CN108811436A - A kind of radiator and heat dissipating method of electronic component - Google Patents

A kind of radiator and heat dissipating method of electronic component Download PDF

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Publication number
CN108811436A
CN108811436A CN201810481013.3A CN201810481013A CN108811436A CN 108811436 A CN108811436 A CN 108811436A CN 201810481013 A CN201810481013 A CN 201810481013A CN 108811436 A CN108811436 A CN 108811436A
Authority
CN
China
Prior art keywords
mounting box
circuit board
printed circuit
place position
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810481013.3A
Other languages
Chinese (zh)
Inventor
赵圣铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Zhong Zhi Xian Technology Co Ltd
Original Assignee
Jiangsu Zhong Zhi Xian Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Zhong Zhi Xian Technology Co Ltd filed Critical Jiangsu Zhong Zhi Xian Technology Co Ltd
Priority to CN201810481013.3A priority Critical patent/CN108811436A/en
Publication of CN108811436A publication Critical patent/CN108811436A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of radiator of electronic component and heat dissipating methods, including mounting box, fixing groove, box cover and heat emission fan, it is provided with place position on the right side of the mounting box, the place position is connected by sliding rail with mounting box, the fixing groove is symmetrically mounted on the left and right sides inside mounting box, printed circuit board is installed in the fixing groove, the box cover is arranged in the surface of mounting box, and the upper surface of box cover symmetrically offers sliding slot, guard is installed in the sliding slot, the heat emission fan is mounted on the center of box cover, the back side of the mounting box is equipped with heat sink, the internal reservation of the place position has storehouse inside groove.The radiator of the electronic component, by the fixing groove being arranged in mounting box, convenient for printed circuit board is fixed, abandoning tradition carries out installation fixation with screw and fixing glue, it brings inconvenience to the dismounting safeguarded and repaired, and be easy to cause the reduced service life of circuit board.

Description

A kind of radiator and heat dissipating method of electronic component
Technical field
The present invention relates to technical field of electronic components, the radiator of specially a kind of electronic component and heat dissipation side Method.
Background technology
Electronic component is mounted in various electronic products and electric appliance, very much, the printed circuit of type of electronic component Plate is also one kind of electronic component, printed circuit board due to be electronic component electrical connection supplier, usually will produce A large amount of heat can cause system operation unstable so that some electric appliance service lifes if not radiating to circuit board Shorten, or even burn the part on printed circuit board, therefore radiates to the printing electric hot plate in some mounting boxs It is very necessary.
Invention content
The purpose of the present invention is to provide a kind of radiator of electronic component and heat dissipating methods, to solve above-mentioned background In technology propose printed circuit board due to be electronic component electrical connection supplier, usually will produce a large amount of heat, lead Cause system operation unstable so that some electric appliance reduced service life, or even the problem of burn the part on printed circuit board.
To achieve the above object, the present invention provides the following technical solutions:A kind of radiator of electronic component, including peace Mounted box, fixing groove, box cover and heat emission fan are provided with place position on the right side of the mounting box, and the front surface of place position is provided with Sliding rail, the place position are connected by sliding rail with mounting box, and the fixing groove is symmetrically mounted on the left and right two inside mounting box Side, and fixing groove is connected with cushion, is equipped with printed circuit board in the fixing groove, the box cover be arranged mounting box just on Side, and the upper surface of box cover symmetrically offers sliding slot, and guard is equipped in the sliding slot, the heat emission fan is mounted in box cover The back side of heart position, the mounting box is equipped with heat sink, and heat emission hole is offered on heat sink, and is equipped on heat emission hole The internal reservation of Air Filter, the place position has storehouse inside groove, and is fixed with coolant bottle in the inside groove of storehouse.
Preferably, the place position constitutes drawing structure by sliding rail and mounting box, and the area of place position is less than installation The internal area of box.
Preferably, the fixing groove about mounting box center symmetric setting there are two, and fixing groove and printed circuit board Card slot connects.
Preferably, the guard constitutes dismounting mounting structure by sliding slot and box cover, and the area coverage of guard is less than box The area of lid.
Preferably, heat emission hole, and the arc-shaped structure of heat emission hole are equidistantly offered on the heat sink.
Preferably, the coolant bottle equidistantly be mounted on place position inside, and coolant bottle by storehouse inside groove with put Set storehouse composition dismounting mounting structure.
Compared with prior art, the beneficial effects of the invention are as follows:The radiator of the electronic component,
1. by the fixing groove being arranged in mounting box, convenient for printed circuit board is fixed, abandoning tradition with screw and Fixing glue carries out installation fixation, brings inconvenience to the dismounting safeguarded and repaired, and be easy to cause the reduced service life of circuit board;
2. by the heat emission fan installed above mounting box, printed circuit board when being conducive to running radiates, and prevents temperature Height is spent, printed circuit board is caused to break down, shortens the service life of printed circuit board;
3. by the coolant bottle installed in place position, convenient for further radiating to printed circuit board, heat dissipation effect is improved Rate increases the practicability of the device;
4. by the back mounted heat sink of mounting box, many places heat emission hole is wherein offered on heat sink, convenient for improving installation The contact area of printed circuit board and air inside box, and then radiate to printed circuit board, improve radiating efficiency.
Description of the drawings
Fig. 1 is internal structure schematic diagram of the present invention;
Fig. 2 is overlooking structure diagram of the present invention;
Fig. 3 is structure schematic diagram of the present invention;
Fig. 4 is place position overlooking structure diagram of the present invention.
In figure:1, mounting box;2, place position;3, sliding rail;4, fixing groove;5, cushion;6, printed circuit board;7, box cover;8, Sliding slot;9, guard;10, heat emission fan;11, heat sink;12, heat emission hole;13, Air Filter;14, storehouse inside groove;15, coolant bottle.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of radiator of electronic component, including installation Box 1, place position 2, sliding rail 3, fixing groove 4, cushion 5, printed circuit board 6, box cover 7, sliding slot 8, guard 9, heat emission fan 10, heat sink 11, the right side of heat emission hole 12, Air Filter 13, storehouse inside groove 14 and coolant bottle 15, mounting box 1 is provided with place position 2, and place position 2 front surface is provided with sliding rail 3, and place position 2 is connected by sliding rail 3 with mounting box 1, and place position 2 passes through sliding rail 3 and mounting box 1 constitutes drawing structure, and the area of place position 2 is less than the internal area of mounting box 1, convenient for taking out place position 2 out of mounting box 1 Go out, fixing groove 4 is symmetrically mounted on the left and right sides inside mounting box 1, and fixing groove 4 is connected with cushion 5, is installed in fixing groove 4 Have a printed circuit board 6, fixing groove 4 about mounting box 1 center symmetric setting there are two, and fixing groove 4 is blocked with printed circuit board 6 Slot connects, and convenient for printed circuit board 6 is fixed, abandoning tradition is screwed printed circuit board 6, to printed circuit board 6 maintenance and repair brings inconvenience, and box cover 7 is arranged in the surface of mounting box 1, and the upper surface of box cover 7 symmetrically offers cunning Slot 8, guard 9 is equipped in sliding slot 8, and guard 9 constitutes dismounting mounting structure, and the covering surface of guard 9 by sliding slot 8 and box cover 7 Product does not influence the working efficiency of heat emission fan 10 less than the area of box cover 7 convenient for regularly being cleared up heat emission fan 10, radiates Fan 10 is mounted on the center of box cover 7, and the back side of mounting box 1 is equipped with heat sink 11, and heat dissipation is offered on heat sink 11 Hole 12 equidistantly offers heat emission hole 12, and 12 arc-shaped structure of heat emission hole on heat sink 11, convenient for increase in mounting box 1 with The contact area of air improves radiating efficiency, and is equipped with Air Filter 13 on heat emission hole 12, and the internal reservation of place position 2 has Storehouse inside groove 14, and coolant bottle 15 is fixed in storehouse inside groove 14, coolant bottle 15 is equidistantly mounted on the inside of place position 2, and Coolant bottle 15 is by storehouse inside groove 14 and the composition dismounting mounting structure of place position 2, convenient for the printed circuit board inside mounting box 1 6 carry out cooling and heat dissipation, increase the practicability of the device.
A kind of heat dissipating method of the radiator of electronic component:It, can when using the radiator of the electronic component To back out the screw of the both sides of the box cover 7 of 1 top of mounting box, regularly safeguards and check to being carried out in mounting box 1, installing The heat sink 11 at 1 back side of box can be dismantled, and printed circuit board 6 is inserted into 2 fixing grooves 4 in mounting box 1, is existed here It is pasted with cushion 5 in fixing groove 4, certain fixation protective effect can be played to printed circuit board 6, prevents printed circuit board 6 Friction is generated with fixing groove 4, printed circuit board 6 is caused to wear, when the printed circuit board 6 in mounting box 1 operates, can be opened Heat emission fan 10 on box cover 7 so that external cold airflow is blown into the inside of mounting box 1 by heat emission fan 10 by box cover 7, to printing electricity Road plate 6 carries out cooling and heat dissipation and can take out guard 9 from sliding slot 8 when needing to clean heat emission fan 10, you can to dissipating Heat fan 10 is cleared up, and the place position 2 on 1 right side of mounting box can be extracted out by sliding rail 3 out of mounting box 1, in place position 2 Coolant bottle 15 carry out regularly examination and maintenance, the case where preventing coolant bottle 15 from leaking, if coolant bottle 15 It leaks, can directly take out coolant bottle 15 from the storehouse inside groove 14 in place position 2, the coolant bottle in place position 2 Coolant liquid is housed in 15, the heat that the printed circuit board 6 in mounting box 1 distributes can be absorbed, printed circuit board 6 is carried out centainly Cooling and heat dissipation processing, prevent the temperature of printed circuit board 6 excessively high, shorten printed circuit board 6 service life, in mounting box 1 The multiple heat emission holes 12 being arranged on the heat sink 11 at the back side, convenient for increasing the contact area of 1 inside and air of mounting box, Jin Erti The radiating efficiency of high printed circuit board 6, the Air Filter 13 installed on heat emission hole 12 have certain dust-proof effect, prevent ash Dirt enters, and causes harmful effect to printed circuit board 6, increases whole practicability.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (7)

1. a kind of radiator of electronic component, including mounting box(1), fixing groove(4), box cover(7)And heat emission fan(10), It is characterized in that:The mounting box(1)Right side be provided with place position(2), and place position(2)Front surface be provided with sliding rail(3), The place position(2)Pass through sliding rail(3)With mounting box(1)It is connected, the fixing groove(4)It is symmetrically mounted on mounting box(1)It is interior The left and right sides in portion, and fixing groove(4)It is connected with cushion(5), the fixing groove(4)Printed circuit board is inside installed(6), described Box cover(7)It is arranged in mounting box(1)Surface, and box cover(7)Upper surface symmetrically offer sliding slot(8), the sliding slot(8) Guard is inside installed(9), the heat emission fan(10)Mounted on box cover(7)Center, the mounting box(1)The back side installation There is heat sink(11), and heat sink(11)On offer heat emission hole(12), and heat emission hole(12)On Air Filter is installed(13), The place position(2)Internal reservation have storehouse inside groove(14), and storehouse inside groove(14)In be fixed with coolant bottle(15).
2. a kind of radiator of electronic component according to claim 1, it is characterised in that:The place position(2)It is logical Cross sliding rail(3)With mounting box(1)Constitute drawing structure, and place position(2)Area be less than mounting box(1)Internal area.
3. a kind of radiator of electronic component according to claim 1, it is characterised in that:The fixing groove(4)It closes In mounting box(1)Center symmetric setting there are two, and fixing groove(4)With printed circuit board(6)Card slot connects.
4. a kind of radiator of electronic component according to claim 1, it is characterised in that:The guard(9)Pass through Sliding slot(8)With box cover(7)Constitute dismounting mounting structure, and guard(9)Area coverage be less than box cover(7)Area.
5. a kind of radiator of electronic component according to claim 1, it is characterised in that:The heat sink(11)On Equidistantly offer heat emission hole(12), and heat emission hole(12)Arc-shaped structure.
6. a kind of radiator of electronic component according to claim 1, it is characterised in that:The coolant bottle(15) Equidistantly it is mounted on place position(2)Inside, and coolant bottle(15)Pass through storehouse inside groove(14)With place position(2)Composition dismounting peace Assembling structure.
7. a kind of heat dissipating method of the radiator of electronic component, it is characterised in that specifically heat dissipating method is:Using the electricity It, can be by mounting box when the radiator of sub- component(1)The box cover of top(7)The screws of both sides back out, to mounting box(1) Interior progress is regularly safeguarded and is checked, in mounting box(1)The heat sink at the back side(11)It can be dismantled, by printed circuit board (6)It is inserted into mounting box(1)2 interior fixing grooves(4)In, here in fixing groove(4)In be pasted with cushion(5), to printed circuit Plate(6)Certain fixation protective effect is played, printed circuit board is prevented(6)With fixing groove(4)Friction is generated, printed circuit is caused Plate(6)Abrasion, works as mounting box(1)Interior printed circuit board(6)When running, open the lid(7)On heat emission fan(10)So that it dissipates Heat fan(10)External cold airflow is passed through into box cover(7)It is blown into mounting box(1)Inside, to printed circuit board(6)Cooling is carried out to dissipate Heat, when needing to heat emission fan(10)It, can be by guard when being cleaned(9)From sliding slot(8)Middle taking-up, i.e., to heat emission fan(10)It carries out Cleaning, in mounting box(1)The place position on right side(2)Pass through sliding rail(3)From mounting box(1)Interior extraction, to place position(2)Interior is cold But flow container(15)Regularly examination and maintenance are carried out, coolant bottle is prevented(15)The case where leaking, if coolant bottle (15)It leaks, it can be directly by coolant bottle(15)From place position(2)Interior storehouse inside groove(14)Middle taking-up, in place position(2) Interior coolant bottle(15)In be equipped with coolant liquid, absorb mounting box(1)Interior printed circuit board(6)The heat distributed, to printing Circuit board(6)Certain cooling and heat dissipation processing is carried out, printed circuit board is prevented(6)Temperature it is excessively high, shorten printed circuit board(6) Service life, in mounting box(1)The heat sink at the back side(11)Multiple heat emission holes of upper setting(12), convenient for increasing mounting box (1)The internal contact area with air, and then improve printed circuit board(6)Radiating efficiency, in heat emission hole(12)Upper installation Air Filter(13), there is certain dust-proof effect, prevent dust from entering, to printed circuit board(6)Cause harmful effect.
CN201810481013.3A 2018-05-18 2018-05-18 A kind of radiator and heat dissipating method of electronic component Pending CN108811436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810481013.3A CN108811436A (en) 2018-05-18 2018-05-18 A kind of radiator and heat dissipating method of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810481013.3A CN108811436A (en) 2018-05-18 2018-05-18 A kind of radiator and heat dissipating method of electronic component

Publications (1)

Publication Number Publication Date
CN108811436A true CN108811436A (en) 2018-11-13

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867330A (en) * 2021-01-13 2021-05-28 赣州邦德电路科技有限公司 Dismantle convenient protection against electric shock circuit board device
CN113078528A (en) * 2021-05-10 2021-07-06 中国航发湖南动力机械研究所 Friction pair cooling seal cavity structure
CN113766726A (en) * 2021-07-15 2021-12-07 苏州瑞煜华电子科技有限公司 High-protection high-density circuit board structure for communication

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867330A (en) * 2021-01-13 2021-05-28 赣州邦德电路科技有限公司 Dismantle convenient protection against electric shock circuit board device
CN113078528A (en) * 2021-05-10 2021-07-06 中国航发湖南动力机械研究所 Friction pair cooling seal cavity structure
CN113766726A (en) * 2021-07-15 2021-12-07 苏州瑞煜华电子科技有限公司 High-protection high-density circuit board structure for communication

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