CN108770217A - PCB plate production method with internal layer super thick copper coin - Google Patents
PCB plate production method with internal layer super thick copper coin Download PDFInfo
- Publication number
- CN108770217A CN108770217A CN201810875089.4A CN201810875089A CN108770217A CN 108770217 A CN108770217 A CN 108770217A CN 201810875089 A CN201810875089 A CN 201810875089A CN 108770217 A CN108770217 A CN 108770217A
- Authority
- CN
- China
- Prior art keywords
- copper coin
- thick copper
- super thick
- internal layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 55
- 239000010949 copper Substances 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011162 core material Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of PCB plate production methods with internal layer super thick copper coin.Step S1：Core material and super thick copper coin are etched to form internal layer circuit.Step S2：The logicalnot circuit area of super thick copper coin is etched into half copper thickness to form groove.Step S3：One or multiple PP layers of non-woven fabrics for containing resin are placed between adjacent super thick copper coin.Step S4：PP layers of each super thick copper coin of step S3 and non-woven fabrics are pressed to obtain target plate body.PCB plate production method disclosed by the invention with internal layer super thick copper coin, PP layers of conventional FR4 is replaced using PP layers of non-woven fabrics to press filler, the etched recesses for no longer needing to fill and lead up the logicalnot circuit area of super thick copper coin using resin, to simplify production process and to reduce cost of manufacture.
Description
Technical field
The invention belongs to wiring board production technical fields, and in particular to a kind of pcb board making with internal layer super thick copper coin
Method.
Background technology
Currently, internal layer super thick copper coin only etches half copper thickness in logicalnot circuit area and forms groove.And then, it generally requires and adopts
It is pressed again after being filled and led up the logicalnot circuit region (i.e. recess region) of etching with potting resin mode.However, above-mentioned conventional system
Make method existing defects, is mainly reflected in that production method flow is longer, is not easy to reduce cost, increases process control difficulties.
Invention content
The present invention is directed to the situation of the prior art, overcomes drawbacks described above, provides a kind of pcb board with internal layer super thick copper coin
Production method.
The present invention uses following technical scheme, and the PCB plate production method with internal layer super thick copper coin includes following step
Suddenly：
Step S1：Core material and super thick copper coin are etched to form internal layer circuit；
Step S2：The logicalnot circuit area of super thick copper coin is etched into half copper thickness to form groove；
Step S3：One or multiple PP layers of non-woven fabrics for containing resin are placed between adjacent super thick copper coin；
Step S4：PP layers of each super thick copper coin of step S3 and non-woven fabrics are pressed to obtain target plate body.
According to above-mentioned technical proposal, in step s3, non-woven fabrics PP layers of the resin content is 90%~94%.
According to above-mentioned technical proposal, in step s3, non-woven fabrics PP layers of the thickness is 0.20mm~0.22mnm.
According to above-mentioned technical proposal, in step s 4, the high pressure section pressing pressure of the pressing is 360Psi~390Psi.
According to above-mentioned technical proposal, heating rate when being pressed together on 80 DEG C~140 DEG C be 1.5 DEG C/min~2.5 DEG C/
min。
According to above-mentioned technical proposal, the solidification temperature of the pressing is 185 DEG C~195 DEG C.
According to above-mentioned technical proposal, the hardening time of the pressing is no less than 70min.
PCB plate production method disclosed by the invention with internal layer super thick copper coin, advantage is, uses non-woven fabrics
PP layers replace conventional FR4PP layers to press filler, it is no longer necessary to the etching in the logicalnot circuit area of super thick copper coin is filled and led up using resin
Groove, to simplify production process and to reduce cost of manufacture.
Description of the drawings
Fig. 1 is the schematic cross-section of the internal layer circuit etching of the preferred embodiment of the present invention.
Fig. 2 is the schematic cross-section of the bonding processes of the preferred embodiment of the present invention.
Reference numeral includes：10- super thick copper coins；11- etched recesses；PP layers of 20- non-woven fabrics.
Specific implementation mode
It is right with reference to preferred embodiment the invention discloses a kind of PCB plate production method with internal layer super thick copper coin
The specific implementation mode of the present invention is further described.
Referring to Figure 1 of the drawings and Fig. 2, Fig. 1 show the cross section structure that internal layer circuit etches, and Fig. 2 shows bonding processes
Cross section structure.
Wherein, the super thick copper coin 10 has etched recesses 11, and the depth of the etched recesses 11 is super thick copper coin 10
General copper is thick.
Wherein, one or PP layers of multiple non-woven fabrics are provided between adjacent super thick copper coin 10.
Preferably, the PCB plate production method with internal layer super thick copper coin includes the following steps：
Step S1：Core material and super thick copper coin are etched to form internal layer circuit；
Step S2：The logicalnot circuit area of super thick copper coin is etched into half copper thickness to form groove；
Step S3：One or multiple PP layers of non-woven fabrics for containing resin are placed between adjacent super thick copper coin；
Step S4：PP layers of each super thick copper coin of step S3 and non-woven fabrics are pressed to obtain target plate body.
Further, in step s3, non-woven fabrics PP layers of the resin content is 90%~94%.
Further, in step s3, non-woven fabrics PP layers of the thickness is 0.20mm~0.22mnm.
Further, in step s 4, the high pressure section pressing pressure of the pressing is 360Psi~390Psi.
Further, in step s 4, heating rate when being pressed together on 80 DEG C~140 DEG C is 1.5 DEG C/min~2.5
℃/min。
Further, in step s 4, the solidification temperature of the pressing is 185 DEG C~195 DEG C.
Further, in step s 4, the hardening time of the pressing is no less than 70min.
According to above preferred embodiment, the disclosed pcb board making side with internal layer super thick copper coin of present patent application
Method, relative to old process (sawing sheet → internal layer circuit (etching core material and super-thick copper copper coin, by super-thick copper copper coin logicalnot circuit
Area only etches half copper thickness and forms groove) → resin filled and led up and (filled and led up the copper face groove of etching using resin) → and pressing (uses
Common glass PP pieces) → lower process), directly pressed using PP layers of the non-woven fabrics with high resin content, without pressing after the etching
Potting resin before closing, simplifies flow, has saved cost.In addition, the difference in height of the thick copper coin and base material after general etching compared with
Greatly, the contact turning between the copper of depth and base material will be formed.The glass that conventional FR4PP layers use is in braided and has one
Fixed rigidity, turning position are not easy to fill, are easy to form filler dead angle, cause glue amount deficiency, resin cavity etc. when copper thickness is too thick
Problem.The non-woven fabrics for PP layers of the non-woven fabrics that present patent application uses passes through in cotton-shaped, very thin and softness and increases nothing
The resin content (general resin content is 90%~94%, and general thickness is in 0.20mm~0.22mm) that PP layers of woven fabric, Ke Yiyou
The filler of thick copper and base material turning position, will not occur in filler deficiency, filling cavity problem when high thick copper coin being avoided to effect to press
Dead Core Problems.
According to above preferred embodiment, the disclosed pcb board making side with internal layer super thick copper coin of present patent application
Method is characterized by, and filler is pressed using FR4PP layers of replacement routine of PP layers of non-woven fabrics.
For a person skilled in the art, the technical solution recorded in foregoing embodiments can still be repaiied
Change or equivalent replacement of some of the technical features, all within the spirits and principles of the present invention, made by any repair
Change, equivalent replacement, improvement etc., should be included in protection scope of the present invention.
Claims (7)
1. a kind of PCB plate production method with internal layer super thick copper coin, which is characterized in that include the following steps：
Step S1：Core material and super thick copper coin are etched to form internal layer circuit；
Step S2：The logicalnot circuit area of super thick copper coin is etched into half copper thickness to form groove；
Step S3：One or multiple PP layers of non-woven fabrics for containing resin are placed between adjacent super thick copper coin；
Step S4：PP layers of each super thick copper coin of step S3 and non-woven fabrics are pressed to obtain target plate body.
2. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that in step S3
In, non-woven fabrics PP layers of the resin content is 90%~94%.
3. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that in step S3
In, non-woven fabrics PP layers of the thickness is 0.20mm~0.22mnm.
4. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that in step S4
In, the high pressure section pressing pressure of the pressing is 360Psi~390Psi.
5. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that the pressing
Heating rate at 80 DEG C~140 DEG C is 1.5 DEG C/min~2.5 DEG C/min.
6. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that the pressing
Solidification temperature be 185 DEG C~195 DEG C.
7. the PCB plate production method according to claim 1 with internal layer super thick copper coin, which is characterized in that the pressing
Hardening time be no less than 70min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875089.4A CN108770217B (en) | 2018-08-03 | 2018-08-03 | Manufacturing method of PCB with inner-layer super-thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875089.4A CN108770217B (en) | 2018-08-03 | 2018-08-03 | Manufacturing method of PCB with inner-layer super-thick copper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108770217A true CN108770217A (en) | 2018-11-06 |
| CN108770217B CN108770217B (en) | 2020-12-01 |
Family
ID=63968618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810875089.4A Active CN108770217B (en) | 2018-08-03 | 2018-08-03 | Manufacturing method of PCB with inner-layer super-thick copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770217B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6651324B1 (en) * | 2000-11-06 | 2003-11-25 | Viasystems Group, Inc. | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
| CN104918419A (en) * | 2014-03-11 | 2015-09-16 | 深南电路有限公司 | Thick copper circuit board processing method |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN107835570A (en) * | 2017-10-23 | 2018-03-23 | 景旺电子科技(龙川)有限公司 | A kind of lid of taking off for pressing from both sides copper core plate reveals copper core plate method |
-
2018
- 2018-08-03 CN CN201810875089.4A patent/CN108770217B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6651324B1 (en) * | 2000-11-06 | 2003-11-25 | Viasystems Group, Inc. | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
| CN104918419A (en) * | 2014-03-11 | 2015-09-16 | 深南电路有限公司 | Thick copper circuit board processing method |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN107835570A (en) * | 2017-10-23 | 2018-03-23 | 景旺电子科技(龙川)有限公司 | A kind of lid of taking off for pressing from both sides copper core plate reveals copper core plate method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN111447750B (en) * | 2020-04-17 | 2023-05-05 | 景旺电子科技(龙川)有限公司 | Manufacturing method of ultra-thick copper PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108770217B (en) | 2020-12-01 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing method of PCB board with inner super thick copper plate Effective date of registration: 20211103 Granted publication date: 20201201 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201201 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method for manufacturing PCB boards with inner layer ultra-thick copper plates Granted publication date: 20201201 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |