CN108831828B - Flexible electronic device applicable to various surfaces and preparation method thereof - Google Patents
Flexible electronic device applicable to various surfaces and preparation method thereof Download PDFInfo
- Publication number
- CN108831828B CN108831828B CN201810570994.9A CN201810570994A CN108831828B CN 108831828 B CN108831828 B CN 108831828B CN 201810570994 A CN201810570994 A CN 201810570994A CN 108831828 B CN108831828 B CN 108831828B
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- conductive electrode
- electrode layer
- functional layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 274
- 239000000758 substrate Substances 0.000 claims abstract description 225
- 239000002346 layers by function Substances 0.000 claims abstract description 120
- 238000000034 method Methods 0.000 claims abstract description 69
- 239000012790 adhesive layer Substances 0.000 claims abstract description 49
- 230000008569 process Effects 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 22
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 239000001301 oxygen Substances 0.000 claims description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- -1 temperature Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 4
- 239000008204 material by function Substances 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 21
- 239000002070 nanowire Substances 0.000 description 15
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 11
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000010023 transfer printing Methods 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 8
- 230000002209 hydrophobic effect Effects 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000001962 electrophoresis Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000002207 thermal evaporation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 239000011173 biocomposite Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910021392 nanocarbon Inorganic materials 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003828 vacuum filtration Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
Abstract
The invention discloses a flexible electronic device applicable to various surfaces and a preparation method thereof, wherein the preparation method of the flexible electronic device comprises the following steps: preparing a patterned conductive electrode layer on a first substrate, wherein the first substrate has an adjustable surface energy and viscoelastic properties; transferring the conductive electrode layer onto an adhesive layer of a second substrate, wherein the second substrate is a flexible substrate; one or more functional layers are covered on the conductive electrode layer transferred to the adhesion layer, so that the problem that the integrity of components is easily damaged in the transfer process is solved, the quality of the transfer technology is improved, the flexible electronic device is easily prepared, and the preparation cost is saved.
Description
Technical Field
The embodiment of the invention relates to the technical field of flexible electronic devices, in particular to a flexible electronic device capable of being applied to various surfaces and a preparation method thereof.
Background
Due to the advantages of being bendable, suitable for solution state manufacturing process, high in sensitivity and the like, the flexible electronic device based on the low-dimensional material is widely concerned in the application of wearable sensors. Compared with the corresponding bulk material, the nano semiconductor material has higher surface-volume ratio, so that the nano semiconductor material is more sensitive to the change of environmental factors such as light, electricity, heat, humidity, magnetic field and the like, and is very suitable for the preparation of sensors. In addition, at present, the conventional transparent electrode indium tin oxide is relatively high in price and easy to crack, the metal nanowire has the advantages of being bendable, good in conductivity, relatively high in light transmittance and the like, and the metal nanowire is considered to replace indium tin oxide to serve as a transparent electrode and is applied to the preparation of a flexible electronic device. Therefore, the preparation of flexible electronic devices by using semiconductor nano materials and metal nanowire electrodes is receiving extensive attention and research.
One of the technologies for manufacturing flexible electronic devices based on nanomaterials is a method for transferring a target assembly on a primary substrate to a target substrate by a viscoelastic stamp. The transfer technique needs to take into account the surface energy of the respective contact surfaces, the surface roughness and the kinetic control of the adhesion. In order to ensure that the target assembly is smoothly transferred onto the target substrate, an adhesive is usually introduced in the transfer process, but the liquid adhesive may form strong adhesion with the original substrate, and the target assembly is partially transferred into the target substrate, so that the target assembly is damaged and fails to be transferred, or the cured adhesive loses viscosity and cannot be transferred onto the target substrate, so that the transfer is unsuccessful.
Disclosure of Invention
The invention provides a flexible electronic device applicable to various surfaces and a preparation method thereof, so that the flexible electronic device can be simply and completely prepared by applying a transfer printing technology, and the flexible sensor can be worn simply and conveniently.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a flexible electronic device, where the method includes:
preparing a patterned conductive electrode layer on a first substrate, wherein the first substrate has adjustable surface energy and viscoelasticity;
transferring the conductive electrode layer to an adhesion layer of a second substrate, wherein the second substrate is a flexible substrate;
and covering one or more functional layers on the conductive electrode layer transferred to the adhesion layer, wherein the functional layers comprise optical, mechanical, electrical, chemical, temperature, gas, humidity and acoustic sensing functional materials and electrophoretic materials applied to electronic paper.
In a second aspect, an embodiment of the present invention further provides a flexible electronic device, where the flexible electronic device includes: a second substrate, an adhesion layer, a conductive electrode layer, and a functional layer, wherein,
the second substrate is a flexible substrate, and one or two surfaces of the second substrate are provided with adhesive layers;
the conductive electrode layer is positioned on the adhesion layer, wherein the conductive electrode layer is a patterned conductive electrode layer;
the functional layers are located on the conductive electrode layer, and one or more of the functional layers are located on the conductive electrode layer.
The flexible electronic device applicable to various surfaces and the preparation method thereof provided by the embodiment of the invention have the advantages that the second substrate with the adhesive layer is used, the conductive electrode layer prepared on the first substrate with viscoelasticity is simply and completely transferred to the second substrate, and one or more functional layers are covered on the conductive electrode layer and are used for measuring the change of the external physical quantity. Therefore, the problem that the integrity of the device is easily damaged in the transfer printing process is well solved, the quality of the transfer printing technology is improved, the flexible electronic device is simply prepared, and the preparation cost is saved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a flexible electronic device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of transferring a conductive electrode layer onto an adhesion layer of a second substrate according to an embodiment of the present invention;
fig. 3 is a first flowchart of a method for manufacturing a flexible electronic device according to a second embodiment of the present invention;
fig. 4 is a second flowchart of a method for manufacturing a flexible electronic device according to a second embodiment of the present invention;
fig. 5 is a third flowchart of a method for manufacturing a flexible electronic device according to the second embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a flexible electronic device according to a third embodiment of the present invention;
fig. 7 is a flowchart of a method for manufacturing a flexible electronic device according to a fourth embodiment of the present invention;
fig. 8 is a schematic structural diagram of a flexible electronic device according to a fifth embodiment of the present invention;
fig. 9 is another schematic structural diagram of a flexible electronic device according to a fifth embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive faculty, are within the scope of the invention.
Example one
The solution process described in the embodiments of the present invention is a generic term of methods of various solutions used in preparing each film layer of a flexible electronic device, and for example, the solution process may include spin coating, knife coating, electrospray coating, slit coating, stripe coating, dip coating, roll coating, inkjet printing, nozzle printing, and bump printing. Specifically, these solution processes belong to the prior art, and those skilled in the art can specifically select various parameters in the preparation process according to actual situations, and the specific operation process of each method of the embodiments of the present invention is not described in detail.
It should be noted that the vacuum process methods such as magnetron sputtering, vacuum thermal evaporation, organic vapor deposition and the like described in the embodiments of the present invention also belong to the prior art, and those skilled in the art can specifically select each parameter in the preparation process according to the actual situation, and the specific operation process of the embodiments of the present invention is not described in detail.
Fig. 1 is a flowchart of a method for manufacturing a flexible electronic device according to an embodiment of the present invention, as shown in fig. 1, the method includes the following steps:
s110, preparing a patterned conductive electrode layer on the first substrate.
In this embodiment, the first substrate is characterized by adjustable surface energy and viscoelasticity. The first substrate may be a Polydimethylsiloxane (PDMS) substrate, which has good viscoelasticity and good chemical inertness; the PDMS has low surface energy and hydrophobic property, so that a conductive electrode layer prepared on the surface of the PDMS is easy to tear off without destroying the integrity of the conductive electrode layer, and after hydrophilic treatment, the surface energy of the PDMS is changed, and the hydrophobic property is changed into hydrophilic property. The viscoelasticity is that the response of a high molecular polymer to stress due to the properties of a long chain structure and macromolecular motion has the dual characteristics of an elastic solid and a viscous fluid, and the PDMS as the high molecular polymer has good viscoelasticity and can be well adhered to a conductive electrode layer prepared on the surface of the PDMS, and when the conductive electrode layer needs to be stripped, the elasticity of the PDMS can ensure that the conductive electrode layer cannot be torn during stripping. When the PDMS pure material and the curing agent are mixed according to different proportions and then dried, PDMS substrates with different viscoelasticity can be obtained.
Of course, in specific embodiments, the first substrate may also be other substrate materials with viscoelastic properties and adjustable surface energy, and when the first substrate is hydrophobic with viscoelastic properties and low surface energy, the surface energy of the first substrate may be changed by ultraviolet light, ozone and/or plasma treatment to obtain a hydrophilic region; when the first substrate is hydrophilic with viscoelasticity and high surface energy, the surface energy of the first substrate can be changed by hydrophobization treatment to obtain a hydrophobic region. When other materials are used as the first substrate, the surface energy of the material should be low, and patterned hydrophilic regions are formed on the first substrate after treatment with ultraviolet light, ozone and/or plasma to alter the surface energy of the material. When the first substrate is uniformly coated with the conductive material, the conductive electrode layer is formed on the hydrophilic region, and the conductive electrode layer is not formed on the non-hydrophilic region, so that the conductive electrode layer is easy to form a film on the surface of the first substrate and is not easy to damage when being peeled off. This embodiment is merely an example of the conductive electrode layer to explain the process of manufacturing the device on the first substrate, and other devices, such as a functional layer, etc., may be manufactured on the first substrate by using the same principle.
In this embodiment, a conductive electrode layer is prepared on a first substrate by using a nano silver wire as a conductive electrode material and using a spin coating method. Firstly, fixing a PDMS substrate with a patterned hydrophilic region on a spin coater, dripping nano-silver dispersion liquid on the center of the PDMS substrate, rotating at the speed of 2500 rpm to form a nano-silver conductive layer on the PDMS substrate, placing the PDMS substrate with the conductive layer on a hot plate, and drying at 70 ℃ to completely evaporate the dispersant in the nano-silver dispersion liquid, thereby completing the patterning preparation of the conductive electrode layer on the first substrate. The patterned conductive electrode layer can be an interdigital patterned conductive electrode layer, and the interdigital patterned conductive electrode layer has the advantages that the conductive electrode layer is formed by a pair of interdigital parallel electrodes which are mutually opposite and staggered like fingers or combs and are formed on the same plane, so that an electrode layer does not need to be prepared on the other side of the functional layer in subsequent experiments, the preparation process is simplified, and the preparation cost is saved.
In this embodiment, the preparation of the conductive electrode layer is not limited to spin coating, but may be prepared by other solution methods, such as blade coating, dip coating, ink jet printing, or by vacuum processes, for example: magnetron sputtering, organic vapor deposition, thermal evaporation, and the like. The preparation method using the solution has the advantages of simple preparation process, low cost, large-area preparation and the like, and has higher market value; the vacuum process has the advantages of good uniformity, high cost, high environmental cleanliness and the like.
And S120, transferring the conductive electrode layer to an adhesion layer of a second substrate.
The second substrate is a flexible substrate, and the second substrate is provided with an adhesive layer, wherein the adhesive layer has good adhesiveness. Preferably, the material of the adhesion layer may be Optically Clear Adhesive (OCA), and the OCA has the characteristics of good adhesiveness, colorless transparency, high light transmittance and the like, and is one of the preferable materials as the adhesion layer.
The conductive materials in the conductive electrode layer are distributed in a net structure, the conductive electrode layer is made of nano-wire conductive materials such as nano silver wires, nano gold wires and nano copper wires or nano tubular conductive materials such as nano carbon tubes, the nano-wire conductive materials are uniformly formed into a film on the substrate and then distributed in a net structure, so that an area, which is not covered by the conductive materials in the net structure, on the adhesion layer has adhesion to the functional layer, and the functional layer prepared on the third substrate can be smoothly transferred to the conductive electrode layer. Certainly, the material of the conductive electrode layer can also be a nanoparticle conductive material, and when the conductive electrode material is in a nanoparticle shape, the conductive electrode layer is a patterned electrode layer, so that the adhesion layer which is not covered by the conductive electrode layer has an enough area to be in contact with the functional layer, and the functional layer can be completely adhered to the conductive electrode layer and the adhesion layer to smoothly complete transfer.
Fig. 2 is a schematic diagram of transferring a conductive electrode layer onto an adhesive layer of a second substrate according to a first embodiment of the present invention, and as shown in fig. 2, a second substrate 4 having an adhesive layer 3 is covered on a first substrate 1 having the conductive electrode layer 2, and the adhesive layer 3 of the second substrate 4 is closely attached to the conductive electrode layer 2 on the first substrate 1, so that the conductive electrode layer 2 is completely adhered by the adhesive layer 3 on the second substrate 4, and the second substrate 4 having the adhesive layer 3 is peeled off from the first substrate 1. Since the adhesion force of the adhesion layer 3 on the second substrate 4 to the conductive electrode layer 2 is greater than the adhesion force of the first substrate 1 to the conductive electrode layer 2, the conductive electrode layer 2 (shown by a dotted line in fig. 2) originally located on the first substrate 1 is completely transferred onto the adhesion layer 3 of the second substrate 4 in the peeling process, without destroying the integrity of the conductive electrode layer 2. Wherein, the size of the adhesion layer 3 is larger than or equal to the size of the conductive electrode layer 2.
In the embodiment of the present invention, the conductive electrode layer is transferred to the adhesive layer of the second substrate by using a transfer technique, wherein the second substrate is an adhesive tape. The adhesive tape itself is provided with an adhesive layer such as an optical transparent adhesive tape, and the adhesive tape can be a single-sided adhesive tape or a double-sided adhesive tape.
Preferably, the second substrate 4 is a flexible substrate, and the material of the flexible substrate may be polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, polymethacrylate, polyacrylonitrile, polyether ether ketone, polyether sulfone, vinyl alcohol, polycarbonate, polyoxymethylene resin, polyurethane, polyolefin, polyethylene, metal foil, ultra-thin glass, paper substrate, silk fabric material, or bio-composite material, and the like.
And S130, covering one or more functional layers on the conductive electrode layer transferred to the adhesion layer.
The functional layer mainly is a functional material which has specific functions after the functions of light, electricity, magnetism, heat, chemistry, biochemistry and the like are performed, the functional layer can be used for detecting the change of environmental factors such as physics, chemistry, biology and the like in the environment, the conversion between energy is realized by converting unmeasurable environmental variables into measurable physical quantities, and the functional layer can be specifically prepared into an optical detector, a pressure sensor, a humidity sensor, a temperature sensor and the like.
And covering the functional layer on the conductive electrode layer to ensure that the conductive electrode layer is in good contact with the functional layer, wherein the functional layer can be transferred to the conductive electrode layer after being prepared by a third substrate or can be directly prepared on the conductive electrode layer.
Illustratively, paper-based electronic paper is taken as the flexible electronic device, wherein the second substrate is a paper-based substrate, and the functional layer is an electronic paper electrophoretic material. The paper-based substrate is provided with an adhesive layer on at least one surface, a conductive electrode layer is prepared on a first substrate, such as a PDMS substrate, the conductive electrode layer can be a surface electrode layer or a patterned electrode layer, and the conductive electrode layer is transferred to the adhesive layer of the paper-based substrate. And then preparing an electrophoresis material layer on a third substrate such as a PDMS substrate, transferring the electrophoresis material layer to a paper-based substrate, covering another conductive electrode layer on the electrophoresis material layer transferred to the paper-based substrate, preparing a conductive electrode layer and a functional layer on the first substrate, and forming a film on the conductive electrode layer and the functional layer on the surface of the first substrate by using the adjustable surface energy and the viscoelasticity property of the first substrate, wherein the conductive electrode layer and the functional layer are not easily damaged during stripping, so that the paper-based electronic paper flexible device is prepared by applying a high-quality and quick transfer printing technology.
The embodiment of the invention provides a preparation method of a flexible electronic device, which comprises the steps of preparing a conductive electrode layer on a first substrate with viscoelasticity, completely transferring the conductive electrode layer onto a second substrate through an adhesive layer with good adhesion on the second substrate, and covering one or more functional layers on the conductive electrode layer transferred onto the adhesive layer, so that the transfer quality is well improved, the integrity of the device in the transfer process is improved, the preparation flow of the device is simplified, and the manufacturing cost is saved.
It should be noted that the method for manufacturing the flexible electronic device further includes: the method includes the steps of firstly transferring one or more functional layers onto an adhesive layer on a second substrate, and then transferring a conductive electrode layer onto the functional layers on the second substrate, wherein the conductive electrode layer is tightly attached to the adhesive layer on the second substrate, so that the conductive electrode layer can be completely transferred onto the second substrate, as long as enough space is available on the adhesive layer on the second substrate, which is covered with the functional layers, and the method is not limited to the preparation sequence that the conductive electrode layer is firstly transferred onto the adhesive layer on the second substrate, and then one or more functional layers are covered on the conductive electrode layer.
On the basis of the above embodiment, the step S110 of preparing the patterned conductive electrode layer on the first substrate may further include the steps of:
s1101, placing a mask plate on the first substrate.
Wherein, the pattern of the exposure area of the mask plate corresponds to the pattern of the conductive electrode layer.
S1102, processing the first substrate by adopting ultraviolet ozone or plasma, changing the hydrophilicity and hydrophobicity of the exposure area of the first substrate, and forming a hydrophilic area in the exposure area of the first substrate.
After being treated by ultraviolet, ozone or plasma, the exposed area on the surface of the first substrate is subjected to chemical reaction to generate hydrophilic groups to form a hydrophilic area, and for the unexposed area, the treatment of ultraviolet ozone or plasma is not carried out, so that the hydrophilic groups are not generated, and the surface energy is not changed.
S1103, uniformly coating the hydrophilic region by using a solution process to form a patterned conductive electrode layer.
Since the hydrophilic region is rich in hydrophilic groups, the aqueous substance is easily adsorbed on the region, whereas for the non-exposed region, the hydrophilic substance is not adsorbed due to the absence or presence of only a very small amount of hydrophilic groups. The conductive material is dispersed in an aqueous solvent, and when the conductive material is uniformly coated on the first substrate, the hydrophilic groups in the hydrophilic regions adsorb the aqueous substance, so that the conductive material is adsorbed on the hydrophilic regions due to the dispersion in the aqueous solvent, while the non-hydrophilic regions are free of the conductive material, thereby forming a patterned conductive electrode layer.
The steps can be specifically as follows: placing a mask plate corresponding to the pattern of the conductive electrode layer on a first substrate, placing the first substrate with the mask plate in an ultraviolet ozone processor or a plasma processor for a preset time, wherein the preset time can be 10 minutes, 15 minutes or 20 minutes and the like, so that the property of an exposure area on the first substrate which is not shielded by the mask plate is changed from hydrophobic to hydrophilic, from low surface energy to high surface energy, and a patterned hydrophilic area is formed in the exposure area of the first substrate. And uniformly coating a conductive material on the first substrate, wherein the conductive material is adsorbed on the hydrophilic area, so that a patterned conductive electrode layer is formed.
Example two
Fig. 3 is a first flowchart of a manufacturing method of a flexible electronic device according to a second embodiment of the present invention, and the manufacturing method according to the second embodiment is embodied on the basis of the first embodiment. Specifically, the preparation method comprises the following steps:
s210, preparing a patterned conductive electrode layer on the first substrate.
And S220, transferring the conductive electrode layer to an adhesion layer of a second substrate.
Steps S210 and S220 are the same as steps S110 and S120 in the above embodiments, and are not described again here.
S230, preparing one or more functional layers on a third substrate, and transferring the one or more functional layers to the conductive electrode layer on the adhesion layer.
And preparing one or more functional layers on a third substrate by using a solution process or a vacuum process, wherein the third substrate can be the same as or different from the first substrate, and preferably, the third substrate is a material with the same chemical property as the first substrate and serves as a substrate. The third substrate has a hydrophobic property, and one or more functional layers are prepared on the third substrate by using a method of a solution process such as blade coating, spin coating and the like, or a method of a vacuum process such as thermal evaporation and the like. Optionally, one or more functional layers are horizontally covered on the conductive electrode layer to realize that different functional layers are prepared in different areas of the same conductive electrode layer, so as to realize integration of multiple sensing devices.
Illustratively, this example takes a photosensitive layer of cadmium sulfide as an example to explain the preparation of the functional layer. In the embodiment, cadmium sulfide nanowires are used as functional materials, and Anodic Aluminum Oxide (AAO) is used as a substrate. First, an AAO membrane having a nano-pore structure of 200 nm was coated with octadecyltrichlorosilane (formula: C)18H37Cl3Si, octadeceltrichosilane, OTS) was pre-modified to form a hydrophobic surface. Diluting a cadmium sulfide dispersion liquid with a certain concentration in ethanol, dropping a proper amount of the diluted cadmium sulfide dispersion liquid into the AAO template subjected to OTS hydrophobic treatment, placing the AAO template in a vacuum filter to realize vacuum filtration of cadmium sulfide nanowire film formation, uniformly dropping PDMS on the film-formed cadmium sulfide nanowire, enabling the PDMS to be a viscous liquid and to be self-uniformly formed into a film after standing, tearing off the PDMS film adhered with the cadmium sulfide nanowire from the AAO template after drying and forming the PDMS into a film, enabling the cadmium sulfide photosensitive layer to be completely stripped from the AAO template due to hydrophobic treatment of the AAO template and viscoelasticity of the PDMS, covering the cadmium sulfide photosensitive layer on a conductive electrode layer on a second substrate, and allowing sulfur to be contained in the conductive electrode layerThe cadmium sulfide nano wire photosensitive layer is tightly adhered to the conductive electrode layer, so far, the cadmium sulfide nano wire photosensitive layer is already prepared on the conductive electrode layer as a functional layer. If the size of the functional layer is controlled, the pressure sensing layer, the humidity sensing layer and the like are prepared by the same method, the functional layers are horizontally placed in different areas of the conductive layer to realize the flexible sensing device integrating multiple functions, and the functional layers can be laminated on the conductive electrode layer.
On the basis of the foregoing embodiment, fig. 4 is a second flowchart of a manufacturing method of a flexible electronic device according to a second embodiment of the present invention, as shown in fig. 4, step S230 in the manufacturing method may specifically be:
s2301, preparing one or more functional layers on a third substrate, enabling the functional layers to be tightly attached to the adhesion layer with the conductive electrode layer, and transferring the one or more functional layers to the conductive electrode layer on the adhesion layer.
And preparing one or more functional layers on the third substrate by adopting a solution state process or a vacuum process, and transferring the functional layers on the third substrate to the conductive electrode layer on the second substrate by adopting a transfer printing technology. One or more functional layers on the third substrate are closely attached to the adhesion layer with the conductive electrode layer, and the conductive electrode layer is a patterned electrode layer and the conductive material is distributed in a net structure, so that the functional layers on the third substrate and the adhesion layer can be perfectly and closely attached to each other, and the bonding force between the functional layers and the adhesion layer is larger than that between the functional layers and the third substrate, so that the one or more functional layers on the third substrate are smoothly and completely transferred to the conductive electrode layer on the adhesion layer.
On the basis of the foregoing embodiment, fig. 5 is a third flowchart of a manufacturing method of a flexible electronic device according to the second embodiment of the present invention, and as shown in fig. 5, step S230 in the manufacturing method may specifically be:
s2302, preparing one or more functional layers on a third substrate, peeling the functional layers from the third substrate, and covering the functional layers on the conductive electrode layer transferred to the adhesive layer.
And preparing one or more functional layers on the third substrate by adopting a solution state process or a vacuum process, and carrying out glass separation on the one or more functional layers from the third substrate by adopting a separation technology, and covering the one or more functional layers on the conductive electrode layer on the second substrate. Because the conductive electrode layer is a patterned electrode layer and the conductive material is formed into nanowires or nanotubes distributed in a net structure, the functional layer on the third substrate can be perfectly and tightly attached to the adhesion layer and covers the conductive electrode layer on the adhesion layer. The separation technique adopted in the present embodiment is the prior art, and is not described herein again.
According to the embodiment of the invention, the patterned conductive electrode layer is prepared on the first substrate, the conductive electrode layer is transferred to the adhesion layer of the second substrate, the one or more functional layers are prepared on the third substrate, and the one or more functional layers are transferred to the conductive electrode layer on the adhesion layer, so that the flexible electronic device is simply and completely prepared by applying a transfer printing technology, and the flexible sensor is simply and conveniently wearable.
EXAMPLE III
Fig. 6 is a flowchart of a method for manufacturing a flexible electronic device according to a third embodiment of the present invention, where the method for manufacturing a flexible electronic device according to the third embodiment is embodied on the basis of the above-mentioned embodiments. Specifically, the preparation method comprises the following steps:
s310, preparing a patterned conductive electrode layer on the first substrate.
And S320, transferring the conductive electrode layer to an adhesion layer of a second substrate.
Steps S310 and S320 are the same as steps S110 and S120 in the above embodiments, and are not described again here.
S330, preparing one or more functional layers on the conductive electrode layer transferred to the adhesion layer through a solution state process or a vacuum process.
In this embodiment, the functional layers are prepared without transfer from another substrate to the conductive electrode layer using transfer techniques, but one or more functional layers are prepared directly on the conductive electrode layer. For example, one or more functional layers, such as a temperature sensing layer, a photosensitive layer, a pressure sensing layer, and the like, may be formed on the conductive electrode layer on the second substrate by a solution process or a vacuum process.
According to the embodiment of the invention, the patterned conductive electrode layer is prepared on the first substrate, the conductive electrode layer is transferred to the adhesion layer of the second substrate, and one or more functional layers are prepared on the conductive electrode layer transferred to the adhesion layer through a solution state process or a vacuum process, so that the flexible electronic device is simply and completely prepared by applying a transfer printing technology, and the flexible sensor is simply and conveniently wearable.
Example four
Fig. 7 is a flowchart of a method for manufacturing a flexible electronic device according to a fourth embodiment of the present invention, and as shown in fig. 7, the method includes the following steps:
s410, preparing a patterned conductive electrode layer on the first substrate.
Step S410 is the same as step S110, and is not described herein again.
And S420, preparing a water and oxygen barrier layer on the second substrate.
And preparing a water and oxygen barrier layer between the second substrate and the adhesion layer to prevent water, oxygen, impurities and the like from entering the flexible electronic device, wherein the water and oxygen barrier layer can be polyvinylidene fluoride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), Polyamide (PA), polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), Polyimide (PI) and the like.
It should be noted that step S420 is not necessary, and when the adhesion layer on the second substrate has the function of water and oxygen barrier, the adhesion layer simultaneously serves as a water and oxygen barrier layer; when the adhesion layer is prepared on the second substrate, the adhesion layer has adhesion property and good water and oxygen barrier capability by adding the filler or other high polymer materials. When the material of the adhesion layer does not have the function of the water and oxygen barrier, a water and oxygen barrier layer may be prepared between the second substrate 4 and the adhesion layer 3, and step S420 is performed. Illustratively, when
S430, preparing an adhesion layer on at least one surface of the second substrate.
The material of the adhesion layer can be Optical Clear Adhesive (OCA), instant Adhesive, epoxy resin bonding glue, anaerobic glue, ultraviolet light curing glue, hot melt Adhesive, pressure sensitive Adhesive, latex and other materials with Adhesive force, and the uniform adhesion layer can be prepared on the second substrate by adopting modes of spin coating, blade coating and the like.
It should be noted that step S430 is not necessary, and when an adhesive layer is already provided on the second substrate, the adhesive layer does not need to be prepared, where the second substrate may be a flexible substrate with an optically transparent adhesive, such as a transparent adhesive tape or a double-sided adhesive tape.
S440, transferring the conductive electrode layer to an adhesion layer of a second substrate.
S450, covering one or more functional layers on the conductive electrode layer transferred to the adhesion layer.
Steps S440 and S450 are the same as steps S120 and S130 of the first embodiment, and are not described again here.
S460, preparing a packaging protective layer on the functional layer, and covering the second substrate, the adhesive layer, the conductive electrode layer and the functional layer.
And preparing a packaging protective layer on the functional layer to cover the second substrate, the adhesive layer, the conductive electrode layer and the functional layer so as to package and protect the whole flexible electronic device, wherein the packaging protective layer can be polyester such as polyvinylidene fluoride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), Polyamide (PA), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and the like, Polyimide (PI) and the like.
It should be noted that the first substrate and the second substrate may be separately and independently prepared, and thus the sequence of the steps S310, S320, and S330 may be different.
The embodiment of the invention provides a preparation method of a flexible electronic device, which comprises the steps of preparing a conductive electrode layer on a first substrate with viscoelasticity, preparing a water-oxygen barrier layer and an adhesive layer on a second substrate, completely transferring the conductive electrode layer to the second substrate through the adhesive layer with good adhesion, covering one or more functional layers on the conductive electrode layer transferred to the adhesive layer, and preparing an encapsulation protective layer on the functional layers, so that the transfer quality is well improved, the integrity of a transfer pattern is improved, the preparation flow of the device is simplified, and the manufacturing cost is saved.
EXAMPLE five
According to a second aspect of the invention, embodiments of the invention also provide a flexible electronic device. Fig. 8 is a schematic structural diagram of a flexible electronic device according to a fifth embodiment of the present invention, and as shown in fig. 8, the flexible electronic device is prepared according to the method provided in the foregoing embodiment. The flexible electronic device includes: a second substrate 4, an adhesive layer 3, a conductive electrode layer 2 and a functional layer 5. Wherein, the second substrate 4 is a flexible substrate, and one side or two sides of the second substrate 4 are provided with adhesive layers 3; the conductive electrode layer 2 is positioned on the adhesion layer 4, wherein the conductive electrode layer 2 is a patterned conductive electrode layer; the functional layer 5 is located on the conductive electrode layer 2, and one or more functional layers 5 are provided. As shown in fig. 8, a functional layer of the flexible electronic device completely covers the conductive electrode layer, and of course, a plurality of functional layers can be stacked to realize a flexible electronic device integrated with a plurality of sensing functions. Fig. 9 is another schematic structural diagram of a flexible electronic device according to a fifth embodiment of the present invention. As shown in fig. 9, one functional layer of the flexible electronic device partially covers the conductive electrode layer, and a plurality of functional layers cover different regions of the same conductive electrode layer, where the functional layers may be functional layers that implement the same function or functional layers that implement different functions, so as to implement integration of multiple sensing functions on the same flexible electronic device.
Wherein a conductive electrode layer is prepared on a first substrate having adjustable surface energy and viscoelasticity, the conductive electrode layer is entirely transferred onto a second substrate through an adhesion layer having good adhesion on the second substrate, and then one or more functional layers are coated on the conductive electrode layer transferred onto the adhesion layer.
The conductive materials in the conductive electrode layer are distributed in a net structure, the conductive electrode layer is made of nano-wire conductive materials such as nano silver wires, nano gold wires and nano copper wires or nano tubular conductive materials such as nano carbon tubes, the nano-wire conductive materials are uniformly formed into a film on the substrate and then distributed in a net structure, so that an area, which is not covered by the conductive materials in the net structure, on the adhesion layer has adhesion to the functional layer, and the functional layer prepared on the third substrate can be smoothly transferred to the conductive electrode layer.
Optionally, the conductive electrode layer 2 may be made of a material having conductivity, such as metal, graphene, carbon nanotube, etc., and the shape of the material may be nanoparticles, nanowires, nanotubes, or nanoblocks, etc., and when the nanomaterial is nanoparticles, the conductive electrode layer is a patterned electrode layer, so that the functional layer can be completely adhered to the conductive electrode layer and the adhesion layer.
Optionally, the material of the second substrate 4 may be: flexible substrates such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, polymethacrylate, polyacrylonitrile, polyetheretherketone, polyethersulfone, vinyl alcohol, polycarbonate, polyoxymethylene resin, polyurethane, polyolefin, polyethylene, metal foil, ultra-thin glass, paper substrates, silk fabric materials, or biocomposite materials, but may also be rigid substrates.
Alternatively, when there are a plurality of functional layers 5, the functional layers 5 are stacked on the conductive electrode layer 2, or the functional layers 5 are horizontally disposed on different regions of the conductive electrode layer 2
The embodiment of the invention provides a flexible electronic device which comprises a second substrate, an adhesion layer, a conductive electrode layer and a functional layer, wherein the second substrate is a flexible substrate, the adhesion layer is prepared on one surface or two surfaces of the second substrate, the conductive electrode layer is positioned on the adhesion layer, the conductive electrode layer is a patterned conductive electrode layer and positioned on the conductive electrode layer, and one or more functional layers are arranged on the functional layer, so that the transfer printing quality is well improved, the integrity of a transfer printing pattern is improved, the preparation flow of the device is simplified, and the manufacturing cost is saved.
Optionally, the functional layer 5 includes optical, mechanical, electrical, chemical, temperature, gas, humidity, acoustic sensing functional materials and electrophoretic materials applied to electronic paper, such as optical detection, acceleration detection, electrical induction, gas detection, temperature detection, humidity detection, sound sensing and other functions, may have a sensing function for sensing changes of factors such as light, electricity, magnetism, heat, chemistry, biochemistry and the like in the environment, and may be prepared into an optical sensor, a force sensor, a temperature sensor, a humidity sensor, a chemical sensor, a paper-based electronic paper device and the like.
On the basis of the above embodiment, the flexible electronic device may further include: a water oxygen barrier layer located between the second substrate 4 and the adhesive layer 3. It should be noted that when the adhesive layer on the second substrate has the function of water and oxygen barrier, the adhesive layer simultaneously serves as a water and oxygen barrier, i.e. there is no need to prepare a water and oxygen barrier again, and when the material of the adhesive layer does not have the function of water and oxygen barrier, a water and oxygen barrier can be prepared between the second substrate 4 and the adhesive layer 3. Illustratively, when the flexible electronic device is paper-based electronic paper, since the water and oxygen barrier capability of the paper substrate is weak, and the common optically transparent adhesive as the adhesive layer does not have the high water and oxygen barrier capability, in order to enable the paper-based electronic paper flexible device to work normally, a water and oxygen barrier layer needs to be prepared between the paper substrate and the adhesive layer, or on the other side of the paper substrate without the adhesive layer, so as to ensure the normal work of the paper-based electronic paper.
On the basis of the above embodiment, the flexible electronic device further includes: and the packaging protective layer is positioned on the functional layer and covers the second substrate 4, the adhesive layer 2, the conductive electrode layer 2 and the functional layer 5.
In a preferred embodiment of the invention, the flexible electronic device charges the flexible electronic device using a wireless charging module, a flexible battery and/or a self-contained solar cell. In this embodiment, the wireless charging module is prior art. The battery in the flexible electronic device is a flexible battery and is embedded into the flexible electronic device, and the flexible battery is charged through the wireless charging module, so that the charging can be realized at any time and any place. The flexible electronic device can also comprise a solar cell which is arranged on the flexible electronic device, external solar energy is converted into electric energy, and the electric energy is supplied by solar energy in an auxiliary mode.
On the basis of the embodiment, the flexible electronic device is provided with at least one adhesive layer, so that the flexible sensor can be conveniently adhered to the skin of a human body, detected equipment and instruments, and the flexible electronic device is adhered to the regular or unqualified surface, can be applied to the surfaces of various objects, realizes the test and measurement of functions, does not need an additional fixing device, can be used for preparing the flexible electronic sensor with low cost and large area, integrates various sensing functions, and has the characteristics of light weight, small size, multiple functions and the like.
The above description is only for the preferred embodiment of the present invention and the technical principles applied, but the scope of the present invention is not limited thereto. It will be understood by those skilled in the art that the present invention is not limited to the specific embodiments described herein, and any changes or substitutions that may be easily made by those skilled in the art within the technical scope of the present invention disclosed herein are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention is subject to the protection scope of the appended claims.
Claims (15)
1. A method of making a flexible electronic device, the method comprising:
preparing a patterned conductive electrode layer on a first substrate by a solution state preparation method, forming the conductive electrode layer on a hydrophilic area of the first substrate, and not forming the conductive electrode layer on a non-hydrophilic area; wherein the conductive electrode layer is an interdigital patterned conductive electrode layer, and is obtained by forming interdigital parallel electrodes which are in an interdigital shape or a comb shape and face each other and are staggered on the first substrate together, and the first substrate has adjustable surface energy and viscoelasticity; modifying a surface energy of the first substrate by at least one of ultraviolet light, ozone, plasma treatment, and hydrophobization treatment;
transferring the conductive electrode layer to an adhesion layer of a second substrate, wherein the second substrate is a flexible substrate; the conductive materials in the conductive electrode layer are distributed in a net structure;
covering one or more functional layers on the conductive electrode layer transferred onto the adhesion layer, and utilizing the adhesion of the area, which is not covered by the conductive material with the mesh structure, on the adhesion layer to the functional layers, so that the functional layers prepared on a third substrate in advance are transferred onto the conductive electrode layer from the third substrate; the functional layer comprises optical, mechanical, electrical, chemical, temperature, gas, humidity and acoustic sensing functional materials and electrophoretic materials applied to electronic paper.
2. The method of claim 1, wherein transferring the conductive electrode layer to an adhesion layer of a second substrate comprises:
covering the second substrate with the adhesive layer on the first substrate, and enabling the adhesive layer of the second substrate to be tightly attached to the conductive electrode layer on the first substrate;
and peeling the second substrate with the adhesion layer from the first substrate, so that the conductive electrode layer originally positioned on the first substrate is transferred to the adhesion layer of the second substrate.
3. The production method according to claim 1, wherein the covering of one or more functional layers on the conductive electrode layer transferred onto the adhesion layer comprises:
preparing one or more functional layers on a third substrate, transferring said one or more functional layers to said conductive electrode layer on said adhesion layer.
4. The method of claim 3, wherein said transferring said one or more functional layers to said conductive electrode layer on said adhesion layer comprises:
preparing one or more functional layers on a third substrate, closely attaching the functional layers to the adhesive layer with the conductive electrode layer, and transferring the one or more functional layers to the conductive electrode layer on the adhesive layer; or the like, or, alternatively,
preparing one or more functional layers on a third substrate, peeling the functional layers off the third substrate, and covering the functional layers on the conductive electrode layer transferred to the adhesion layer.
5. The production method according to claim 1, wherein the covering of one or more functional layers on the conductive electrode layer transferred onto the adhesion layer further comprises:
one or more functional layers are prepared on the conductive electrode layer transferred onto the adhesive layer by a solution process or a vacuum process.
6. The method according to claim 1, wherein the preparing the patterned conductive electrode layer on the first substrate comprises:
and forming a patterned hydrophilic area on the first substrate, and uniformly coating the hydrophilic area by using a solution process to form a patterned conductive electrode layer.
7. The method according to claim 6, wherein the forming of the patterned hydrophilic region on the first substrate is in particular:
placing a mask on the first substrate;
and processing the first substrate by adopting ultraviolet light, ozone and/or plasma, changing the hydrophilicity and hydrophobicity of the exposure area of the first substrate, and forming a hydrophilic area on the exposure area of the first substrate.
8. The method according to claim 1, wherein before the transferring the conductive electrode layer onto the adhesive layer of the second substrate, the method further comprises:
an adhesion layer is prepared on at least one surface of the second substrate.
9. The method of manufacturing according to claim 1, further comprising:
a water oxygen barrier layer is prepared between the second substrate and the adhesion layer.
10. The method of manufacturing according to claim 1, further comprising:
and preparing a packaging protective layer on the functional layer to cover the second substrate, the adhesive layer, the conductive electrode layer and the functional layer.
11. A flexible electronic device produced by the method for producing a flexible electronic device according to claim 1, comprising: a second substrate, an adhesion layer, a conductive electrode layer, and a functional layer, wherein,
the second substrate is a flexible substrate, and an adhesion layer is prepared on one surface or two surfaces of the second substrate;
the conductive electrode layer is positioned on the adhesion layer, wherein the conductive electrode layer is a patterned conductive electrode layer;
the functional layers are located on the conductive electrode layer, wherein one or more of the functional layers are located.
12. The flexible electronic device according to claim 11, wherein when the functional layer is plural, a plurality of the functional layers are stacked on the conductive electrode layer, or a plurality of the functional layers are horizontally disposed on different regions of the conductive electrode layer.
13. The flexible electronic device of claim 11, further comprising:
a water oxygen barrier layer between the second substrate and the adhesive layer.
14. The flexible electronic device of claim 11, further comprising:
and the packaging protective layer is positioned on the functional layer and covers the second substrate, the adhesive layer, the conductive electrode layer and the functional layer.
15. The flexible electronic device according to any of claims 11-14, wherein the flexible electronic device is charged using a wireless charging module, a flexible battery and/or a self-contained solar cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570994.9A CN108831828B (en) | 2018-06-05 | 2018-06-05 | Flexible electronic device applicable to various surfaces and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570994.9A CN108831828B (en) | 2018-06-05 | 2018-06-05 | Flexible electronic device applicable to various surfaces and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108831828A CN108831828A (en) | 2018-11-16 |
| CN108831828B true CN108831828B (en) | 2021-01-08 |
Family
ID=64144029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810570994.9A Active CN108831828B (en) | 2018-06-05 | 2018-06-05 | Flexible electronic device applicable to various surfaces and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108831828B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456526A (en) * | 2019-06-27 | 2019-11-15 | 中山大学 | A kind of flexible phasmon modulator of dynamic reconfigurable and preparation method thereof |
| CN110350107B (en) * | 2019-07-15 | 2020-11-06 | 上海大学 | Transferable flexible electrode and preparation method and application thereof |
| CN111063658B (en) * | 2019-12-30 | 2020-09-29 | 清华大学 | Method for producing flexible and extensible electronic device |
| CN111883604B (en) * | 2020-08-11 | 2023-06-13 | 杭州福斯特应用材料股份有限公司 | Photovoltaic module and manufacturing method thereof |
| CN112829479B (en) * | 2020-12-22 | 2021-11-05 | 中国科学院苏州纳米技术与纳米仿生研究所广东(佛山)研究院 | Stamp for fine circuit printing and printing method |
| CN112687548A (en) * | 2020-12-25 | 2021-04-20 | 光华临港工程应用技术研发(上海)有限公司 | Preparation method and structure of transferable flexible interconnection structure |
| CN113855046A (en) * | 2021-10-12 | 2021-12-31 | 华中科技大学 | Intelligent safety helmet for monitoring human body physical signs and brain electrical information and monitoring method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102656016B (en) * | 2009-10-16 | 2015-12-16 | 石墨烯广场株式会社 | Graphene volume to volume printing transferring method, the graphene roll be made up of the method and Graphene volume to volume transfer device |
| KR20130079327A (en) * | 2010-04-02 | 2013-07-10 | 로디아 오퍼레이션스 | Selective nanoparticle assembly systems and methods |
| US20160137507A1 (en) * | 2014-11-19 | 2016-05-19 | Institute For Basic Science | Large-area graphene transfer method |
| CN104779014B (en) * | 2015-03-13 | 2016-08-24 | 深圳市华科创智技术有限公司 | The forming method of conductive pattern |
| CN105470390B (en) * | 2015-11-23 | 2017-12-15 | 苏州大学 | Large area, flexibility, the method for wearable organic nano field of line effect transistor arrays are built by substrate of adhesive tape |
-
2018
- 2018-06-05 CN CN201810570994.9A patent/CN108831828B/en active Active
Non-Patent Citations (1)
| Title |
|---|
| 大功率LED多芯片集成封装的热分析;蚁泽纯等;《半导体光电》;20110615;第32卷(第3期);第320-324段 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108831828A (en) | 2018-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108831828B (en) | Flexible electronic device applicable to various surfaces and preparation method thereof | |
| Yan et al. | Inkjet printing for flexible and wearable electronics | |
| Wang et al. | Standing enokitake-like nanowire films for highly stretchable elastronics | |
| You et al. | A wearable piezocapacitive pressure sensor with a single layer of silver nanowire-based elastomeric composite electrodes | |
| Lipomi et al. | Skin-like pressure and strain sensors based on transparent elastic films of carbon nanotubes | |
| Jeon et al. | Waterproof electronic-bandage with tunable sensitivity for wearable strain sensors | |
| Khan et al. | Flexible tactile sensors using screen-printed P (VDF-TrFE) and MWCNT/PDMS composites | |
| US20190113326A1 (en) | Flexible sensor apparatus | |
| Mohiuddin et al. | Flexible cellulose acetate/graphene blueprints for vibrotactile actuator | |
| KR102038853B1 (en) | Method for Forming an Apparatus Including Two-Dimensional Materials | |
| Wu et al. | All-carbon based flexible humidity sensor | |
| KR100992154B1 (en) | Transparent Conductive Thin Film Using Carbon Nano Tube and Method for Preparation thereof | |
| Han et al. | Effects of the corona pretreatment of PET substrates on the properties of flexible transparent CNT electrodes | |
| CN107525613A (en) | Stretchable pliable pressure sensor and its manufacture method | |
| Bian et al. | Aligning one-dimensional nanomaterials by solution processes | |
| Song et al. | Highly efficient patterning technique for silver nanowire electrodes by electrospray deposition and its application to self-powered triboelectric tactile sensor | |
| CN112834087A (en) | Double-layer flexible pressure sensor and preparation method thereof | |
| US10995001B2 (en) | Graphene oxide percolation network | |
| KR101892919B1 (en) | Transparent hybrid electrode and manufacturing method thereof | |
| CN109741881B (en) | Graphene flexible electrode and preparation method thereof | |
| Lee et al. | Transfer of preheat-treated SnO2 via a sacrificial bridge-type ZnO layer for ethanol gas sensor | |
| Buchberger et al. | Transparent, flexible, thin sensor surfaces for passive light-point localization based on two functional polymers | |
| Liu et al. | Rapid fabrication of nanomaterial electrodes using digitally controlled electrokinetics | |
| KR102195506B1 (en) | Detection sensor of heavy metal ion and method thereof | |
| Kinkeldei et al. | Feasibility of printing woven humidity and temperature sensors for the integration into electronic textiles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |