating disc (73) is provided with a circular groove (9) matched with the lower grinding disc (71).
2. The semiconductor silicon wafer polishing processing system of claim 1, wherein: the first motor (51) is fixed on the side wall of one side of the box body (1), and the end of a rotating shaft of the first motor (51) is fixedly connected with a first rotating plate (54); a third motor (91) is fixedly installed on the side wall of the other side of the box body (1), the end of a rotating shaft of the third motor (91) is fixedly connected with a first wheel (521), and a supporting seat (522) is fixedly connected to the outer side of the first wheel (521); the first rotating plate (54) consists of two second rotating plates (541) and two third rotating plates (542); the two second rotating plates (541) are fixedly connected with a rotating shaft of the first motor (51), and the two second rotating plates (541) are symmetrically distributed; the third rotating plate (542) is inserted on the second rotating plate (541); the first rod (55) is fixedly connected with the third rotating plate (542); no. two pole (56) and No. three rotating plate (542) fixed connection, annular groove (92) top is equipped with dodges the groove of dodging No. one pole (55) and No. two pole (56).
3. The semiconductor silicon wafer polishing processing system of claim 1, wherein: the two sides of the lower grinding disc (71) are provided with air outlet pipes (711), and a first groove (712) is arranged in the lower grinding disc (71); a blocking block (713) is arranged in the first groove (712), the first groove (712) is communicated with the bottom of the circular groove (9), an elastic sheet (714) is arranged at the bottom of the circular groove (9), an air outlet pipe (711) is connected to one side of the first groove (712), and the swing ball (731) can extrude the elastic sheet (714) and spray air flow through the air outlet pipe (711).
4. The semiconductor silicon wafer polishing processing system of claim 1, wherein: an arc-shaped plate (732) is rotatably mounted between two circular grooves (9) in the second rotating disc (73), the arc-shaped plate (732) consists of a first plate (733) and a second plate (734), the first plate (733) is located in one circular groove (9), the second plate (734) is located in the circular groove (9) adjacent to the first plate (733), and the first plate (733) and the second plate (734) are respectively connected with the second rotating disc (73) through springs.
5. The semiconductor silicon wafer polishing processing system of claim 3, wherein: a soft plate (715) is arranged in the air outlet pipe (711); one end of the soft plate (715) is provided with bristles, the other end of the soft plate (715) is provided with a spherical piston, and the spherical piston is slidably arranged in the air outlet pipe (711).
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| CN108857862B true CN108857862B (en) | 2020-05-12 |
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| JP3949941B2 (en) * | 2001-11-26 | 2007-07-25 | 株式会社東芝 | Semiconductor device manufacturing method and polishing apparatus |
| CN101394971A (en) * | 2006-03-03 | 2009-03-25 | 英诺普雷股份有限公司 | Polishing head for polishing semiconductor wafers |
| DE102010062166A1 (en) * | 2010-11-30 | 2012-05-31 | Thin Materials Ag | Method for treating wafers and microplates |
| KR101458035B1 (en) * | 2013-02-25 | 2014-11-04 | 주식회사 엘지실트론 | Apparatus and method for processing wafer |
| JP6344950B2 (en) * | 2014-03-31 | 2018-06-20 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| CN205685171U (en) * | 2016-06-22 | 2016-11-16 | 浙江嘉兴翔阳金属材料科技有限公司 | A kind of polishing structure in grinder |
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