CN108766905A - A kind of verification apparatus for baking of wafer burn in, system and method - Google Patents

A kind of verification apparatus for baking of wafer burn in, system and method Download PDF

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Publication number
CN108766905A
CN108766905A CN201810393096.0A CN201810393096A CN108766905A CN 108766905 A CN108766905 A CN 108766905A CN 201810393096 A CN201810393096 A CN 201810393096A CN 108766905 A CN108766905 A CN 108766905A
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China
Prior art keywords
baking
oven
controller
temperature
wafer
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Pending
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CN201810393096.0A
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Chinese (zh)
Inventor
王印玺
秦超
陶源
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Jiangsu Macau Microelectronics Co Ltd
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Jiangsu Macau Microelectronics Co Ltd
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Priority to CN201810393096.0A priority Critical patent/CN108766905A/en
Publication of CN108766905A publication Critical patent/CN108766905A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides a kind of verification apparatus for baking of wafer burn in, system and method, including oven, oven includes heater, electronic lock, wind turbine, air velocity transducer, temperature sensor and controller, and heater, electronic lock, wind turbine, air velocity transducer and temperature sensor are electrically connected with the controller.The present invention can in real time during monitoring record wafer-baking temperature, wind speed and wafer Self-variation, facilitate supervision retrospect wafer testing procedure, data input high degree of automation that can reduce the mistake of artificial information's typing, improve testing efficiency and test quality.

Description

A kind of verification apparatus for baking of wafer burn in, system and method
Technical field
The invention belongs to wafer test technical fields, and in particular to a kind of verification apparatus for baking of wafer burn in, system and Its method.
Background technology
During semiconductor crystal wafer is manufactured, wafer usually requires to place carries out baking operation in an oven.When In order to dry ink after wafer stamps ink, second is that in order to which high-temperature behavior is tested, i.e., test wafer product is in specific high temperature shape Whether function is normal under state.Wafer is in baking process, it is desirable that precise control of temperature and time need to go through and pick after baking Except defective wafer.But there are more defects when existing industrial baking oven progress wafer-baking:Such as the batch of wafer when wafer-baking, Oven number, the temperature in wafer testing procedure in oven, wind speed variation for using etc. can not be obtained and be stored automatically, be unfavorable for Retrospect baking flow;Wafer-baking parameter needs manually to input setting, is susceptible to mistake, leads to test crash;Wafer Artificial detection defective is needed after baking;It is likely to occur by manually opening and closing oven door and opens by mistake oven, and test is caused to lose Lose, personnel burn, scald etc. accidents.
Therefore it is badly in need of a kind of wafer burn in higher automated information typing storage inquiry and automation oven control Apparatus for baking, system and method.
Invention content
In order to solve the above technical problem, the present invention provides the apparatus for baking of verification wafer burn in, system and method, should Device, system and method can in real time during monitoring record wafer-baking temperature, wind speed and wafer Self-variation, side Just supervision retrospect wafer testing procedure, data input high degree of automation can reduce the mistake of artificial information's typing, improve test Efficiency and test quality.
The present invention provides the following technical solutions:
A kind of apparatus for baking of verification wafer burn in, including oven, oven include heater, electronic lock, wind turbine, wind speed biography Sensor, temperature sensor and controller, heater, electronic lock, wind turbine, air velocity transducer and temperature sensor and controller are electrically connected It connects.
Preferably, air velocity transducer and temperature sensor respectively have 4, and air velocity transducer and temperature sensor are separately positioned on Four edges of interior oven walls.
Preferably, further include IP Camera and alarm, IP Camera is arranged below interior oven walls center of top, Alarm is set to above oven outer wall, and IP Camera and alarm are connect with controller, IP Camera and monitor terminal Connection.
Preferably, controller includes timer, memory and signal processor, and controller receives air velocity transducer and temperature The wind speed and temperature signal of sensor transmissions, signal processor are used to wind speed and temperature signal being converted to wind speed and temperature number According to memory sends signal when baking time reaches and presets baking time for storing information, timer to controller.
A kind of baking system of verification wafer burn in, including data collector, monitoring computer and above-mentioned apparatus for baking, dry The controller and data collector of roasting device are connected with monitoring computer, and for toasting wafer, data collector is used for apparatus for baking Wafer lot number and default Flue curing parameter information are acquired, monitoring computer is for receiving the information of data collector and controller transmission simultaneously Control instruction is transmitted to controller.
Preferably, monitoring computer includes that database module, data analysis module, data management module and data show mould Wind speed and temperature data are transferred to monitoring computer by block, controller, and wind speed and temperature data are stored into number by data management module According in library module, data analysis module reading database mould wind speed in the block and temperature data formed wind speed-time and temperature-when Between relationship analysis as a result, data disaply moudle show analysis result, analysis result include analysis curve.
Preferably, further include administrative center, administrative center is connect by wired or wireless network with monitoring computer.
A kind of baking method of verification wafer burn in, includes the following steps:
S1:Wafer-baking initial information to be baked is obtained, the Quick Response Code that wafer to be baked is scanned using data collector is obtained It takes in the lot number and default baking procedure classification input monitoring computer of wafer to be baked;Monitoring computer is inquired from database module The default baking time and temperature parameter of the corresponding baking procedure default in detail of the default baking procedure classification of acquisition, each step;Prison Control default baking time, temperature parameter and craft that computer presets baking procedure, each step by the lot number of wafer to be baked, in detail Wafer-baking initial information to be baked is formed in the oven number deposit database module of input;
S2:Wafer to be baked is put into oven and is opened oven switch by baking, and oven electronic lock starts locking oven, Oven heat device and fan operation, roaster controller obtain the default baking time and temperature parameter in monitoring computer, oven control Temperature reaches preset temperature and keeps, baking box timer timing, the wind in oven in device control oven heat device elevated oven processed Fast sensor and temperature sensor transmit wind speed and temperature signal to controller, the IP Camera in oven to controller and/ Or monitor terminal transmits video monitoring signal;
S3:Baking terminates, and interrupt signal, control are sent to controller when baking box timer timing, which reaches, presets baking time Device processed closes oven heat device after receiving interrupt signal and starts alarm equipment alarm;
S4:Cooling oven, controller control electronic lock unlock and open oven, and controller controls fan operation to accelerate oven Cooling, when roasting the temperature inside the box that temperature sensor detects in oven reaches 40 degree, controller starts alarm alarm, takes out brilliant Circle;
S5:Data upload and storage, and controller transmits wind speed and temperature data, oven shut-in time to monitoring computer and deposits Enter in database module, database module initially believes wind speed and temperature data, oven shut-in time and wafer-baking to be baked Breath stores to form baking daily record;
S6:Data analysis with check, the data analysis module reading database mould wind speed in the block and temperature of monitoring computer Data form wind speed-time and Temperature-time relationship analysis as a result, data disaply moudle shows analysis result.
The beneficial effects of the invention are as follows:
1, quadrangle is respectively provided with an air velocity transducer and a temperature sensor in oven of the present invention, they pass through controller Real-time wind speed and temperature monitoring data can be transmitted to monitoring computer can be formed by the data analysis module in monitoring computer Wind speed-time and Temperature-time relationship analysis toast flow as a result, being traced after convenient for firing, promote test quality.
2, IP Camera in oven of the present invention is set, monitor terminal is connected by IP Camera, such as mobile phone, monitoring electricity Brain etc. facilitates tester in real time or the subsequent variation for checking wafer in baking process.Since wafer is to be placed on wafer cassette vertically In place into oven, therefore, by IP Camera take pictures it can be seen that each wafer vertical direction change in shape, if brilliant Rupture occurs in circle baking process, and then vertical direction has corresponding deformation, is easy to be captured by IP Camera, so as to very Defective wafer is easily rejected, when can accomplish to trace defective wafer rupture in combination with air velocity transducer and temperature sensor Oven temperature, wind conditions facilitate the defect cause of enterprise diagnosis defective wafer, improve manufacturing process, provide wafer Quality.
3, oven of the present invention is equipped with electronic lock, during oven cooking cycle wafer, is remained off by controller control, When oven cooking cycle wafer is completed, is controlled by controller and unlock and open oven, avoidable operator opens by mistake oven, and causes to test The accidents such as failure, personnel's burn, scald.
4, data input high degree of automation of the present invention can reduce the mistake of artificial information's typing, improve testing efficiency.Its In baking procedure classification preset by scanning record, inquiry obtains default baking procedure class to monitoring computer from database module again The default baking time and temperature parameter of not corresponding baking procedure default in detail, each step;Monitoring computer, which presets these, to be dried Roasting time and temperature parameter are sent to controller, carry out wafer-baking according to default baking procedure by controller control oven, make Temperature, the time control of entire baking flow are more accurate, and can meet the needs of complicated baking procedure.
5, after oven of the present invention is opened, controller can control fan operation to accelerate oven cooling, reduces oven cooling and spends Time, be conducive to promoted testing efficiency.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, the reality with the present invention It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is Roasting oven structure schematic diagram of the present invention;
Fig. 2 is main functional modules connection diagram of the present invention;
Fig. 3 is the baking method step schematic diagram of present invention verification wafer burn in.
In figure label for:1, oven;11, heater;12, electronic lock;13, wind turbine;14, air velocity transducer;15, temperature passes Sensor;16, controller;161, timer;162, memory;163, signal processor;164, processor;17, IP Camera; 18, alarm;2, data collector;3, monitoring computer;31, data management module;32, database module;33, data analysis mould Block;34, data disaply moudle;4, administrative center;5, wireless network.
Specific implementation mode
The preferred embodiment of the present invention is described below in conjunction with the accompanying drawings.
As depicted in figs. 1 and 2, a kind of apparatus for baking of verification wafer burn in, including oven 1, oven 1 include heater 11, electronic lock 12, wind turbine 13, air velocity transducer 14, temperature sensor 15 and controller 16, heater 11, electronic lock 12, wind turbine 13, air velocity transducer 14 and temperature sensor 15 are electrically connected with controller 16.
Air velocity transducer 14 and temperature sensor 15 respectively have 4, and air velocity transducer 14 and temperature sensor 15 are respectively set In four edges of 1 inner wall of oven.
Specifically, further including IP Camera 17 and alarm 18, during IP Camera 17 is arranged at the top of 1 inner wall of oven Centre lower section, alarm 18 are set to above 1 outer wall of oven, and IP Camera 17 and alarm 18 are connect with controller 16, network Camera 17 is connect with monitor terminal.IP Camera 17 can be connect by wireless network with monitor terminal, and monitor terminal can be with It is mobile phone, tablet or computer.
Controller 16 includes timer 161, memory 162 and signal processor 163.Controller 16 receives air velocity transducer 14 and temperature sensor 15 wind speed and temperature signal that transmit, signal processor 163 is for being converted to wind speed and temperature signal Wind speed and temperature data, memory 162 is for storing information, including wind speed and temperature data, default baking time, default baking Temperature, timer 161 send signal when baking time reaches and presets baking time to controller 16.Specifically, controller 16 Including processor 164, timer 161, memory 162 and signal processor 163 and processor 164 connect, and processor 164 is used for It carries out executing calculation processing and control.
A kind of baking system of verification wafer burn in, including data collector 2, monitoring computer 3 and above-mentioned apparatus for baking are roasting Case 1, the controller 16 and data collector 2 of apparatus for baking are connected with monitoring computer 3, and apparatus for baking is for toasting wafer, data Collector 2 is for acquiring wafer lot number and default Flue curing parameter information, and monitoring computer 3 is for receiving data collector 2 and control The information of the transmission of device 16 simultaneously transmits control instruction to controller 16.
Monitoring computer 3 includes that data management module 31, database module 32, data analysis module 33 and data show mould Wind speed and temperature data are transferred to monitoring computer 3 by block 34, controller 16, and data management module 31 deposits wind speed and temperature data It stores up in database module 32, the wind speed and temperature data in 33 reading database module 32 of data analysis module form wind speed- Time and Temperature-time relationship analysis are as a result, data disaply moudle 34 shows that analysis result, analysis result include analysis curve.
Specifically, further including administrative center 4, administrative center 4 is connect by wired or wireless network 5 with monitoring computer 3.
Specifically, monitoring computer 3 can connect 5 ovens 1 simultaneously, multi-section monitoring computer 3 can connection management center 4.Management Center 4 is used to store the analysis result and data of 3 upload of processing multi-section monitoring computer, and to 3 shared information of monitoring computer.Monitoring Computer 3 and administrative center 4 can install manufacturing enterprise's production process and execute (MES) system, realize the production information pipe in enterprise Reason and sharing functionality.
As shown in figure 3, a kind of baking method of verification wafer burn in, includes the following steps:
S1:Wafer-baking initial information to be baked is obtained, the Quick Response Code that wafer to be baked is scanned using data collector 2 is obtained It takes in the lot number and default baking procedure classification input monitoring computer 3 of wafer to be baked;Monitoring computer 3 is from database module 32 Inquiry, which obtains, presets the corresponding baking procedure default in detail of baking procedure classification, the default baking time of each step and temperature ginseng Number;Monitoring computer 3 by the lot number of wafer to be baked, default baking time, the temperature parameter of baking procedure default in detail, each step Wafer-baking initial information to be baked is formed in the oven number deposit database module 32 of manually input.
S2:Wafer to be baked is put into oven 1 and is opened oven switch by baking, and it is roasting that oven electronic lock 12 starts locking Case 1, oven heat device 11 and wind turbine 13 are run, and roaster controller 16 obtains default baking time and temperature in monitoring computer 3 Parameter, roaster controller 16 control temperature in 11 elevated oven 1 of oven heat device and reach preset temperature and keep, baking box timer 161 timing, air velocity transducer 14 and temperature sensor 15 in oven transmit wind speed and temperature signal, oven 1 to controller 16 Interior IP Camera 17 transmits video monitoring signal to controller 16 and/or monitor terminal 3.IP Camera 17 also can be to prison Control terminal transmission video signal, monitor terminal can be mobile phone, tablet or computer.
S3:Baking terminates, and is sent to controller 16 when 161 timing of baking box timer, which reaches, presets baking time and interrupts letter Number, controller 16 closes oven heat device 11 after receiving interrupt signal and starts the alarm of alarm 18, and baking is prompted to terminate.
S4:Cooling oven, controller 16 control the unlock of electronic lock 12 and open oven 1, and controller 16 controls wind turbine 13 and runs To accelerate oven 1 to cool down, when temperature reaches 40 degree in the oven 1 that temperature sensor 15 detects in oven 1, controller 16 starts Alarm 18 alerts, and takes out wafer;
S5:Data upload and storage, and controller 16 transmits wind speed and temperature data, oven shut-in time to monitoring computer 3 And be stored in database module 32, database module 32 dries wind speed and temperature data, oven shut-in time and wafer to be baked Roasting initial information stores to form baking daily record, to trace access in the future.
S6:Data analysis with check, the wind speed in the 33 reading database module 32 of data analysis module of monitoring computer 3 and Temperature data forms wind speed-time and Temperature-time relationship analysis as a result, data disaply moudle 34 shows analysis result, analysis As a result include analysis curve.The analysis curve can be according to selection of time curve in different time periods, and can be from database module 32 Detailed data is transferred to check.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned reality Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation Technical solution recorded in example is modified or equivalent replacement of some of the technical features.All essences in the present invention With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.

Claims (8)

1. a kind of apparatus for baking of verification wafer burn in, which is characterized in that including oven, the oven includes heater, electronics Lock, wind turbine, air velocity transducer, temperature sensor and controller, the heater, the electronic lock, the wind turbine, the wind speed Sensor and the temperature sensor are electrically connected with the controller.
2. the apparatus for baking of verification wafer burn according to claim 1, which is characterized in that the air velocity transducer and institute Stating temperature sensor respectively has 4, and the air velocity transducer and the temperature sensor are separately positioned on the four of the interior oven walls Edge.
3. it is according to claim 2 verification wafer burn in apparatus for baking, which is characterized in that further include IP Camera and Alarm, the IP Camera are arranged below the interior oven walls center of top, and the alarm is set to the oven Above outer wall, the IP Camera and the alarm are connect with the controller, the IP Camera and monitor terminal Connection.
4. the apparatus for baking of verification wafer burn according to claim 3, which is characterized in that the controller includes timing Device, memory and signal processor, the controller receive the wind speed of the air velocity transducer and temperature sensor transmission And temperature signal, the signal processor is used to the wind speed and temperature signal being converted to wind speed and temperature data, described to deposit Reservoir sends signal when baking time reaches and presets baking time for storing information, the timer to the controller.
5. a kind of baking system of verification wafer burn in, which is characterized in that including data collector, monitoring computer and as right is wanted The apparatus for baking described in 4, the controller and the data collector of the apparatus for baking is asked to be connected with the monitoring computer, The apparatus for baking is for toasting wafer, and the data collector is for acquiring wafer lot number and default Flue curing parameter information, institute Monitoring computer is stated to be used to receive the information of the data collector and controller transmission and transmit control to the controller Instruction.
6. the baking system of verification wafer burn according to claim 5, which is characterized in that the monitoring computer includes number According to library module, data analysis module, data management module and data disaply moudle, the controller passes wind speed and temperature data It is defeated by the monitoring computer, wind speed and temperature data are stored into the database module by the data management module, described Data analysis module reads wind speed in the database module and temperature data forms wind speed-time and Temperature-time relationship Analysis result, the data disaply moudle show that the analysis result, the analysis result include analysis curve.
7. the baking system of verification wafer burn according to claim 6, which is characterized in that further include administrative center, institute Administrative center is stated to connect with the monitoring computer by wired or wireless network.
8. a kind of baking method of verification wafer burn in, which is characterized in that include the following steps:
S1:Wafer-baking initial information to be baked is obtained, the Quick Response Code acquisition that wafer to be baked is scanned using data collector is waited for In the lot number and default baking procedure classification input monitoring computer that toast wafer;Monitoring computer is inquired from database module and is obtained The default baking time and temperature parameter of the corresponding baking procedure default in detail of default baking procedure classification, each step;Monitoring electricity Brain presets default baking time, temperature parameter and the manually input of baking procedure, each step by the lot number of wafer to be baked, in detail Oven number deposit database module in form wafer-baking initial information to be baked;
S2:Wafer to be baked, is put into oven and is opened oven switch by baking, and oven electronic lock starts locking oven, oven Heater and fan operation, roaster controller obtain the default baking time and temperature parameter in monitoring computer, roaster controller Temperature reaches preset temperature and keeps, baking box timer timing in control oven heat device elevated oven, and the wind speed in oven passes Sensor and temperature sensor transmit wind speed and temperature signal to controller, and the IP Camera in oven is to controller and/or prison Control terminal transmits video monitoring signal;
S3:Baking terminates, and interrupt signal, controller are sent to controller when baking box timer timing, which reaches, presets baking time Oven heat device is closed after receiving interrupt signal and starts alarm equipment alarm;
S4:Cooling oven, controller control electronic lock unlock and open oven, and controller controls fan operation to accelerate oven cold But, when roasting the temperature inside the box that temperature sensor detects in oven reaches 40 degree, controller starts alarm alarm, takes out brilliant Circle;
S5:Data upload and storage, and controller transmits wind speed and temperature data, oven shut-in time to monitoring computer and is stored in number According in library module, database module deposits wind speed and temperature data, oven shut-in time and wafer-baking initial information to be baked Storage gets up to form baking daily record;
S6:Data analysis with check, the data analysis module reading database mould wind speed in the block and temperature data of monitoring computer Wind speed-time and Temperature-time relationship analysis are formed as a result, data disaply moudle shows analysis result.
CN201810393096.0A 2018-04-27 2018-04-27 A kind of verification apparatus for baking of wafer burn in, system and method Pending CN108766905A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110244130A (en) * 2019-05-10 2019-09-17 惠州恩慈智能科技有限公司 A kind of real time data measurement of capacitance aging fixture, the method for wireless transmission
CN112133046A (en) * 2019-06-24 2020-12-25 江西鸿利光电有限公司 Fool-proof method of LED oven
CN113791336A (en) * 2021-10-12 2021-12-14 北京唯捷创芯精测科技有限责任公司 Multi-cavity mistake-proofing automatic control baking oven for integrated circuit testing and method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205177794U (en) * 2015-10-22 2016-04-20 安徽超元半导体有限公司 A device for wafer toasts
CN105768173A (en) * 2016-03-28 2016-07-20 中国烟草总公司广东省公司 Internet remote monitoring tobacco curing barn
CN206440112U (en) * 2016-11-04 2017-08-25 成都弘达药业有限公司 A kind of automatic exhausting control system of heated-air circulation oven
US9869715B2 (en) * 2014-12-16 2018-01-16 Tokyo Seimitsu Co., Ltd. Semiconductor wafer inspection apparatus and semiconductor wafer inspection method
CN107808831A (en) * 2017-11-10 2018-03-16 上海华岭集成电路技术股份有限公司 Whole process can trace to the source semiconductor test data record method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9869715B2 (en) * 2014-12-16 2018-01-16 Tokyo Seimitsu Co., Ltd. Semiconductor wafer inspection apparatus and semiconductor wafer inspection method
CN205177794U (en) * 2015-10-22 2016-04-20 安徽超元半导体有限公司 A device for wafer toasts
CN105768173A (en) * 2016-03-28 2016-07-20 中国烟草总公司广东省公司 Internet remote monitoring tobacco curing barn
CN206440112U (en) * 2016-11-04 2017-08-25 成都弘达药业有限公司 A kind of automatic exhausting control system of heated-air circulation oven
CN107808831A (en) * 2017-11-10 2018-03-16 上海华岭集成电路技术股份有限公司 Whole process can trace to the source semiconductor test data record method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110244130A (en) * 2019-05-10 2019-09-17 惠州恩慈智能科技有限公司 A kind of real time data measurement of capacitance aging fixture, the method for wireless transmission
CN112133046A (en) * 2019-06-24 2020-12-25 江西鸿利光电有限公司 Fool-proof method of LED oven
CN113791336A (en) * 2021-10-12 2021-12-14 北京唯捷创芯精测科技有限责任公司 Multi-cavity mistake-proofing automatic control baking oven for integrated circuit testing and method thereof

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