CN108792098B - Silicon wafer shaping method and device - Google Patents
Silicon wafer shaping method and device Download PDFInfo
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- CN108792098B CN108792098B CN201810317493.XA CN201810317493A CN108792098B CN 108792098 B CN108792098 B CN 108792098B CN 201810317493 A CN201810317493 A CN 201810317493A CN 108792098 B CN108792098 B CN 108792098B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B63/00—Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged
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- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a silicon wafer shaping method and a silicon wafer shaping device, wherein the shaping method comprises the following steps: grabbing a stack of silicon wafers, and vertically placing the stack of silicon wafers at a set position above a shaping platform; loosening the stacked silicon wafers along the thickness direction of the stacked silicon wafers by a set distance, and blowing air to the stacked silicon wafers to loosen the stacked silicon wafers; the side edges of the stack of silicon wafers are clamped into alignment. The invention can automatically realize the shaping of the silicon chip, arrange and align the peripheral edges of a stack of silicon chips, and facilitate the subsequent plastic package and packaging of the silicon chips, thereby avoiding the fracture or hidden crack of the edges and corners of the protruded silicon chips caused by the misalignment of the silicon chips and avoiding the difficulty in loading the silicon chips into a foam box due to the large size of the silicon chips after the plastic package caused by the misalignment of the silicon chips; the shaping method is simple and convenient, and has high shaping speed, high efficiency and good shaping effect.
Description
Technical Field
The invention relates to a silicon wafer shaping method and device, and belongs to the technical field of solar photovoltaics.
Background
In the solar photovoltaic industry, the battery silicon wafer needs to be packaged before leaving the factory. The existing silicon wafer packaging mode adopts a foam box to bear the silicon wafer, wherein a stack of silicon wafers are required to be subjected to plastic package, and then the silicon wafers subjected to plastic package are placed in the foam box.
Before plastic package of the silicon wafer, the stack of silicon wafers needs to be shaped to enable the edges of the periphery of the silicon wafer to be aligned, so that cracking or hidden cracking of the edges and corners of the protruded silicon wafer caused by misalignment of the silicon wafer can be avoided, and the problem that the silicon wafer after plastic package is large in size and difficult to mount into a foam box caused by misalignment of the silicon wafer can be avoided.
At present, the shaping of the silicon chip adopts manual operation. The labor intensity of manual shaping is high, workers are easy to fatigue, and the efficiency of shaping the silicon wafer is low and the effect is poor. Therefore, it is necessary to provide a silicon wafer shaping method and device, which can automatically shape a silicon wafer.
Disclosure of Invention
The invention aims to provide a silicon wafer shaping method and a silicon wafer shaping device, which can automatically realize the shaping of silicon wafers and arrange and align the peripheral edges of a stack of silicon wafers.
The above object of the present invention can be achieved by the following technical solutions:
the invention provides a silicon wafer shaping method, which comprises the following steps:
the shaping method comprises the following steps:
grabbing a stack of silicon wafers, and vertically placing the stack of silicon wafers at a set position above a shaping platform;
loosening the stacked silicon wafers along the thickness direction of the stacked silicon wafers by a set distance, and blowing air to the stacked silicon wafers to loosen the stacked silicon wafers;
the side edges of the stack of silicon wafers are clamped into alignment.
In one embodiment of the invention, when a stack of silicon wafers is grasped, the left and right edges of the stack of silicon wafers are grasped in the thickness direction of the stack of silicon wafers.
In one embodiment of the invention, the set position is a position where the lower edge of the stack of silicon wafers is 3-5mm away from the shaping platform.
In one embodiment of the invention, the set distance is 5-10 mm.
In one embodiment of the invention, the stack of silicon wafers is clamped in the thickness direction of the stack of silicon wafers after said clamping of the side edges of the stack of silicon wafers into alignment.
The invention also provides a silicon wafer shaping device, which applies the shaping method of any one of the embodiments and comprises a shaping platform, a shaping mechanism, a blowing mechanism, a grabbing mechanism and a manipulator, wherein the shaping mechanism is arranged on the shaping platform, and the grabbing mechanism is arranged on the manipulator; the manipulator can drive the grabbing mechanism to carry a stack of silicon wafers to be shaped to the shaping mechanism; the blowing mechanism can blow air to the stacked silicon wafers and is matched with the grabbing mechanism to shape the upper and lower edges of the stacked silicon wafers; the shaping mechanism can clamp the stacked silicon wafers from the side to shape the left and right edges of the stacked silicon wafers.
In an embodiment of the present invention, the shaping platform is made of a soft material or a soft material is laid on the upper surface of the shaping platform.
In one embodiment of the invention, the gripping mechanism comprises a first gripping drive and two first gripping jaws arranged at the drive end of the first gripping drive; second grabbing driving parts are respectively arranged on opposite surfaces of the two first clamping jaws, and two second clamping jaws are arranged at driving ends of the two second grabbing driving parts; the first grabbing driving piece can drive the two first clamping jaws to move relatively, so that the two second grabbing driving pieces move to the left edge and the right edge of the silicon wafer stack respectively; the two second grabbing driving pieces can respectively and simultaneously drive the two second clamping jaws to grab the left edge and the right edge of the stacked silicon wafer along the thickness direction of the stacked silicon wafer.
In one embodiment of the invention, the shaping mechanism comprises two shaping components, and the two shaping components are correspondingly arranged on the left side and the right side of the stack of silicon wafers; each shaping subassembly all includes plastic driving piece and ejector pad, the ejector pad setting is in the drive end of plastic driving piece.
In one embodiment of the invention, the air blowing mechanism comprises an air knife bracket and an air knife, wherein the air knife is arranged on the air knife bracket, and the air knife blows air towards the left side and/or the right side and/or the upper side of the silicon stack.
The silicon wafer shaping method and the device have the beneficial effects that:
the silicon wafer shaping method and the device can automatically realize the shaping of the silicon wafer, arrange and align the peripheral edges of a stack of silicon wafers, and facilitate the subsequent plastic packaging and packaging of the silicon wafers, thereby avoiding the fracture or hidden crack of the protruded corners of the silicon wafers caused by the misalignment of the silicon wafers and avoiding the difficulty in loading the silicon wafers into a foam box due to the large size of the silicon wafers after the plastic packaging caused by the misalignment of the silicon wafers; the shaping method is simple and convenient, and has high shaping speed, high efficiency and good shaping effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a flow chart of one embodiment of a silicon wafer shaping method of the present invention.
Fig. 2 is a schematic front view of a silicon wafer shaping device according to an embodiment of the present invention.
FIG. 3 is a schematic top view of a silicon wafer shaping device according to an embodiment of the present invention.
The figures of the above drawings are numbered: 10. a shaping platform; 20. a shaping mechanism; 30. a blowing mechanism; 40. a grabbing mechanism; 41. a first grasping drive; 42. a first jaw; 43. a second grasping drive; 44. a second jaw; 50. and (3) a silicon wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and based on the embodiments of the present invention, other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be understood that when the term "comprising" is used in this specification it indicates the presence of the feature, step, operation, device, component and/or combination thereof.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, left, right, upper, lower", "lateral, vertical, horizontal", top, bottom ", etc. are usually based on the orientation or positional relationship shown in the drawings only for the convenience of description and simplicity of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the scope of the present invention. The terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
Referring to fig. 1, an embodiment of the present invention provides a silicon wafer shaping method, including the following steps:
s100, a stack of silicon wafers 50 is grabbed and vertically placed at a set position above the shaping platform 10.
In the embodiment of the present invention, the grabbing mechanism 40 may be used to grab a stack of silicon wafers 50, the grabbing mechanism 40 is disposed on a robot (not shown in fig. 2 and 3), the robot moves the grabbing mechanism 40 to the silicon wafer stacker, grabs the stack of silicon wafers 50 from the magazine of the stacker, then moves the stack of silicon wafers 50 to a set position above the shaping platform 10, and vertically places the stack of silicon wafers 50.
Further, when grasping a stack of silicon wafers 50, the grasping mechanism 40 grasps the left and right edges of the stack of silicon wafers 50 in the thickness direction of the stack of silicon wafers 50, thereby grasping and holding the stack of silicon wafers 50.
Further, the robot moves the gripping mechanism 40 carrying the stack of silicon wafers 50 to a position above the shaping platform 10, so that the stack of silicon wafers 50 gripped by the gripping mechanism 40 is placed vertically (the shaping platform 10 is horizontally disposed, and the stack of silicon wafers 50 is placed perpendicular to the shaping platform 10), and the stack of silicon wafers 50 is located above the shaping platform 10, and a certain distance exists between the lower edge of the stack of silicon wafers 50 and the shaping platform 10. The distance between the lower edge of the stack of silicon wafers 50 and the shaping platform 10 should not be too small or too large. When the distance is too small, the silicon wafer with the protruded lower edge in the stack of silicon wafers 50 is easy to touch the shaping platform 10 and be crushed; when the distance is too large, the stack of silicon wafers 50 is easily broken when it freely falls under the action of gravity in step S200. Preferably, the lower edge of the stack of silicon wafers 50 is 3-5mm from the shaping platform 10. It should be noted that, when calculating the distance between the lower edge of the stack of silicon wafers 50 and the shaping stage 10, the lower edge of the stack of silicon wafers 50 is referred to as the lower edge of the mostly aligned silicon wafer.
S200, loosening the stack of silicon wafers 50 for a set distance along the thickness direction of the stack of silicon wafers 50, and blowing air to the stack of silicon wafers 50 to loosen the stack of silicon wafers.
In the embodiment of the present invention, the grasping mechanism 40 releases the stack of silicon wafers 50 in the thickness direction of the stack of silicon wafers 50 so that the stack of silicon wafers 50 can move within the grasping area of the grasping mechanism 40. Wherein the gripping area is a space between two second clamping jaws 44 of the gripping mechanism 40 that clamp/unclamp the stack of silicon wafers 50 in the thickness direction of the stack of silicon wafers 50. Some of the silicon wafers in the stack 50 may fall down onto the shaping platform 10 under the action of gravity, and the lower edge may contact the shaping platform 10 completely or partially, while other silicon wafers are suspended in the air due to friction and other factors. At this time, the stack of silicon wafers 50 is blown by the blowing mechanism 30, and the stack of silicon wafers 50 is blown away, so that each silicon wafer in the stack of silicon wafers 50 can freely fall downwards under the action of the self gravity, and the lower edge of each silicon wafer is in contact with the shaping platform 10. The lower edges of the stack of silicon wafers 50 are trimmed into alignment when the lower edges of each wafer are all in contact with the shaping table 10. At this time, a phenomenon that a part of the silicon wafers tip back and forth (a part of the silicon wafers rotate with the lower edge thereof as an axis) may occur, that is, the upper edge of the stack of silicon wafers 50 is misaligned. However, since the stack of silicon wafers 50 is not so much prone to toppling back and forth, the upper and lower edges of the stack of silicon wafers 50 may be considered aligned.
Further, when the silicon wafer is loosened by the grabbing mechanism 40, the distance for the grabbing mechanism 40 to loosen the silicon wafer is not suitable to be too small or too large. When the distance for loosening the silicon wafer is too small, the stack of silicon wafers 50 cannot be sufficiently blown apart; when the distance for releasing the silicon wafer is too large, the stack of silicon wafers 50 is likely to fall off from the grasping area of the grasping mechanism 40. Preferably, the silicon wafer is released by the gripping mechanism 40 at a distance of 5-10 mm.
S300, clamping the side edges of the stack of silicon wafers 50 to be in an aligned state.
In the present embodiment, the stack of silicon wafers 50 is pushed in the middle from the left and right sides of the stack of silicon wafers 50 by the shaping mechanism 20 until the left and right edges of the stack of silicon wafers 50 are aligned.
Further, after clamping the side edges of the stack of silicon wafers 50 to the aligned state, the gripping mechanism 40 clamps the stack of silicon wafers 50 along the thickness direction of the stack of silicon wafers 50, and at this time, a part of the silicon wafers tilted back and forth in the stack of silicon wafers 50 is clamped to be in a vertical state from the tilted back and forth state, that is, the upper edges of the stack of silicon wafers 50 are aligned.
Referring to fig. 2 and 3, an embodiment of the present invention further provides a silicon wafer shaping apparatus, including a shaping platform 10, a shaping mechanism 20, a blowing mechanism 30, a grabbing mechanism 40, and a manipulator (not shown in fig. 2 and 3), where the shaping mechanism 20 is disposed on the shaping platform 10, and the grabbing mechanism 40 is disposed on the manipulator; the manipulator can drive the grabbing mechanism 40 to carry a stack of silicon wafers 50 to be shaped to the shaping mechanism 20; the blowing mechanism 30 can blow air to the stacked silicon wafers 50 and shape the upper and lower edges of the stacked silicon wafers 50 by matching with the grabbing mechanism 40; the shaping mechanism 20 can clamp the silicon wafer stack 50 from the side to shape the left and right edges of the silicon wafer stack 50.
In the embodiment of the present invention, the shaping platform 10 is made of a soft material, or a soft material is laid on the upper surface of the shaping platform 10, for example, PU (Polyurethane) is used. The shaping platform 10 is made of a soft material or the soft material is laid on the upper surface of the shaping platform 10, so that the silicon wafer 50 can be prevented from being cracked or hidden cracked when falling onto the shaping platform 10.
In the present embodiment, the grasping mechanism 40 includes a first grasping drive 41 and two first jaws 42 provided at the drive end of the first grasping drive 41; second grabbing driving parts 43 are respectively arranged on the opposite surfaces of the two first clamping jaws 42, and two second clamping jaws 44 are respectively arranged at the driving ends of the two second grabbing driving parts 43; the first grabbing driving part 41 can drive the two first clamping jaws 42 to move relatively, so that the two second grabbing driving parts 43 move to the left edge and the right edge of the stack of silicon wafers 50 respectively; the two second grasping drive members 43 can simultaneously drive the two second gripping jaws 44 to grasp the left and right edges of the stack of silicon wafers 50 in the thickness direction (front-rear direction) of the stack of silicon wafers 50, respectively. In step S200, the second grasping drive 43 of the grasping mechanism 40 simultaneously drives the two second jaws 44 to move back and forth respectively to release the stack of silicon wafers 50, so that the stack of silicon wafers 50 can move in the grasping area formed between the two second jaws 44. Wherein, the distance of the two second clamping jaws 44 moving back and forth is the distance of the silicon chip released by the grabbing mechanism 40.
In the embodiment of the present invention, the shaping mechanism 20 is used for clamping the side edges of the stack of silicon wafers 50 to an aligned state, and includes two shaping components, which are correspondingly disposed on the left and right sides of the stack of silicon wafers; each shaping assembly comprises a shaping driving piece and a pushing block, and the pushing block is arranged at the driving end of the shaping driving piece. The left and right shaping driving parts can drive the two pushing blocks to clamp the stack of silicon wafers between the two pushing blocks in a centering manner to be aligned.
In the embodiment of the present invention, the blowing mechanism 30 is used for blowing the stack of silicon wafers 50 apart, and includes an air knife holder and an air knife, the air knife is disposed on the air knife holder, and the air knife blows air towards the left side and/or the right side and/or the upper side of the stack of silicon wafers 50. It should be noted that the blowing mechanism 30 may be disposed at any position, for example, on the shaping platform 10, and further, as long as the blowing mechanism 30 can blow away the stack of silicon wafers 50, for example, on the grabbing mechanism 40; the upper left side is included in the left side and the upper side, and therefore, the present invention is also within the scope of the present invention, and similarly, the upper right side is also within the scope of the present invention.
The silicon wafer shaping method and the device can automatically realize the shaping of the silicon wafer, arrange and align the peripheral edges of a stack of silicon wafers, and facilitate the subsequent plastic packaging and packaging of the silicon wafers, thereby avoiding the fracture or hidden crack of the protruded corners of the silicon wafers caused by the misalignment of the silicon wafers and avoiding the difficulty in loading the silicon wafers into a foam box due to the large size of the silicon wafers after the plastic packaging caused by the misalignment of the silicon wafers; the shaping method is simple and convenient, and has high shaping speed, high efficiency and good shaping effect.
While the invention has been described with reference to specific embodiments, it will be apparent to those skilled in the art that these descriptions are illustrative and not intended to limit the scope of the invention. Various modifications and alterations of this invention will become apparent to those skilled in the art based upon the spirit and principles of this invention, and such modifications and alterations are also within the scope of this invention.
Claims (6)
1. A silicon wafer shaping method is characterized in that: the shaping method comprises the following steps:
grabbing a stack of silicon wafers, and vertically placing the stack of silicon wafers at a set position above a shaping platform;
loosening the stacked silicon wafers along the thickness direction of the stacked silicon wafers by a set distance, and blowing air to the stacked silicon wafers to loosen the stacked silicon wafers;
clamping the side edges of the stack of silicon wafers to an aligned state;
clamping the stack of silicon wafers along the thickness direction of the stack of silicon wafers;
when a stack of silicon wafers is grabbed, the left edge and the right edge of the stack of silicon wafers are grabbed along the thickness direction of the stack of silicon wafers.
2. A method of silicon wafer shaping as defined in claim 1, wherein: the set position is a position at which the distance between the lower edge of the stack of silicon wafers and the shaping platform is 3-5 mm.
3. A method of silicon wafer shaping as defined in claim 1, wherein: the set distance is 5-10 mm.
4. A silicon wafer shaping device applying the shaping method as set forth in any one of claims 1 to 3, comprising a shaping platform, a shaping mechanism, a blowing mechanism, a gripping mechanism and a manipulator, wherein the shaping mechanism is arranged on the shaping platform, and the gripping mechanism is arranged on the manipulator; the manipulator can drive the grabbing mechanism to carry a stack of silicon wafers to be shaped to the shaping mechanism; the blowing mechanism can blow air to the stacked silicon wafers and is matched with the grabbing mechanism to shape the upper and lower edges of the stacked silicon wafers; the shaping mechanism can clamp the stacked silicon wafers from the side to shape the left and right edges of the stacked silicon wafers;
the grabbing mechanism comprises a first grabbing driving piece and two first clamping jaws arranged at the driving end of the first grabbing driving piece; second grabbing driving parts are respectively arranged on opposite surfaces of the two first clamping jaws, and two second clamping jaws are arranged at driving ends of the two second grabbing driving parts; the first grabbing driving piece can drive the two first clamping jaws to move relatively, so that the two second grabbing driving pieces move to the left edge and the right edge of the silicon wafer stack respectively; the two second grabbing driving pieces can respectively and simultaneously drive the two second clamping jaws to grab the left edge and the right edge of the stacked silicon wafer along the thickness direction of the stacked silicon wafer;
the shaping mechanism comprises two shaping components which are correspondingly arranged on the left side and the right side of the stacked silicon wafers; each shaping subassembly all includes plastic driving piece and ejector pad, the ejector pad setting is in the drive end of plastic driving piece.
5. The wafer shaping device according to claim 4, wherein: the shaping platform is made of soft materials or soft materials are paved on the upper surface of the shaping platform.
6. The wafer shaping device according to claim 4, wherein: the blowing mechanism comprises an air knife support and an air knife, the air knife is arranged on the air knife support, and the air knife blows towards the left side and/or the right side and/or the upper side of the stacked silicon wafers.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810317493.XA CN108792098B (en) | 2018-04-10 | 2018-04-10 | Silicon wafer shaping method and device |
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| CN201810317493.XA CN108792098B (en) | 2018-04-10 | 2018-04-10 | Silicon wafer shaping method and device |
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| CN108792098A CN108792098A (en) | 2018-11-13 |
| CN108792098B true CN108792098B (en) | 2021-04-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6662529B2 (en) * | 2001-09-26 | 2003-12-16 | Foodtools, Inc. | Ultrasonic method for dividing pastries and inserting dividers |
| CN201553501U (en) * | 2009-10-22 | 2010-08-18 | 创盛工业股份有限公司 | Vibration type paper finishing machine |
| CN201882644U (en) * | 2010-11-02 | 2011-06-29 | 无锡力马化工机械有限公司 | Stack shaping machine |
| CN203800129U (en) * | 2014-04-28 | 2014-08-27 | 山东爱通工业机器人科技有限公司 | Battery piece feeding and stacking mechanism |
| CN206108287U (en) * | 2016-09-28 | 2017-04-19 | 西安启源机电装备股份有限公司 | Accumulator plate finishing device |
| CN207165690U (en) * | 2017-07-28 | 2018-03-30 | 中山市盛屹机电科技有限公司 | Battery wrapper sheet machine |
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