CN108808184B - All-dielectric integrated packaged low-pass filter - Google Patents
All-dielectric integrated packaged low-pass filter Download PDFInfo
- Publication number
- CN108808184B CN108808184B CN201810783837.6A CN201810783837A CN108808184B CN 108808184 B CN108808184 B CN 108808184B CN 201810783837 A CN201810783837 A CN 201810783837A CN 108808184 B CN108808184 B CN 108808184B
- Authority
- CN
- China
- Prior art keywords
- metal
- dielectric plate
- microstrip line
- dielectric
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The invention relates to a low-pass filter of an all-dielectric integrated package, which consists of three dielectric plates: a low pass filter of a bottom dielectric plate (17); the middle layer dielectric plate (18) is an air gap supported by a dielectric strip, and the edges of the upper surface and the lower surface of the middle layer dielectric plate are printed with metal layers (4) (22) (23); the upper surface of the top dielectric plate (19) is plated with a first metal layer (1), and the edge of the lower surface is printed with a second metal layer (20) (21). Metal through holes (2) (3) (5) (6) (8) are punched on the edges of the dielectric plates of all layers to form magnetic walls, and the magnetic walls are used for shielding external electromagnetic interference and preventing internal electromagnetic leakage. The invention makes the packaging of the microwave device easier, and simultaneously has the advantages of saving the manufacturing cost, reducing the quality of packaging components and the like.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a low-pass filter of an all-dielectric integrated package.
Background
The substrate integrated gap waveguide technology is to use an electromagnetic bandgap structure to realize bandgap, and the periodic structure needs a dielectric plate with longer wavelength among dielectric plates. However, when the substrate integrated gap waveguide is used for frequencies below the Ku band, the microwave device designed in this way is several times of the wavelength, which results in a microwave device that is too large in size, so that it is not advantageous in size.
The substrate integrated gap waveguide uses an electromagnetic bandgap structure to achieve bandgap, and the periodic structure is embedded in a dielectric plate, which requires a larger size of the dielectric plate. When the substrate integrated gap waveguide is used for working frequency below Ku, the designed microwave device is several times of wavelength, so that the size of the microwave device is too large to have practicability. In the practical environment, electromagnetic waves with various frequencies exist, and the designed microwave device is required to have electromagnetic interference resistance, so that the designed filter is required to be packaged. The most common method of packaging is to enclose the microwave circuit with a metal cavity, which is not only large in size but also heavy in weight; the substrate integrated suspension microstrip line packaging method comprises five layers, wherein microstrip lines are suspended on a middle layer dielectric plate, the upper surface and the lower surface of the middle layer dielectric plate are respectively provided with an air gap supported by dielectric strips, the air layers are respectively provided with a layer of dielectric plate plated with metal, and the edges of each layer of dielectric plate are respectively provided with periodic metal through holes.
The full-medium integrated packaging technology combines a substrate integrated gap waveguide technology and a substrate integrated suspension microstrip line technology. The packaging circuit is composed of three layers of dielectric plates: the bottom dielectric plate is a main microwave circuit, the middle dielectric plate is an air gap supported by using strip-shaped dielectric, the top dielectric plate is a dielectric plate plated with a metal layer, and periodic metal through holes are drilled at the edge of each dielectric plate. This structure makes packaging of the microwave device easier while saving manufacturing costs and improving the quality of the packaged parts.
The content of the invention is searched by the literature, and the same disclosure report as the invention is not found.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and designs a low-pass filter with an all-dielectric integrated package.
The low-pass filter of the invention comprises: a top dielectric plate (19), a middle dielectric plate (18), a bottom dielectric plate (17), wherein:
a. the upper surface of the top dielectric plate (19) is printed with a first metal layer (1), and the edge of the lower surface is printed with a second metal layer (20) and a third metal layer (21); the edge of the top dielectric plate (19) is provided with a first periodic metal via hole (2) and a second periodic metal via hole (3);
b. the middle layer dielectric plate (18) is positioned in the middle of the top layer dielectric plate (19) and the bottom layer dielectric plate (17), and edges of the upper surface and the lower surface of the middle layer dielectric plate are printed with a fourth metal layer (4), a fifth metal layer (22), a sixth metal layer (23) and a seventh metal layer (26); the edge of the middle layer dielectric plate (18) is provided with a third periodic metal via hole (5) and a fourth periodic metal via hole (6);
c. the edge of the bottom dielectric plate (17) is provided with a fifth periodic metal via hole (9) and a sixth periodic metal via hole (8); a seventh metal layer (24) is printed on the lower surface of the bottom dielectric plate (17); the edge of the upper surface of the bottom dielectric plate (17) is provided with a printed eighth metal layer (7) and a printed ninth metal layer (25); four groups of eight square metal rings (14) are printed on the upper surface of the bottom dielectric plate (17), and a gap (27) is formed between two square metal rings in each group of square metal rings; each metal ring is connected with a rectangular metal patch (12); the first group of square metal rings (33) and the second group of square metal rings (34) are connected through microstrip lines (30); the second group of square metal rings (34) and the third group of square metal rings (35) are connected through two first microstrip lines (10) and two second microstrip lines (11); the third group of square metal rings (35) and the fourth group of square metal rings (36) are connected through microstrip lines (13); the printed first feed microstrip line (15) and second feed microstrip line (31) are connected with the first group of square metal rings (33) and the fourth group of square metal rings (36) through the third microstrip line (28) and the fourth microstrip line (29); a first branch (16) and a second branch (32) are added at the port of the feed microstrip line; the edge of the upper surface of the bottom dielectric plate (26) is provided with a printed eighth metal layer (7) and a printed ninth metal layer (25);
d. the dielectric constants of the top dielectric plate (19), the middle dielectric plate (18) and the bottom dielectric plate (17) are the same, and the three dielectric plates are fixed together through bonding; the lengths and the widths of the three-layer dielectric plates are the same; the edges of the three-layer dielectric plates are provided with through holes (37, 38) for installation: a first via (37) and a second via (38).
The low-pass filter comprises a bottom dielectric plate (17), an eighth metal layer (7), a ninth metal layer (25) and a tenth metal layer (24) which are printed on the bottom dielectric plate, four groups of metal rings, a first square metal ring (33), a second square metal ring (34), a third square metal ring (35) and a fourth square metal ring (36), wherein the first microstrip line (10), the second microstrip line (11), the third microstrip line (28), the fourth microstrip line (29) and the fifth microstrip line (13) are connected with the square metal ring, a rectangular metal patch (12) in the square metal ring, and a first feed microstrip line (15) and a second feed microstrip line (31) and a first branch (16) and a second branch (32) at the ports of the feed microstrip line form the low-pass filter; the interlayer dielectric plate (18) supports the air gap; metal via holes drilled at the edges of each dielectric plate: the first metal via hole (2), the second metal via hole (3), the third metal via hole (5), the fourth metal via hole (6), the fifth metal via hole (8) and the sixth metal via hole (9) form magnetic walls, and are used for shielding external electromagnetic interference and preventing internal electromagnetic leakage; the middle dielectric plate (18) and the top dielectric plate (19) are used for packaging the low-pass filter formed on the bottom dielectric plate (17).
In the all-dielectric integrated packaged low-pass filter, after the air thickness of the middle layer exceeds 0.07 air wavelength, the resonance problem of the packaged low-pass filter cavity can be eliminated.
The low-pass filter of the all-dielectric integrated package increases the width or length of the rectangular metal patch (12) in the square metal ring, can reduce the cut-off frequency of a filter circuit and reduce the size of the circuit.
The second and third groups of square metal rings in the filter circuit are connected by the two first microstrip lines (10) and the second microstrip lines (11) to facilitate matching.
According to the all-dielectric integrated packaged low-pass filter, the branches (16) are added at the ports of the feed microstrip line, so that the resonance problem at the high-order mode can be eliminated.
Compared with the prior art, the invention has the following advantages:
1. solves the problems of large size and large quality of the traditional packaging technology;
2. has lower packaging thickness;
3. the structure is stable, and the transmission performance is good;
4. the anti-electromagnetic interference and anti-electromagnetic leakage capabilities are strong;
drawings
Fig. 1 is an overall structure diagram of a low-pass filter of an all-dielectric integrated package of the present invention.
Fig. 2 is a top surface view of a top dielectric plate of the all-dielectric integrated packaged low-pass filter of the present invention.
Fig. 3 is a bottom surface view of a top dielectric plate of the all-dielectric integrated package low-pass filter of the present invention.
Fig. 4 is a top surface view of an intermediate dielectric plate of the all-dielectric integrated package low-pass filter of the present invention.
Fig. 5 is a bottom surface view of an intermediate dielectric plate of the all-dielectric integrated package low-pass filter of the present invention.
Fig. 6 is a top surface view of the bottom dielectric plate of the all-dielectric integrated encapsulated low-pass filter of the present invention.
Fig. 7 is a bottom surface view of the bottom dielectric plate of the all-dielectric integrated encapsulated low-pass filter of the present invention.
Fig. 8 is a graph of the results of S11 and S21 for the all-dielectric integrated encapsulated low pass filter of the present invention.
Detailed Description
The technical scheme of the invention is further described in detail below with reference to the specific embodiments.
The low-pass filter of the invention comprises: a top dielectric plate (19), a middle dielectric plate (18), a bottom dielectric plate (17), wherein:
e. the upper surface of the top dielectric plate (19) is printed with a first metal layer (1), and the edge of the lower surface is printed with a second metal layer (20) and a third metal layer (21); the edge of the top dielectric plate (19) is provided with a first periodic metal via hole (2) and a second periodic metal via hole (3);
f. the middle layer dielectric plate (18) is positioned in the middle of the top layer dielectric plate (19) and the bottom layer dielectric plate (17), and edges of the upper surface and the lower surface of the middle layer dielectric plate are printed with a fourth metal layer (4), a fifth metal layer (22), a sixth metal layer (23) and a seventh metal layer (26); the edge of the middle layer dielectric plate (18) is provided with a third periodic metal via hole (5) and a fourth periodic metal via hole (6);
g. the edge of the bottom dielectric plate (17) is provided with a fifth periodic metal via hole (9) and a sixth periodic metal via hole (8); a seventh metal layer (24) is printed on the lower surface of the bottom dielectric plate (17); the edge of the upper surface of the bottom dielectric plate (17) is provided with a printed eighth metal layer (7) and a printed ninth metal layer (25); four groups of eight square metal rings (14) are printed on the upper surface of the bottom dielectric plate (17), and a gap (27) is formed between two square metal rings in each group of square metal rings; each metal ring is connected with a rectangular metal patch (12); the first group of square metal rings (33) and the second group of square metal rings (34) are connected through microstrip lines (30); the second group of square metal rings (34) and the third group of square metal rings (35) are connected through two first microstrip lines (10) and two second microstrip lines (11); the third group of square metal rings (35) and the fourth group of square metal rings (36) are connected through microstrip lines (13); the printed first feed microstrip line (15) and second feed microstrip line (31) are connected with the first group of square metal rings (33) and the fourth group of square metal rings (36) through the third microstrip line (28) and the fourth microstrip line (29); a first branch (16) and a second branch (32) are added at the port of the feed microstrip line; the edge of the upper surface of the bottom dielectric plate (26) is provided with a printed eighth metal layer (7) and a printed ninth metal layer (25);
h. the dielectric constants of the top dielectric plate (19), the middle dielectric plate (18) and the bottom dielectric plate (17) are the same, and the three dielectric plates are fixed together through bonding; the lengths and the widths of the three-layer dielectric plates are the same; the edges of the three-layer dielectric plates are provided with through holes (37, 38) for installation: a first via (37) and a second via (38).
The low-pass filter comprises a bottom dielectric plate (17), an eighth metal layer (7), a ninth metal layer (25) and a tenth metal layer (24) which are printed on the bottom dielectric plate, four groups of metal rings, a first square metal ring (33), a second square metal ring (34), a third square metal ring (35) and a fourth square metal ring (36), wherein the first microstrip line (10), the second microstrip line (11), the third microstrip line (28), the fourth microstrip line (29) and the fifth microstrip line (13) are connected with the square metal ring, a rectangular metal patch (12) in the square metal ring, and a first feed microstrip line (15) and a second feed microstrip line (31) and a first branch (16) and a second branch (32) at the ports of the feed microstrip line form the low-pass filter; the interlayer dielectric plate (18) supports the air gap; metal via holes drilled at the edges of each dielectric plate: the first metal via hole (2), the second metal via hole (3), the third metal via hole (5), the fourth metal via hole (6), the fifth metal via hole (8) and the sixth metal via hole (9) form magnetic walls, and are used for shielding external electromagnetic interference and preventing internal electromagnetic leakage; the middle dielectric plate (18) and the top dielectric plate (19) are used for packaging the low-pass filter formed on the bottom dielectric plate (17).
In the all-dielectric integrated packaged low-pass filter, after the air thickness of the middle layer exceeds 0.07 air wavelength, the resonance problem of the packaged low-pass filter cavity can be eliminated.
The low-pass filter of the all-dielectric integrated package increases the width or length of the rectangular metal patch (12) in the square metal ring, can reduce the cut-off frequency of a filter circuit and reduce the size of the circuit.
The second and third groups of square metal rings in the filter circuit are connected by using the two first microstrip lines (10) and the second microstrip lines (11), so that the low-pass filter is favorable for matching.
According to the all-dielectric integrated packaged low-pass filter, the branches (16) are added at the ports of the feed microstrip line, so that the resonance problem at the high-order mode can be eliminated.
In the embodiment of the invention, the bottom dielectric plate (17), the middle dielectric plate (18) and the top dielectric plate (19) are all FR4 epoxy, wherein the thickness of the top dielectric plate (19) is 2mm, the thickness of the middle dielectric plate (18) is 6mm, and the thickness of the bottom dielectric plate (17) is 1.6mm; the air thickness of the middle layer is 0.07 air wavelength, so that the lower packaging thickness is maintained; the packaged filter has no cavity resonance problem and has strong electromagnetic interference resistance.
While the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (6)
1. A low pass filter of an all dielectric integrated package comprising: a top dielectric plate (19), a middle dielectric plate (18), a bottom dielectric plate (17), wherein:
the upper surface of the top dielectric plate (19) is printed with a first metal layer (1), and the edge of the lower surface is printed with a second metal layer (20) and a third metal layer (21); the edge of the top dielectric plate (19) is provided with a first periodic metal via hole (2) and a second periodic metal via hole (3);
the middle layer dielectric plate (18) is positioned in the middle of the top layer dielectric plate (19) and the bottom layer dielectric plate (17), the edge of the upper surface of the middle layer dielectric plate is printed with a fourth metal layer (4) and a sixth metal layer (23), and the edge of the lower surface of the middle layer dielectric plate is printed with a fifth metal layer (22) and a seventh metal layer (26); the edge of the middle layer dielectric plate (18) is provided with a third periodic metal via hole (5) and a fourth periodic metal via hole (6);
the edge of the bottom dielectric plate (17) is provided with a fifth periodic metal via hole (9) and a sixth periodic metal via hole (8); a seventh metal layer (24) is printed on the lower surface of the bottom dielectric plate (17); four groups of eight square metal rings (14) are printed on the upper surface of the bottom dielectric plate (17), and a gap (27) is formed between two square metal rings in each group of square metal rings; each metal ring is connected with a rectangular metal patch (12); the first group of square metal rings (33) and the second group of square metal rings (34) are connected through microstrip lines (30); the second group of square metal rings (34) and the third group of square metal rings (35) are connected through the first microstrip line (10) and the second microstrip line (11); the third group of square metal rings (35) and the fourth group of square metal rings (36) are connected through a fifth microstrip line (13); the printed first feed microstrip line (15) is connected with a first group of square metal rings (33) through a fourth microstrip line (29); the printed second feed microstrip line (31) is connected with a fourth group of square metal rings (36) through a third microstrip line (28); the ports of the first feed microstrip line (15) and the second feed microstrip line (31) are respectively added with a first branch (16) and a second branch (32);
the edge of the upper surface of the bottom dielectric plate (26) is provided with a printed eighth metal layer (7) and a printed ninth metal layer (25); the dielectric constants of the top dielectric plate (19), the middle dielectric plate (18) and the bottom dielectric plate (17) are the same, and the three dielectric plates are fixed together through bonding; the lengths and the widths of the three-layer dielectric plates are the same;
the edges of the three-layer dielectric plates are perforated with vias (37, 38) for mounting.
2. The all-dielectric integrated packaged low pass filter of claim 1, wherein: the low-pass filter comprises a bottom dielectric plate (17), a eighth metal layer (7), a ninth metal layer (25) and a tenth metal layer (24) which are printed on the bottom dielectric plate, four groups of metal rings, a first square metal ring (33), a second square metal ring (34), a third square metal ring (35) and a fourth square metal ring (36), wherein the square metal rings are connected with a first microstrip line (10), a second microstrip line (11), a third microstrip line (28), a fourth microstrip line (29) and a fifth microstrip line (13), rectangular metal patches (12), a first feed microstrip line (15) and a second feed microstrip line (31) in the square metal rings, and a first branch (16) and a second branch (32) at the ports of the feed microstrip lines; the interlayer dielectric plate (18) supports the air gap; metal via holes drilled at the edges of each dielectric plate: the first metal via hole (2), the second metal via hole (3), the third metal via hole (5), the fourth metal via hole (6), the fifth metal via hole (8) and the sixth metal via hole (9) form magnetic walls, and are used for shielding external electromagnetic interference and preventing internal electromagnetic leakage; an intermediate dielectric plate (18) and a top dielectric plate (19) are used to encapsulate the low pass filter.
3. The all-dielectric integrated packaged low pass filter of claim 1, wherein: the air thickness of the interlayer dielectric sheet (18) is greater than 0.07 air wavelengths.
4. The all-dielectric integrated packaged low pass filter of claim 1, wherein: increasing the width or length of the rectangular metal patches (12) in the square metal ring can reduce the cut-off frequency of the filter circuit and reduce the circuit size.
5. The all-dielectric integrated packaged low pass filter of claim 1, wherein: the second group of square metal rings and the third group of square metal rings in the filter circuit are connected by the first microstrip line (10) and the second microstrip line (11), so that matching is facilitated.
6. The all-dielectric integrated packaged low pass filter of claim 1, wherein: the resonance problem at the higher order modes can be eliminated by adding the first branch (16) and the second branch (32) at the ports of the first feed microstrip line (15) and the second feed microstrip line (31) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810783837.6A CN108808184B (en) | 2018-07-17 | 2018-07-17 | All-dielectric integrated packaged low-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810783837.6A CN108808184B (en) | 2018-07-17 | 2018-07-17 | All-dielectric integrated packaged low-pass filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108808184A CN108808184A (en) | 2018-11-13 |
| CN108808184B true CN108808184B (en) | 2023-09-22 |
Family
ID=64076864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810783837.6A Active CN108808184B (en) | 2018-07-17 | 2018-07-17 | All-dielectric integrated packaged low-pass filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108808184B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131164B (en) * | 2021-03-07 | 2022-01-14 | 西安电子科技大学 | Suspension line gap waveguide based on stacked mushroom type electromagnetic band gap structure package |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414656A (en) * | 2002-12-20 | 2003-04-30 | 清华大学 | Micro wave single folding filter |
| CN104795614A (en) * | 2015-04-07 | 2015-07-22 | 上海大学 | Broad-stopband electrically-tunable dual-frequency band-pass filter |
| CN106785466A (en) * | 2016-12-28 | 2017-05-31 | 华南理工大学 | A kind of three frequency filter antennas with high-frequency selectivity |
| CN106848519A (en) * | 2017-01-17 | 2017-06-13 | 电子科技大学 | A kind of integrated suspended substrate stripline of medium of artificial complex media filling |
| CN206422238U (en) * | 2016-12-28 | 2017-08-18 | 华南理工大学 | A kind of three frequency filter antennas with high-frequency selectivity |
| CN107369869A (en) * | 2017-06-20 | 2017-11-21 | 电子科技大学 | A kind of low insertion loss wave filter based on encapsulation micro-strip |
| CN209389185U (en) * | 2018-07-17 | 2019-09-13 | 云南大学 | The low-pass filter of novel medium integration packaging |
-
2018
- 2018-07-17 CN CN201810783837.6A patent/CN108808184B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414656A (en) * | 2002-12-20 | 2003-04-30 | 清华大学 | Micro wave single folding filter |
| CN104795614A (en) * | 2015-04-07 | 2015-07-22 | 上海大学 | Broad-stopband electrically-tunable dual-frequency band-pass filter |
| CN106785466A (en) * | 2016-12-28 | 2017-05-31 | 华南理工大学 | A kind of three frequency filter antennas with high-frequency selectivity |
| CN206422238U (en) * | 2016-12-28 | 2017-08-18 | 华南理工大学 | A kind of three frequency filter antennas with high-frequency selectivity |
| CN106848519A (en) * | 2017-01-17 | 2017-06-13 | 电子科技大学 | A kind of integrated suspended substrate stripline of medium of artificial complex media filling |
| CN107369869A (en) * | 2017-06-20 | 2017-11-21 | 电子科技大学 | A kind of low insertion loss wave filter based on encapsulation micro-strip |
| CN209389185U (en) * | 2018-07-17 | 2019-09-13 | 云南大学 | The low-pass filter of novel medium integration packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108808184A (en) | 2018-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103187603B (en) | A kind of Wide stop bands LTCC band pass filter based on magneto-electric coupled cancellation technology | |
| CN108963402A (en) | It is a kind of for making the transmission structure and production method of frequency microwave device and antenna | |
| CN103378387B (en) | Based on the Wide stop bands LTCC band pass filter of frequency selectivity coupling technique | |
| CN110265755A (en) | A kind of dielectric waveguide filter | |
| WO2008104501B1 (en) | Improved noise isolation in high-speed digital systems on packages and printed circuit boards (pcbs) | |
| CN109599646B (en) | Packaged planar integrated dual band filter | |
| CN109361040A (en) | Broad-band chip integrates gap waveguide bandpass filter | |
| CN106848517A (en) | A kind of encapsulation microstrip line construction of the integrated gap waveguide of new substrate | |
| CN105337009A (en) | LTCC filter for coupling inhibition of third and fifth harmonics based on frequency selectivity | |
| CN108808184B (en) | All-dielectric integrated packaged low-pass filter | |
| CN111816964B (en) | Millimeter wave suspension strip line composite filter | |
| CN102856620A (en) | Balun with laminated structure | |
| CN110225649B (en) | Novel electromagnetic band gap structure for suppressing synchronous switch noise | |
| CN107317080A (en) | Inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate | |
| CN208674340U (en) | It is a kind of for making the transmission structure of frequency microwave device and antenna | |
| CN109301408A (en) | The Planar integration gap waveguide dual frequency filter of encapsulation | |
| CN209389185U (en) | The low-pass filter of novel medium integration packaging | |
| CN108923104A (en) | Highly selective substrate integrates gap waveguide bandpass filter | |
| CN101246982A (en) | Second self compound transmission line and resonance loop coupled band-pass filter | |
| CN101938023A (en) | Bragg rectangular two-dimensional electromagnetic band gap (EBG) high-impedance backboard plane structure | |
| CN107317079A (en) | Based on the integrated gap waveguide bending microstrip line encapsulation of substrate | |
| CN109216838A (en) | Improved defect ground structure low-pass filter | |
| CN103687280B (en) | A kind of electromagnetic bandgap structure | |
| CN204947046U (en) | Based on the LTCC filter of frequency selectivity coupling suppression three quintuple harmonicss | |
| US20090056984A1 (en) | Signal transmission structure and layout method for the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |