CN108828433A - A kind of photoelectric properties test device of flip LED chips - Google Patents
A kind of photoelectric properties test device of flip LED chips Download PDFInfo
- Publication number
- CN108828433A CN108828433A CN201810590304.6A CN201810590304A CN108828433A CN 108828433 A CN108828433 A CN 108828433A CN 201810590304 A CN201810590304 A CN 201810590304A CN 108828433 A CN108828433 A CN 108828433A
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- axis
- led chips
- sliding shoe
- flip led
- test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention provides a kind of photoelectric properties test devices of flip LED chips,Including device noumenon,Described device ontology includes carrier system,Transportation system,Precision alignment system and test macro,Carrier system of the present invention can place multi-disc flip LED chips to be measured simultaneously,Test macro is directed at flip LED chips to be measured by precision alignment system by transportation system one by one,Test macro is fallen after alignment,So that a pair of test macro bottom tests the positive and negative pin of probe contact measured flip LED chips and applies corresponding test voltage,Flip LED chips to be measured are made to shine,Light is received optical port and is integrated ball collection,It can be calculated the optical parameter of flip LED chips to be measured by spectrometer,Test probe can measure the electrical parameter of flip LED chips to be measured,To complete the photoelectric properties test to flip LED chips to be measured,It can be tested in batches,Testing efficiency is high,It is at low cost.
Description
Technical field
The present invention relates to flip LED chips performance test apparatus technical field, in particular to a kind of light of flip LED chips
Electric performance testing device.
Background technique
With the fast development of LED technology, LED street lamp, LED flash, LED glare light electric torch, LED automobile headlamp etc. are produced
Product initially enter the life of ordinary people, but since to be limited to lesser power, current distribution not uniform enough for traditional packed LED chip
R&D direction steering can be born higher-wattage and heat-sinking capability by the poor reason with heat dissipation performance, major LED chip enterprise
Preferable flip LED chips.
Flip LED chips have different degrees of improvement compared with traditional packed LED chip, light efficiency and production cost, therefore
Importance of the flip LED chips in LED technology application is also more prominent.In flip LED chips manufacturing process, photoelectric properties
Test is to judge the committed step of chip quality quality.Due to the structure of flip LED chips and traditional packed LED chip have compared with
Big difference, therefore photo electric cannot be carried out to flip LED chips using the photoelectric properties test device of traditional packed LED chip
It can test, need to develop more efficient, the lower photoelectric properties test device dedicated for flip LED chips of cost.
Summary of the invention
(1) the technical issues of solving
To solve the above-mentioned problems, the present invention provides a kind of photoelectric properties test device of flip LED chips, loading systems
System can place multi-disc flip LED chips to be measured simultaneously, and test macro is aligned by transportation system one by one by precision alignment system
Flip LED chips to be measured, fall test macro after alignment, so that a pair of of test probe contact measured of test macro bottom
The positive and negative pin of flip LED chips simultaneously applies corresponding test voltage, and flip LED chips to be measured is made to shine, and light is through receiving optical port
It is integrated ball collection, can be calculated the optical parameter of flip LED chips to be measured by spectrometer, test probe can measure to be measured
The electrical parameter of flip LED chips can be tested in batches to complete to test the photoelectric properties of flip LED chips to be measured,
Testing efficiency is high, at low cost.
(2) technical solution
A kind of photoelectric properties test device of flip LED chips, including device noumenon, described device ontology include loading system
System, transportation system, precision alignment system and test macro, the carrier system include objective table and several placing grooves, the load
Control module is equipped in object platform, several placing grooves are uniformly set to the top of the objective table, the width of the placing groove
Corresponding with the width of chip to be measured, close to the face side of described device ontology, the back side of the objective table is set the placing groove
There is power supply line, the transportation system includes X-axis platform, Y-axis platform and hoistable platform, is additionally provided at the top of the objective table described
X-axis platform, for the X-axis platform close to the back side of described device ontology, the X-axis platform includes X-axis guide rail and X-axis sliding
It is connected at the top of block, the bottom of the X-axis guide rail and the objective table, the X-axis guide rail is embedded with the X-axis sliding shoe,
The X-axis sliding shoe can be slided along the X-axis guide rail, and the X-axis platform is connected by support plate with the Y-axis platform,
The Y-axis platform includes Y-axis guide rail and Y-axis sliding shoe, and one end of the support plate is connected with the top of the X-axis sliding shoe
It connects, the other end of the support plate is connected with the Y-axis guide rail, and the Y-axis guide rail is to be arranged downward, in the Y-axis guide rail
Embedded with the Y-axis sliding shoe, the Y-axis sliding shoe can be slided along the Y-axis guide rail, and the precision alignment system includes several
RF tag, X-axis radio frequency receiver and Y-axis radio frequency receiver, the quantity one of the quantity of the RF tag and the placing groove
It causing, the RF tag is located at the bottom inside of the placing groove, and the X-axis radio frequency receiver is located in the X-axis sliding shoe,
The Y-axis radio frequency receiver is located in the Y-axis sliding shoe, the bottom of the Y-axis sliding shoe it is placed in the middle be equipped with hoistable platform, institute
Stating hoistable platform includes lifting motor and elevating lever, and the pedestal of the lifting motor is fixed on the bottom of the Y-axis sliding shoe, institute
The end connecting test system of the elevating lever of lifting motor is stated, the test macro includes test box, integrating sphere and a pair of of test
Probe, the test box are hollow structure, and the test box includes cabinet, and the top of the cabinet is placed in the middle with the elevating lever
Be connected, the bottom of the cabinet it is placed in the middle be equipped with light hole, the inner sidewall of the cabinet is equipped with the link block of outwardly convex,
The integrating sphere is connected by the link block with the inner sidewall of the cabinet, and the receipts optical port of the integrating sphere faces described
Light hole, not less than the bore for receiving optical port, a pair of test probe is symmetrically set between two parties in the aperture of the light hole
The spacing of the two sides of the bottom of the cabinet, a pair of test probe is corresponding with the width of the placing groove, the radio frequency mark
Label connect the input terminal of the control module, and the output end of the control module is separately connected the X-axis radio frequency receiver, described
Y-axis radio frequency receiver, the X-axis sliding shoe, the Y-axis sliding shoe, the lifting motor, the integrating sphere and the test are visited
Needle, the power supply line connect external power supply, and the external power supply provides operating voltage for described device ontology.
Further, the X-axis radio frequency receiver and the Y-axis radio frequency receiver select RI-R6C-001A radio frequency to read
Write device.
Further, the X-axis sliding shoe and the Y-axis sliding shoe are electronics sliding block.
Further, the lifting motor is linear motor.
Further, the control module selects 16 single-chip microcontroller MC95S12DJ128.
(3) beneficial effect
The present invention provides a kind of photoelectric properties test devices of flip LED chips, and flip LED chips to be measured are just being faced
Under be put into placing groove, can so that multiple placing grooves are arranged in the positive and negative pin of flip LED chips to be measured upward, on objective table
Batch carries out photoelectric properties test to flip LED chips to be measured, improves testing efficiency, and transportation system's cooperation, which precisely aligns, is
System, test macro is aligned with placing groove one by one, control module compiles the RF tag of placing groove bottom inside
The Y-axis radio frequency receiver in X-axis radio frequency receiver and Y-axis sliding shoe number to distinguish different radiofrequency signals, in X-axis sliding shoe
Receive the radiofrequency signal of RF tag transmission respectively and fed back, X-axis sliding shoe and Y-axis sliding shoe are accordingly towards radiofrequency signal
Placing groove sliding so that test macro is located at the surface of flip LED chips to be measured, test macro drops in lifting motor
Under, so that the test probe of test box two sides of the bottom is in contact with the positive and negative pin of flip LED chips to be measured respectively and applies phase
The test voltage answered makes flip LED chips to be measured shine, and the light of sending is collected through light hole by receipts optical port, and light exists
Pass through diffusing reflection inside integrating sphere and the optical parameter of LED flip chip to be measured is calculated by spectrometer, test probe can
The electrical parameter of flip LED chips to be measured is measured, to complete to test the photoelectric properties of flip LED chips to be measured, automation
And intelligence degree is high, simple in sturcture, ingenious in design, system power dissipation is low, and measuring accuracy is high, fast response time, stability and
Good reliability has good practicability and scalability, reduces testing cost, can be widely used for flip LED chips performance
Other occasions of test.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the photoelectric properties test device of flip LED chips according to the present invention.
Fig. 2 is a kind of X-axis platform cross section knot of photoelectric properties test device of flip LED chips according to the present invention
Structure schematic diagram.
Fig. 3 is that a kind of test system structure of the photoelectric properties test device of flip LED chips according to the present invention shows
It is intended to.
Fig. 4 is a kind of test macro internal junction of the photoelectric properties test device of flip LED chips according to the present invention
Structure schematic diagram.
Fig. 5 is a kind of System Working Principle figure of the photoelectric properties test device of flip LED chips according to the present invention.
Specific embodiment
Embodiment according to the present invention is described in further details with reference to the accompanying drawing.
In conjunction with FIG. 1 to FIG. 5, a kind of photoelectric properties test device of flip LED chips, including device noumenon, device noumenon
Including carrier system, transportation system, precision alignment system and test macro, carrier system includes objective table 1 and several placing grooves
2, be equipped with control module in objective table 1, several placing grooves 2 are uniformly set to the top of objective table 1, the width of placing groove 2 with to
The width for surveying chip is corresponding, the face side of 2 approaching device ontology of placing groove, and the back side of objective table 1 is equipped with power supply line, transport system
System includes X-axis platform, Y-axis platform and hoistable platform, and the top of objective table 1 is additionally provided with X-axis platform, X-axis platform approaching device sheet
The back side of body, X-axis platform include X-axis guide rail 3 and X-axis sliding shoe 4, and the bottom of X-axis guide rail 3 is connected with the top of objective table 1
Connect, X-axis guide rail 3 is embedded with X-axis sliding shoe 4, and X-axis sliding shoe 4 can be slided along X-axis guide rail 3, X-axis platform by support plate 5 with
Y-axis platform is connected, and Y-axis platform includes Y-axis guide rail 6 and Y-axis sliding shoe 7, one end and the top of X-axis sliding shoe 4 of support plate 5
It is connected, the other end of support plate 5 is connected with Y-axis guide rail 6, and Y-axis guide rail 6 is to be arranged downward, and it is sliding that Y-axis guide rail 6 is embedded with Y-axis
Motion block 7, Y-axis sliding shoe 7 can be slided along Y-axis guide rail 6, and precision alignment system includes several RF tags, X-axis radio frequency receiver
Consistent with the quantity of placing groove 2 with the quantity of Y-axis radio frequency receiver, RF tag, RF tag is located in the bottom of placing groove 2
Side, X-axis radio frequency receiver are located in X-axis sliding shoe 4, and Y-axis radio frequency receiver is located in Y-axis sliding shoe 7, the bottom of Y-axis sliding shoe 7
Portion it is placed in the middle be equipped with hoistable platform, hoistable platform includes lifting motor 8 and elevating lever 9, and the pedestal of lifting motor 8 is fixed on Y-axis
The bottom of sliding shoe 7, the end connecting test system of the elevating lever 9 of lifting motor 8, test macro include test box 10, integral
Ball 13 and a pair of of test probe 15, test box 10 are hollow structure, and test box 10 includes cabinet, the top of cabinet it is placed in the middle with liter
Drop bar 9 is connected, the bottom of cabinet it is placed in the middle be equipped with light hole 11, the inner sidewall of cabinet is equipped with the link block of outwardly convex
12, integrating sphere 13 is connected by link block 12 with the inner sidewall of cabinet, and the receipts optical port 14 of integrating sphere 13 faces light hole 11,
The aperture of light hole 11 is not less than the bore for receiving optical port 14, a pair of test probe 15 symmetrical bottom two for being set to cabinet placed in the middle
The spacing of side, a pair of test probe 15 is corresponding with the width of placing groove 2, the input terminal of RF tag link control module, control
The output end of molding block is separately connected X-axis radio frequency receiver, Y-axis radio frequency receiver, X-axis sliding shoe 4, Y-axis sliding shoe 7, lifting
Motor 8, integrating sphere 13 and test probe 15, power supply line connect external power supply, and external power supply provides operating voltage for device noumenon.
By being put into the placing groove 2 at 1 top of objective table for flip LED chips face down to be measured, make flip LED core to be measured
The positive and negative pin of piece is upward.Multiple placing grooves 2 are arranged simultaneously in the top of objective table 1, can carry out in batches to flip LED chips to be measured
Photoelectric properties test, improves testing efficiency, reduces testing cost.
The bottom inside of placing groove 2 is equipped with RF tag, and control module compiles the RF tag in different placing grooves 2
Number, to distinguish the different radio frequency signal of different radio frequency label transmitting.X-axis radio frequency receiver in X-axis sliding shoe 4 receives radio frequency letter
Number, and control module is fed back to, control module control X-axis sliding shoe is responded, along X-axis guide rail 3 towards issuing the radiofrequency signal
Placing groove 2 slide.Y-axis radio frequency receiver in Y-axis sliding shoe 7 receives the radiofrequency signal simultaneously, and feeds back to control module,
Control module control Y-axis sliding shoe 7 is responded, and is slided along Y-axis guide rail 6 towards the placing groove 2 for issuing the radiofrequency signal, to make
Test macro is located at the surface for issuing the placing groove 2 of the radiofrequency signal in X axis and Y-axis simultaneously, that is, is located at upside-down mounting to be measured
The surface of LED chip.X-axis radio frequency receiver and Y-axis radio frequency receiver select RI-R6C-001A frequency read/write, and X-axis is sliding
Motion block 4 and Y-axis sliding shoe 7 are electronics sliding block.In view of the simplification of program, since multiple placing grooves 2 are uniformly set to loading
The top of platform 1, once therefore Y-axis sliding shoe 7 be accurately positioned after one of placing groove 2, state can be remained stationary, only by
X-axis sliding shoe 4 positions the placing groove 2 where next flip LED chips to be measured, so that it may realize one by one to placing groove 2 into
Row is accurately positioned, and improves testing efficiency, reduces system power dissipation.
After test macro is directed at one of placing groove 2, hoistable platform work, lifting motor 8 is linear motor, is driven
Dynamic elevating lever 9 extends, and the test macro of 9 end of elevating lever is fallen, is pressed against it on flip LED chips to be measured.Due to putting
The of same size of the width of slot 2 and flip LED chips to be measured is set, and between a pair of of test probe 15 of 10 two sides of the bottom of test box
Spacing again it is of same size with placing groove 2, i.e., when test macro is fallen, a pair of test probe 15 just with it is to be measured fall
The positive and negative pin of dress LED chip is in contact.Control module applies corresponding test voltage at test probe 15 at this time, makes to be measured
Flip LED chips shine, and the light of sending enters in test box 10 through light hole 11.The aperture of light hole 11 is not less than integrating sphere
The bore of 13 receipts optical port 14 enables light adequately to be entered by light hole 11 and receives optical port 14, ensure that the accuracy of test
And testing efficiency.The light for receiving 14 pairs of optical port sendings is collected, and light by diffusing reflection and passes through light inside integrating sphere 13
The optical parameter of LED flip chip to be measured is calculated in spectrometer.Meanwhile test probe 15 can measure flip LED chips to be measured
Electrical parameter, to complete to test the photoelectric properties of flip LED chips to be measured, automation and intelligence degree are high.
Control module handles the radiofrequency signal of RF tag, and output control signal controls X-axis radio frequency reception respectively
Device, Y-axis radio frequency receiver, X-axis sliding shoe 4, Y-axis sliding shoe 7, lifting motor 8, integrating sphere 13 and test probe 15 carry out work
Make.In order to simplify circuit, cost is reduced, the scalability in system later period is improved, control module selects 16 single-chip microcontrollers
The EEPROM of the RAM and 2KB of MC95S12DJ128, Flash, 8KB of built-in 128KB have 5V input and driving capability,
CPU working frequency can reach 50MHz.The independent number I/O interface in 29 tunnels, 20 road bands interrupt and the digital I/O of arousal function connects
Mouthful, 10 A/D converters in 28 channels, input capture/output with 8 channels is compared, and also has 8 programmable PWM logical
Road.With 2 serial asynchronous communication interface SCI, 2 synchronous serial Peripheral Interface SPI, I2C buses and CAN functional module etc.,
Meet design requirement.
The present invention provides a kind of photoelectric properties test devices of flip LED chips, and flip LED chips to be measured are just being faced
Under be put into placing groove, can so that multiple placing grooves are arranged in the positive and negative pin of flip LED chips to be measured upward, on objective table
Batch carries out photoelectric properties test to flip LED chips to be measured, improves testing efficiency, and transportation system's cooperation, which precisely aligns, is
System, test macro is aligned with placing groove one by one, control module compiles the RF tag of placing groove bottom inside
The Y-axis radio frequency receiver in X-axis radio frequency receiver and Y-axis sliding shoe number to distinguish different radiofrequency signals, in X-axis sliding shoe
Receive the radiofrequency signal of RF tag transmission respectively and fed back, X-axis sliding shoe and Y-axis sliding shoe are accordingly towards radiofrequency signal
Placing groove sliding so that test macro is located at the surface of flip LED chips to be measured, test macro drops in lifting motor
Under, so that the test probe of test box two sides of the bottom is in contact with the positive and negative pin of flip LED chips to be measured respectively and applies phase
The test voltage answered makes flip LED chips to be measured shine, and the light of sending is collected through light hole by receipts optical port, and light exists
Pass through diffusing reflection inside integrating sphere and the optical parameter of LED flip chip to be measured is calculated by spectrometer, test probe can
The electrical parameter of flip LED chips to be measured is measured, to complete to test the photoelectric properties of flip LED chips to be measured, automation
And intelligence degree is high, simple in sturcture, ingenious in design, system power dissipation is low, and measuring accuracy is high, fast response time, stability and
Good reliability has good practicability and scalability, reduces testing cost, can be widely used for flip LED chips performance
Other occasions of test.
The above-described embodiments are merely illustrative of preferred embodiments of the present invention, not to structure of the invention
Think and range is defined.Without departing from the design concept of the invention, ordinary people in the field is to technology of the invention
The all variations and modifications that scheme is made, should all drop into protection scope of the present invention, the claimed technology contents of the present invention,
It is all described in the claims.
Claims (5)
1. a kind of photoelectric properties test device of flip LED chips, including device noumenon, it is characterised in that：Described device ontology
Including carrier system, transportation system, precision alignment system and test macro, the carrier system includes objective table and several placements
Slot, the objective table is interior to be equipped with control module, and several placing grooves are uniformly set to the top of the objective table, the placement
The width of slot is corresponding with the width of chip to be measured, face side of the placing groove close to described device ontology, the objective table
The back side be equipped with power supply line, the transportation system includes X-axis platform, Y-axis platform and hoistable platform, and the top of the objective table is also
Equipped with the X-axis platform, for the X-axis platform close to the back side of described device ontology, the X-axis platform includes X-axis guide rail and X
It is connected at the top of axis sliding shoe, the bottom of the X-axis guide rail and the objective table, it is sliding that the X-axis guide rail is embedded with the X-axis
Motion block, the X-axis sliding shoe can be slided along the X-axis guide rail, and the X-axis platform passes through support plate and the Y-axis platform phase
Connection, the Y-axis platform includes Y-axis guide rail and Y-axis sliding shoe, the top of one end of the support plate and the X-axis sliding shoe
It is connected, the other end of the support plate is connected with the Y-axis guide rail, and the Y-axis guide rail is to be arranged downward, and the Y-axis is led
Rail is embedded with the Y-axis sliding shoe, and the Y-axis sliding shoe can be slided along the Y-axis guide rail, and the precision alignment system includes
Several RF tags, X-axis radio frequency receiver and Y-axis radio frequency receiver, the number of the quantity of the RF tag and the placing groove
Amount is consistent, and the RF tag is located at the bottom inside of the placing groove, and the X-axis radio frequency receiver is located at X-axis sliding
In block, the Y-axis radio frequency receiver is located in the Y-axis sliding shoe, and the lifting that is equipped with placed in the middle of the bottom of the Y-axis sliding shoe is put down
Platform, the hoistable platform include lifting motor and elevating lever, and the pedestal of the lifting motor is fixed on the bottom of the Y-axis sliding shoe
Portion, the end connecting test system of the elevating lever of the lifting motor, the test macro includes test box, integrating sphere and a pair
Probe is tested, the test box is hollow structure, and the test box includes cabinet, and the top of the cabinet is placed in the middle with the liter
Drop bar is connected, the bottom of the cabinet it is placed in the middle be equipped with light hole, the inner sidewall of the cabinet is equipped with the company of outwardly convex
Block is connect, the integrating sphere is connected by the link block with the inner sidewall of the cabinet, the receipts optical port face of the integrating sphere
The light hole, not less than the bore for receiving optical port, a pair of test probe is symmetrical between two parties for the aperture of the light hole
The two sides of the bottom set on the cabinet, the spacing of a pair of test probe is corresponding with the width of the placing groove, described
RF tag connects the input terminal of the control module, and the output end of the control module is separately connected the X-axis radio frequency reception
Device, the Y-axis radio frequency receiver, the X-axis sliding shoe, the Y-axis sliding shoe, the lifting motor, the integrating sphere and institute
Test probe is stated, the power supply line connects external power supply, and the external power supply provides operating voltage for described device ontology.
2. a kind of photoelectric properties test device of flip LED chips according to claim 1, it is characterised in that：The X-axis
Radio frequency receiver and the Y-axis radio frequency receiver select RI-R6C-001A frequency read/write.
3. a kind of photoelectric properties test device of flip LED chips according to claim 1, it is characterised in that：The X-axis
Sliding shoe and the Y-axis sliding shoe are electronics sliding block.
4. a kind of photoelectric properties test device of flip LED chips according to claim 1, it is characterised in that：The liter
Drop motor is linear motor.
5. a kind of photoelectric properties test device of flip LED chips according to claim 1, it is characterised in that：The control
Molding block selects 16 single-chip microcontroller MC95S12DJ128.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810590304.6A CN108828433A (en) | 2018-06-08 | 2018-06-08 | A kind of photoelectric properties test device of flip LED chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810590304.6A CN108828433A (en) | 2018-06-08 | 2018-06-08 | A kind of photoelectric properties test device of flip LED chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108828433A true CN108828433A (en) | 2018-11-16 |
Family
ID=64144625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810590304.6A Withdrawn CN108828433A (en) | 2018-06-08 | 2018-06-08 | A kind of photoelectric properties test device of flip LED chips |
Country Status (1)
| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111006719A (en) * | 2019-12-13 | 2020-04-14 | 武汉光安伦光电技术有限公司 | VCSEL measuring device |
| CN113835019A (en) * | 2021-11-25 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip alignment device and method |
| CN114355166A (en) * | 2022-01-10 | 2022-04-15 | 深圳市斯迈得半导体有限公司 | LED packaged chip detection device |
| CN115840128A (en) * | 2022-10-18 | 2023-03-24 | 深圳市三一联光智能设备股份有限公司 | Novel photoelectric testing mechanism and chip testing jig module thereof |
-
2018
- 2018-06-08 CN CN201810590304.6A patent/CN108828433A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111006719A (en) * | 2019-12-13 | 2020-04-14 | 武汉光安伦光电技术有限公司 | VCSEL measuring device |
| CN113835019A (en) * | 2021-11-25 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip alignment device and method |
| CN114355166A (en) * | 2022-01-10 | 2022-04-15 | 深圳市斯迈得半导体有限公司 | LED packaged chip detection device |
| CN114355166B (en) * | 2022-01-10 | 2024-06-04 | 深圳市斯迈得半导体有限公司 | LED packaging chip detection device |
| CN115840128A (en) * | 2022-10-18 | 2023-03-24 | 深圳市三一联光智能设备股份有限公司 | Novel photoelectric testing mechanism and chip testing jig module thereof |
| CN115840128B (en) * | 2022-10-18 | 2023-09-22 | 深圳市三一联光智能设备股份有限公司 | Novel photoelectric testing mechanism and chip testing jig module thereof |
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Application publication date: 20181116 |