CN108777724A - Cover plate assembly, housing unit and electronic equipment - Google Patents

Cover plate assembly, housing unit and electronic equipment Download PDF

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Publication number
CN108777724A
CN108777724A CN201810220564.4A CN201810220564A CN108777724A CN 108777724 A CN108777724 A CN 108777724A CN 201810220564 A CN201810220564 A CN 201810220564A CN 108777724 A CN108777724 A CN 108777724A
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CN
China
Prior art keywords
accumulation
electronic equipment
electrode
energy
energy film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810220564.4A
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Chinese (zh)
Inventor
杨光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810220564.4A priority Critical patent/CN108777724A/en
Publication of CN108777724A publication Critical patent/CN108777724A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0262Details of the structure or mounting of specific components for a battery compartment
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/34Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
    • H02J7/35Parallel operation in networks using both storage and other dc sources, e.g. providing buffering with light sensitive cells
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Abstract

The application discloses a kind of cover plate assembly, housing unit and electronic equipment.The cover plate assembly of electronic equipment includes main part and accumulation of energy film.Accumulation of energy film is attached at the surface of main part, and accumulation of energy film is suitable for connecting with the battery of electronic equipment.According to the cover plate assembly of the electronic equipment of the application, pass through the accumulation of energy film that is sticked on main part, accumulation of energy film can convert nonelectrical energy (such as solar energy) to electric energy, and accumulation of energy film is electrically connected with battery, so as to which the electric energy after conversion is passed to battery, for providing electric energy for electronic equipment.Electronic equipment may be implemented to charge everywhere using accumulation of energy film, so as to user-friendly.

Description

Cover plate assembly, housing unit and electronic equipment
Technical field
This application involves technical field of electronic equipment, specifically, more particularly to a kind of cover plate assembly, housing unit and electricity Sub- equipment.
Background technology
Solar energy is used widely in recent years as the novel environment friendly energy.With the continuous maturation of heliotechnics, The transfer efficiency of solar cell is constantly being promoted, while cost is gradually reduced.By solar charging power technology and electronic equipment skill Art field combines the innovation for electronic equipment and is of great significance with development.
In the related technology, the solar recharging for realizing mobile phone by the way that solar charging electrical components are arranged on mobile phone, it is this to set It sets that mode is complicated, increases the volume and quality of mobile phone, the usage experience of user is poor.
Apply for content
The application aims to solve at least one of the technical problems existing in the prior art.For this purpose, the application proposes a kind of electricity The cover plate assembly of the cover plate assembly of sub- equipment, the electronic equipment has the advantages that energy conversion.
The application also proposes that the housing unit of a kind of electronic equipment, the housing unit of the electronic equipment have structure letter It is single, use the advantage more than function.
The application also proposes that a kind of electronic equipment, the electronic equipment have the advantages that facilitate charging.
According to the cover plate assembly of the electronic equipment of the embodiment of the present application, including:Main part;Accumulation of energy film, the accumulation of energy film patch Set on the surface of the main part, the accumulation of energy film is suitable for connecting with the battery of the electronic equipment.
According to the cover plate assembly of the electronic equipment of the embodiment of the present application, pass through the accumulation of energy film that is sticked on main part, accumulation of energy film Nonelectrical energy (such as solar energy) can be converted to electric energy, and accumulation of energy film is connect with battery, be passed so as to the electric energy after converting Battery is passed, for providing electric energy for electronic equipment.Electronic equipment may be implemented to charge everywhere using accumulation of energy film, so as to side Just user uses.
According to the housing unit of the electronic equipment of the embodiment of the present application, including:Protecgulum;Rear cover, the rear cover with it is described before Lid connection, and the rear cover limits accommodating chamber with the protecgulum, at least one of the protecgulum and the rear cover include master Body portion and accumulation of energy film, the accumulation of energy film are attached at the surface of the main part, and the accumulation of energy film is suitable for and the electronic equipment Battery is electrically connected.
According to the housing unit of the electronic equipment of the embodiment of the present application, pass through the accumulation of energy film that is sticked on main part, accumulation of energy film Nonelectrical energy (such as solar energy) can be converted to electric energy, and accumulation of energy film is electrically connected with battery, so as to the electric energy after converting Battery is passed to, for providing electric energy for electronic equipment, electronic equipment may be implemented to charge everywhere using accumulation of energy film, so as to It is user-friendly.Moreover, the set-up mode of accumulation of energy film is simple, can directly be sticked protecgulum or after cover, can make Protecgulum or rear cover are serving as structural member simultaneously, realize the function of solar recharging, are set so as to simplify solar recharging structure It sets, reduces the structure member of electronic equipment.
According to the electronic equipment of the embodiment of the present application, including:Housing unit, the housing unit include protecgulum and rear cover, The rear cover is connect with the protecgulum, and the rear cover and the protecgulum limit accommodating chamber, in the protecgulum and the rear cover It is at least one include main part and accumulation of energy film, the accumulation of energy film is attached at the surface of the main part, and the accumulation of energy film is suitable for It is electrically connected with the battery of the electronic equipment;Display module, the display module are set to the housing unit.
According to the electronic equipment of the embodiment of the present application, by the accumulation of energy film that is sticked on main part, accumulation of energy film can be by non-electrical Energy (such as solar energy) is converted into electric energy, and accumulation of energy film is connect with battery, so as to which the electric energy after conversion is passed to battery, uses In providing electric energy for electronic equipment, electronic equipment may be implemented to charge everywhere using accumulation of energy film, so as to user-friendly. Moreover, the set-up mode of accumulation of energy film is simple, can directly be sticked protecgulum or after cover, protecgulum or rear cover can be made to fill When structural member simultaneously, realize the function of solar recharging, so as to simplify solar recharging structure setting, reduce electronic equipment Structure member.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the application will become in the description from combination following accompanying drawings to embodiment Obviously and it is readily appreciated that, wherein:
Fig. 1 is the structural schematic diagram according to the cover plate assembly of the electronic equipment of the embodiment of the present application;
Fig. 2 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application.
Reference numeral:
Electronic equipment 1,
Housing unit 10, protecgulum 11, rear cover 12, display module 20,
Cover plate assembly 100, main part 110, accumulation of energy film 120,
Anti-reflection film 121, first electrode 122, N-type semiconductor 123, P-type semiconductor 124, second electrode 125, Anti-reflective coating 126, ink layer 127, semiconductor layer 128.
Specific implementation mode
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that the orientation of instructions such as term " thickness ", "upper", "lower", "inner" or Position relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the application and simplifies to describe, without It is instruction or implies that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore not It can be interpreted as the limitation to the application.In addition, defining " first ", the feature of " second " can explicitly or implicitly include one A or more this feature.In the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or two with On.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can Can also be electrical connection to be mechanical connection;It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in application.
As shown in Figure 1, according to the cover plate assembly 100 of the electronic equipment 1 of the embodiment of the present application, including main part 110 and storage It can film 120.
As shown in Figure 1, accumulation of energy film 120 is attached at the surface of main part 110, accumulation of energy film 120 is suitable for the electricity with electronic equipment 1 Pond connects.It is understood that accumulation of energy film 120 is located on the surface of main part 110.Accumulation of energy film 120 can absorb nonelectrical energy (example Such as solar energy), and convert nonelectrical energy to electric energy.Accumulation of energy film 120 is connect with battery, and the electric energy after being converted by accumulation of energy film 120 can It for delivery to battery and stores, to provide electric energy for the electrical part in electronic equipment 1.
It should be noted that accumulation of energy film 120 can have viscosity, accumulation of energy film 120 that can directly be bonded in main part 110 Surface.Accumulation of energy film 120 can also be bonded in the surface of main part 110 indirectly by intermediate member (such as viscose glue part).Certainly, it stores Energy film 120 can also be set to the surface of main part 110 otherwise, be not especially limited here.
In addition, " connection " mentioned herein is the connection of broad sense, for example, the battery of accumulation of energy film 120 and electronic equipment 1 can With electrical connection.Accumulation of energy film 120 can be directly electrically connected with battery.Accumulation of energy film 120 can also be realized by conducting wire with battery and is electrically connected It connects.Alternatively, accumulation of energy film 120 can be electrically connected with battery by magnetic field or electric field realization.
According to the cover plate assembly 100 of the electronic equipment 1 of the embodiment of the present application, pass through the accumulation of energy film that is sticked on main part 110 120, accumulation of energy film 120 can convert nonelectrical energy (such as solar energy) to electric energy, and accumulation of energy film 120 is connect with battery, so as to Electric energy after conversion is passed into battery, for providing electric energy for electronic equipment 1.Electronic equipment 1 can be real using accumulation of energy film 120 It now charges everywhere, so as to user-friendly.
As shown in Figure 1, according to some embodiments of the present application, accumulation of energy film 120 may include the 122, second electricity of first electrode Pole 125 and semiconductor layer 128.First electrode 122 and second electrode 125 are suitable for being electrically connected with battery.It is understood that first Electrode 122 can be electrically connected with battery.Second electrode 125 can also be electrically connected with battery.Converted one of accumulation of energy film 120 Divide electric energy that can be transferred to battery by first electrode 122.Another point of electric energy that accumulation of energy film 120 is converted can pass through the second electricity Pole 125 is transferred to battery.For example, first electrode 122 can be electrically connected with the anode of battery, second electrode 125 can be with electricity The cathode in pond is electrically connected, so as to realize the transmission of electric energy.
As shown in Figure 1, semiconductor layer 128 may include N-type semiconductor 123 and P-type semiconductor 124.Semiconductor layer 128 with First electrode 122 and second electrode 125 are electrically connected.It is understood that semiconductor layer 128 is electrically connected with first electrode 122.Half Conductor layer 128 is also electrically connected with second electrode 125.Semiconductor layer 128 may be implemented nonelectrical energy and be converted into electric energy.Semiconductor layer Electric energy after conversion can be transferred to battery by 128 by first electrode 122 and second electrode 125.
It needs to illustrate, there are two types of carrier, i.e. electronics in hole and conduction band in forbidden band in semiconductor, with Semiconductor based on electronic conduction is referred to as N-type semiconductor, on the other side, and the semiconductor based on hole conduction is known as p-type Semiconductor.The P-type semiconductor that triad impurity may make up scarce capsomere, incorporation five are mixed in Semiconducting Silicon Materials or germanium crystal Valence element impurity may make up the N shape semiconductors of extra capsomere.
N-type semiconductor is by mixing impurity in pure semiconductor material (such as pure silicon wafer), making to occur in forbidden band miscellaneous Mass-energy grade, foreign atom can provide electronics." N " indicates the meaning of negative electricity, is derived from the first letter of English Negative.At this In based semiconductor, it is mainly electronegative electronics to participate in conductive (i.e. conductive carrier).Electron excitation in N-type semiconductor enters Conduction band becomes principal carrier.
P-type semiconductor, also referred to as P-type semiconductor.P-type semiconductor, that is, hole concentration is much larger than free electronic concentration Extrinsic semiconductor.P-type semiconductor is by mixing triad in pure silicon crystal, being allowed to replace silicon atom in lattice Seat just forms P-type semiconductor.In P-type semiconductor, hole is mostly sub, and free electron is few son, mainly by hole conduction. The impurity of incorporation is more, and the concentration of more sons (hole) is higher, and electric conductivity is stronger." P " indicates the meaning of positive electricity, is derived from The first letter of English Positive.In this based semiconductor, it is mainly positively charged to participate in conductive (i.e. charge carrier) Hole, acceptor of these holes in semiconductor.
Further, semiconductor layer 128 is set to first electrode 122 and second electrode 125 by silk-screen printing technique.Specifically Parameter includes:Mesh:- 1000 mesh of 300 mesh, frictioning hardness:Shore hardness is 40 degree of -90 degree, squeegee speed 50mm/sec- 300mm/sec, it is 0.5um-10um to scrape thickness.
As shown in Figure 1, in some embodiments of the present application, N-type semiconductor 123 is stacked with P-type semiconductor 124. It is understood that N-type semiconductor 123 and 124 overlapping arrangement of P-type semiconductor, i.e. N-type semiconductor 123 a surface and p-type One surface of semiconductor 124 contacts.N-type semiconductor 123 and P-type semiconductor 124 are stacked, can not only reduce and partly lead The thickness of body layer 128 can also expand the contact area of N-type semiconductor 123 and P-type semiconductor 124, so as to be convenient for N types Electricity effect is formed between semiconductor 123 and P-type semiconductor 124, is turned with realizing solar energy conversion electric energy and can improve energy The efficiency of change.
As shown in Figure 1, in some embodiments of the present application, first electrode 122 can be attached at the one of semiconductor layer 128 Side, and first electrode 122 is located between main part 110 and semiconductor layer 128.It is understood that first electrode 122 is located at Between main part 110 and semiconductor layer 128.For example, main part 110, first electrode 122 and semiconductor layer 128 can by up to Under (as shown in Figure 1 from top to bottom) be stacked.It is set as a result, with being electrically connected for semiconductor layer 128 convenient for first electrode 122 It sets, the thickness of cover plate assembly 100 can also be reduced.
Further, first electrode 122 can be Nian Jie with main part 110.First electrode 122 can be with semiconductor layer 128 Bonding.Thus, it is possible to convenient for first electrode 122 to be set on main part 110, and the mode of operation being bonded is fairly simple and steady Qualitative height can also reduce the thickness of cover plate assembly 100.Further, first electrode 122 is set to by silk-screen printing technique Main part 110.Design parameter includes:Mesh:- 1000 mesh of 300 mesh, frictioning hardness:Shore hardness is 40 degree of -90 degree, scrapes speed Degree is 50mm/sec-300mm/sec, and it is 0.5um-10um to scrape thickness.
As shown in Figure 1, in some embodiments of the present application, second electrode 125 is attached at the another of semiconductor layer 128 Side.It is understood that semiconductor layer 128 is between first electrode 122 and second electrode 125.Semiconductor layer 128 has A pair of opposite surface.First electrode 122 is attached at one of surface.Second electrode 125 is attached at another surface.Example Such as, first electrode 122, semiconductor layer 128 and second electrode 125 can be stacked.
Thus, it is possible to be electrically connected setting convenient for semiconductor layer 128 and first electrode 122, second electrode 125.It can be with Improve semiconductor layer 128 and first electrode 122, the contact area of second electrode 125, so as to improve semiconductor layer 128 to The electric energy transfer rate of first electrode 122 and second electrode 125.
Further, second electrode 125 is set to semiconductor layer 128 by silk-screen printing technique.Design parameter includes:Net Mesh:- 1000 mesh of 300 mesh, frictioning hardness:Shore hardness is 40 degree of -90 degree, and squeegee speed 50mm/sec-300mm/sec is scraped Print thickness is 0.5um-10um.
As shown in Figure 1, according to some embodiments of the present application, there is anti-reflection film between main part 110 and accumulation of energy film 120 121.It is understood that anti-reflection film 121 is folded between main part 110 and accumulation of energy film 120.Anti-reflection film 121 is attached at main body The surface in portion 110.Accumulation of energy film 120 is attached at surface of the anti-reflection film 121 far from main part 110.For example, anti-reflection film 121 has one To opposite surface, as above under (under as shown in Figure 1), main part 110 is contacted with upper surface on (as shown in Figure 1 is upper) surface Connection, accumulation of energy film 120 are connected with lower surface.
In some embodiments of the present application, anti-reflection film 121 can be set to main part 110 by way of vacuum evaporation. The plated film mode Technical comparing of vacuum evaporation is ripe, and coating effects can ensure.The vacuum degree of vacuum coating is 10E-4Pa- 10E-4Pa.The speed of vacuum coating is 0.05nm/sec-1nm/sec.The thickness of anti-reflection film 121 is 10nm-200nm.Further Ground, the light transmittance of anti-reflection film 121 is between 90%-99%.
When light is incident to main part 110, what generated reflected light was to determine with transmitted light energy.Do not considering light When absorbing the other factors such as the scattering with light, the gross energy of reflected light and transmitted light is equal to the energy of incident light.Anti-reflection film 121 Effect is that the energy of reflected light and transmitted light is made to redistribute, so that the energy of transmitted light increases.Thus, it is possible to improve light into The amount for entering accumulation of energy film 120 so as to improve the electric flux of the conversion of accumulation of energy film 120, and then can improve the energy of cover plate assembly 100 Measure transfer efficiency.
As shown in Figure 1, according to some embodiments of the present application, the side of the separate main part 110 of accumulation of energy film 120 has Anti-reflective coating 126.It is understood that accumulation of energy film 120 is between main part 110 and Anti-reflective coating 126.Anti-reflective coating 126 can paste It is located at the surface of accumulation of energy film 120.When light exposes to Anti-reflective coating 126 across accumulation of energy film 120, generated reflected light and transmission What light energy was to determine.
In other factors such as the scatterings of absorption and light for not considering light, the gross energy of reflected light and transmitted light is equal to incidence The energy of light.The effect of Anti-reflective coating 126 is that the energy of reflected light and transmitted light is made to redistribute, so that the energy of reflected light increases Greatly, reflected light can be again introduced into accumulation of energy film 120.Thus, it is possible to the volume reflection of the light after Anti-reflective coating 126 is improved, to The amount into accumulation of energy film 120 can be improved, and then the electric flux of the conversion of accumulation of energy film 120 can be improved, to improve cover plate assembly 100 Energy conversion efficiency.
In some embodiments of the present application, Anti-reflective coating 126 can be set to main part 110 by way of vacuum evaporation. The vacuum degree of vacuum coating can be 10E-4Pa-10E-4Pa.The speed of vacuum coating is 0.05nm/sec-1nm/sec.Increase The thickness of permeable membrane 121 can be 10nm-200nm.The plated film mode Technical comparing of vacuum evaporation is ripe, and coating effects can protect Card.Further, the reflectivity of Anti-reflective coating 126 can be between 10%-70%.
Further, as shown in Figure 1, the side of the separate main part 110 of accumulation of energy film 120 has ink layer 127, Anti-reflective coating 126 between ink layer 127 and accumulation of energy film 120.Have for example, surface of the Anti-reflective coating 126 far from accumulation of energy film 120 can be sticked Ink layer 127.In order to increase the light transmittance of main part 110 so that light can enter accumulation of energy film 120 by main part 110, main Body portion 110 is generally transparent, and ink layer 127 is arranged in side of the accumulation of energy film 120 far from main part 110, not only can be to avoid Enter the influence of accumulation of energy film 120 to amount light, it is also possible that cover plate assembly 100 has appearance color, to block in electronic equipment 1 Component structural map, improve electronic equipment 1 aesthetics.Further, the thickness of ink layer 127 can be controlled in 2um-50um Between.In other words, the thickness of ink layer 127 is between 2 microns to 5 microns.
According to some embodiments of the present application, main part 110 can be transmission element.Thus, it is possible to improve main part 110 Light transmission capacity so as to improve the amount that light enters accumulation of energy film 120, and then can improve accumulation of energy film 120 and convert solar energy into The energy of electric energy.Further, main part 110 is Transparent Parts.Thus, it is possible to so that composition light (the yellowish green blueness of such as blood orange in light Royal purple seven-colour-light) main part 110 can be passed through, so as to improve the amount that light enters accumulation of energy film 120, and then can improve The energy that accumulation of energy film 120 converts solar energy into electrical energy.
According to some embodiments of the present application, main part 110 can be glass plate, PC plate, PMMA plates or sapphire plate.It changes Yan Zhi, main part 110 can be glass plate.Glass plate material is extensive, and at low cost and light transmission is good.Main part 110 can also For PC (Polycarbonate) plate, i.e. polycarbonate plate.PC plate has a good translucency, the light transmittance of PC plate up to 89%, And PC plate stable structure, light weight, there is good anti-collision performance.
PMMA (Polymethyl Met-hacrylate) plate, i.e. polymethyl methacrylate plate, it is organic to be commonly called as antistatic Glass plate, antistatic acrylic plate or antistatic acrylic board etc..PMMA plates have high mechanical strength, and anti-collision performance is good, thoroughly Light rate is up to 90% or more.Sapphire main component is aluminium oxide (Al2O3), be in sapphire except red ruby it Outside, the common name of other color sapphires.Sapphire structures intensity is big, light transmission is good.
According to some embodiments of the present application, the thickness of main part 110 is d, 0.3mm≤d≤2.0mm.In other words, main body The thickness in portion 110 is between 0.3 millimeter to 2 millimeters.The thickness of main part 110 can be 0.3 millimeter.The thickness of main part 110 It may be 2.0 millimeters.Further, the form of main part 110 can be 2D, 2.5D or 3D.
According to some embodiments of the present application, accumulation of energy film 120 can be to store warm component.Thermal energy can be converted by storing warm component For electric energy.For example, for hot summer, ambient temperature is high, can make full use of the heat in environment, utilizes the warm group of storage Part converts heat to electric energy.For another example, the main part 110 that rubs can be passed through so that the temperature on 110 surface of main part increases, main Body portion 110 can transfer heat to the warm component of storage, and it can be electric energy by converting heat to store warm component.
As shown in Fig. 2, according to the housing unit 10 of the electronic equipment 1 of the embodiment of the present application, including protecgulum 11 and rear cover 12. Rear cover 12 is connect with protecgulum 11, and rear cover 12 limits accommodating chamber, at least one of protecgulum 11 and rear cover 12 packet with protecgulum 11 Main part 110 and accumulation of energy film 120 are included, accumulation of energy film 120 is attached at the surface of main part 110, and accumulation of energy film 120 is suitable for setting with electronics Standby 1 battery is electrically connected.
For example, rear cover 12 may include main part 110 and accumulation of energy film 120, accumulation of energy film 120 is located in accommodating chamber.It stores as a result, Energy film 120 can be located at the inside of housing unit 10, so as to improve the aesthetics of electronic equipment 1.For another example, protecgulum 11 can be with Including main part 110 and accumulation of energy film 120, accumulation of energy film 120 is located in accommodating chamber.Accumulation of energy film 120 can be located at housing unit as a result, 10 inside, so as to improve the aesthetics of electronic equipment 1.Certainly, protecgulum 11 can have accumulation of energy film 120, rear cover 12 There can be accumulation of energy film 120, and two accumulation of energy films 120 are respectively positioned in accommodating chamber.Thus, it is possible to improve the energy of electronic equipment 1 Transfer efficiency.
According to the housing unit 10 of the electronic equipment 1 of the embodiment of the present application, pass through the accumulation of energy film that is sticked on main part 110 120, accumulation of energy film 120 can convert nonelectrical energy (such as solar energy) to electric energy, and accumulation of energy film 120 is electrically connected with battery, so as to The electric energy after conversion is passed to battery, for providing electric energy for electronic equipment 1, electronic equipment 1 can be with using accumulation of energy film 120 Realization is charged everywhere, so as to user-friendly.Moreover, the set-up mode of accumulation of energy film 120 is simple, can directly be sticked On protecgulum 11 or rear cover 12, protecgulum 11 or rear cover 12 can be made to serve as structural member simultaneously, realize the work(of solar recharging Can, so as to simplify solar recharging structure setting, reduce the structure member of electronic equipment 1.
As shown in Figure 1, according to some embodiments of the present application, accumulation of energy film 120 may include the 122, second electricity of first electrode Pole 125 and semiconductor layer 128.First electrode 122 and second electrode 125 are suitable for being electrically connected with battery.It is understood that first Electrode 122 can be electrically connected with battery.Second electrode 125 can also be electrically connected with battery.Converted one of accumulation of energy film 120 Divide electric energy that can be transferred to battery by first electrode 122.Another point of electric energy that accumulation of energy film 120 is converted can pass through the second electricity Pole 125 is transferred to battery.For example, first electrode 122 can be electrically connected with the anode of battery, second electrode 125 can be with electricity The cathode in pond is electrically connected, so as to realize the transmission of electric energy.
As shown in Figure 1, semiconductor layer 128 may include N-type semiconductor 123 and P-type semiconductor 124.Semiconductor layer 128 with First electrode 122 and second electrode 125 are electrically connected.It is understood that semiconductor layer 128 is electrically connected with first electrode 122.Half Conductor layer 128 is also electrically connected with second electrode 125.Semiconductor layer 128 may be implemented nonelectrical energy and be converted into electric energy.Semiconductor layer Electric energy after conversion can be transferred to battery by 128 by first electrode 122 and second electrode 125.
It needs to illustrate, there are two types of carrier, i.e. electronics in hole and conduction band in forbidden band in semiconductor, with Semiconductor based on electronic conduction is referred to as N-type semiconductor, on the other side, and the semiconductor based on hole conduction is known as p-type Semiconductor.The P-type semiconductor that triad impurity may make up scarce capsomere, incorporation five are mixed in Semiconducting Silicon Materials or germanium crystal Valence element impurity may make up the N shape semiconductors of extra capsomere.
N-type semiconductor is by mixing impurity in pure semiconductor material (such as pure silicon wafer), making to occur in forbidden band miscellaneous Mass-energy grade, foreign atom can provide electronics." N " indicates the meaning of negative electricity, is derived from the first letter of English Negative.At this In based semiconductor, it is mainly electronegative electronics to participate in conductive (i.e. conductive carrier).Electron excitation in N-type semiconductor enters Conduction band becomes principal carrier.
P-type semiconductor, also referred to as P-type semiconductor.P-type semiconductor, that is, hole concentration is much larger than free electronic concentration Extrinsic semiconductor.P-type semiconductor is by mixing triad in pure silicon crystal, being allowed to replace silicon atom in lattice Seat just forms P-type semiconductor.In P-type semiconductor, hole is mostly sub, and free electron is few son, mainly by hole conduction. The impurity of incorporation is more, and the concentration of more sons (hole) is higher, and electric conductivity is stronger." P " indicates the meaning of positive electricity, is derived from The first letter of English Positive.In this based semiconductor, it is mainly positively charged to participate in conductive (i.e. charge carrier) Hole, acceptor of these holes in semiconductor.
As shown in Figure 1, in some embodiments of the present application, N-type semiconductor 123 is stacked with P-type semiconductor 124. It is understood that N-type semiconductor 123 and 124 overlapping arrangement of P-type semiconductor, i.e. N-type semiconductor 123 a surface and p-type One surface of semiconductor 124 contacts.N-type semiconductor 123 and P-type semiconductor 124 are stacked, can not only reduce and partly lead The thickness of body layer 128 can also expand the contact area of N-type semiconductor 123 and P-type semiconductor 124, so as to be convenient for N types Electricity effect is formed between semiconductor 123 and P-type semiconductor 124, is turned with realizing solar energy conversion electric energy and can improve energy The efficiency of change.
As shown in Figure 1, in some embodiments of the present application, first electrode 122 can be attached at the one of semiconductor layer 128 Side, and first electrode 122 is located between main part 110 and semiconductor layer 128.It is understood that first electrode 122 is located at Between main part 110 and semiconductor layer 128.For example, main part 110, first electrode 122 and semiconductor layer 128 can by up to Lower layer's folded setting (as shown in Figure 1 from top to bottom).It is set as a result, with being electrically connected for semiconductor layer 128 convenient for first electrode 122 It sets, the thickness of cover plate assembly 100 can also be reduced.
As shown in Figure 1, in some embodiments of the present application, second electrode 125 is attached at the another of semiconductor layer 128 Side.It is understood that semiconductor layer 128 is between first electrode 122 and second electrode 125.Semiconductor layer 128 has A pair of opposite surface.First electrode 122 is attached at one of surface.Second electrode 125 is attached at another surface.Example Such as, first electrode 122, semiconductor layer 128 and second electrode 125 can be stacked.Thus, it is possible to be convenient for semiconductor layer 128 It is electrically connected setting with first electrode 122, second electrode 125.Semiconductor layer 128 and first electrode 122, the can also be improved The contact area of two electrodes 125, so as to improve electric energy of the semiconductor layer 128 to first electrode 122 and second electrode 125 Transmission rate.
As shown in Fig. 2, according to the electronic equipment 1 of the embodiment of the present application, including housing unit 10 and display module 20.Shell Component 10 includes protecgulum 11 and rear cover 12, and rear cover 12 is connect with protecgulum 11, and rear cover 12 limits accommodating chamber, protecgulum with protecgulum 11 At least one of 11 and rear cover 12 include main part 110 and accumulation of energy film 120, and accumulation of energy film 120 is attached at the table of main part 110 Face, accumulation of energy film 120 are suitable for being electrically connected with the battery of electronic equipment 1.Display module 20 is set to housing unit 10.
For example, rear cover 12 may include main part 110 and accumulation of energy film 120, accumulation of energy film 120 is located in accommodating chamber.It stores as a result, Energy film 120 can be located at the inside of housing unit 10, so as to improve the aesthetics of electronic equipment 1.For another example, protecgulum 11 can be with Including main part 110 and accumulation of energy film 120, accumulation of energy film 120 is located in accommodating chamber.Accumulation of energy film 120 can be located at housing unit as a result, 10 inside, so as to improve the aesthetics of electronic equipment 1.Certainly, protecgulum 11 can have accumulation of energy film 120, rear cover 12 There can be accumulation of energy film 120, and two accumulation of energy films 120 are respectively positioned in accommodating chamber.Thus, it is possible to improve the energy of electronic equipment 1 Transfer efficiency.
It should be noted that including, but are not limited to be configured to via wired line as " electronic equipment 1 " as used herein Road connection (such as via Public Switched Telephone Network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection, And/or another data connection/network) and/or via (for example, for cellular network, WLAN (WLAN), such as The digital TV networks of DVB-H networks, satellite network, AM-FM broadcasting transmitter and/or another communication terminal) wirelessly connect The device of mouth reception/transmission signal of communication.The example of electronic equipment 1 includes, but are not limited to satellite or cellular phone;It can combine PCS Personal Communications System (PCS) terminal of cellular radio telephone and data processing, fax and communication ability;It can wrap Include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system The PDA of system (GPS) receiver;And conventional laptop and/or palmtop receiver or include radiotelephone transceiver its Its electronic device.
According to the electronic equipment 1 of the embodiment of the present application, pass through the accumulation of energy film 120 that is sticked on main part 110, accumulation of energy film 120 Nonelectrical energy (such as solar energy) can be converted to electric energy, and accumulation of energy film 120 is connect with battery, so as to the electric energy after converting Battery is passed to, for providing electric energy for electronic equipment 1, electronic equipment 1 may be implemented to charge everywhere using accumulation of energy film 120, from And it can be user-friendly.Moreover, the set-up mode of accumulation of energy film 120 is simple, can directly be sticked in protecgulum 11 or rear cover On 12, protecgulum 11 or rear cover 12 can be made to serve as structural member simultaneously, the function of solar recharging is realized, so as to simplification Solar recharging structure setting reduces the structure member of electronic equipment 1.
Below with reference to Fig. 1-Fig. 2 detailed descriptions according to the electronic equipment 1 of the embodiment of the present application.
It is worth understanding, it is described below to be merely illustrative, rather than to the concrete restriction of the application.The electronics is set Standby 1 can be it is various can be from the external equipment for obtaining data and being handled the data, alternatively, the electronic equipment 1 can be with Be it is various be built-in with battery, and can be from the external equipment that obtains electric current and charge to the battery, for example, mobile phone, tablet are electric Brain, computing device or device for display of message etc..
The electronic equipment 1 that the application is applicable in is introduced by taking mobile phone as an example.In the embodiment of the present application, mobile phone can be with Including housing unit 10, radio circuit, memory, input unit, Wireless Fidelity (WiFi, wireless fidelity) mould The components such as block, display module 20, sensor, voicefrequency circuit, processor, projecting cell, shooting unit, battery.
As shown in Fig. 2, housing unit 10 includes protecgulum 11 and rear cover 12, rear cover 12 connect with protecgulum 11, and rear cover 12 and Protecgulum 11 limits accommodating chamber, and protecgulum 11 and rear cover 12 include main part 110 and accumulation of energy film 120, main part 110 and accumulation of energy Film 120 is located in accommodating chamber.Main part 110 is Transparent Parts.It is illustrated by taking the structure of rear cover 12 as an example below.
As shown in Figure 1, main part 110 is attached at the inner surface of rear cover 12, accumulation of energy film 120 is attached at the table of main part 110 Face, accumulation of energy film 120 are suitable for being electrically connected with battery.Display module 20 is set to housing unit 10.Accumulation of energy film 120 include anti-reflection film 121, First electrode 122, N-type semiconductor 123, P-type semiconductor 124, second electrode 125, Anti-reflective coating 126 and ink layer 127.Anti-reflection film 121, first electrode 122, N-type semiconductor 123, P-type semiconductor 124, second electrode 125, Anti-reflective coating 126 and ink layer 127 from Top to bottm (as shown in Figure 1 upper and lower) is cascading, and is bonded between the adjacent component of any two.
Radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, by base station After downlink information receives, processor processing is given;In addition, the data of mobile phone uplink are sent to base station.In general, radio circuit includes But be not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..In addition, radio frequency electrical Road can also be communicated with network and other equipment by radio communication.Above-mentioned wireless communication can use any communication standard or association View, including but not limited to global system for mobile communications (GSM, Global System for Mobile communication), General packet radio service (GPRS, General Packet Radio Service), CDMA (CDMA, Code Division Multiple Access), wideband code division multiple access (WCDMA, Wideband Code Division Multiple Access), long term evolution (LTE, Long Term Evolution), Email, short message service (SMS, Short Messaging Service) etc..
Wherein, memory can be used for storing software program and module, and processor is stored in the soft of memory by operation Part program and module, to execute various function application and the data processing of mobile phone.Memory can include mainly storage journey Sequence area and storage data field, wherein storing program area can storage program area, the application program needed at least one function (such as Sound-playing function, image player function etc.) etc.;Storage data field can be stored uses created data (such as according to mobile phone Audio data, phone directory etc.) etc..In addition, memory may include high-speed random access memory, can also include non-volatile Property memory, a for example, at least disk memory, flush memory device or other volatile solid-state parts.
Input unit can be used for receiving the number or character information of input, and generate the user setting and work(with mobile phone Related key signals can be controlled.Specifically, input unit may include touch panel and other input equipments.Touch panel, Referred to as touch screen, collect user on it or neighbouring touch operation (for example user is suitble to using finger, stylus etc. are any The operation on touch panel or near touch panel of object or attachment), and driven according to preset formula corresponding Attachment device.Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, inspection is touched The touch orientation of device detection user is surveyed, and detects the signal that touch operation is brought, transmits a signal to touch controller;It touches Controller receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can receive Order that processor is sent simultaneously is executed.Furthermore, it is possible to more using resistance-type, condenser type, infrared ray and surface acoustic wave etc. Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other are defeated Enter equipment and can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse It is one or more in mark, operating lever etc..
Wherein, display module 20 can be used for showing information input by user or be supplied to the information and mobile phone of user Various menus.Display module 20 may include display panel, it is alternatively possible to using LCD assembly 20 (LCD, Liquid Crystal Display), the forms such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) match Set display panel.Further, touch panel can cover display panel, when touch panel detects on it or neighbouring touch After operation, processor is sent to determine the type of touch event, is followed by subsequent processing device according to the type of touch event in display surface Corresponding visual output is provided on plate.
Wherein, the position in the outer display panel of the visual output which can identify, can be used as aftermentioned " viewing area Domain ".The function that outputs and inputs that mobile phone can be realized using touch panel and display panel as two independent components, also may be used That mobile phone is realized so that touch panel and display panel is integrated outputs and inputs function.
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings Device.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity Energy-stored spring made of part drives electric contact, to realize the variation that Gravity changer is converted into electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function Hit) etc..
According to the electronic equipment 1 of the embodiment of the present application, pass through the accumulation of energy film 120 that is sticked on main part 110, accumulation of energy film 120 Nonelectrical energy (such as solar energy) can be converted to electric energy, and accumulation of energy film 120 is electrically connected with battery, so as to the electricity after converting Battery can be passed to, for providing electric energy for electronic equipment 1, electronic equipment 1 may be implemented to charge everywhere using accumulation of energy film 120, So as to user-friendly.Moreover, the set-up mode of accumulation of energy film 120 is simple, can directly be sticked protecgulum 11 or after On lid 12, protecgulum 11 or rear cover 12 can be made to serve as structural member simultaneously, the function of solar recharging is realized, so as to letter Change solar recharging structure setting, reduces the structure member of electronic equipment 1.
In the embodiment of the present application, it is first as aftermentioned " attitude parameter " is obtained that motion sensor listed above may be used Part, but not limited to this, other sensors that can obtain " attitude parameter " are each fallen in the protection domain of the application, example Such as, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, here, in order to It avoids repeating, description is omitted.
In addition, in the embodiment of the present application, as sensor, can also configure barometer, hygrometer, thermometer and infrared ray The other sensors such as sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein ambient light sensor can be according to ambient light The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or Backlight.
Voicefrequency circuit, loud speaker and microphone can provide the audio interface between user and mobile phone.Voicefrequency circuit can will connect The transformed electric signal of audio data received, is transferred to loud speaker, and voice signal output is converted to by loud speaker;Another party The voice signal of collection is converted to electric signal by face, microphone, is converted to audio data after being received by voicefrequency circuit, then by audio After the processing of data output processing device, through radio circuit to be sent to such as another mobile phone, or audio data exported to storage Device is to be further processed.
WiFi belongs to short range wireless transmission technology, mobile phone can help user to send and receive e-mail by WiFi module, Browse webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.
Processor is that the control centre of mobile phone is passed through using the various pieces of various interfaces and connection whole mobile phone Operation executes the software program and/or module being stored in memory, and calls the data being stored in memory, executes The various functions and processing data of mobile phone, to carry out integral monitoring to mobile phone.Optionally, processor may include one or more Processing unit;Preferably, processor can integrate application processor and modem processor, wherein application processor is mainly located Operating system, user interface and application program etc. are managed, modem processor mainly handles wireless communication.
It is understood that above-mentioned modem processor can not also be integrated into processor.
Also, the processor can execute same or similar with processing unit as the realization element of above-mentioned processing unit Function.
Mobile phone further includes the power supply (such as battery) powered to all parts.
Preferably, power supply can be logically contiguous with processor by power-supply management system, to pass through power-supply management system Realize the functions such as management charging, electric discharge and power managed.Although being not shown, mobile phone can also be including bluetooth module etc., herein It repeats no more.
It should be noted that mobile phone is only a kind of citing of terminal device, the application is simultaneously not particularly limited, and the application can be with Applied to the electronic equipments such as mobile phone, tablet computer 1, the application does not limit this.
The electronic equipment 1 of the embodiment of the present application makes protecgulum 11 by the way that accumulation of energy film 120 is arranged on protecgulum 11 and rear cover 12 With rear cover 12 while serving as structural member, the function of solar recharging may be implemented.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ", The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that:Not In the case of being detached from the principle and objective of the application a variety of change, modification, replacement and modification can be carried out to these embodiments, this The range of application is limited by claim and its equivalent.

Claims (18)

1. the cover plate assembly of a kind of electronic equipment, which is characterized in that including:
Main part;
Accumulation of energy film, the accumulation of energy film are attached at the surface of the main part, and the accumulation of energy film is suitable for the electricity with the electronic equipment Pond connects.
2. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the accumulation of energy film includes:
First electrode and second electrode, the first electrode and the second electrode are suitable for being electrically connected with the battery;
Semiconductor layer, the semiconductor layer include N-type semiconductor and P-type semiconductor, the semiconductor layer and the first electrode It is electrically connected with the second electrode.
3. the cover plate assembly of electronic equipment according to claim 2, which is characterized in that the N-type semiconductor and the p-type Semiconductor multilayer is arranged.
4. the cover plate assembly of electronic equipment according to claim 2, which is characterized in that the first electrode is attached at described The side of semiconductor layer, and the first electrode is located between the main part and the semiconductor layer.
5. the cover plate assembly of electronic equipment according to claim 2, which is characterized in that the second electrode is attached at described The other side of semiconductor layer.
6. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the main part and the accumulation of energy film Between have anti-reflection film.
7. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the separate master of the accumulation of energy film The side in body portion has Anti-reflective coating.
8. the cover plate assembly of electronic equipment according to claim 7, which is characterized in that the separate master of the accumulation of energy film The side in body portion has ink layer, and the Anti-reflective coating is between the ink layer and the accumulation of energy film.
9. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the main part is transmission element.
10. the cover plate assembly of electronic equipment according to claim 9, which is characterized in that the main part is Transparent Parts.
11. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the main part is glass plate, PC Plate, PMMA plates or sapphire plate.
12. the cover plate assembly of electronic equipment according to claim 1, which is characterized in that the accumulation of energy film is to store warm component.
13. the housing unit of a kind of electronic equipment, which is characterized in that including:
Protecgulum;
Rear cover, the rear cover are connect with the protecgulum, and the rear cover limits accommodating chamber, the protecgulum and institute with the protecgulum It includes main part and accumulation of energy film to state at least one of rear cover, and the accumulation of energy film is attached at the surface of the main part, the storage Energy film is suitable for being electrically connected with the battery of the electronic equipment.
14. the housing unit of electronic equipment according to claim 13, which is characterized in that the accumulation of energy film includes:
First electrode and second electrode, the first electrode and the second electrode are suitable for being electrically connected with the battery;
Semiconductor layer, the semiconductor layer include N-type semiconductor and P-type semiconductor, the semiconductor layer and the first electrode It is electrically connected with the second electrode.
15. the housing unit of electronic equipment according to claim 14, which is characterized in that the N-type semiconductor and the P The folded setting of type semiconductor layer.
16. the housing unit of electronic equipment according to claim 14, which is characterized in that the first electrode is attached at institute The side of semiconductor layer is stated, and the first electrode is located between the main part and the semiconductor layer.
17. the housing unit of electronic equipment according to claim 14, which is characterized in that the second electrode is attached at institute State the other side of semiconductor layer.
18. a kind of electronic equipment, which is characterized in that including:
Housing unit, the housing unit include protecgulum and rear cover, and the rear cover is connect with the protecgulum, and the rear cover and institute It states protecgulum and limits accommodating chamber, at least one of the protecgulum and the rear cover include main part and accumulation of energy film, the accumulation of energy Film is attached at the surface of the main part, and the accumulation of energy film is suitable for being electrically connected with the battery of the electronic equipment;
Display module, the display module are set to the housing unit.
CN201810220564.4A 2018-03-16 2018-03-16 Cover plate assembly, housing unit and electronic equipment Pending CN108777724A (en)

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