CN108857147A - A kind of tin bismuth preformed solder production technology - Google Patents
A kind of tin bismuth preformed solder production technology Download PDFInfo
- Publication number
- CN108857147A CN108857147A CN201810694268.8A CN201810694268A CN108857147A CN 108857147 A CN108857147 A CN 108857147A CN 201810694268 A CN201810694268 A CN 201810694268A CN 108857147 A CN108857147 A CN 108857147A
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- alloy
- preformed solder
- production technology
- tin bismuth
- mold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The invention discloses a kind of tin bismuth preformed solder production technologies, are related to preformed solder field, include the following steps：1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；2. squeezing：Sn-bi alloy solution is squeezed into mold；3. forming：Sn-bi alloy is cooled and shaped；4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.Sn-bi alloy is molten into melt by heating by the present invention, by the sn-bi alloy of fusing by way of extruding, is injected in mold and is synthetically formed tin bismuth preformed solder, not only simple production process, but also the preformed solder forming degree and accuracy that synthesize are higher.
Description
Technical field
The present invention relates to preformed solder field, especially a kind of tin bismuth preformed solder production technology.
Background technique
With the particularity of increasingly accurate, the integrated and certain welding procedure of electronic component, existing tin cream, tin silk etc.
Electronic component increasingly higher demands are unable to satisfy, thus preformed solder comes into being, and preformed solder has shape
Multiplicity, the spy that molding is accurate, (solder and scaling powder) dosage is accurate, welding quality is stable, easy to use, production is simple and efficient
Point is widely used in chip welding, optical fibre device welding, connector and terminal device welding, printing circuit board assembling and electricity
The fields such as son encapsulation, are increasingly subject to the favor of electronics industry.
But in the preformed solder of the prior art often including metallic lead, such as China CN200380108665.4 discloses one
Kind soldered ball, welding powder and coating composition of preformed solder and its preparation method and application include metallic lead in solder.Tin bismuth closes
Gold is a kind of unleaded environment-friendly type alloy, is in solid-state under room temperature, and fusing point is 138 DEG C.Sn-bi alloy has solid-liquid volume simultaneously
Shrinking percentage is 0.051%, has many advantages, such as stronger permeability, coating whether there is or not whisker, fusing point is low, solderability is good, external big
Amount promotes and applies, and research and application at home is then less.
Sn-bi alloy multi-pass is crossed the mode poured and is produced in the prior art, but due to preformed solder dosage essence
Standard, so solder size also very little（About 1mm）, can not be produced by directly pouring.Existing preformed solder multi-pass
Overshoot pressure carries out processing synthesis, but sn-bi alloy, since its brittleness is higher, punching press is unable to get appearance and size qualification
Tin bismuth preformed solder.
Summary of the invention
Goal of the invention of the invention is：In view of the above problems, a kind of tin bismuth preformed solder production work is provided
Skill solves the problems, such as that the small processing of sn-bi alloy preformed solder size is complicated.
The technical solution adopted by the present invention is as follows：
A kind of tin bismuth preformed solder production technology, includes the following steps：
1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；
2. squeezing：Sn-bi alloy solution is squeezed into mold；
3. forming：Sn-bi alloy is cooled and shaped；
4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.
Further, 1. middle fusion temperature is 140 ~ 150 DEG C to the step, is heated to sn-bi alloy and is completely melt.
The fusing point of sn-bi alloy is 138 DEG C, and 140 ~ 150 DEG C can melt sn-bi alloy.
Further, the step 2. in mold material be graphite.
Mold uses graphite material, since graphite has gas permeability, during injecting sn-bi alloy melt into mold,
Gas in mold can emit, and be bonded sn-bi alloy more with mold, and reduce the preformed solder after being formed
The bubble of middle generation, solder usage amount are more accurate.
It further, include following raw material according to graphite jig described in parts by weight：70 ~ 85 parts of graphite powder, graphene 20 ~ 30
Part, 10 ~ 15 parts of pitch, 20 ~ 25 parts of phenolic resin, 3 ~ 7 parts of nanometer silicon carbide, 1 ~ 3 part of titanium dioxide three-iron.
Further, 2. the middle mold used includes at least two pieces to the step, the detachable split of mold.
Since using the above structure, mold includes at least two pieces, facilitate the taking-up of preformed solder after molding.
Further, the step 2. in mold temperature be 50 ~ 60 DEG C, keep 10 ~ 15min, then cool to room temperature.
For preformed solder due to scaled fine, sn-bi alloy fusing point is lower, is cooled and shaped fast speed.Due to using above-mentioned
Step slows down sn-bi alloy cooling velocity, is bonded sn-bi alloy more with mold, keeps preformed solder forming degree more preferable.
The sn-bi alloy pressurizing unit include pipe sleeve, the pressure ram being set in pipe sleeve, the upper cover being connect with pipe sleeve and
Lower cover, the upper cover and pipe sleeve detachable connection, one end of the pressure ram extends upward upper cover and is connected with handle, described to squeeze
The other end of compression bar is connected with tube core, and the tube core outer diameter is 0.03mm smaller than clear internal diameter, and the lower cover offers discharge gate, institute
It states lower cover to be connected to pipe sleeve, is provided with electric calorifie installation on the pipe sleeve inner wall.
Since using the above structure, the detachable setting of upper cover realizes charging by opening upper cover；Then by sn-bi alloy
It is put into sn-bi alloy extrusion forming device, sn-bi alloy is molten into sn-bi alloy liquid by heating；Pass through pressure ram again
Sn-bi alloy liquid is discharged into mold from discharge gate.
Further, the electric calorifie installation is connected with temperature controller.
Due to using the above structure, can control the temperature being accurately controlled in pipe sleeve.
Further, the discharge port of the lower cover is gradually reduced along discharging direction.
Due to that using the above structure, can more accurately control the extrusion output of sn-bi alloy, while sn-bi alloy discharges
More at the uniform velocity.
In conclusion by adopting the above-described technical solution, the beneficial effects of the invention are as follows：
1, sn-bi alloy is molten into melt by heating by the present invention, by the sn-bi alloy of fusing, injection by way of extruding
The preformed solder forming degree and essence for being synthetically formed tin bismuth preformed solder in mold, not only simple production process, but also synthesizing
Exactness is higher.
2, since preformed solder is due to scaled fine, sn-bi alloy fusing point is lower, is cooled and shaped fast speed；By mold
Sn-bi alloy cooling velocity can be slowed down by being heated to 50 ~ 60 DEG C, be bonded sn-bi alloy more with mold, make preformed solder at
Type degree is more preferable.
3, mold uses graphite material, and since graphite has gas permeability, sn-bi alloy melt process is being injected into mold
In, the gas in mold can emit, and be bonded sn-bi alloy more with mold, and reduce the preforming weldering after being formed
The bubble generated in material, solder usage amount are more accurate.
4, pressurizing unit can effectively control sn-bi alloy extrusion output, not only make the preformed solder content to be formed more
Precisely, it and it is possible to prevente effectively from wastes.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein：
Fig. 1 is the schematic diagram of tin bismuth preformed solder production technology；
Fig. 2 is the schematic diagram of sn-bi alloy extrusion forming device；
1- handle, 2- pressure ram, 3- fixing piece, 4- tube core, 5- upper cover, 6- pipe sleeve, 7- lower cover, 8- electric calorifie installation, 9- temperature control
Device processed.
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
Embodiment 1
As shown in Fig. 2, provide a kind of sn-bi alloy pressurizing unit, including pipe sleeve 6, the pressure ram being set in pipe sleeve 62, with
The upper cover 5 and lower cover 7 that pipe sleeve 6 connects, upper cover 5 and 6 detachable connection of pipe sleeve, one end of pressure ram 2 extend upward the company of upper cover 2
It is connected to handle 1, the other end of pressure ram 2 is connected with tube core 4, and 4 outer diameter of tube core is 0.03mm smaller than 6 internal diameter of pipe sleeve, lower cover 7
Discharge gate is offered, lower cover 7 is connected to pipe sleeve 6, and electric calorifie installation 8 is provided on 6 inner wall of pipe sleeve, and electric calorifie installation 8 is connected with temperature
Controller 9 is provided with graduation mark on pipe sleeve 6；The discharge port of lower cover 7 is gradually reduced along discharging direction.
The working principle of the present embodiment is：
Upper cover 5 is opened in use process, sn-bi alloy is put into pipe sleeve 6, closes upper cover 5；Discharge gate is to close shape at this time
State；9 set temperature of opening temperature controller is 140 DEG C, and pipe sleeve 6 is heated to sn-bi alloy and is completely melt as melt, the time according to
6 size of pipe sleeve and addition sn-bi alloy determine, then open the exhaust outlet of lower cover 7, are transported downwards by Driven by Hydraulic Cylinder pressure ram 2
It is dynamic, sn-bi alloy melt is expressed into mold.Graduation mark is provided on pipe sleeve 6 can control extrusion output, improve accuracy.
Embodiment 2
The present embodiment completes production technology by using embodiment 1.
A kind of tin bismuth preformed solder production technology, includes the following steps：
1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；
2. squeezing：Sn-bi alloy solution is squeezed into mold；
3. forming：Sn-bi alloy is cooled and shaped；
4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.
Step 1. in fusion temperature be 140 DEG C, be heated to sn-bi alloy and be completely melt.
2. middle mold is the graphite jig of two boards composition to step, includes following raw material according to parts by weight of graphite mold：Stone
70 parts of ink powder, 20 parts of graphene, 10 parts of pitch, 20 parts of phenolic resin, 3 parts of nanometer silicon carbide, 1 part of titanium dioxide three-iron.
Step 2. in mold temperature be 50 DEG C, keep 15min, then cool to room temperature, mold by electric hot plate progress
Heating heating.
Embodiment 3
A kind of tin bismuth preformed solder production technology, includes the following steps：
1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；
2. squeezing：Sn-bi alloy solution is squeezed into mold；
3. forming：Sn-bi alloy is cooled and shaped；
4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.
1. middle fusion temperature is 145 DEG C to step, is heated to sn-bi alloy and is completely melt.
2. middle mold is the graphite jig of two boards composition to step, includes following raw material according to parts by weight of graphite mold：Stone
80 parts of ink powder, 25 parts of graphene, 13 parts of pitch, 22 parts of phenolic resin, 5 parts of nanometer silicon carbide, 2 parts of titanium dioxide three-iron.
Step 2. in mold temperature be 55 DEG C, keep 12min, then cool to room temperature, mold by electric hot plate progress
Heating heating.
Embodiment 4
A kind of tin bismuth preformed solder production technology, includes the following steps：
1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；
2. squeezing：Sn-bi alloy solution is squeezed into mold；
3. forming：Sn-bi alloy is cooled and shaped；
4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.
1. middle fusion temperature is 150 DEG C to step, is heated to sn-bi alloy and is completely melt.
2. middle mold is the graphite jig of two boards composition to step, includes following raw material according to parts by weight of graphite mold：Stone
85 parts of ink powder, 30 parts of graphene, 15 parts of pitch, 25 parts of phenolic resin, 7 parts of nanometer silicon carbide, 3 parts of titanium dioxide three-iron.
Step 2. in mold temperature be 60 DEG C, keep 10min, then cool to room temperature, mold by electric hot plate progress
Heating heating.
This specification（Including any accessory claim, abstract）Disclosed in any feature, unless specifically stated,
It is replaced by other equivalent or with similar purpose alternative features.That is, unless specifically stated, each feature is a series of
An example in equivalent or similar characteristics.
The invention is not limited to specific embodiments above-mentioned.The present invention, which expands to, any in the present specification to be disclosed
New feature or any new combination, and disclose any new method or process the step of or any new combination.
Claims (10)
1. a kind of tin bismuth preformed solder production technology, which is characterized in that include the following steps：
1. melting：Sn-bi alloy is melted into sn-bi alloy solution, it is spare；
2. squeezing：Sn-bi alloy solution is squeezed into mold；
3. forming：Sn-bi alloy is cooled and shaped；
4. being surface-treated：Molding sn-bi alloy is demoulded, polishing grinding is carried out and obtains finished product.
2. tin bismuth preformed solder production technology according to claim 1, which is characterized in that the step 1. in fusing
Temperature is 140 ~ 150 DEG C, is heated to sn-bi alloy and is completely melt.
3. tin bismuth preformed solder production technology according to claim 1, which is characterized in that 2. middle mold is the step
Graphite jig.
4. tin bismuth preformed solder production technology according to claim 3, which is characterized in that according to parts by weight, the stone
Black mold includes following raw material：70 ~ 85 parts of graphite powder, 20 ~ 30 parts of graphene, 10 ~ 15 parts of pitch, 20 ~ 25 parts of phenolic resin,
3 ~ 7 parts of nanometer silicon carbide, 1 ~ 3 part of titanium dioxide three-iron.
5. tin bismuth preformed solder production technology according to claim 1 or 3, which is characterized in that the step 2. in adopt
Mold includes at least two pieces, the detachable split of mold.
6. tin bismuth preformed solder production technology according to claim 1, which is characterized in that the step 2. in mold
Temperature is 50 ~ 60 DEG C, keeps 10 ~ 15min, then cools to room temperature.
7. tin bismuth preformed solder production technology according to claim 1, which is characterized in that the fusing of the step 1. and
2. extruding completed in sn-bi alloy pressurizing unit.
8. tin bismuth preformed solder production technology according to claim 7, which is characterized in that the sn-bi alloy squeezes dress
It sets including pipe sleeve（6）, be set in pipe sleeve（6）Interior pressure ram（2）With pipe sleeve（6）The upper cover of connection（5）And lower cover（7）, described
Upper cover（5）With pipe sleeve（6）Detachable connection, the pressure ram（2）One end extend upward upper cover（2）It is connected with handle（1）,
The pressure ram（2）The other end be connected with tube core（4）, the tube core（4）Outer diameter compares pipe sleeve（6）Internal diameter small 0.03mm, it is described
Lower cover（7）Offer discharge gate, the lower cover（7）With pipe sleeve（6）Connection, the pipe sleeve（6）Electric calorifie installation is provided on inner wall
（8）.
9. tin bismuth preformed solder production technology according to claim 8, which is characterized in that the electric calorifie installation（8）Even
It is connected to temperature controller（9）.
10. tin bismuth preformed solder production technology according to claim 8, which is characterized in that the lower cover（7）Discharging
Opening's edge discharging direction be gradually reduced.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810694268.8A CN108857147A (en) | 2018-06-29 | 2018-06-29 | A kind of tin bismuth preformed solder production technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810694268.8A CN108857147A (en) | 2018-06-29 | 2018-06-29 | A kind of tin bismuth preformed solder production technology |
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| Publication Number | Publication Date |
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| CN108857147A true CN108857147A (en) | 2018-11-23 |
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ID=64297145
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| CN201810694268.8A Pending CN108857147A (en) | 2018-06-29 | 2018-06-29 | A kind of tin bismuth preformed solder production technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732296A (en) * | 2021-09-06 | 2021-12-03 | 深圳市福英达工业技术有限公司 | Preparation method of tin-based eutectic alloy powder with stable metal lattices on particle surfaces |
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| US20130206351A1 (en) * | 2012-02-11 | 2013-08-15 | International Business Machines Corporation | Forming metal preforms and metal balls |
| CN103639620A (en) * | 2013-12-04 | 2014-03-19 | 广州先艺电子科技有限公司 | Method for manufacturing Sn-Bi brittle alloy performed soldering lug |
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| CN105643147A (en) * | 2016-03-07 | 2016-06-08 | 昆明理工大学 | Preparation method for Sn-58Bi welding wire |
| CN106695161A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Pb-free Sn-Bi alloy solder and preparation method thereof |
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2018
- 2018-06-29 CN CN201810694268.8A patent/CN108857147A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616981A (en) * | 1969-08-08 | 1971-11-02 | Erie Technological Prod Inc | Lead and solder preform assembly and method of making the same |
| CN101844280A (en) * | 2010-02-08 | 2010-09-29 | 岳阳金正电子材料有限公司 | Tin-bismuth solder with low melting point and preparation method thereof |
| US20130206351A1 (en) * | 2012-02-11 | 2013-08-15 | International Business Machines Corporation | Forming metal preforms and metal balls |
| CN103639620A (en) * | 2013-12-04 | 2014-03-19 | 广州先艺电子科技有限公司 | Method for manufacturing Sn-Bi brittle alloy performed soldering lug |
| CN104209664A (en) * | 2014-08-13 | 2014-12-17 | 汕尾市栢林电子封装材料有限公司 | Preparation method and preparation device of solder foil |
| CN105478947A (en) * | 2015-12-23 | 2016-04-13 | 南京信息职业技术学院 | Pcb welding device |
| CN105479115A (en) * | 2015-12-30 | 2016-04-13 | 无锡透平叶片有限公司 | Forming method for sliver welding plate for brazed specially-shaped Stellite alloy plate for steam turbine blade |
| CN105643147A (en) * | 2016-03-07 | 2016-06-08 | 昆明理工大学 | Preparation method for Sn-58Bi welding wire |
| CN106695161A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Pb-free Sn-Bi alloy solder and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732296A (en) * | 2021-09-06 | 2021-12-03 | 深圳市福英达工业技术有限公司 | Preparation method of tin-based eutectic alloy powder with stable metal lattices on particle surfaces |
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Application publication date: 20181123 |