CN108800656B

CN108800656B - Semiconductor refrigeration module and refrigeration equipment

Info

Publication number: CN108800656B
Application number: CN201711089391.9A
Authority: CN
Inventors: 王定远; 裴玉哲; 卞伟; 刘杰; 王晔; 张立臣; 赵建芳; 胡成; 李新远; 杨未
Original assignee: Qingdao Haier Special Refrigerator Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd
Current assignee: Qingdao Haier Special Refrigerator Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd; Haier Smart Home Co Ltd
Priority date: 2017-04-28
Filing date: 2017-11-08
Publication date: 2020-09-08
Anticipated expiration: 2037-11-08
Also published as: CN108679877A; CN108375276B; CN108375274B; CN108731298A; CN108895705A; CN108917256B; CN108709335B; CN108679877B; CN108397959A; CN108375274A; CN108397959B; CN108375276A; CN108917256A; CN108709335A; CN108731298B; WO2018196679A1; CN108895705B; CN108800656A

Abstract

The invention discloses a semiconductor refrigeration module and refrigeration equipment, which comprise a semiconductor refrigeration chip, a heat pipe and an assembly module, wherein the assembly module comprises a first heat insulation support, a second heat insulation support, a hot end heat conduction seat and a cold end heat conduction seat, a first groove is formed in the inner surface of the first heat insulation support, a mounting hole penetrating through the first heat insulation support is formed in the first groove, a second groove is formed in the inner surface of the second heat insulation support, the first heat insulation support is fixed on the second heat insulation support, a mounting cavity is formed between the first groove and the second groove, the semiconductor refrigeration chip is positioned in the mounting hole, the cold end heat conduction seat is arranged in the mounting cavity and is in contact with the cold end face of the semiconductor refrigeration chip, the hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end face of the semiconductor refrigeration chip, and the heat pipe is connected. The refrigeration capacity loss of the semiconductor refrigeration module is reduced, so that the refrigeration efficiency of the refrigeration equipment is improved, and the energy consumption is reduced.

Description

Semiconductor refrigeration module and refrigeration equipment

Technical Field

The invention relates to refrigeration equipment, in particular to a semiconductor refrigeration module and refrigeration equipment.

Background

At present, with the development of semiconductor refrigeration technology, refrigeration equipment which adopts a semiconductor refrigeration chip to carry out refrigeration is widely used, and a Chinese patent No. 2014107111772 discloses a semiconductor refrigeration equipment which adopts the refrigeration quantity generated by the semiconductor refrigeration chip to realize refrigeration. The semiconductor refrigeration chip comprises a cold end for releasing cold and a hot end for releasing heat, wherein in the operation process, the cold end of the semiconductor refrigeration chip releases the cold into the refrigeration chamber of the refrigeration equipment through the cold end radiator, and the hot end of the semiconductor refrigeration chip needs to radiate the heat to the outside through the hot end radiator. However, in the actual use process, because the cold end and the hot end of the semiconductor refrigeration chip are oppositely arranged in a back-to-back manner, the cold end radiator and the hot end radiator are adjacent to each other, and the cold end radiator and the hot end radiator are easy to generate heat exchange to cause the loss of cold energy, so that the refrigeration efficiency of the refrigeration equipment is lower and the energy consumption is increased. The invention aims to solve the technical problem of how to design a refrigeration device with high refrigeration efficiency and low energy consumption.

Disclosure of Invention

The invention provides a semiconductor refrigeration module and refrigeration equipment, which can reduce the loss of refrigeration capacity of the semiconductor refrigeration module, improve the refrigeration efficiency of the refrigeration equipment and reduce energy consumption.

In order to achieve the technical purpose, the invention adopts the following technical scheme:

a semiconductor refrigeration module comprises a semiconductor refrigeration chip and a heat pipe, wherein the semiconductor refrigeration chip comprises a cold end surface for releasing cold and a hot end surface for releasing heat, and also comprises an assembly module, the assembly module comprises a first heat insulation support, a second heat insulation support, a hot end heat conduction seat and a cold end heat conduction seat, the first heat insulation support is fixed on the second heat insulation support, a mounting cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with a mounting hole communicated with the mounting cavity, the semiconductor refrigeration chip is positioned in the mounting hole, the cold end heat conduction seat is arranged in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigeration chip, the hot end heat conduction seat is arranged on the first heat insulation support and is in surface contact with the hot end of the semiconductor refrigeration chip, and the heat pipe is connected with the cold end heat conduction seat.

Further, a heat insulation groove is formed in the outer surface of the first heat insulation support and surrounds the mounting hole, and heat insulation cotton is arranged in the heat insulation groove; the hot end of the semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.

Furthermore, the surface of first thermal-insulated support still is provided with the wiring groove, the wiring groove with the mounting hole intercommunication.

Furthermore, an avoiding gap is formed in the cold-end heat conducting seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conducting seat respectively, bolts penetrate through the corresponding through holes, and the bolts penetrate through an area formed by the avoiding gap.

Further, the cold end heat conduction seat comprises a first heat conduction plate and a second heat conduction plate which are connected together, and the heat pipe is clamped between the first heat conduction plate and the second heat conduction plate.

Further, the internal surface of first heat-conducting plate has seted up the first mounting groove of horizontal setting, the internal surface of second heat-conducting plate has seted up the second mounting groove of vertical setting, the heat pipe divide into horizontal flat heat pipe and vertical flat heat pipe, horizontal flat heat pipe sets up in the first mounting groove, vertical flat heat pipe sets up in the second mounting groove, and, horizontal flat heat pipe with vertical flat heat pipe contacts each other.

Furthermore, the inner surface of the first heat insulation support is provided with a first pipe groove for installing the heat pipe, and the edge of the second heat insulation support is provided with a notch or a through hole or a second pipe groove for the heat pipe to pass through.

Furthermore, a plurality of positioning baffles are arranged on the outer surface of the first heat insulation support around the outer side of the mounting hole, and the hot end heat conduction seat is arranged among the positioning baffles.

Furthermore, the semiconductor refrigeration module comprises a plurality of semiconductor refrigeration chips, the assembly module is provided with the hot end heat conduction seat and the cold end heat conduction seat which correspond to the semiconductor refrigeration chips, and the first heat insulation support is provided with the mounting hole which corresponds to the semiconductor refrigeration chip.

The invention also provides refrigeration equipment, which comprises an inner container and the semiconductor refrigeration module; and the heat pipe of the semiconductor refrigeration module is attached to the surface of the inner container.

Compared with the prior art, the invention has the advantages and positive effects that: the cold end heat conduction seat is installed through the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation support, the cold end face of the semiconductor refrigeration chip is ensured to be in good contact with the cold end heat conduction seat, the hot end face of the semiconductor refrigeration chip is ensured to be in good contact with the hot end heat conduction seat, heat is ensured to be rapidly dissipated, and the use reliability is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a semiconductor refrigeration module according to an embodiment of the present invention;

FIG. 2 is a schematic front view of a first heat-insulating support in an embodiment of a semiconductor refrigeration module according to the present invention;

FIG. 3 is a schematic view of a reverse side of a first heat-insulating support in an embodiment of a semiconductor refrigeration module according to the invention;

FIG. 4 is a schematic front view of a second heat insulating support of the semiconductor refrigeration module according to the embodiment of the present invention;

FIG. 5 is a schematic view of a second heat-insulating support of an embodiment of a semiconductor refrigeration module of the present invention;

FIG. 6 is a schematic diagram illustrating a first heat-conducting plate according to an embodiment of the semiconductor refrigeration module of the present invention;

FIG. 7 is a diagram illustrating a second thermal conductive plate according to an embodiment of the semiconductor refrigeration module of the present invention;

FIG. 8 is an exploded view of an embodiment of a semiconductor refrigeration module of the present invention;

fig. 9 is a reference diagram illustrating a usage status of the semiconductor refrigeration module according to the embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 9, the semiconductor refrigeration module of this embodiment includes a semiconductor refrigeration chip 1 and a heat pipe 2, where the semiconductor refrigeration chip 1 includes a cold end surface for releasing cold and a hot end surface for releasing heat, and further includes an assembly module 3, where the assembly module 3 includes a first heat insulation support 31, a second heat insulation support 32, a hot end heat conduction seat 33 and a cold end heat conduction seat 34, the first heat insulation support 31 is fixed on the second heat insulation support 32, a mounting cavity with a heat insulation function is formed between the first heat insulation support 31 and the second heat insulation support 32, a mounting cavity is formed between the first groove 311 and the second groove 321, the semiconductor refrigeration chip 1 is located in the mounting hole 312, the cold end heat conduction seat 34 is arranged in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigeration chip 1, and the hot end heat conduction seat 33 is arranged on the first heat insulation support 31 and is in contact with the semiconductor refrigeration chip 1 Is in face contact with the hot end of the heat pipe 2, and the cold end heat conducting seat 34 is connected with the heat pipe 2.

Specifically, the semiconductor refrigeration module of the present embodiment embeds the semiconductor refrigeration chip 1 in the mounting hole 312 of the first heat insulation support 31, the periphery of the semiconductor refrigeration chip 1 is wrapped by the first heat insulation support 31, and the hot end heat conduction seat 33 and the cold end heat conduction seat 34 are separated by the first heat insulation bracket 31, the heat transfer generated between the hot-end heat conduction seat 33 and the cold-end heat conduction seat 34 can be effectively reduced, thereby reducing the cold loss of the cold end heat conducting seat 34, meanwhile, the cold end heat conducting seat 34 is wrapped in the installation cavity which is formed by the first heat insulation bracket 31 and the second heat insulation bracket 32 and has the heat insulation function, the cold energy generated by the semiconductor refrigeration chip 1 conducted by the cold-end heat conduction seat 34 can be rapidly transmitted to a required area through the heat pipe 2 to the maximum extent, thereby reducing the amount of cold energy dissipation of the cold end heat conduction seat 34 per se, more effectively reducing the energy consumption and improving the refrigeration efficiency. Wherein, the inner surface of the first heat insulation support 31 and/or the inner surface of the second heat insulation support 32 are provided with grooves, and the installation cavity is formed by the grooves, for example: the inner surface of the first heat insulation support 31 is provided with a first groove 311, the first groove 311 is provided with a mounting hole 312 penetrating through the first heat insulation support 31, the inner surface of the second heat insulation support 32 is provided with a second groove 321, and a mounting cavity is formed between the first groove 311 and the second groove 321.

Preferably, the outer surface of the first heat insulation bracket 31 is provided with a heat insulation groove 313 around the mounting hole 312, and heat insulation cotton (not marked) is arranged in the heat insulation groove 313; the hot end of the semiconductor refrigeration chip 1 protrudes outward from the outer surface of the first heat insulation support 31. Specifically, the heat insulation cotton can be arranged on the periphery of the semiconductor refrigeration chip 1 through the heat insulation groove 313, so that the outward dissipation of cold on the cold end face of the semiconductor refrigeration chip 1 is further reduced through a heat insulation ring formed by the heat insulation cotton, meanwhile, the heat on the hot end face of the semiconductor refrigeration chip 1 can be reduced to enter the installation cavity, and the loss of cold is reduced to the maximum extent; the hot end face of the semiconductor refrigeration chip 1 is slightly higher than the outer surface of the first heat insulation support 31, so that the hot end face of the semiconductor refrigeration chip 1 and the hot end heat conduction seat 33 can conduct heat in a good contact mode, and the hot end face of the semiconductor refrigeration chip 1 is separated from the mounting hole 312, heat can be reduced from being transmitted into the mounting cavity from the mounting hole 312, and loss of cold energy can be effectively reduced. In order to facilitate the connection of circuit wiring, a wiring groove 314 is further disposed on the outer surface of the first heat insulation support 31, and the wiring groove 314 is communicated with the mounting hole 312. In addition, according to the requirement of the refrigerating capacity of the refrigerating device, the semiconductor refrigerating module of this embodiment includes a plurality of semiconductor refrigerating chips 1, the assembly module 3 is configured with the hot end heat conduction seat 33 and the cold end heat conduction seat 34 corresponding to the semiconductor refrigerating chips 1, and the first heat insulation support 31 is provided with the mounting hole 312 corresponding to the semiconductor refrigerating chips 1.

Further, in order to more effectively reduce heat transfer generated between the hot end heat conduction seat 33 and the cold end heat conduction seat 34 due to assembly, an avoidance gap 340 is provided on the cold end heat conduction seat 34, through holes (not marked) are respectively provided on the first heat insulation support 31, the second heat insulation support 32 and the hot end heat conduction seat 33, a bolt 35 is inserted into the corresponding through hole, and the bolt 35 passes through an area formed by the avoidance gap 340. Specifically, in the assembling process, the hot end heat conducting seat 33, the first heat insulating support 31, the cold end heat conducting seat 34 and the second heat insulating support 32 are sequentially assembled and fixed together through the bolt 35, and the bolt 35 avoids the cold end heat conducting seat 34 through the avoiding notch 340, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 through the bolt 35 can be avoided. The inner surface of the first heat insulation support 31 is provided with a first pipe groove 316 for installing the heat pipe 2, and the edge of the second heat insulation support 32 is provided with a notch or a through hole 322 or a second pipe groove for the heat pipe 2 to pass through. Specifically, the heat pipe 2 passes through the assembly module 3 through the first pipe groove 316 and the through hole 322, so that the heat pipe 2 is conveniently disposed on the inner container 100 of the refrigeration apparatus. In addition, in order to facilitate quick positioning and installation of the hot end heat conduction seat 33, a plurality of positioning baffles 315 are arranged on the outer surface of the first heat insulation support 31 around the outer side of the installation hole 312, and the hot end heat conduction seat 33 is arranged among the positioning baffles 315. During assembly, the hot end heat conduction seat 33 can be conveniently positioned and installed through the positioning baffle 315, and the hot end heat conduction seat 33 can be ensured to be accurately in good contact with the semiconductor refrigeration chip 1.

Still further, the cold end heat conduction seat 34 includes a first heat conduction plate 341 and a second heat conduction plate 342 connected together, and the heat pipe 2 is sandwiched between the first heat conduction plate 341 and the second heat conduction plate 342. Specifically, the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 which is transversely arranged, the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 which is longitudinally arranged, the heat pipe 2 is divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove 3411, the longitudinal flat heat pipe is arranged in the second mounting groove 3421, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other. Specifically, adopt flat heat pipe can effectual increase heat pipe and the area of contact of cold junction heat conduction seat 34, simultaneously, flat heat pipe can also the area of contact between effectual increase and inner bag 100, provides heat exchange efficiency. And the transverse flat heat pipe is contacted with the longitudinal flat heat pipe, so that the temperature of the heat pipes at different positions is uniformly distributed, the temperature difference is reduced, and the temperature uniformity is improved.

Specifically, the semiconductor refrigeration module in the embodiment of the invention can be a semiconductor refrigeration module in the embodiment of the semiconductor refrigeration module, and the specific structure thereof can be referred to the embodiment of the semiconductor refrigeration module of the invention and the descriptions of fig. 1 to fig. 9, which are not described herein again.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. A semiconductor refrigeration module comprises a semiconductor refrigeration chip and a heat pipe, wherein the semiconductor refrigeration chip comprises a cold end face for releasing cold and a hot end face for releasing heat, and is characterized by further comprising an assembly module, the assembly module comprises a first heat insulation support, a second heat insulation support, a hot end heat conduction seat and a cold end heat conduction seat, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with an installation hole communicated with the installation cavity, the semiconductor refrigeration chip is positioned in the installation hole, the cold end heat conduction seat is arranged in the installation cavity and is in contact with the cold end face of the semiconductor refrigeration chip, the hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end face of the semiconductor refrigeration chip, the heat pipe is connected with the cold end heat conducting seat.

2. The semiconductor refrigeration module of claim 1, wherein an outer surface of the first heat shield support is provided with a heat shield groove around the mounting hole, and heat shield cotton is arranged in the heat shield groove; the hot end of the semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.

3. The semiconductor refrigeration module of claim 1, wherein the outer surface of the first heat insulation support is further provided with a wiring groove, and the wiring groove is communicated with the mounting hole.

4. The semiconductor refrigeration module according to claim 1, wherein an avoidance notch is formed in the cold-end heat conduction seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conduction seat respectively, a bolt is inserted into the corresponding through hole, and the bolt penetrates through an area formed by the avoidance notch.

5. The semiconductor refrigeration module of claim 1 wherein the cold end heat conduction seat comprises a first heat conduction plate and a second heat conduction plate joined together, the heat pipe being sandwiched between the first heat conduction plate and the second heat conduction plate.

6. The semiconductor refrigeration module according to claim 5, wherein the inner surface of the first heat conduction plate is provided with a first mounting groove arranged transversely, the inner surface of the second heat conduction plate is provided with a second mounting groove arranged longitudinally, the heat pipes are divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove, the longitudinal flat heat pipe is arranged in the second mounting groove, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other.

7. The semiconductor refrigeration module according to claim 1, wherein the inner surface of the first heat insulation support is provided with a first pipe groove for installing the heat pipe, and the edge of the second heat insulation support is provided with a notch or a through hole or a second pipe groove for the heat pipe to pass through.

8. The semiconductor refrigeration module of claim 1, wherein a plurality of positioning baffles are disposed on an outer surface of the first heat insulation support around an outer side of the mounting hole, and the hot end heat conduction seat is disposed between the plurality of positioning baffles.

9. The semiconductor refrigeration module of claim 1, wherein the semiconductor refrigeration module comprises a plurality of semiconductor refrigeration chips, the assembly module is configured with the hot end heat conduction seat and the cold end heat conduction seat corresponding to the semiconductor refrigeration chips, and the first heat insulation bracket is provided with the mounting hole corresponding to the semiconductor refrigeration chip.

10. A refrigeration device comprising an inner container, further comprising a semiconductor refrigeration module according to any one of claims 1 to 9; and the heat pipe of the semiconductor refrigeration module is attached to the surface of the inner container.