CN108807258A - 一种半导体芯片生产工艺 - Google Patents
一种半导体芯片生产工艺 Download PDFInfo
- Publication number
- CN108807258A CN108807258A CN201810568949.XA CN201810568949A CN108807258A CN 108807258 A CN108807258 A CN 108807258A CN 201810568949 A CN201810568949 A CN 201810568949A CN 108807258 A CN108807258 A CN 108807258A
- Authority
- CN
- China
- Prior art keywords
- wafer
- shrapnel
- hinged
- gripping block
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000000227 grinding Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000006835 compression Effects 0.000 claims abstract description 17
- 238000007906 compression Methods 0.000 claims abstract description 17
- 238000003801 milling Methods 0.000 claims abstract description 15
- 239000013078 crystal Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 4
- 230000003647 oxidation Effects 0.000 claims abstract description 4
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 4
- 238000001020 plasma etching Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 99
- 238000003825 pressing Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810568949.XA CN108807258B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810568949.XA CN108807258B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108807258A true CN108807258A (zh) | 2018-11-13 |
CN108807258B CN108807258B (zh) | 2020-12-18 |
Family
ID=64088588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810568949.XA Active CN108807258B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108807258B (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004255568A (ja) * | 2004-05-14 | 2004-09-16 | Tokyo Seimitsu Co Ltd | ウェーハ位置決め方法及び装置 |
CN101090087A (zh) * | 2006-06-14 | 2007-12-19 | 西门子公司 | 用于晶片的夹紧装置 |
US20100099221A1 (en) * | 2008-10-22 | 2010-04-22 | Disco Corporation | Stacked device manufacturing method |
CN101728302A (zh) * | 2009-12-08 | 2010-06-09 | 中国电子科技集团公司第四十五研究所 | 边缘接触夹持式晶圆末端执行器 |
CN102945820A (zh) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | 盘状物夹持装置 |
CN102950536A (zh) * | 2011-08-30 | 2013-03-06 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置及化学机械研磨方法 |
CN104505364A (zh) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | 一种晶圆可旋转的夹持装置 |
CN104786139A (zh) * | 2014-01-21 | 2015-07-22 | 株式会社荏原制作所 | 基板保持装置及研磨装置 |
CN106938436A (zh) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | 一种用于电子产品制造的晶圆研磨设备 |
-
2018
- 2018-06-05 CN CN201810568949.XA patent/CN108807258B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004255568A (ja) * | 2004-05-14 | 2004-09-16 | Tokyo Seimitsu Co Ltd | ウェーハ位置決め方法及び装置 |
CN101090087A (zh) * | 2006-06-14 | 2007-12-19 | 西门子公司 | 用于晶片的夹紧装置 |
US20100099221A1 (en) * | 2008-10-22 | 2010-04-22 | Disco Corporation | Stacked device manufacturing method |
CN101728302A (zh) * | 2009-12-08 | 2010-06-09 | 中国电子科技集团公司第四十五研究所 | 边缘接触夹持式晶圆末端执行器 |
CN102950536A (zh) * | 2011-08-30 | 2013-03-06 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置及化学机械研磨方法 |
CN102945820A (zh) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | 盘状物夹持装置 |
CN104786139A (zh) * | 2014-01-21 | 2015-07-22 | 株式会社荏原制作所 | 基板保持装置及研磨装置 |
CN104505364A (zh) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | 一种晶圆可旋转的夹持装置 |
CN106938436A (zh) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | 一种用于电子产品制造的晶圆研磨设备 |
Also Published As
Publication number | Publication date |
---|---|
CN108807258B (zh) | 2020-12-18 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201116 Address after: Room 276800, floor 302, No. 177, hi tech Zone, Shandong Province Applicant after: Rizhao Yiming Technology Service Co., Ltd Address before: 225126 Yangzhou Hanjie electronic Polytron Technologies Inc 6, Hanye Road, Hanjiang District, Yangzhou, Jiangsu Applicant before: Wang Qing |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20211123 Address after: 276800 Building 1, No. 177, Gaoxin Sixth Road, high tech Zone, Rizhao City, Shandong Province Patentee after: Rizhao Jingying Media Technology Co.,Ltd. Address before: Room 302, 3 / F, building B2, Venture Center, hi tech Zone, No. 177, Gaoxin 6th Road, Rizhao City, Shandong Province Patentee before: Rizhao Yiming Technology Service Co., Ltd |
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TR01 | Transfer of patent right |