CN108828728A - A kind of fixing means and light emission component of passive optical lens - Google Patents
A kind of fixing means and light emission component of passive optical lens Download PDFInfo
- Publication number
- CN108828728A CN108828728A CN201810579787.XA CN201810579787A CN108828728A CN 108828728 A CN108828728 A CN 108828728A CN 201810579787 A CN201810579787 A CN 201810579787A CN 108828728 A CN108828728 A CN 108828728A
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- CN
- China
- Prior art keywords
- light
- condenser lens
- lens
- laser diode
- optical
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention provides the fixing means and light emission component of a kind of passive optical lens, the fixed form of passive condenser lens, special Coupling device is not needed, the automatic placement machine for only needing to be normally used for patch can complete the fixation of condenser lens, moreover it is possible to guarantee the coupling efficiency of final optical path.Light emission component of the light emission component for a kind of passive fixation of optical lens, the fixed form of the passive focus lens, because of simple process, the advantages that saving equipment, save working hour, meanwhile, using the fixed lens of adhesive, technique threshold is low, and equipment investment is lower.As transmission rate is getting faster, with regard to more and more prominent, the 25G EML TOSA being made into using the technique can be modulated to 50G by PAM4 and be used the more and more longer advantage of distance.
Description
Technical field
The present invention relates to optical field more particularly to optical lens fixing means.
Background technique
With the fast development of optical communication industry, it is desirable that transmission rate is higher, and transmission range is longer.This mentions optical device
Higher requirement is gone out.
The single channel light emission component of general transmission long range includes：Electronic refrigerator TEC, laser diode chip and its
Support plate, condenser lens, the above device are encapsulated on light emitting shell, and close to light emitting shell by the way of parallel soldering and sealing
Envelope.There are also optoisolators outside light emitting shell, receive light lock pin, that is, adapter.Electronic refrigerator TEC controls laser diode
Light is squeezed into light by condenser lens so that laser diode chip issues the light for having certain dispersion angle by the temperature of chip
Emit the light lock pin outside shell, to realize the long distance transmission of data and signal.
Condenser lens mounting means is active coupled modes in the prior art, i.e. the physical bit by adjusting condenser lens
It sets, while monitoring the optical power being input on lock pin adapter behind coupling focusing lens, when optical power is met the requirements or is reached
When to maximum value, by condenser lens connect without soldering or laser welding by way of be fixed on optical transmitting set optical path in, and
And this condenser lens needs dedicated either automatically or manually coupling table, therefore time-consuming and laborious by the way of active coupling,
Low efficiency, automatic coupling equipment price RMB up to a million easily need higher technical threshold, laser in addition, connecing without soldering
Welding needs the welding equipment of special valuableness.More than, all seriously limit the research and development and batch life of the domestic production product
It produces.
Summary of the invention
It is described the present invention provides a kind of fixing means of passive optical lens in order to solve the problems, such as in the prior art
Optical lens is a component of light emission component, and the light emission component includes electronic refrigerator TEC, laser diode core
Piece, first vector, Second support, condenser lens, light emitting shell, optoisolator and adapter, the condenser lens are described
Optical lens, the first vector are chip carrier, the electronic refrigerator TEC, laser diode chip, first vector, the
Two carriers and condenser lens are encapsulated on light emitting shell；First vector is mounted on above Second support, and Second support is mounted on
Above electronic refrigerator TEC, electronic refrigerator TEC controls the temperature of laser diode chip, while being connected by lead to sharp
Luminous diode chip adds driving current, so that laser diode chip shines, the light of sending passes through the convergence of condenser lens, penetrates
The optical window of light emitting shell is eventually entered into the adapter lock pin for receiving light by optoisolator；
The fixing means of optical lens therein is：
It is simulated first by accurately optical simulation, under the premise of meeting final light power requirement, laser diode
Chip light emitting item is aligned with the center of condenser lens, be can satisfy optical simulation and is simulated the margin of tolerance allowed come, simultaneously
Select the chip mounter of suitable patch precision；
Measurement or chip mounter automatically identify vertical range of the laser diode light-emitting section apart from Second support, are defined as
Height H1；Condenser lens center has been measured to the height H2 of condenser lens lower edge, has been calculated under condenser lens by H1, H2
The thickness H2-H1 of face adhesive；
Chip mounter implements patch：
First, chip mounter first completes automatically dropping glue, and dispensing is with a thickness of thickness H2-H1；
Second, chip mounter automatically controls distance of the condenser lens apart from following Second support, guarantees Y-direction H1 and H3 height
Unanimously, it can satisfy optical simulation and simulate the margin of tolerance allowed come；
It is placed to adjust condenser lens the position of third, the light-emitting section on chip mounter automatic identification laser diode chip surface
Position, on guaranteeing X-direction, laser diode light-emitting section and condenser lens center point-blank, can satisfy optics
The margin of tolerance allowed that analogue simulation comes out；
4th, by the distance between laser diode chip and condenser lens, i.e., the focus L1 distance controlling of optical path is in light
The distance simulated is learned, optical simulation is can satisfy and simulates the margin of tolerance allowed come；
5th, patch uses the mode of UV UV or heat cure to solidify adhesive after the completion.
As a further improvement of the present invention, the height H2 is guaranteed by the supplied materials of condenser lens.
As a further improvement of the present invention, with the mode of parallel soldering and sealing to light emitting package closure.
A kind of light emission component, the light emission component is a kind of light emission component of the passive fixation of optical lens, described
Light emission component is the light emission component obtained by the fixing means of the passive optical lens of above-mentioned any one.
The beneficial effects of the invention are as follows：
The fixed form of the passive focus lens, because of simple process, the advantages that saving equipment, save working hour, meanwhile, make
Lens are fixed with adhesive, technique threshold is low, and equipment investment is lower.As transmission rate is getting faster, distance is increasingly grown excellent
With regard to more and more prominent, the 25G EML TOSA being made into using the technique can be modulated to 50G by PAM4 and be used gesture.
Detailed description of the invention
Fig. 1 is light emission component structural schematic diagram of the present invention；
Fig. 2 is the side view of laser diode chip 1002 and 1005 physical location of condenser lens of the present invention；
Fig. 3 is the top view of invention laser diode chip 1002 Yu 1005 physical location of condenser lens.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing.
As shown in figure 1, electronic refrigerator TEC 1001, laser diode chip 1002, first vector 1003, Second support
1004, condenser lens 1005, first vector 1003 are chip carrier, and the above device is encapsulated on light emitting shell 1006, and is adopted
Light emitting shell 1006 is sealed with the mode of parallel soldering and sealing.In 1006 outside of light emitting shell, there are also optoisolators 1007, receive
Light lock pin, that is, adapter 1008.
Working principle：
First vector 1003 is mounted on above Second support 1004, and Second support 1004 is mounted on electronic refrigerator TEC
Above 1001, electronic refrigerator TEC 1001 controls the temperature of laser diode chip 1002, while being connected by lead to sharp
Luminous diode chip 1002 plus driving current, so that laser diode chip 1002 shines, the light of sending passes through condenser lens
1005 convergence, by optoisolator 1007, eventually enters into the adapter lock pin for receiving light through the optical window of light emitting shell 1006
In 1008.
The application introduces a kind of fixed form of passive condenser lens 1005, that is, does not need special Coupling device, only
The automatic placement machine for needing to be normally used for patch can complete the fixation of condenser lens.Also ensure the coupling effect of final optical path
Rate.
It firstly the need of what is done is simulated by accurately optical simulation, under the premise of meeting final light power requirement,
1002 light-emitting section of laser diode chip is aligned with the center of condenser lens 1005, be can satisfy optical simulation and is simulated the appearance come
Perhaps the margin of tolerance.The chip mounter of the suitable patch precision of simultaneous selection, such as patch precision are following several：+/-3um,+/-7um,
+/-10um。
The preparation of passive fixed form has：
The side view of laser diode chip 1002 and 1005 physical location of condenser lens as shown in Figure 2, it is necessary first to mention
Preceding measurement or chip mounter automatically identify vertical range of the laser diode light-emitting section apart from Second support 1004, are defined as height
Spend H1；1005 center of condenser lens has been measured in advance to the height H2 of condenser lens lower edge, this highly can be saturating by focusing
The supplied materials of mirror guarantees, i.e. the supplied materials precision that guarantees this size, for example, condenser lens can accomplish that preferable precision is (such as +/-
3um).The thickness H2-H1 of adhesive below condenser lens is calculated by H1, H2.
Chip mounter implements patch：
First, chip mounter first completes automatically dropping glue, and dispensing is with a thickness of thickness H2-H1；
Second, chip mounter automatically controls distance of the condenser lens 1005 apart from following Second support 1004, in Fig. 2, protects
Card Y-direction H1 is consistent with H3 height, can satisfy optical simulation and simulates the margin of tolerance allowed come；
Third, the position of the light-emitting section on 1002 surface of chip mounter automatic identification laser diode chip adjust condenser lens
The position of placement, in Fig. 3, i.e., on guaranteeing X-direction, laser diode light-emitting section and condenser lens center are in straight line
On, it can satisfy optical simulation and simulate the margin of tolerance allowed come.
4th, by the distance between laser diode chip 1002 and condenser lens 1005, such as the focus L1 distance of optical path
The distance gone out in optical simulation is controlled, optical simulation is can satisfy and simulates the margin of tolerance allowed come.
5th, patch uses the mode of UV UV or heat cure to solidify adhesive after the completion.
Above five step needs while meeting and completing that entire passive fixation procedure could be completed, and is finally completed above-mentioned patch mistake
Cheng Hou is powered on to laser diode chip, and laser diode chip is made to shine, assembled optical isolation outside optics shell
Device and adapter, which only need to do, optical coupled can make the optical power value received meet the requirements range.The single channel is finally made
The passive fixation of condenser lens light emission component.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (4)
1. a kind of fixing means of passive optical lens, it is characterised in that：The optical lens is one of light emission component
Component, the light emission component include electronic refrigerator TEC（1001）, laser diode chip（1002）, first vector
（1003）, Second support（1004）, condenser lens（1005）, light emitting shell（1006）, optoisolator（1007）And adapter
（1008）, the condenser lens（1005）For the optical lens, the first vector（1003）For chip carrier, the electronics
Refrigerator TEC（1001）, laser diode chip（1002）, first vector（1003）, Second support（1004）And condenser lens
（1005）It is encapsulated in light emitting shell（1006）On；First vector（1003）It is mounted on Second support（1004）Above, it second carries
Body（1004）It is mounted on electronic refrigerator TEC（1001）Above, electronic refrigerator TEC（1001）Control laser diode chip
（1002）Temperature, while being connected by lead to laser diode chip（1002）Add driving current, so that laser diode
Chip（1002）It shines, the light of sending passes through condenser lens（1005）Convergence, through light emitting shell（1006）Optical window, lead to
Cross optoisolator（1007）, eventually enter into the adapter lock pin for receiving light（1008）In；
The fixing means of optical lens therein is：
It is simulated first by accurately optical simulation, under the premise of meeting final light power requirement, laser diode chip
（1002）Light-emitting section and condenser lens（1005）Center alignment, can satisfy optical simulation simulate come the tolerance model allowed
It encloses, the chip mounter of the suitable patch precision of simultaneous selection；
Measurement or chip mounter automatically identify laser diode light-emitting section apart from Second support（1004）Vertical range, definition
For height H1；Condenser lens is measured（1005）Center is calculated poly- to the height H2 of condenser lens lower edge by H1, H2
The thickness H2-H1 of adhesive below focus lens；
Chip mounter implements patch：
First, chip mounter first completes automatically dropping glue, and dispensing is with a thickness of thickness H2-H1；
Second, chip mounter automatically controls condenser lens（1005）Apart from following Second support（1004）Distance, guarantee Y-direction H1
It is consistent with H3 height, it can satisfy optical simulation and simulate the margin of tolerance allowed come；
Third, chip mounter automatic identification laser diode chip（1002）It is put to adjust condenser lens the position of the light-emitting section on surface
The position set, on guaranteeing X-direction, laser diode light-emitting section and condenser lens center point-blank, can satisfy light
Learn the margin of tolerance allowed that analogue simulation comes out；
4th, by laser diode chip（1002）With condenser lens（1005）The distance between, i.e. the focus L1 distance of optical path
The distance gone out in optical simulation is controlled, optical simulation is can satisfy and simulates the margin of tolerance allowed come；
5th, patch uses the mode of UV UV or heat cure to solidify adhesive after the completion.
2. the fixing means of the passive optical lens of one kind according to claim 1, it is characterised in that：The height H2 is logical
The supplied materials of over-focusing lens guarantees.
3. the fixing means of the passive optical lens of one kind according to claim 1, it is characterised in that：With parallel soldering and sealing
Mode is to light emitting shell（1006）Sealing.
4. a kind of light emission component, it is characterised in that：The light emission component is a kind of light emitting of the passive fixation of optical lens
Component, the light emission component are the light obtained by the fixing means of the passive optical lens of claims 1 to 3 any one
Emitting module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810579787.XA CN108828728A (en) | 2018-06-07 | 2018-06-07 | A kind of fixing means and light emission component of passive optical lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810579787.XA CN108828728A (en) | 2018-06-07 | 2018-06-07 | A kind of fixing means and light emission component of passive optical lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108828728A true CN108828728A (en) | 2018-11-16 |
Family
ID=64143344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810579787.XA Pending CN108828728A (en) | 2018-06-07 | 2018-06-07 | A kind of fixing means and light emission component of passive optical lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108828728A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358398A (en) * | 2018-12-07 | 2019-02-19 | 东莞铭普光磁股份有限公司 | A kind of optical module, optical module transmitting optical device and preparation method thereof |
| CN109613655A (en) * | 2019-01-17 | 2019-04-12 | 苏州旭创科技有限公司 | A kind of optical module and its manufacturing method |
| CN113341510A (en) * | 2021-06-03 | 2021-09-03 | 成都光创联科技有限公司 | Simple optical path and miniature single-channel box-shaped packaged optical device based on same |
| CN113608304A (en) * | 2021-06-29 | 2021-11-05 | 武汉联特科技股份有限公司 | Preparation method and device applied to light emitting device |
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| CN1410790A (en) * | 2001-09-28 | 2003-04-16 | 日本光进株式会社 | Optical transmission module |
| JP2005252005A (en) * | 2004-03-04 | 2005-09-15 | Central Glass Co Ltd | Optical devices |
| CN104570236A (en) * | 2014-11-27 | 2015-04-29 | 武汉电信器件有限公司 | High-speed butterfly-shaped packaging optical emitter component |
-
2018
- 2018-06-07 CN CN201810579787.XA patent/CN108828728A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1410790A (en) * | 2001-09-28 | 2003-04-16 | 日本光进株式会社 | Optical transmission module |
| JP2005252005A (en) * | 2004-03-04 | 2005-09-15 | Central Glass Co Ltd | Optical devices |
| CN104570236A (en) * | 2014-11-27 | 2015-04-29 | 武汉电信器件有限公司 | High-speed butterfly-shaped packaging optical emitter component |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358398A (en) * | 2018-12-07 | 2019-02-19 | 东莞铭普光磁股份有限公司 | A kind of optical module, optical module transmitting optical device and preparation method thereof |
| CN109358398B (en) * | 2018-12-07 | 2024-05-14 | 东莞铭普光磁股份有限公司 | Optical module, optical module light emitting device and preparation method thereof |
| CN109613655A (en) * | 2019-01-17 | 2019-04-12 | 苏州旭创科技有限公司 | A kind of optical module and its manufacturing method |
| CN109613655B (en) * | 2019-01-17 | 2020-12-15 | 苏州旭创科技有限公司 | Optical assembly and manufacturing method thereof |
| CN113341510A (en) * | 2021-06-03 | 2021-09-03 | 成都光创联科技有限公司 | Simple optical path and miniature single-channel box-shaped packaged optical device based on same |
| CN113608304A (en) * | 2021-06-29 | 2021-11-05 | 武汉联特科技股份有限公司 | Preparation method and device applied to light emitting device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 room a1101201 301 401 501, building 13, Junfeng Industrial Park, Chongqing Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: XGIGA Communication Technology Co., Ltd. Address before: 518000 Nanshan District, Shenzhen, Guangdong, Guangdong Province, south Guangdong Road, 9680 Shennan Road, No. 1, building 9, 901, Applicant before: XGIGA Communication Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181116 |