CN108767032A - A kind of solar cell package plate preparation process, solar cell package plate and solar cell - Google Patents
A kind of solar cell package plate preparation process, solar cell package plate and solar cell Download PDFInfo
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- CN108767032A CN108767032A CN201810515107.8A CN201810515107A CN108767032A CN 108767032 A CN108767032 A CN 108767032A CN 201810515107 A CN201810515107 A CN 201810515107A CN 108767032 A CN108767032 A CN 108767032A
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- coating
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- barrier layer
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- solar cell
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- 238000002360 preparation method Methods 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 155
- 239000011248 coating agent Substances 0.000 claims abstract description 146
- 230000004888 barrier function Effects 0.000 claims abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000741 silica gel Substances 0.000 claims abstract description 51
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000002834 transmittance Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 166
- -1 Diol ester Chemical class 0.000 claims description 17
- 239000011259 mixed solution Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 238000007761 roller coating Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 5
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 238000000231 atomic layer deposition Methods 0.000 claims description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 238000012536 packaging technology Methods 0.000 abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 239000010408 film Substances 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 230000003678 scratch resistant effect Effects 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of solar cell package plate preparation process of present invention offer, solar cell package plate and solar cell, the preparation process include：There is provided a substrate layer, wherein the substrate layer has the first surface and second surface being oppositely arranged；Second coating is coated on the second surface；Using coating process, barrier layer is formed on the third surface of the second coating；Wherein, the barrier layer is arranged far from the third surface in the second coating of the substrate layer；On the first surface by first coating coating；On the 4th surface of the barrier layer, layer of silica gel is formed；The layer of silica gel is arranged far from the 4th surface of the barrier layer of the substrate layer.The preparation process of the present invention is simple, packaging technology time-saving and efficiency, and material and process costs are relatively low, and the water vapor transmittance for the package board being prepared is down to 10‑5g/m2Day ranks, light transmittance are higher than 95%.
Description
Technical field
The present invention relates to technical field of solar batteries more particularly to a kind of preparation process of solar cell package plate,
Solar cell package plate and solar cell.
Background technology
A new varieties of the flexible thin-film solar cell as solar cell, technologically advanced, function admirable, purposes are wide
It is general, it is increasingly valued by people, the raising with people's quality of the life and demand, the demand to the mobile energy is also increasingly
Greatly, the solar energy movement energy is increasingly becoming the movement for best suiting the modern life due to environmentally protective, light soft, easy to carry
The energy.
But due to current flexible package plate, water vapor transmittance height, the not factors such as damage resistant make in mobile energy class production
Product service life is shorter, generally less than 5 years.
Application No. is the Chinese patent applications of CN201110454523.X to disclose a kind of flexible solar panel and its processing
Technique, which employs the method for the compound high light transmission fluorine-containing layer in PET bases, although said program solves PET (poly- to benzene two
Formic acid glycol ester) ageing-resistant problem, but composite material is not due to containing high water vapor rejection layer, water vapor rejection rate compared with
It is low.
A kind of flexible solar panel is disclosed application No. is 201410321670.3 Chinese patent application and its is added
Work technique, including be combined with each other high light transmission fluorine-containing layer, flexible glass layer, transparent encapsulation material layer, although said program water
Vapour barrier property and ageing-resistant performance make moderate progress, but product structure is complicated, and cost is higher, be not suitable for mobile energy low cost,
Relatively low service life requires and the requirement of frivolous softness.
In the above prior art, partially flexible package board resistance to ag(e)ing is higher, outdoor service life up to 25 years or more,
But structure of composite membrane is complicated, and preparation process is cumbersome, and material cost is higher, is not suitable for mobile energy low cost, relatively low uses year
Limit requires, the requirement of frivolous softness.And high light transmission frosted PET is encapsulated for solar panels, although anti-finger to a certain extent
Line, anti-scratch, but PET resistances to ag(e)ing are poor, and water vapor rejection rate is relatively low.Segmentation scheme is using frosted PET film, photovoltaic hot pressing glue
Piece, PET block water the compound mode of film to prepare flexible package plate, although this mode solves water vapor transmittance and appearance
The problem of, but product structure is complicated, and processing technology is cumbersome, and product is thicker harder after encapsulation, is not suitable for the consumption frivolous softness of category
Demand.Conventional solar cells transparent enclosure film light transmittance is poor simultaneously, and chemical substance, while ageing-resistant effect is easily precipitated
Poor, process operation temperatures are higher (general 140 DEG C or more), and the process time is longer (general lamination times 20-30min), portion
Divide glued membrane to also need to special installation, therefore cause packaging technology complicated, the process time is longer, cost higher, while product cools down
It is not only thick but also hard afterwards.
Invention content
The present invention provides a kind of preparation process of solar cell package plate, to solve current solar cell package plate system
The packaging technology of standby technique is complicated, the process time is longer, the higher problem of manufacturing cost.
The one side of the embodiment of the present invention provides a kind of preparation process of solar cell package plate, the preparation process
Include the following steps：
There is provided a substrate layer, wherein the substrate layer has the first surface and second surface being oppositely arranged；
Second coating is coated on the second surface；
Using coating process, barrier layer is formed on the third surface of the second coating；Wherein, the barrier layer setting exists
On third surface in the second coating far from the substrate layer；The barrier layer and the second coating are disconnected from each other；
On the first surface by first coating coating；
On the 4th surface of the barrier layer, layer of silica gel is formed；The layer of silica gel is arranged far from the substrate layer
On 4th surface of the barrier layer.
Preferably, described the step of first coating is coated on the first surface, including：
First coating mixed solution is provided；
The first coating mixed solution is coated on the first surface of substrate layer with brushing or roller applications；
The dry first coating of heating.
Preferably, step second coating being coated on the second surface, including：
Second coating mixed solution is provided；
Second coating mixed solution is coated on second surface with coating method；
The dry second coating of heating.
Preferably, the coating process includes：Atomic layer deposition process or magnetron sputtering technique.
Preferably, described on the 4th surface of the barrier layer, formed layer of silica gel the step of, including：
Liquid silica gel mixed liquor is stirred；
On the 4th surface of the barrier layer, the layer of silica gel is coated by the way of spray or blade coating or roller coating；
The dry layer of silica gel of heating.
Preferably, the temperature that the layer of silica gel is dried is：50℃-120℃；The dry time is 1min-5min.
The another aspect of the embodiment of the present invention, provides a kind of solar cell package plate, which includes：
Substrate layer, the substrate layer have the first surface and second surface being oppositely arranged；
First coating, on the first surface, the first coating is wear-resistant coating for the first coating setting；
Second coating, the second coating are arranged on the second surface, and the second coating is bonding coat；
Barrier layer, the barrier layer are arranged on the third surface of the second coating；The barrier layer is arranged far from
On third surface in the second coating of the substrate layer；The barrier layer and the second coating are disconnected from each other；
Layer of silica gel, the layer of silica gel are arranged on the 4th surface of the barrier layer；The layer of silica gel is arranged far from institute
On the 4th surface for stating the barrier layer of substrate layer.
Preferably, the substrate layer and the light transmittance of the first coating are more than or equal to 90%.
Preferably, the material of the first coating is：At least one of fluorocarbon resin and polytetrafluoroethylene (PTFE).Preferably,
The material of the substrate layer is：To polyethylene terephthalate or polyethylene naphthalate or poly- benzene dicarboxylic acid butanediol
Ester.
Preferably, the material of the second coating is：At least one of polyester, polyurethane and acrylic acid.
Preferably, the material of the barrier layer is：At least one of silica and aluminium oxide.
Preferably, the water vapor transmittance of the barrier layer is：Less than or equal to 10-5g/m2.Day。
Preferably, the thickness of the layer of silica gel is：10μm-100μm.
The another aspect of the embodiment of the present invention provides a kind of solar cell, including solar energy described in any one of the above embodiments
Cell package plate and solar battery chip, the solar battery chip are fixed on the solar cell package plate, institute
State the compound film material that solar cell package plate is hot pressing.
It is applied in embodiments of the present invention by using coating first coating and second coating on substrate layer and then second
Plated film barrier layer on layer, is packaged using layer of silica gel, makes that preparation process is simple, packaging technology time-saving and efficiency, material and technique
Cost is relatively low, and the water vapor transmittance for the package board being prepared is down to 10-5g/m2Day ranks, light transmittance are higher than 95%, produce simultaneously
Product are simple in structure, easy to use.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 shows the flow chart of solar cell package plate preparation process of one embodiment of the invention a kind of.
Fig. 2 shows another embodiment of the present invention it is a kind of by second coating be coated in the second surface on technique stream
Cheng Tu；
Fig. 3 shows a kind of technological process by coating coating on the first surface of further embodiment of this invention
Figure；
Fig. 4 shows a kind of on the 4th surface of the barrier layer of further embodiment of this invention, forms layer of silica gel
Process flow chart；
Fig. 5 shows a kind of structural schematic diagram of solar cell package plate of further embodiment of this invention；
Specific implementation mode
Exemplary embodiment of the present invention is more fully described below with reference to accompanying drawings.Although showing the present invention in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the present invention without should be by embodiments set forth here
It is limited.It is to be able to be best understood from the present invention on the contrary, providing these embodiments, and can be by the scope of the present invention
Completely it is communicated to those skilled in the art.
Referring to Fig.1, the flow chart of solar cell package plate preparation process of one embodiment of the invention a kind of is shown.It should
Preparation process includes the following steps：
Step 10：There is provided a substrate layer, wherein the substrate layer has the first surface and second surface being oppositely arranged.
In embodiments of the present invention, provide material be to polyethylene terephthalate or polyethylene naphthalate or
The substrate layer of polybutylene terephthalate after then cleaning substrate layer, is dried, spare.
Step 20：Second coating is coated on the second surface.
Step 30：Using coating process, barrier layer is formed on the third surface of the second coating；Wherein, the barrier
Layer is arranged far from the third surface in the second coating of the substrate layer；The barrier layer and the second coating are mutual
Phase separation.
In embodiments of the present invention, barrier layer is formed on the third surface of the second coating, wherein the material of barrier layer
Select the silica with high water vapor rejection effectiveness or the inorganic matters such as aluminium oxide, by these inorganic matters it is single it is one or more into
Row mixing, is uniformly deposited on using using atomic layer deposition process or magnetron sputtering technique on third surface, and barrier layer is formed.
Step 40：On the first surface by first coating coating.
Step 50：On the 4th surface of the barrier layer, layer of silica gel is formed；Its described layer of silica gel is arranged far from described
On 4th surface of the barrier layer of substrate layer.
In embodiments of the present invention, translucent silica gel layer is dried, i.e. translucent silica gel layer is cured, wherein dry
Temperature is 50 DEG C -120 DEG C；The dry time is 1min-5min.
With reference to Fig. 2 shows another embodiment of the present invention it is a kind of by second coating be coated in the second surface on work
Skill flow chart, specifically includes following steps：
Step 21, second coating mixed solution is provided；
Step 22, second coating mixed solution is coated on second surface with coating method；
Step 23, heat up dry second coating.
In embodiments of the present invention, specifically, the second surface in dry substrate layer is coated with second coating, and to second
Coating is dried.Wherein, the second coating being just coated with is wet film, and second coating dry film is formed after high temperature drying, coating
Material is：One or more of polyester, polyurethane, acrylic acid mixture.The surface abrasion resistance of film layer is scratch-resistant after coating, while table
Face is smooth continuous, and roughness is low.
With reference to Fig. 3, a kind of work by coating coating on the first surface of another embodiment of the present invention is shown
Skill flow chart, specifically includes following steps：
Step 41, first coating mixed solution is provided；
Step 42, the first coating mixed solution is coated in the first surface of substrate layer with brushing or roller applications
On；
Step 43, heat up dry first coating.
In embodiments of the present invention, described the step of first coating is coated on the first surface, including：There is provided the
One coating mixed solution；The first coating mixed solution is coated in the first surface of substrate layer with brushing or roller applications
On；The dry first coating of heating.Specifically, on substrate layer first surface, the first painting is coated with by the way of brushing or roller coating
Layer wet film, forms first coating dry film after wet film is dried.
With reference to Fig. 4, a kind of on the 4th surface of the barrier layer of one embodiment of the invention is shown, form layer of silica gel
Process flow chart, specifically include following steps：
Step 51, liquid silica gel mixed liquor is stirred；
Step 52, on the 4th surface of the barrier layer, the silicon is coated by the way of spray or blade coating or roller coating
Glue-line；
Step 53, the dry layer of silica gel of heating.
In embodiments of the present invention, liquid silica gel mixed liquor refers to mixing silica gel substrate and curing agent, solvent and auxiliary agent
The mixed liquor of formation.After the mixed liquor is stirred evenly, on the 4th surface of the barrier layer using spray or blade coating or roller coating
Mode prepare layer of silica gel, then the translucent silica gel layer is dried, obtains the solar cell package plate.
It is applied in embodiments of the present invention by using coating first coating and second coating on substrate layer and then second
Plated film barrier layer on layer, is packaged using layer of silica gel, makes that preparation process is simple, packaging technology time-saving and efficiency, material and technique
Cost is relatively low, and the water vapor transmittance for the package board being prepared is down to 10-5g/m2Day ranks, light transmittance are higher than 95%, produce simultaneously
Product are simple in structure, easy to use.
A preferred embodiment of the invention specifically describes a kind of preparation process of solar cell package plate；The preparation process
Include the following steps：
Offer thickness is 100 μm, the substrate layer that light transmittance 90%, material are PET carries out after substrate layer cleaning
It is dry；
By the second coating that the second surface coating thickness of the substrate layer after cleaning-drying is 15 μm, material is polyester, and
The second coating is dried；
On the third surface of the second coating, it is 30 μ to use atomic layer deposition process to prepare material as silica, thickness
M, steam light transmittance is 10-5g/m2.Day aqueous vapor separation layer；
In the first surface of substrate layer, use brush mode coating material for fluorocarbon resin, thickness be 30 μm, light transmittance
For 94% first coating, and the first coating is dried；
Liquid silica gel mixed liquor is stirred, on the 4th surface of barrier layer, use the mode of spray prepare thickness for
Then the layer of silica gel is 120 DEG C in temperature and 3min is dried, obtains the solar cell package by 10 μm of layer of silica gel
Plate.
Through the embodiment of the present invention, can be prepared thickness be 185 μm, light transmittance 96%, steam is filtered into 10 thoroughly- 3g/m2.Day, the solar cell package plate of 0 grade of coating binding force.
A preferred embodiment of the invention specifically describes a kind of preparation process of solar cell package plate；The preparation process
Include the following steps：
Offer thickness is 200 μm, the substrate layer that light transmittance 92%, material are PEN carries out after substrate layer cleaning
It is dry；
By the second surface coating thickness of the substrate layer after cleaning-drying be 1 μm, material is polyurethane and polyester mixture
Second coating, and the second coating is dried；
The third surface of the second coating, use magnetron sputtering technique prepare material for aluminium oxide, thickness be 1 μm, water
Vapour light transmittance is 10-2g/m2.Day aqueous vapor separation layer；
In the first surface of substrate layer, to use roller applications coating material for polytetrafluoroethylene (PTFE), thickness be 15 μm, light transmittance
For 90% first coating, and the first coating is dried；
Liquid silica gel mixed liquor is stirred, on the 4th surface of barrier layer, use the mode of blade coating prepare thickness for
Then the layer of silica gel is 50 DEG C in temperature and 1min is dried, obtains the solar cell package plate by 50 μm of layer of silica gel.
Through the embodiment of the present invention, can be prepared thickness be 267 μm, light transmittance 95%, steam is filtered into 10 thoroughly- 2g/m2.Day, the solar cell package plate of 0 grade of coating binding force.
A preferred embodiment of the invention specifically describes a kind of preparation process of solar cell package plate；The preparation process
Include the following steps：
Offer thickness is 50 μm, the substrate layer that light transmittance 91%, material are PBT is done after cleaning the substrate layer
It is dry；
It it is 8 μm by the second surface coating thickness of the substrate layer after cleaning-drying, material is polyurethane and acrylic acid mixing
The second coating of object, and the second coating is dried；
On the third surface of second coating, uses magnetron sputtering technique to prepare material and mixed for silica and aluminium oxide
Object, thickness are 15 μm, steam light transmittance is 10-5g/m2.Day barrier layer；
In the first surface of substrate layer, to use roller applications coating material for polytetrafluoroethylene (PTFE), thickness be 5 μm, light transmittance
For 94% first coating, and the first coating is dried；
Liquid silica gel mixed liquor is stirred, on the 4th surface of barrier layer, use the mode of roller coating prepare thickness for
Then the layer of silica gel is 80 DEG C in temperature and 3min is dried by 100 μm of translucent silica gel layers, obtain the solar cell envelope
Loading board.
Through the embodiment of the present invention, can be prepared thickness be 178 μm, light transmittance 96%, steam is filtered into 10 thoroughly- 5g/m2.Day, the solar cell package plate of 0 grade of coating binding force.
As shown in figure 5, showing a kind of structural schematic diagram of solar cell package plate of the present invention；The package board includes：
Substrate layer 2, the substrate layer 2 have the first surface 11 being oppositely arranged and second surface 12；First coating 1, institute
It states first coating 1 to be arranged on the first surface 11, the first coating 1 is wear-resistant coating；Second coating 3, described second
Coating 3 is arranged on the second surface 12, and the second coating 3 is bonding coat；Barrier layer 4, the setting of the barrier layer 4 exist
On third surface 13 in the second coating 3 far from the substrate layer 2；The barrier layer 4 is mutual with the second coating 3
Separation；Layer of silica gel 5, the layer of silica gel 5 are arranged far from the 4th surface of the barrier layer 4 of the substrate layer 2.
In embodiments of the present invention, first coating 1 can be light transmission fluorine-containing coat, have the effect of scratch-resistant wear-resisting；Wherein,
The thickness of first coating 1 may be selected 5 μm -30 μm, and light transmittance is higher than 90%, and specific choice can be selected according to actual needs,
The embodiment of the present invention does not limit this.
In embodiments of the present invention, barrier layer and second coating are compound, when barrier layer is inorganic particulate, in preparation process
In, do not merged with second coating.
Wherein, the material of first coating 1 is：At least one of fluorocarbon resin and polytetrafluoroethylene (PTFE).Implement in the present invention
In example, first coating can also select other high light transmissions, scratch-resistant, wear-resisting, self-cleaning fluorine material.
In embodiments of the present invention, substrate layer 2 can be transparent film substrate, have the effect of weatherability；Substrate layer 2
Thickness may be selected 50 μm -200 μm.Specific choice can be selected according to actual needs, and the embodiment of the present invention does not limit this
System.
Wherein, the material of substrate layer 2 is：To polyethylene terephthalate (PET) or polyethylene naphthalate
(PEN) or polybutylene terephthalate (PBT).Light transmittance is more than 90%.
In embodiments of the present invention, second coating 3 is base coating, the specific can be that water vapor rejection primary coat coating, is used
In coated between substrate layer and barrier layer, playing cohesive effect, the material of second coating 3 is：Polyester, polyurethane and propylene
At least one of acid.Thickness is 1 μm -15 μm.
In embodiments of the present invention, barrier layer 4 is mainly used to obstruct steam, and the thickness of barrier layer is 1 μm -30 μm.Barrier
Layer water vapor transmittance be：Less than or equal to 10-5g/m2.Day.The material of barrier layer is：In silica and aluminium oxide at least
It is a kind of.In embodiments of the present invention, the material of barrier layer can also be other inorganic material.
In embodiments of the present invention, layer of silica gel is as encapsulating material, and simple for process, packaging time is short.The thickness of layer of silica gel
For：10 μm -100 μm, wherein specific thickness can be configured according to actual needs, and the embodiment of the present invention does not limit this.
It is answered in embodiments of the present invention by using substrate layer, first coating, second coating, barrier layer and layer of silica gel
It closes, wherein substrate layer has the effect of weatherability；First coating has the effect of scratch-resistant wear-resisting；Second coating has bonding
Effect；Barrier layer has the effect of barrier steam, makes water vapor transmittance down to 10-5g/m2Day ranks, light transmittance are higher than 95%,
Product structure is simple simultaneously, and easy to use, packaging technology time-saving and efficiency, material and process costs are relatively low.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within the protection of the present invention.
Claims (15)
1. a kind of solar cell package preparation process, which is characterized in that the technique includes the following steps：
There is provided a substrate layer, wherein the substrate layer has the first surface and second surface being oppositely arranged；
Second coating is coated on the second surface；
Using coating process, barrier layer is formed on the third surface of the second coating；Wherein, the barrier layer is arranged far from
On third surface in the second coating of the substrate layer；The barrier layer and the second coating are disconnected from each other；
On the first surface by first coating coating；
On the 4th surface of the barrier layer, layer of silica gel is formed；The layer of silica gel is arranged far from the described of the substrate layer
On 4th surface of barrier layer.
2. preparation process according to claim 1, which is characterized in that described that second coating is coated in the second surface
On step, including：
Second coating mixed solution is provided；
Second coating mixed solution is coated on second surface with coating method；
The dry second coating of heating.
3. preparation process according to claim 1, which is characterized in that described that first coating is coated in the first surface
On step, including：
First coating mixed solution is provided；
The first coating mixed solution is coated on the first surface of substrate layer with brushing or roller applications；
The dry first coating of heating.
4. preparation process according to claim 1, which is characterized in that the coating process includes：Atomic layer deposition process or
Magnetron sputtering technique.
5. preparation process according to claim 1, which is characterized in that described on the 4th surface of the barrier layer, shape
The step of at layer of silica gel, including：
Liquid silica gel mixed liquor is stirred；
On the 4th surface of the barrier layer, the layer of silica gel is coated by the way of spray or blade coating or roller coating；
The dry layer of silica gel of heating.
6. wanting the preparation process described in 5 according to right, which is characterized in that the temperature that the layer of silica gel is dried is：50℃-
120℃；The dry time is 1min-5min.
7. a kind of solar cell package plate, which is characterized in that including：
Substrate layer, the substrate layer have the first surface and second surface being oppositely arranged；
First coating, on the first surface, the first coating is wear-resistant coating for the first coating setting；
Second coating, the second coating are arranged on the second surface, and the second coating is bonding coat；
Barrier layer, the barrier layer are arranged far from the third surface in the second coating of the substrate layer；The resistance
Interlayer and the second coating are disconnected from each other；
Layer of silica gel, the layer of silica gel are arranged far from the 4th surface of the barrier layer of the substrate layer.
8. package board according to claim 7, which is characterized in that the substrate layer and the light transmittance of the first coating are big
In equal to 90%.
9. package board according to claim 7, which is characterized in that the material of the first coating is：Fluorocarbon resin and poly-
At least one of tetrafluoroethene.
10. package board according to claim 7, which is characterized in that the material of the substrate layer is：To poly- ethylene
Diol ester or polyethylene naphthalate or polybutylene terephthalate.
11. package board according to claim 7, which is characterized in that the material of the second coating is：Polyester, polyurethane
At least one of with acrylic acid.
12. package board according to claim 7, which is characterized in that the material of the barrier layer is：Silica and oxidation
At least one of aluminium.
13. package board according to claim 7, which is characterized in that the water vapor transmittance of the barrier layer is：It is less than or equal to
10-5g/m2.Day。
14. package board according to claim 7, which is characterized in that the thickness of the layer of silica gel is：10μm-100μm.
15. a kind of solar cell, which is characterized in that including claim 7-14 any one of them solar cell package plates
And solar battery chip, the solar battery chip are fixed on the solar cell package plate, the solar-electricity
Pond package board is the compound film material of hot pressing.
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| CN201810515107.8A CN108767032A (en) | 2018-05-25 | 2018-05-25 | A kind of solar cell package plate preparation process, solar cell package plate and solar cell |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982444A (en) * | 2019-09-30 | 2020-04-10 | 青岛至亚美莱新型材料股份有限公司 | Multilayer peelable anti-doodling film for locomotive glass |
| CN111430500A (en) * | 2018-12-24 | 2020-07-17 | 汉能移动能源控股集团有限公司 | Preparation process of solar composite packaging plate |
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|---|---|---|---|---|
| JP2012218206A (en) * | 2011-04-05 | 2012-11-12 | Oike Ind Co Ltd | Manufacturing method of hydrothermally resistant gas barrier film, and the hydrothermally resistant gas barrier film |
| CN105990459A (en) * | 2015-02-28 | 2016-10-05 | 汉能新材料科技有限公司 | Flexible package composite film and manufacturing method thereof |
| CN106992255A (en) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | Encapsulating structure, its preparation method and its apply |
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| JP2012218206A (en) * | 2011-04-05 | 2012-11-12 | Oike Ind Co Ltd | Manufacturing method of hydrothermally resistant gas barrier film, and the hydrothermally resistant gas barrier film |
| CN105990459A (en) * | 2015-02-28 | 2016-10-05 | 汉能新材料科技有限公司 | Flexible package composite film and manufacturing method thereof |
| CN106992255A (en) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | Encapsulating structure, its preparation method and its apply |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111430500A (en) * | 2018-12-24 | 2020-07-17 | 汉能移动能源控股集团有限公司 | Preparation process of solar composite packaging plate |
| CN110982444A (en) * | 2019-09-30 | 2020-04-10 | 青岛至亚美莱新型材料股份有限公司 | Multilayer peelable anti-doodling film for locomotive glass |
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