CN108843988A - A kind of LED package substrates and LED encapsulation structure - Google Patents
A kind of LED package substrates and LED encapsulation structure Download PDFInfo
- Publication number
- CN108843988A CN108843988A CN201810561416.9A CN201810561416A CN108843988A CN 108843988 A CN108843988 A CN 108843988A CN 201810561416 A CN201810561416 A CN 201810561416A CN 108843988 A CN108843988 A CN 108843988A
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- Prior art keywords
- buckle
- led
- encapsulation
- fixed
- slot
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 57
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 230000006835 compression Effects 0.000 claims abstract description 21
- 238000007906 compression Methods 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 3
- 210000000481 breast Anatomy 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED package substrates and LED encapsulation structures, including firm banking, horizontal buckle, it is vertically arranged buckle, compressed spring, fixed block and screw hole, the firm banking is fixed on device substrate bottom, and device base internal middle position offers encapsulation fluting, the compressed spring setting is in compression snap-fastener, and compression snap-fastener end positions are fixedly connected with briquetting, the fixed block is fixed on device upper surface of substrate, and the screw hole is provided with firm banking upper surface.The LED package substrates and LED encapsulation structure are provided with through slot and buckle slot on the outside of encapsulation fluting, when downwards press be vertically arranged buckle when, horizontal buckle can be squeezed to the right, it to making in the horizontal through-hole for being fastened on LED light bottom, while pressing when compressing snap-fastener, passes through the effect of compressed spring, it is shunk to make to compress snap-fastener, and then it is fixed on compression snap-fastener below fixed block, to squeeze good horizontal buckle, will can be packaged between the bottom LED and device substrate well.
Description
Technical field
The present invention relates to LED light device technical field, specially a kind of LED package substrates and LED encapsulation structure.
Background technique
In recent years with the rise of worldwide energy saving concept, obtained using the general illumination technology of white light LEDs
Grow rapidly, the street lamp application field especially illuminated outdoors, and being normally applied in the market it is horizontal considerably beyond
The light efficiency of common energy-saving lamp, and as White light LED technology is more and more widely used in general illumination market, to white light LEDs device
The requirement of the luminous efficiency and luminescent quality of part is also higher and higher, therefore occurs various LED envelopes on the market now
Substrate and LED encapsulation structure are filled, but present LED package substrates and LED encapsulation structure on the market when in use cannot be better
LED light is fixed, while cannot be easily packaged when packaged, it is inconvenient for operation, it is unable to satisfy in real work
Demand set to improve this therefore on the market there is an urgent need to which the technology of LED package substrates and LED encapsulation structure structure can be improved
It is standby.
Summary of the invention
The purpose of the present invention is to provide a kind of LED package substrates and LED encapsulation structures, to solve in above-mentioned background technique
The existing LED package substrates and LED encapsulation structure proposed cannot preferably be fixed LED light when in use, while
It cannot be easily packaged when encapsulation, problem inconvenient for operation.
To achieve the above object, the present invention provides the following technical solutions：A kind of LED package substrates and LED encapsulation structure, packet
It includes firm banking, horizontal buckle, be vertically arranged buckle, compressed spring, fixed block and screw hole, the firm banking is fixed on device substrate
Bottom, and device base internal middle position offers encapsulation fluting, described device base internal corresponding encapsulation fluting outside position
It sets and offers through slot, and device base internal corresponds to and offers buckle slot on the outside of through slot, the horizontal buckle traverse is placed in logical
In slot, and horizontal buckle is internally provided with spring, and the buckle that is vertically arranged is vertically arranged in horizontal buckle top position in buckle slot,
And be vertically arranged buckle upper end position and be fixed with compression snap-fastener, the compressed spring setting compresses snap-fastener both ends in compression snap-fastener
Position is fixedly connected with briquetting, and the fixed block is fixed on device upper surface of substrate, and the screw hole opens up on the fixed base
Surface.
Preferably, it is helicitic texture that the encapsulation fluting is internal, and the size for encapsulating fluting is consistent with the size of LED light bottom
It closes.
Preferably, it is connected between the through slot, buckle slot and encapsulation fluting, and through slot and buckle slot are about encapsulation fluting
Longitudinal central axis line is symmetrical.
Preferably, it is connected between the buckle slot and encapsulation fluting and corresponding through slot.
Preferably, the horizontal buckle includes the first fixture block and the second fixture block, and the both ends of horizontal buckle are respectively fixed with
First fixture block and the second fixture block, and the first fixture block surface is smooth structure.
Preferably, the buckle bottom that is vertically arranged is semi-circular structure, and is vertically arranged the size of buckle bottom and the ruler of the first fixture block
It is very little to match.
Preferably, stretching structure, and the maximum elongation of compressed spring are constituted between compression snap-fastener and the compressed spring
Greater than the distance between 2 fixed blocks, and the smallest elongation of compressed spring is less than the distance between 2 fixed blocks.
Preferably, there are four the fixed block is arranged altogether, and every 2 fixed blocks are one group, and 2 groups of fixed blocks are uniform
Setting is above compression snap-fastener.
Preferably, the screw hole is uniformly distributed on the fixed base, and screw hole is distributed in circular ring shape.
Compared with prior art, the beneficial effects of the invention are as follows：The LED package substrates and LED encapsulation structure：
1. the device is provided with the firm banking with screw hole in device substrate bottom, while screw hole is uniformly distributed in a ring
On the fixed base, screw can be fixed on metope by screw hole well during installation, thus preferably right when in use
LED light is fixed；
2. the device has opened up the encapsulation fluting of helicitic texture above device substrate, can be fine by helicitic texture
LED light is fixed in encapsulation fluting by ground；
3. the device is provided with through slot and buckle slot on the outside of encapsulation fluting, when press downwards be vertically arranged buckle when, can to the right
Horizontal buckle is squeezed, by the effect of spring, convenient for making in the horizontal groove for being fastened on LED light bottom.
4. the device is provided with compressed spring in compression snap-fastener, when pressing compression snap-fastener, by the effect of compressed spring,
It is shunk to make to compress snap-fastener, and then is fixed on compression snap-fastener below fixed block, so that good horizontal buckle is squeezed, it can be fine
Ground will be packaged between the bottom LED and device substrate.
5. the device will be vertically arranged buckle bottom and be set as semi-circular structure, and be vertically arranged the size and the first fixture block of buckle bottom
Size matches, and the first fixture block can be made to roll in the semi-circular structure for being vertically arranged buckle bottom well.
Detailed description of the invention
Fig. 1 is schematic view of the front view of the present invention；
Fig. 2 is overlooking structure diagram of the present invention；
Fig. 3 is the portion A of the present invention enlarged structure schematic diagram；
Fig. 4 is the portion B of the present invention enlarged structure schematic diagram.
In figure：1, firm banking, 2, device substrate, 3, encapsulation fluting, 4, through slot, 5, buckle slot, 6, horizontal buckle, 601,
First fixture block, the 602, second fixture block, 7, spring, 8, be vertically arranged buckle, 9, compression snap-fastener, 10, compressed spring, 11, briquetting, 12,
Fixed block, 13, screw hole.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution：A kind of LED package substrates and LED encapsulation structure, including
Firm banking 1, is vertically arranged buckle 8, compressed spring 10, fixed block 12 and screw hole 13 at horizontal buckle 6, and firm banking 1 is fixed on device
2 bottom of substrate, and 2 bosom position of device substrate offers encapsulation fluting 3,3 inside of encapsulation fluting is helicitic texture, encapsulation
The size of fluting 3 is consistent with the size of LED light bottom, is connected through a screw thread, LED light bottom can be fixed on envelope well
In dress fluting 3,3 outer fixes of corresponding encapsulation fluting offer through slot 4 inside device substrate 2, and corresponding logical inside device substrate 2
Buckle slot 5 is offered on the outside of slot 4, is connected between through slot 4, buckle slot 5 and encapsulation fluting 3, and through slot 4 and buckle slot 5 are about envelope
The longitudinal central axis line of dress fluting 3 is symmetrical, is connected between buckle slot 5 and encapsulation fluting 3 and corresponding through slot 4, can preferably make to press
Contracting snap-fastener 9 slides in through slot 4, and 6 traverses of horizontal buckle are placed in through slot 4, and horizontal buckle 6 is internally provided with spring 7, horizontal
Setting buckle 6 includes the first fixture block 601 and the second fixture block 602, and the both ends of horizontal buckle 6 are respectively fixed with 601 He of the first fixture block
Second fixture block 602, and 601 surface of the first fixture block is smooth structure, can reduce by the first fixture block 601 and be vertically arranged 8 bottoms of buckle
Frictional force, convenient for squeezing the first fixture block 601 well, be vertically arranged buckle 8 be vertically arranged in buckle slot 5 it is horizontal buckle 6 top
Position, and be vertically arranged 8 upper end positions of buckle and be fixed with compression snap-fastener 9, being vertically arranged 8 bottoms of buckle is semi-circular structure, and is vertically arranged 8 bottoms of buckle
The size in portion matches with the size of the first fixture block 601, and the first fixture block 601 can be made to be vertically arranged the half of 8 bottoms of buckle well
It is rolled in circle structure, the setting of compressed spring 10 compresses 9 end positions of snap-fastener and be fixedly connected with briquetting in compression snap-fastener 9
11, it compresses and constitutes stretching structure between snap-fastener 9 and compressed spring 10, and the maximum elongation of compressed spring 10 is greater than 2 fixations
The distance between block 12, and the smallest elongation of compressed spring 10 passes through compression bullet less than the distance between 2 fixed blocks 12
The effect of spring 10 can be such that compression snap-fastener 9 is compressed well, penetrate fixed block 12 convenient for making to compress snap-fastener 9, can be fine
Ground is fixed to buckle 8 is vertically arranged, and fixed block 12 is fixed on 2 upper surface of device substrate, and fixed block 12 has altogether there are four settings, and
Every 2 fixed blocks 12 are one group, and 2 groups of fixed blocks 12 are uniformly arranged on 9 top of compression snap-fastener, will can compress bullet well
Spring 10 is fixed, and screw hole 13 is provided with 1 upper surface of firm banking, and screw hole 13 is evenly distributed on firm banking 1, and screw hole 13
It is distributed in circular ring shape, screw can be made to be fixed on metope through screw hole 13 well, be easily installed.
Working principle：Before using the LED package substrates and LED encapsulation structure, it is necessary first to encapsulate base to entire LED
The simple knowledge that bottom and LED encapsulation structure carry out in structure will be fixed with the dress of firm banking 1 when this apparatus is used first
It sets substrate 2 and is placed on metope, screw is fixed by screw hole 13 later, later screw up LED light bottom in encapsulation fluting 3
In, while making the groove face through slot 4 of LED light bottom, it presses down on be vertically arranged buckle 8 later, make the pressure effect for being vertically arranged buckle 8
On the first fixture block 601, so that the second fixture block 602 on horizontal buckle 6 be made to be fastened in the groove of LED light bottom, press simultaneously
Briquetting 11 is pressed, by the effect of compressed spring 10, to make to compress snap-fastener 9 through fixed block 12, is fixed under fixed block 12
Side, by the effect of compressed spring 10, makes to compress the disengaging fixed block 12 of snap-fastener 9, pulls up and be vertically arranged card when pressing briquetting 11
Button 8, so that the second fixture block 602 on horizontal buckle 6 be made to be detached from the groove of LED light bottom, later will by the effect of spring 7
LED light bottom opposite direction turns disengaging encapsulation fluting 3, can easily be dismantled very much, is not described in detail in this explanation
Content belongs to the prior art well known to professional and technical personnel in the field.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of LED package substrates and LED encapsulation structure, including firm banking (1), horizontal buckle (6), it is vertically arranged buckle (8), pressure
Contracting spring (10), fixed block (12) and screw hole (13), it is characterised in that：The firm banking (1) is fixed on device substrate (2) bottom
Portion, and device substrate (2) bosom position offers encapsulation fluting (3), corresponding encapsulation fluting inside described device substrate (2)
(3) outer fix offers through slot (4), and offers buckle slot (5) on the outside of corresponding through slot (4) inside device substrate (2), described
Horizontal buckle (6) traverse is placed in through slot (4), and horizontal buckle (6) is internally provided with spring (7), described to be vertically arranged buckle (8)
It is vertically arranged in horizontal buckle (6) top position in buckle slot (5), and is vertically arranged buckle (8) upper end position and is fixed with compression snap-fastener
(9), compressed spring (10) setting is in compression snap-fastener (9), and compresses snap-fastener (9) end positions and be fixedly connected with briquetting
(11), the fixed block (12) is fixed on device substrate (2) upper surface, and the screw hole (13) is provided with table on firm banking (1)
Face.
2. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：The encapsulation fluting
(3) internal is helicitic texture, and the size of encapsulation fluting (3) is consistent with the size of LED light bottom.
3. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：The through slot (4),
It is connected between buckle slot (5) and encapsulation fluting (3), and the longitudinal central axis of through slot (4) and buckle slot (5) about encapsulation fluting (3)
Line is symmetrical.
4. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：The buckle slot
(5) it is connected between encapsulation fluting (3) and corresponding through slot (4).
5. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：The horizontal buckle
It (6) include the first fixture block (601) and the second fixture block (602), and the both ends of horizontal buckle (6) are respectively fixed with the first fixture block
(601) and the second fixture block (602), and the first fixture block (601) surface is smooth structure.
6. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：It is described to be vertically arranged buckle
(8) bottom is semi-circular structure, and the size for being vertically arranged buckle (8) bottom matches with the size of the first fixture block (601).
7. a kind of LED package substrates according to claim 1 and LED encapsulation structure, it is characterised in that：The compression snap-fastener
(9) stretching structure is constituted between compressed spring (10), and compressed spring (10) maximum elongation is greater than 2 fixed blocks (12)
The distance between, and the distance between less than 2 fixed blocks (12) of compressed spring (10) the smallest elongation.
8. a kind of LED package substrates and LED encapsulation structure described in -7 according to claim 1, it is characterised in that：Fixed block (12)
Be provided with altogether (four), and per (2 fixed blocks) (12) be one group, and 2 groups of fixed blocks (12) be uniformly arranged on compression by
It detains above (9).
9. a kind of LED package substrates and LED encapsulation structure described in -8 according to claim 1, it is characterised in that：Screw hole (13) is equal
It is even to be distributed on firm banking (1), and screw hole (13) is distributed in circular ring shape.
10. a kind of LED package substrates and LED encapsulation method, it is characterised in that：Using the LED package substrates and LED encapsulation knot
Before structure, it is necessary first to the simple knowledge in structure is carried out to entire LED package substrates and LED encapsulation structure, when the use dress
When setting, the device substrate 2 for being fixed with firm banking 1 is placed on metope first, screw is fixed by screw hole 13 later,
LED light bottom is screwed up in encapsulation fluting 3 later, while making the groove face through slot 4 of LED light bottom, is pressed down on later
It is vertically arranged buckle 8, acts on the pressure for being vertically arranged buckle 8 on first fixture block 601, to make the second fixture block 602 on horizontal buckle 6
It is fastened in the groove of LED light bottom, while pressing briquetting 11, by the effect of compressed spring 10, to make to compress snap-fastener 9
Through fixed block 12, be fixed on 12 lower section of fixed block, when pressing briquetting 11, by the effect of compressed spring 10, make compression by
Button 9 is detached from fixed block 12, pulls up and is vertically arranged buckle 8, by the effect of spring 7, to make the second fixture block on horizontal buckle 6
602 be detached from LED light bottoms groove, later by LED light bottom opposite direction turn disengaging encapsulation fluting 3, can very easily into
Row disassembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810561416.9A CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810561416.9A CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108843988A true CN108843988A (en) | 2018-11-20 |
| CN108843988B CN108843988B (en) | 2020-11-13 |
Family
ID=64210641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810561416.9A Active CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108843988B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110510287A (en) * | 2019-08-27 | 2019-11-29 | 许华光 | A kind of refuse container and rubbish topple over method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110510287A (en) * | 2019-08-27 | 2019-11-29 | 许华光 | A kind of refuse container and rubbish topple over method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108843988B (en) | 2020-11-13 |
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