CN108807233A - The workbench and clamping method of bonding are solved after sheet product bonding - Google Patents
The workbench and clamping method of bonding are solved after sheet product bonding Download PDFInfo
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- CN108807233A CN108807233A CN201810647554.9A CN201810647554A CN108807233A CN 108807233 A CN108807233 A CN 108807233A CN 201810647554 A CN201810647554 A CN 201810647554A CN 108807233 A CN108807233 A CN 108807233A
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- 238000000034 method Methods 0.000 title claims abstract description 27
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- 230000007246 mechanism Effects 0.000 claims description 27
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- 230000001360 synchronised effect Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 17
- 239000011521 glass Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 241000252254 Catostomidae Species 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- 238000005303 weighing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The workbench of bonding is solved after being bonded the invention discloses a kind of sheet product, it includes microscope carrier, it is characterised in that：The microscope carrier is equipped with reference plane and at least one sucker group, when product is placed on microscope carrier, the sucker group is touched product prior to reference plane and is attracted with the back side of product, the sucker group drive the product being pulled in sucker group towards reference plane position be moved to the back side of the product and reference plane against.The surface that can be very good jointing product by sucker even if the surface of product there are completing to be attracted well warpage or surface accuracy difference, and can make product fixed and positioned well on microscope carrier by reference plane.The present invention provides the workbench that bonding is solved after a kind of bonding of sheet product, can be therefore versatile in solving bonding process to the product of flatness difference progress clamping.
Description
Technical field
The present invention relates to the technical fields that integrated circuit is prepared with related accessory, specifically after a kind of sheet product bonding
Solve the workbench and clamping method of bonding.
Background technology
Laminar product generally requires first to be bonded to product on one slide glass before carrying out surface processing, such as subtracts
Thin, etching etc. improves the qualification rate of product the defects of thus enhancing the intensity of product, reduce or avoid product fragmentation.It is above-mentioned
This process in semiconductor processing industry with more, so continuing to use the bonding that the definition in its industry is referred to as product
Journey.Certainly, then it is required that product is detached from slide glass after product completion surface working process after bonding, this process is referred to as
Solve bonding process.
And the process of this solution bonding is to fix product and slide glass respectively by microscope carrier and manipulator, then pass through in simple terms
Manipulator drives product and slide glass solution to be bonded with being relatively distant from for microscope carrier.And since the thickness of product is often smaller,
Slide glass is also relatively mostly laminated structure, therefore the fixed form between its microscope carrier and product or slide glass on microscope carrier can not use
Traditional chucking device, more in industry is to use workbench with holes, that is, passes through the suction of suction hole on workbench
So that the sheet products being positioned on workbench are pulled on workbench.
But above-mentioned microscope carrier in the prior art is had some limitations due to the design feature of its own.It changes
Sentence is talked about, when the flatness of above-mentioned product or slide glass is poor, such as the product after plastic packaging, then it can lead to this flatness
It can not be bonded completely between poor product or slide glass and the work top of microscope carrier, thus can there is gas leak phenomenon, this will
So that suction hole acts on the reduction of the suction on product, it will cause product not to be pulled on microscope carrier normally, or due to
The suction-combining force is smaller to be bonded so that can not normally be solved between product and slide glass.
In addition, it is worth mentioning at this point that can also be carried by improving when slide glass is bonded absorption with this microscope carrier of the prior art
The surface accuracy of piece improves adsorption effect or thicker load block is selected to complete clamping by traditional collet, although above-mentioned
Process can be additional increase processing cost and reduce production efficiency, but do not consider production cost small lot processing
In the case of still can achieve the purpose that solve between product and slide glass to be bonded.But when it is required that product is pasted with microscope carrier
There has been no better solutions in the prior art when conjunction absorption.Therefore, this microscope carrier of the prior art is in actual production process
In can only be directed to specific product and slide glass, versatility is poor.
Invention content
The present invention is directed to solve one of in the related technology technical problem at least to a certain extent：It provides a kind of thin
The workbench of bonding is solved after flake products bonding, clamping can be carried out to the product of flatness difference, therefore in solution bonding process
In it is versatile.
For this purpose, solving the workbench of bonding after being bonded an object of the present invention is to provide a kind of sheet product, it is wrapped
Include microscope carrier, it is characterised in that：The microscope carrier be equipped with reference plane and at least one sucker group, when product is placed on microscope carrier described in
Sucker group is touched product prior to reference plane and is attracted with the back side of product, and the sucker group drives the product being pulled in sucker group
Towards reference plane position be moved to the back side of the product and reference plane against.Jointing product is can be very good by sucker
Surface, even if the surface of product there are completing to be attracted well warpage or surface accuracy difference, and pass through reference plane
Product can be made to be fixed and positioned well on microscope carrier.Therefore can complete multiple product solution bonding processing, reduce or
The influence of product surface size and precision for clamping intensity in solution bonding process is avoided, so that above-mentioned workbench
Versatility is good.
According to an example of the present invention, the sucker group includes several vacuum slots made of elastic material, described
Vacuum slot is installed on along the one end in length direction on microscope carrier, and the other end of the vacuum slot is equipped with opening, for
The back side of product is bonded.Adsorption production is not only can be very good by vacuum slot, but also vacuum slot is during absorption
It can be shunk along length direction, therefore product can be driven to fit in reference plane well, that is, synchronously complete product
Actuation and position fixing process.
According to an example of the present invention, the microscope carrier is equipped with a work top, the sucker group and the equal position of reference plane
In on the work top of microscope carrier.Microscope carrier is equipped with independent work top in order to which sucker group and reference plane is arranged.
According to an example of the present invention, the position being located at corresponding to each vacuum slot on the work top of the microscope carrier is equal
Equipped with storage tank, each vacuum slot is respectively arranged in corresponding storage tank, and the opening of each vacuum slot is placed on
Outside storage tank.
According to an example of the present invention, elevating mechanism, end of each vacuum slot far from opening are equipped in the microscope carrier
It is installed on the movable end of elevating mechanism, the movable end of the elevating mechanism drives whole vacuum slots along the groove depth of storage tank
Direction is moved, so that the opening of the vacuum slot is placed on outside storage tank or in storage to storage tank.By being additionally arranged
Elevating mechanism the movement of vacuum slot may be implemented, therefore product can be driven to be fitted in reference plane well, herein mistake
The adjusting that fitting dynamics and displacement distance not only may be implemented in journey causes to produce so as to avoid excessive with reference plane impact force
The situation of product breakage also avoids displacement distance deficiency and leads to the unstable problem of product orientation.In addition, being shut down in microscope carrier not busy
During setting, whole vacuum slots can be made to be accommodated in storage tank by elevating mechanism, play dust-proof effect, keep away
The inconvenience for manually going dismounting vacuum slot to bring is exempted from.
According to an example of the present invention, the sucker group is multiple, and whole suckers are set along the circumferentially-spaced of reference plane
It sets, the reference plane is equipped with several spaced apertures, and the air intake duct being connected to each aperture is equipped in the microscope carrier, described
Air in aperture is detached through air intake duct, so that close to reference plane or fitting in the product in reference plane and shape between reference plane
At the active force being mutually attracted.Sucker group may be used when the flatness at the product back side is poor and be attracted aperture on cooperation microscope carrier
Actuation achievees the effect that product orientation, and sucker group can not be used when the flatness at the product back side is preferable, directly passes through load
Aperture on platform is attracted, simple to operate, therefore that microscope carrier is completed is more for multiple product for above-mentioned structure
The positioning method of sample selects, and versatility is stronger.
According to an example of the present invention, whole vacuum slots is uniformly distributed on microscope carrier, and the reference plane extends
To between two vacuum slots of arbitrary neighborhood.
The present invention is directed to solve another technical problem in the related technology at least to a certain extent：A kind of sheet production is provided
The clamping method of product, the structure based on above-mentioned workbench can be to the sheet products of different surfaces size and precision into luggage
Position is clamped, therefore clamping process is simply efficient, and versatile.
For this purpose, it is another object of the present invention to propose a kind of clamping method of sheet product, it includes above-mentioned work
Make platform, it is characterised in that：Include the following steps：
S1, it will wait for that the product of solution bonding is placed on microscope carrier, and the sucker group on microscope carrier lifts product, so that described
Product is suspended in above microscope carrier；
The back side of S2, sucker group and product are attracted；
S3, synchronous with step S2 or the sucker group drives the product that is pulled in sucker group towards microscope carrier upon step s 2
Position is moved, so that the reference plane on the back side and microscope carrier of the product leans.
Preferably, the step S3, which refers to elevating mechanism after completing step S2 in the microscope carrier, drives sucker
Group drives the product being connected in sucker group to be moved towards microscope carrier position, so that the base on the back side and microscope carrier of the product
Quasi- face leans.
Further preferably, the step S3 includes the following steps：
Where elevating mechanism in S31, the microscope carrier drives sucker group to drive the product towards microscope carrier being connected in sucker group
It moves position；
Aperture on S32, the microscope carrier is blown towards the back side of product, so that close to the product back side of reference plane and microscope carrier
Between form buffer layer, the atmospheric pressure value in the aperture is more than external pressure, and the buffer layer is applied to the work on product
Firmly it is less than pulling force of the sucker group to product；
S33, the elevating mechanism pull product until the back side of the product is bonded with reference plane by sucker group；
S34, air in aperture is detached, so that forming the suction being mutually attracted between the aperture and the back side of product
Power, the atmospheric pressure value in the aperture are less than external pressure.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Above-mentioned technical proposal has the following advantages that or advantageous effect：First, by exposing to reference plane in whole or in part
On sucker group can be very good to be attracted product, and product can be driven to be pressed in reference plane, therefore versatile, secondly,
The axial movement of sucker group may be implemented by elevating mechanism, can not only adjust product and be pressed in reference plane during this
Spacing and pressing force, and can make to hide sucker group when workbench leaves unused, achieve the effect that dust-proof, finally, pass through four
A corner setting sucker group coordinates several apertures of centre position setting so that product foundation own face size and precision are not
It is only attracted by aperture with selection or sucker group is coordinated to be attracted, therefore optimal dress can be provided for different products
Folder mode, it is versatile.
Description of the drawings
Fig. 1 is the structural schematic diagram of the workbench of solution bonding after the sheet product of the present invention is bonded.
Fig. 2 is the schematic diagram of another structure of the present invention.
Fig. 3 is the schematic side view of workbench in the operating condition in Fig. 2.
Wherein, 1, microscope carrier, 2, reference plane, 2.1, aperture, 3, sucker group, 3.1, vacuum slot, 3.2, opening, 4, product,
4.1, the back side, 5, storage tank.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
Below with reference to the accompanying drawings it is described in detail workbench according to the ... of the embodiment of the present invention.
It is whole to each mean that the sheet products after solution bonding are formed after being bonded with slide glass without clearly explaining for product 4 hereinafter
Body, the bonding of so-called solution refers to the process of being detached after sheet products and slide glass bonding, by taking wafer as an example, when wafer bonding exists
It is required that wafer is detached with slide glass after being processed on slide glass, this process is the solution bonding process of wafer, successively
Analogize, the sheet products solution bonding where in text can be detached with two sheets that are interpreted as of broad sense.Further, institute
The product stated can be that the materials such as wafer, glass, sheet metal, engineering plastics are made or are combined by multiple material the synthesis formed
Sheet products made of material.
Embodiment one：
The present invention provides the workbench that bonding is solved after a kind of bonding of sheet product, it includes microscope carrier 1 as shown in Figure 1,
The microscope carrier 1 is placed in horizontal direction as shown in the figure, it is characterised in that：The microscope carrier 1 is equipped with reference plane 2 and at least one suction
Disk group 3, when product 4 is vertically placed on microscope carrier 1 from top to bottom the sucker group 3 prior to reference plane 2 touch product 4 and
It is attracted with the back side 4.1 of product 4, in other words, the product 4 first touches suction during vertically placing from top to bottom
Disk group 3 is located at the part of 1 top of microscope carrier, and the sucker group 3, which drives, after sucker group 3 is attracted product is pulled in sucker group 3
Product 4 towards 2 position of reference plane be moved to the back side 4.1 of the product 4 and reference plane 2 against.
It can refer to that sucker group 3 is evacuated the back side so that sucker group 3 and product 4 that above-mentioned sucker group 3, which drives product 4,
4 DL synchronization of product is driven due to the diminution of sucker group 3 during 4.1 actuations, may also mean that sucker group 3 and product 4
Be attracted after connection drives sucker group 3 and the product 4 being connected in sucker group 3 to move by additional driving mechanism, to reach
To the purpose of driving product 4.
The back side 4.1 of the said goods 4 refer to towards the lower face of microscope carrier 1, as shown in Figure 3, bottom surface vertically
The as back side 4.1 of product 4, by taking wafer as an example, if wafer in lower and slide glass upper, the back side 4.1 of the product 4 refers to crystalline substance
Circle away from the end face of slide glass, if slide glass in lower and wafer upper, the back side 4.1 of the product 4 refers to slide glass far from wafer
Lower face.
Embodiment two：
It is substantially the same in the structure of embodiment one, difference lies in：The sucker group 3 includes made of elastic material
Several vacuum slots 3.1, the vacuum slot 3.1 are installed on along the one end in length direction on microscope carrier 1, the vacuum slot
3.1 other end is equipped with opening 3.2, for being bonded with the back side 4.1 of product 4.As described above, when sucker group 3 is adopted
Made of elastic material when vacuum slot 3.1, specifically may be used ripple suction nozzle, when vacuum slot 3.1 is evacuated with product 4
The back side 4.1 between the suction-combining force increase, while also the thickness direction of microscope carrier 1 along Fig. 1 of product 4 being driven to move downward, until institute
The back side for stating product 4 is bonded with the upper surface of microscope carrier 1, if microscope carrier 1 is equipped with additional reference plane 2 certainly, until the production
The back side 4.1 of product 4 is bonded with the reference plane 2 of microscope carrier 1.
Embodiment three：
It is substantially the same in the structure of embodiment two, difference lies in：The microscope carrier 1 is equipped with a work top, described
Sucker group 3 and reference plane 2 are respectively positioned on the work top of microscope carrier 1.As shown in Figure 1, the work top is the upper of microscope carrier 1
End face, and the reference plane 2 of the whole of this work top as a whole.Certainly, the reference plane 2 can be independently of work
The datum plate or reference block being additionally arranged on table top can also be to cut the upper surface of microscope carrier 1 so that part work top is made
On the basis of face 2.
Example IV：
It is substantially the same in the structure of embodiment three, difference lies in：It is located at each vacuum on the work top of the microscope carrier 1
Position corresponding to suction nozzle 3.1 is equipped with storage tank 5, and each vacuum slot 3.1 is respectively arranged in corresponding storage tank 5,
And the opening 3.2 of each vacuum slot 3.1 is placed on outside storage tank 5.
Embodiment five：
It is substantially the same in the structure of example IV, difference lies in：Elevating mechanism, each vacuum are equipped in the microscope carrier 1
End of the suction nozzle 3.1 far from opening 3.2 is installed on the movable end of elevating mechanism, and the movable end of the elevating mechanism drives all
Vacuum slot 3.1 moved along the groove depth direction of storage tank 5 so that the opening 3.2 of the vacuum slot 3.1 be placed on it is accommodating
Slot 5 is outer or stores to storage tank 5.The elevating mechanism can be disposed on the cylinder in microscope carrier, the work of the piston rod of cylinder
Moved end extends in corresponding storage tank and is fixedly connected with vacuum slot 3.1, is located at from there through the reciprocating motion drive of cylinder
Vacuum slot 3.1 in storage tank 5 is moved up and down along the groove depth direction of storage tank.
Above-mentioned elevating mechanism can reach three purposes, and first, as described above, driven very by elevating mechanism
Suction mouth 3.1 and the product 4 being connected on vacuum slot 3.1 move, so that the back side 4.1 of product 4 is pasted with reference plane 2
It closes and in fixed static condition.Second, in the debugging stage, the position of each vacuum slot 3.1 can be adjusted by elevating mechanism,
Thus when vacuum slot 3.1 is attracted product 4 and drive product 4 towards 2 synchronizing moving of reference plane during avoided close and made
Make 4 fragmentation of product at larger impact force or too far and so that there are spacing normally to paste between product 4 and reference plane 2
It closes and fixes.Third can make whole vacuum slots 3.1 be accommodated in when equipment is in idle state by elevating mechanism
In storage tank 5, it is only necessary to unify dust cover or dust cover, therefore not only good dustproof effect in 1 upper cover of microscope carrier, but also
Vacuum slot 3.1 will not be caused to damage.
Embodiment six：
It is substantially the same in the structure of embodiment five, difference lies in：The sucker group 3 is multiple, whole sucker group 3
Along being provided at circumferentially spaced for reference plane 2, specifically, the sucker group 3 is four as shown in Figure 1, and the microscope carrier 1 is side
Shape, thus each sucker group 3 be respectively arranged at the corner location of microscope carrier 1, the reference plane 2 is equipped with several spaced apertures
2.1, whole apertures 2.1 is clouded in the center of reference plane 2, and the reference plane 2 as shown in Figure 1 is the upper end of microscope carrier 1
Face, therefore whole apertures 2.1 is uniformly distributed in the center of 1 upper surface of microscope carrier, is equipped with and each aperture in the microscope carrier 1
The air intake ducts of 2.1 connections, the air in the aperture 2.1 are detached through air intake duct, so that close to reference plane 2 or fitting in benchmark
The active force being mutually attracted is formed between product 4 on face 2 and reference plane 2.One end of the air intake duct and external vacuum pump
Connection, the air in aperture 2.1 is detached by vacuum pump so that product 4 in reference plane 2, i.e. Fig. 1 microscope carrier 1 it is upper
Make to form the suction generated due to vacuumizing in aperture between product 4 and the upper surface of microscope carrier 1 when end face, reaches actuation production
The purpose of product 4.
Preferably, single sucker group 3 includes the big vacuum slot 3.1 and a structure size of three identical structure sizes
Less than the small vacuum slot 3.1 of big vacuum slot 3.1, i.e. the opening diameter of big vacuum slot 3.1 is more than small vacuum slot 3.1
Opening diameter.
Embodiment seven：
It is substantially the same in the structure of embodiment six, difference lies in：Microscope carrier 1 shown in as shown in Fig. 2, is round carries
Platform, therefore above-mentioned sucker group 3 can be understood as individually, the sucker group 3 include that several wholes are identical or the identical vacuum in part
Suction nozzle, such as soft ripple suction nozzle, whole vacuum slots 3.1 are uniformly distributed on microscope carrier 1, and two vacuum of arbitrary neighborhood
There are spacing between suction nozzle 3.1.Additional setting reference plane 2 is had no in fig. 2, therefore the upper surface of microscope carrier 1 is reference plane
2, thus the reference plane 2 extend between two vacuum slots 3.1 of arbitrary neighborhood.In other words, the upper surface of microscope carrier 1 is made
On the basis of face 2, be evenly distributed with several spaced storage tanks 5 in the reference plane 2, one be each provided in each storage tank 5
Vacuum slot 3.1.Preferably, the microscope carrier 1 is equipped with multiple reference blocks, reference block is fixedly connected on microscope carrier 1, and along water
Square between two vacuum slots 3.1 of arbitrary neighborhood.
Certainly, tracheae is equipped in the microscope carrier 1, one end of tracheae passes through the single such as reversal valve or switch valve or a variety of valves
Door cooperation on microscope carrier 1 aperture 2.1 and vacuum slot 3.1 be connected to, the other end of the tracheae be connected to vacuum pump or
Person passes through external pipeline connection.
A kind of clamping method of sheet product, including above-mentioned workbench, it is characterised in that：Include the following steps：
S1, it will wait for that the product 4 of solution bonding is placed on microscope carrier 1, and the sucker group 3 on microscope carrier 1 lifts product 4, so that
It obtains the product 4 and is suspended in 1 top of microscope carrier；
S2, sucker group 3 and the back side 4.1 of product 4 are attracted；
S3, synchronous with step S2 or the sucker group 3 drives 4 court of product being pulled in sucker group 3 upon step s 2
1 position of microscope carrier is moved, so that the back side 4.1 of the product 4 leans with the reference plane 2 on microscope carrier 1 to the product 4
It is statically placed on microscope carrier 1.
One embodiment as clamping method：Sucker group 3 in above-mentioned step S2 uses can be along length side
To flexible vacuum slot 3.1, in step s 2 during the back side 4.1 of vacuum slot 3.1 and product 4 is attracted,
Synchronously complete step S3, i.e. step S3：The sucker group 3 is vacuum slot 3.1, when the back side of vacuum slot 3.1 and product 4
4.1 vacuum slots 3.1 when being attracted shorten along length direction so that the product 4 is synchronized with vacuum slot 3.1
The back side 4.1 of the product 4 is moved to lean with the reference plane 2 on microscope carrier 1.
Second embodiment as clamping method：Elevating mechanism is equipped in the microscope carrier 1, the sucker group 3 is installed on
On the movable end of elevating mechanism, when completing step S2, the elevating mechanism drives sucker group 3 to be moved towards 2 position of reference plane
It is dynamic, be located in the storage tank 5 corresponding to the sucker group 3 until the sucker group 3 is accommodated on microscope carrier 1, at the same time with suction
Also synchronization is bonded the product 4 that disk group 3 is attracted with reference plane 2, and the product 4 is statically placed on microscope carrier 1, reaches the mesh of clamping product 4
's.
Third embodiment as installation way：It is generally identical as second embodiment, difference lies in：The step
Rapid S3 includes the following steps：
Elevating mechanism in S31, the microscope carrier 1 drives the drive of sucker group 3 to be connected to the product 4 in sucker group 3 towards microscope carrier 1
It moves position；
Aperture 2.1 on S32, the microscope carrier 1 is blown towards the back side 4.1 of product 4, so that close to the product 4 of reference plane 2
Buffer layer is formed between the back side 4.1 and microscope carrier 1, the atmospheric pressure value in the aperture 2.1 is more than external pressure, and the buffer layer
The active force being applied on product 4 is less than pulling force of the sucker group 3 to product 4；
S33, the elevating mechanism pull product 4 until the back side 4.1 of the product 4 is pasted with reference plane 2 by sucker group 3
It closes；
S34, air in aperture 2.1 is detached, so that being formed between the aperture 2.1 and the back side 4.1 of product 4 mutual
The suction of actuation, the atmospheric pressure value in the aperture 2.1 are less than external pressure.
I.e. aperture 2.1 in step s 32 first as shown in Figure 3 from the bottom up towards product 4 blow so that product
4 close to reference plane 2 when influenced to slow down by the high-speed flow blown out in aperture 2.1, i.e., in 4.1 He of the back side of product 4
The buffer layer of high pressure is formed between the upper surface of reference plane 2 or microscope carrier 1, then the airflow direction reversion in aperture 2.1 so that small
Pumping in hole 2.1, so that is be attracted between the product 4 being statically placed on microscope carrier 1 and reference plane 2 is more secured.In this process
Airflow-reversing in middle aperture 2.1 can realize that the process of this commutation is carried out automatically by controller by solenoid directional control valve
Change control, and the timing node of this commutation can select product 4 to be fitted in reference plane 2 to product 4 after reference plane 2
Random time node.In other words, when elevating mechanism drives the drive of sucker group 3 to be connected to the product 4 in sucker group 3 towards microscope carrier
Aperture 2.1 described in when 1 position is mobile and the product 4 is touched with buffer layer can stop blowing.This process
Delay control can be carried out by counter, air pressure change can also be detected by pressure sensor to reach.
What needs to be explained here is that in the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " cross
To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The orientation or positional relationship of the instructions such as "bottom" "inner", "outside", " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as pair
The limitation of the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more, unless separately
There is clearly specific restriction.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be that machinery connects
It connects, can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary in two elements
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is directly under or diagonally below the second feature, or is merely representative of fisrt feature level height and is less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
For a person skilled in the art, after reading above description, various changes and modifications undoubtedly will be evident.
Therefore, appended claims should regard the whole variations and modifications for covering the true intention and range of the present invention as.It is weighing
The range and content of any and all equivalences within the scope of sharp claim, are all considered as still belonging to the intent and scope of the invention.
Claims (10)
1. solving the workbench of bonding after a kind of sheet product bonding, it includes microscope carrier (1), it is characterised in that：The microscope carrier (1)
Be equipped with reference plane (2) and at least one sucker group (3), when product (4) is placed on microscope carrier (1) the sucker group (3) prior to
Reference plane (2) is touched product (4) and is attracted with the back side (4.1) of product (4), and the sucker group (3) drives and is pulled on sucker group
(3) product (4) on is moved to the back side (4.1) of the product (4) towards reference plane (2) position and reference plane (2) is supported
It leans on.
2. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The sucker group
(3) include several vacuum slots (3.1) made of elastic material, the vacuum slot (3.1) is along the one of length direction
End is installed on microscope carrier (1), and the other end of the vacuum slot (3.1) is equipped with opening (3.2), for the back side with product (4)
(4.1) it is bonded.
3. solving the workbench of bonding after sheet product bonding according to claim 2, it is characterised in that：The microscope carrier
(1) it is equipped with a work top, the sucker group (3) and reference plane (2) are respectively positioned on the work top of microscope carrier (1).
4. solving the workbench of bonding after sheet product bonding according to claim 3, it is characterised in that：The microscope carrier
(1) it is located at the position corresponding to each vacuum slot (3.1) on work top and is equipped with storage tank (5), each vacuum slot (3.1)
It is respectively arranged in corresponding storage tank (5), and the opening (3.2) of each vacuum slot (3.1) is placed on storage tank (5)
Outside.
5. solving the workbench of bonding after sheet product bonding according to claim 4, it is characterised in that：The microscope carrier
(1) elevating mechanism is equipped in, end of each vacuum slot (3.1) far from opening (3.2) is installed on the movable end of elevating mechanism,
The movable end of the elevating mechanism drives whole vacuum slots (3.1) to be moved along the groove depth direction of storage tank (5), so that institute
The opening (3.2) for stating vacuum slot (3.1) is placed on storage tank (5) outside or in storage to storage tank (5).
6. solving the workbench of bonding after sheet product bonding as claimed in any of claims 1 to 5, feature exists
In：The sucker group (3) is multiple, whole sucker (3) being provided at circumferentially spaced along reference plane (2), on the reference plane (2)
Equipped with several spaced apertures (2.1), the air intake duct being connected to each aperture (2.1) is equipped in the microscope carrier (1), it is described small
Air in hole (2.1) is detached through air intake duct so that close to reference plane (2) or fit in product (4) in reference plane (2) with
Reference plane forms the active force being mutually attracted between (2).
7. solving the workbench of bonding after sheet product bonding as claimed in any of claims 2 to 5, feature exists
In：Whole vacuum slots (3.1) are uniformly distributed on microscope carrier (1), and the reference plane (2) extends to two of arbitrary neighborhood
Between vacuum slot (3.1).
8. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The microscope carrier
(1) it is equipped with a work top, the sucker group (3) and reference plane (2) are respectively positioned on the work top of microscope carrier (1).
9. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The microscope carrier
(1) it is equipped with corresponding storage tank (5) corresponding to the position of each sucker group (3) on, each sucker group (3) is respectively arranged in respectively right
In the storage tank (5) answered, and the sucker group (3) can be along the axial stretching of storage tank (5), so that sucker group (3) is placed on
Storage tank (5) outside or is contracted in storage tank (5).
10. the workbench of any one of a kind of clamping method, including the claims 1 to 7 of sheet product, feature exist
In：Include the following steps：
S1, it will wait for that the product (4) of solution bonding is placed on microscope carrier (1), and the sucker group (3) on microscope carrier (1) lifts product
(4), so that the product (4) is suspended in above microscope carrier (1)；
S2, sucker group (3) and the back side (4.1) of product (4) are attracted；
S3, synchronous with step S2 or the sucker group (3) drives the product (4) being pulled in sucker group (3) upon step s 2
It is moved towards microscope carrier (1) position, so that the back side (4.1) of the product (4) offsets with the reference plane (2) on microscope carrier (1)
It leans on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810647554.9A CN108807233A (en) | 2018-06-22 | 2018-06-22 | The workbench and clamping method of bonding are solved after sheet product bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810647554.9A CN108807233A (en) | 2018-06-22 | 2018-06-22 | The workbench and clamping method of bonding are solved after sheet product bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108807233A true CN108807233A (en) | 2018-11-13 |
Family
ID=64085018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810647554.9A Pending CN108807233A (en) | 2018-06-22 | 2018-06-22 | The workbench and clamping method of bonding are solved after sheet product bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108807233A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN114695202A (en) * | 2022-02-28 | 2022-07-01 | 上海华力集成电路制造有限公司 | Device and method for enlarging rotary process window in integrated circuit |
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| CN103465198A (en) * | 2013-09-25 | 2013-12-25 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| CN208385362U (en) * | 2018-06-22 | 2019-01-15 | 浙江中纳晶微电子科技有限公司 | The workbench of bonding is solved after sheet product bonding |
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| JP2013066868A (en) * | 2011-09-26 | 2013-04-18 | Dainippon Screen Mfg Co Ltd | Coating device |
| CN103465198A (en) * | 2013-09-25 | 2013-12-25 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| CN208385362U (en) * | 2018-06-22 | 2019-01-15 | 浙江中纳晶微电子科技有限公司 | The workbench of bonding is solved after sheet product bonding |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN110040684B (en) * | 2019-05-14 | 2024-04-09 | 苏州美图半导体技术有限公司 | Automatic bond-releasing machine |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN111244015B (en) * | 2020-01-20 | 2023-07-21 | 杭州立昂东芯微电子有限公司 | Wafer bonding-releasing auxiliary carrier disc, bonding-releasing machine and bonding-releasing method |
| CN114695202A (en) * | 2022-02-28 | 2022-07-01 | 上海华力集成电路制造有限公司 | Device and method for enlarging rotary process window in integrated circuit |
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