CN108764436A - A kind of list interface stripe cell, single interface band, module and smart card - Google Patents
A kind of list interface stripe cell, single interface band, module and smart card Download PDFInfo
- Publication number
- CN108764436A CN108764436A CN201810942969.9A CN201810942969A CN108764436A CN 108764436 A CN108764436 A CN 108764436A CN 201810942969 A CN201810942969 A CN 201810942969A CN 108764436 A CN108764436 A CN 108764436A
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- contact
- antenna
- pads
- stripe cell
- single interface
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000011889 copper foil Substances 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims description 110
- 238000003466 welding Methods 0.000 claims description 53
- 238000003801 milling Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- 238000002955 isolation Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 claims 2
- 235000012149 noodles Nutrition 0.000 claims 1
- 241000218202 Coptis Species 0.000 description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 208000015181 infectious disease Diseases 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application provides a kind of single interface stripe cell, including base material, the base material are covered with copper foil on one side, as copper-clad surface, totally 8 contacts C1-C8 are provided on the copper-clad surface, are electrically isolated from each other by insulating tape between contact；Using any two contacts in C4, C6 and C8 as the first contact and the second contact；It is both provided with hole in substrate regions corresponding with the first contact, the second contact, the contact C1, C2, C3, C5 and C7；Region where first contact and the second contact is extended to adjacent contact respectively, forms the first extension area and the second extension area；It is respectively arranged with the first datum hole and the second datum hole in first extension area and the corresponding substrate regions of the second extension area, present invention also provides the bands and module of the unit for using the list interface band, and the smart card of the application module.The application compatibility preferably, it is higher to promote flexibility.
Description
Technical field
This application involves technical field of intelligent card more particularly to a kind of single interface stripe cell, single interface band, module and
Smart card.
Background technology
Existing double interface smart chip cards (IC card) possess contact and contactless read-write operation function, in the market double boundaries
Face IC modules mainly use special double interface strap seals, and double interface bands contain two layers of copper foil namely contact surface (below may be used
Use " front " acute pyogenic infection of finger tip) copper foil for contact interface and welding surface (or pressure welding face, envelope surfaces, below usable " welding surface "
Acute pyogenic infection of finger tip) copper foil is used for non-contact interface, it is therefore desirable to positive and negative two layers of the copper foil of manufacture is taken in item, and performs etching, plate on it
The techniques such as nickel, gold-plated.This results in double interfaces band price to be higher than single interface band.
The contact of welding surface and circuit are formed in band production technology, after module encapsulation procedure, turn on chip
Non-contact interface circuit and the embedded aerial coil circuit of card so that IC card non-contact function is achieved.In industry
According to iso standard, call 8PIN modules there is the big module of 8 contacts.And there is the little module of 6 contacts to be known as 6PIN modules.
8 contact interface solder joints of 8pin modules according to ISO-7816 respectively with C1, C2 ..., C8 identify.Wherein, C4 and C8 are designed as
Reserved area does not have practical use, and C6 is originally designed as powering to EEPROM, but because of the programm voltage needed for later EEPROM
(Programming Voltage) in chip by directly controlling, so C6 is not just used generally also.
Based on the above, having proposed in the prior art the double interface modules of encapsulation, such as patent No. are brought using single interface item
201710245152.1 patent application, principle are that the area C4, C8, C6 for retaining and being not used in the module using 8pin leads to
Gold thread and Ka Ji antennas that base material punching carrys out the non-contact interface of bridge module welding surface are crossed, to omit the copper foil system of welding surface
It makes.But the existing region C4, C8 or C6 in this design limitation 8pin modules so that its is non-connect antenna bond pad position with it is existing
Different design therefore envelope is surveyed, compatibility is poor on manufacturing card, making double interface modules, further genralrlization is inadequate in the market
Flexibly.
Invention content
To solve the above problems, a kind of single interface stripe cell of the application, including base material, the base material are covered with copper on one side
Foil is provided with totally 8 contacts C1-C8 as copper-clad surface on the copper-clad surface, between contact by insulating tape mutually electricity every
From；
Using any two contacts in C4, C6 and C8 as the first contact and the second contact；It is touched with the first contact, second
It is both provided with hole on point, the corresponding substrate regions in the contact C1, C2, C3, C5 and C7；
Region where first contact and the second contact is extended to adjacent contact respectively, is formed first and is extended
Area and the second extension area；Be respectively arranged on first extension area and the corresponding substrate regions of the second extension area the first datum hole and
Second datum hole.
Preferably, wherein set the side where the contacts C5-C8 to the width of single interface stripe cell, C1, C5 institute
Side be set as the height of single interface stripe cell, coordinate is established as origin using the center of single interface stripe cell
Axis, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and the actual height of single interface stripe cell is arranged
Minimum Bock Altitude for l, single interface stripe cell is h, and the width of C2, C3, C6, C7 are all a, the width of C1, C4, C5, C8
All it is b, if the height of the insulating tape between two contacts of isolation is s；
Then it can be obtained：
Extension areas of the C8 on C6, C7 is ranging from：Extension area on C5
Ranging from：
Extension areas of the C6 on C5 is ranging from：Extension on C7
Area is ranging from：Extension area on C8 is ranging from：
Extension areas of the C4 on C3, C2 is ranging from：C4 prolonging on C1
Stretch area ranging from：
The application also provides a kind of single interface band using above-mentioned single interface stripe cell, wherein list interface item
Band is made of at least two single interface stripe cells.
The application also provides a kind of module using above-mentioned single interface stripe cell, wherein the module includes single interface
Stripe cell and chip；
Wherein, in single interface stripe cell, the face opposite with the copper-clad surface is welding surface, and the chip setting exists
On the welding surface；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole, and described hole makes the contact
It is conducted with corresponding contact surface pad；
Be provided with chip LA pads, chip LB pads on the chip, and with the contact of the contact C1, C2, C3, C5 and C7
Face pad corresponds to the chip contact surface pad of electrical connection；
If the contact surface pad of first contact and the second contact is respectively LA contact surfaces pad and LB contact surface pads；
The LA contact surfaces pad and LB contact surfaces pad are electric with the chip LA pads and the chip LB pads respectively
Connection；
On the welding surface of list interface stripe cell, day is respectively set on the position of first datum hole and the second datum hole
Line LA solder pads and antenna LB solder pads；First datum hole and the second datum hole make the first contact and the second contact and antenna
LA solder pads and antenna LB solder pads conduct.
The application also provides a kind of smart card using above-mentioned module, including card base, module and aerial coil, the antenna
Coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electric with the both ends in the aerial coil circuit respectively
Connection.
Preferably, wherein antenna LA pads and antenna LB pads, the antenna LA pads and antenna are set on the card base
LB pads are separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads respectively with the antenna LA pads and the antenna
LB pads are electrically connected.
Preferably, wherein the antenna LA pads and antenna LB pads are separately positioned on the opposite of groove milling on the card base
Both ends, the antenna LA solder pads and the antenna LB solder pads are separately positioned on and the antenna LA pads and the day
The corresponding position of line LB pads.
Preferably, wherein the antenna LA solder pads and the antenna LB solder pads and the aerial coil circuit
Both ends take the method connection that antenna enameled wire directly welds.
Preferably, wherein the antenna LA pads and the LB pads and the antenna LA solder pads and the antenna
The connection type of LB solder pads is welding or conductive glue connection.
The application also provides a kind of single interface stripe cell, including base material, and the base material is covered with copper foil on one side, as copper
Foil face, the copper-clad surface are provided with center, and center is provided with totally 6 contacts C1, C2, C3, C5, C6, C7, wherein
The copper foil area of the contacts C5 surrounds the center；It is electrically isolated from each other by insulating tape between contact；
Third contact is set between the contacts C1 and the contacts C5, the 4th contact is set between C3 and C7；The third is touched
It is electrically isolated respectively by insulating tape between point, the 4th contact and other contacts；
The third contact, the 4th contact are both provided with hole in the corresponding substrate regions in the contact C1, C2, C3, C5, C6, C7
Hole；
The third contact and the 4th contact are respectively arranged with third datum hole and the 4th on the position of corresponding substrate regions
Datum hole.
Preferably, wherein set the side where C5-C7 to the width of single interface stripe cell, the side where C3, C7 is set
It is set to the height of single interface stripe cell, reference axis is established as origin using the center of single interface stripe cell, and if width parallel
Axis be x-axis, the axis parallel with height is y-axis, and the actual height that single interface stripe cell is arranged is l, and the minimum of contact retains
Height is that the width of p, C2 and C6 are c, and the width of C1, C3, C5, C7 are d, are highly m, if the insulation between two contacts of isolation
The height of band is s,
Then there is third contact ranging from：
Wherein,
4th contact is ranging from：Wherein,
Preferably, wherein replaced in third contact or the 4th contact with the C6 and/or C6 extension areas extended to adjacent contacts
Either one or two of.
Preferably, wherein the side where C5, C6, C7 is set to the width of single interface stripe cell, where C3, C7
While being set as the height of single interface stripe cell, reference axis is established as origin using the center of single interface stripe cell, and if width
Parallel axis is x-axis, and the axis parallel with height is y-axis, and it is l that single interface stripe cell actual height, which is arranged, and the minimum of module is protected
It is h to stay height, and the width of C1, C3, C5, C7 are all d, and the width of C2, C6 are all c, and the insulating tape between two contacts is isolated
Height is s；
The extension area that then C6 extends in the regions C5 is ranging from：
The extension area that then C6 extends in the regions C7 is ranging from：
The application also provides a kind of single interface band using above-mentioned single interface stripe cell, wherein list interface item
Band is made of at least two single interface stripe cells.
The application also provides a kind of module using above-mentioned single interface stripe cell, wherein the module includes single interface
Stripe cell and chip；
Wherein, face opposite with the copper-clad surface in single interface stripe cell is welding surface, and the chip is arranged described
On welding surface；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole；Described hole makes the contact
It is conducted with corresponding contact surface pad；
Be provided on the chip chip LA pads, chip LB pads and with the contact of the contact C1, C2, C3, C5 and C7
Face pad corresponds to the chip contact surface pad of electrical connection；
The third contact, the 4th contact corresponding hole location on welding surface be respectively arranged with LA contact surfaces pad and
LB contact surface pads；The third contact, the 4th contact pass through corresponding hole and the LA contact surfaces pad and LB contact surfaces
Pad conducts；
The LA contact surfaces pad and LB contact surfaces pad are electric with the chip LA pads and the chip LB pads respectively
Connection；
On the welding surface of list interface stripe cell, it is respectively arranged on the position of the third datum hole and the 4th datum hole
Antenna LA solder pads and antenna LB solder pads, the third datum hole and the 4th datum hole make third contact and the 4th contact and day
Line LA solder pads and antenna LB solder pads conduct.
The application also provides a kind of smart card using above-mentioned module, including card base, module and aerial coil, the antenna
Coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electric with the both ends in the aerial coil circuit respectively
Connection.
Preferably, wherein antenna LA pads and antenna LB pads, the antenna LA pads and antenna are set on the card base
LB pads are separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads respectively with the antenna LA pads and the antenna
LB pads are electrically connected.
Preferably, wherein the antenna LA pads and antenna LB pads are separately positioned on the opposite of groove milling on the card base
Both ends, the antenna LA solder pads and the antenna LB solder pads are separately positioned on and the antenna LA pads and the day
The corresponding position of line LB pads.
Preferably, wherein the antenna LA solder pads and the antenna LB solder pads and the aerial coil circuit
Both ends take the method connection that antenna enameled wire directly welds.
Preferably, wherein the antenna LA pads and the LB pads and the antenna LA solder pads and the antenna
The connection type of LB solder pads is welding or conductive glue connection.
The application also provides a kind of single interface stripe cell, including base material, and the base material is covered with copper foil on one side, as copper
Foil face, the copper-clad surface are provided with center, and center is provided with totally 6 contacts C1, C2, C3, C5, C6, C7；Contact it
Between be electrically isolated from each other by insulating tape；
5th contact is set between the contacts C1 and the contacts C5, the 6th contact is set between C3 and C7；Wherein, in described
Heart district is extended copper foil area and surrounds；It is described to extend the extension copper foil for extending copper foil area, the 6th contact that copper foil area is the 5th contact
The combination for extending copper foil area in area or the 5th contact and the 6th contact；
It is isolated by insulating tape between 5th contact, the 6th contact；5th contact, the 6th contact and other contacts it
Between be electrically isolated respectively by insulating tape；
5th contact, the 6th contact are both provided with hole in the corresponding substrate regions in the contact C1, C2, C3, C5, C6, C7
Hole；
5th contact and the 6th contact are respectively arranged with third datum hole and the 4th on the position of corresponding substrate regions
Datum hole.
Preferably, wherein all or part of described hole is arranged in the extension copper foil area of corresponding contacts.
Preferably, wherein set the side where C5-C7 to the width of single interface stripe cell, the side where C3, C7 is set
It is set to the height of single interface stripe cell, reference axis is established as origin using the center of single interface stripe cell, and if width parallel
Axis be x-axis, the axis parallel with height is y-axis, and the actual height that single interface stripe cell is arranged is l, and the minimum of contact retains
Height is that the width of p, C2 and C6 are c, and the width of C1, C3, C5, C7 are d, are highly m, if the insulation between two contacts of isolation
The height of band is s,
Then there is the copper foil area that the 5th contact is arranged between C1 and C5 ranging from：
Wherein,
The copper foil area that 6th contact is arranged between C3 and C7 is ranging from：
Wherein,
Preferably, wherein replaced in the 5th contact or the 6th contact with the C6 and/or C6 extension areas extended to adjacent contacts
Either one or two of.
Preferably, wherein the side where C5, C6, C7 is set to the width of single interface stripe cell, where C3, C7
While being set as the height of single interface stripe cell, reference axis is established as origin using the center of single interface stripe cell, and if width
Parallel axis is x-axis, and the axis parallel with height is y-axis, and it is l that single interface stripe cell actual height, which is arranged, and the minimum of module is protected
It is h to stay height, and the width of C1, C3, C5, C7 are all d, and the width of C2, C6 are all c, and the insulating tape between two contacts is isolated
Height is s；
The extension area that then C6 extends in the regions C5 is ranging from：
The extension area that then C6 extends in the regions C7 is ranging from：
The application also provides a kind of single interface band using above-mentioned single interface stripe cell, wherein list interface item
Band is made of at least two single interface stripe cells.
The application also provides a kind of module using above-mentioned single interface stripe cell, wherein the module includes single interface
Stripe cell and chip；
Wherein, face opposite with the copper-clad surface in single interface stripe cell is welding surface, and the chip is arranged described
On welding surface；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole；Described hole makes the contact
It is conducted with corresponding contact surface pad；
Be provided on the chip chip LA pads, chip LB pads and with the contact of the contact C1, C2, C3, C5 and C7
Face pad corresponds to the chip contact surface pad of electrical connection；
The third contact, the 4th contact corresponding hole location on welding surface be respectively arranged with LA contact surfaces pad and
LB contact surface pads；The third contact, the 4th contact pass through corresponding hole and the LA contact surfaces pad and LB contact surfaces
Pad conducts；
The LA contact surfaces pad and LB contact surfaces pad are electric with the chip LA pads and the chip LB pads respectively
Connection；
On the welding surface of list interface stripe cell, it is respectively arranged on the position of the third datum hole and the 4th datum hole
Antenna LA solder pads and antenna LB solder pads, the third datum hole and the 4th datum hole make third contact and the 4th contact and day
Line LA solder pads and antenna LB solder pads conduct.
The application also provides a kind of smart card using above-mentioned module, including card base, module and aerial coil, the antenna
Coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electric with the both ends in the aerial coil circuit respectively
Connection.
Preferably, wherein antenna LA pads and antenna LB pads, the antenna LA pads and antenna are set on the card base
LB pads are separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads respectively with the antenna LA pads and the antenna
LB pads are electrically connected.
Preferably, wherein the antenna LA pads and antenna LB pads are separately positioned on the opposite of groove milling on the card base
Both ends, the antenna LA solder pads and the antenna LB solder pads are separately positioned on and the antenna LA pads and the day
The corresponding position of line LB pads.
Preferably, wherein the antenna LA solder pads and the antenna LB solder pads and the aerial coil circuit
Both ends take the method connection that antenna enameled wire directly welds.
Preferably, wherein the antenna LA pads and the LB pads and the antenna LA solder pads and the antenna
The connection type of LB solder pads is welding or conductive glue connection.
The present invention is connect by base material punching come the non-of bridge module welding surface on the expansion area in the area C4, C8, C6 of module
Touch interface gold thread and Ka Ji antennas, to omit welding surface copper foil manufacture, the design be not limited to existing C4 in module,
The regions C8 or C6 so that its is non-connect antenna bond pad position be consistent with existing design, survey in envelope, have on manufacturing card it is good
Compatibility improves marketing degree.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments described in application can also be obtained according to these attached drawings other attached for those skilled in the art
Figure.
Fig. 1 is the overall structure diagram for the double-interface smart card for using single interface band in the prior art.
Fig. 2 is the location drawing of antenna LA pads and antenna LB pads in groove milling in the present embodiment 1.
Fig. 3 is the structure chart of 8pin modules in embodiment 1.
Fig. 4 is the structure chart of 6pin modules in embodiment 2.
Fig. 5 is the structure chart of 6pin modules in embodiment 3.
Reference numeral：
1 card base, 2 module, 3 aerial coil, 4 chip
5 contact surface pad, 6 antenna LA solder pads, 7 antenna LB solder pads
8 chip LA pads, 9 chip LB pads, 10 chip contact surface pad
The 4th contact of 11 third contact 12
21 groove milling, 22 antenna LA pads, 23 antenna LB pads, 24 insulating tape
25 extend the 6th contact of 26 the 5th contact 28 of encapsulating compound range 27 of copper foil area.
Specific implementation mode
With reference to the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Ground describes, it is clear that described embodiment is some embodiments of the present application, instead of all the embodiments.Based on the application
In embodiment, the every other embodiment that those skilled in the art are obtained without making creative work, all
Belong to the range of the application protection.
Single interface band in the application refers to the band for being covered with copper foil on one side in base material, is arranged in the another side of base material
Chip, single interface band are so that copper foil and chip is conducted by the way that antenna bond pad hole is arranged on base material.
Module for smart card is divided into two kinds of 8pin modules and 6pin modules, and internal structure is respectively such as Fig. 3 and Fig. 4 institutes
Show.
Embodiment one
A kind of smart card of 8 contact modules is provided in the present embodiment, as shown in Figure 1, the application smart card include card base 1,
Module 2 and aerial coil 3, the aerial coil 3 are arranged in the inside of the card base 1, and 1 surface of card base is provided with groove milling
21, the module 2 is embedded in groove milling 21；
The application module 2 includes single interface stripe cell and chip；List interface stripe cell is by single interface band
Cutting is formed, that is to say, that list interface band is made of several single interface stripe cells.
List interface stripe cell includes base material, and the base material is covered with copper foil on one side, is arranged in the face where copper foil
There are totally 8 contacts C1-C8, is electrically isolated from each other by insulating tape between contact；In the present embodiment, the base material is expoxy glass base
Material.
The module of the smart card includes that single interface stripe cell and chip 4, the chip 4 are arranged in single interface band
The another side for covering copper face of base material；Double-interface smart card overall structure of the present invention is as shown in Figure 1 and Figure 2, including card base 1, card base 1
Internal aerial coil 3 and the module 2 being embedded in the groove milling 21 of card base 1；
Wherein, it as shown in figure 3, its positions and dimensions of totally 8 contacts C1-C8 meet ISO7816 standards, is touched with first
Point, the second contact are both provided with hole through base material in the corresponding substrate regions in the contact C1, C2, C3, C5 and C7；Corresponding
Hole position on be provided with the contact surface pad of each contact, face where the copper foil in module is arranged in the contact surface pad
Reverse side；By the way that hole is arranged, so that contact is in contact with it face pad and conduct；
In the prior art, C6 early stages are defined as program voltage contact point (Vpp), have been of little use now, in practice only
SWP interfaces are used in SIM card；And C4 and C8 is retained, and USB high-speed interfaces are used in practice or other special-shaped antennas connect
Mouthful, it is also of little use now.
Therefore, we extend C4 to the lateral area of C3, C2 and C1；By C8 to the lateral area of C7, C6 and C5
Extended, forms two extension areas；
Wherein, the side where C5-C8 in module is set to the width of module, the side where C1, C5 is set as module
Highly, to enable the module to be read, the height of the module has to be larger than certain Bock Altitude, that is, C8 to C5, C6,
The extension area range of C7 need to be set as where C5-C8 in module while to apart from this while be less than the region of certain altitude.
Wherein, reference axis is established as origin using the center of module, if the axis with smart card module width parallel is x-axis, with
The parallel axis of smart card module height is y-axis, and setup module actual height is l (including both sides insulating tape), and the minimum of module is protected
Stay height for h, the width of insulating tape is s between contact, and the width of C2, C3, C6, C7 are all a (not including both sides insulating tape),
The width of C1, C4, C5, C8 are all b (not including both sides insulating tape)；
Then it can be obtained：
Extension areas of the C8 on C6, C7 is ranging from：Extension area on C5
Ranging from：
Extension areas of the C6 on C5 is ranging from：Extension on C7
Area is ranging from：Extension area on C8 is ranging from：
Extension areas of the C4 on C3, C2 is ranging from：C4 prolonging on C1
Stretch area ranging from：
In the present embodiment, the height of module is 12.6mm, according to the content that ISO/IEC 7816-2 are defined, can be obtained in order to
The module can be allowed to be read by card reader, minimum Bock Altitude is 9.62mm, wherein the insulating tape 24 for being electrically isolated two contacts is wide
Degree is 0.15mm；
C8, which then can be obtained, to be (12.6-9.62)/2-0.15=to the maximum height of C5, C6, C7 extension area being arranged
1.34mm；
Similarly, the maximum height that extension area can be arranged in C4 on the contact C1, C2, C3 is：(12.6-9.62)/2-0.15
=1.34mm；
It can be arranged in above-mentioned C4 and C8 on the expoxy glass base material of the module of extension area and an antenna bond pad hole is respectively set,
In the present embodiment, the antenna bond pad void shape is endless track shape or ellipse, size 2.2*1mm；If in module
The one side for covering copper foil is the copper-clad surface of module, and the one side for covering copper foil in module is welding surface, then on the welding surface of module
Antenna LA solder pads 6 and antenna LB solder pads 7 are set at antenna bond pad hole；
It is provided with chip LA pads 8, chip LB pads 9 on the chip 4 and is connect with the contact C1, C2, C3, C5, C7
Totally 5 chip contact surface pads 10 that contacting surface pad 5 connects；
Aerial coil 3 is provided with antenna LA pads 22 and antenna LB pads 23, the antenna LA welderings on 21 both sides of groove milling
Disk 22 and antenna LB pads 23 are separately connected the both ends in the circuit of aerial coil 3.
Antenna LA solder pads 6 and the antenna LB solder pads 7 in the module 2 respectively on aerial coil 3
The antenna LA pads 8 and the antenna LB pads 9 electrical connection.
The contact surface pad of contact where the antenna LA solder pads 6 and antenna LB solder pads 7 respectively with
The chip LA pads 8 and the chip LB pads 9 electrical connection；
The antenna LA pads 8 and antenna LB pads 9 are separately positioned on the both ends of groove milling 21, antenna LA, LB welding
Pad is corresponding with antenna LA, LB pad in position.
Wherein, the pad opened up on module 2 and chip 4 meets ISO7816 standards.
C8 is done and similarly designs change with C4, in the case where the height of module is more than minimum Bock Altitude, to C7,
C6, C5 contact region are extended, and extension area is formed, and the punching on extension area is arranged in the position of the welding surface punching of module
Antenna LB solder pads form another way bridge joint.
By above-mentioned setting, by antenna LA solder pads 6, antenna LB solder pads 7 and contact surface pad 5 on circuit by
Copper foil forms nature conducting, and bridging chip 4 and aerial coil 3.
During module encapsulates, in addition to by the contact surface pad of C1, C2, C3, C5, C7 and corresponding chip contact surface
Between pad by gold thread pressure welding other than, chip LA pads 8 are also electrically connected to the contact surface of C8 with gold thread (or other forms)
Pad.The LB pads 9 of chip are equally electrically connected to C4 contact surface pads.
In encapsulating process, module 2 welding surface with encapsulating compound cover chip, by each gold thread and C1, C2, C3, C5,
C6, C7 and C4, C8 contact surface pad sealings cover and cure, and include antenna LA solder pads 6 by remaining position, antenna LB welderings
Connect the exposure of pad 7.Module is so far encapsulated and is finished, then process after tested.
Finally by the antenna LA solder pads 6 of module 2, antenna LB solder pads 7 are welded with the antenna LA of aerial coil 3 respectively
Disk 22 and antenna LB pads 23 are electrically connected using welding or other methods, then are embedded in module 2 is smooth in groove milling 21 and are glued
Card primary surface is fixed in conjunction, and antenna interconnecting piece part is then hidden.
As an optional embodiment, the contacts C6 arbitrarily can be used all the way in C4, C8 two-way bridge joint of above-described embodiment
It replaces, at this time one of chip LA pads or LB pads are electrically connected to the contact surface pad of C6 by the methods of spun gold pressure welding.
Using the contacts C6 as when substituting, in the case where the height of module is more than minimum Bock Altitude, can be touched in C6
Point or C6 punchings on the extension area of adjacent contacts form bridge joint.
The connection of antenna LA, LB solder pad on antenna LA, LB pad and module can be taken other than welding
Other methods, such as conductive glue connection, or the method (omitting antenna LA, LB pad) of taking antenna enameled wire directly to weld.
If also needing to take into account other professional standards that card must comply in design size, size, which separately calculates, takes its simultaneous
Hold.
Embodiment two：
It includes single interface band that double-interface smart card in the present embodiment, which uses 6pin modules, herein described 6pin modules,
Unit and chip；The list interface stripe cell is to be cut to be formed by single interface band, that is to say, that list interface band is
By several single interfaces, stripe cell is constituted.
Be provided centrally with center in single interface stripe cell that 6pin modules use, around center be provided with C1,
Totally 6 contacts C2, C3, C5, C6, C7, wherein the copper foil area of the contacts C5 surrounds the center；Pass through insulating tape between contact
It is electrically isolated from each other；
One independent hard contact 11 (i.e. third contact) is set between C1 and C5；
One independent hard contact 12 (i.e. the 4th contact) is set between C3 and C7, and third contact and the 4th contact exist
It is indicated by dash area in Fig. 4；11 and the 4th contact 12 of the third contact is electrically isolated with other contacts by insulating tape.
Contact surface pad 5 is also respectively set on 11 and the 4th contact 12 of the third contact and other 6 contacts；
Datum hole is respectively set on the base material of third contact 11 and the 4th contact 12, antenna LA is respectively set on two datum holes
Solder pad 6 and antenna LB solder pads 7；
Similarly with embodiment one, the contact surface pad 5 of C1, C2, C3, C5, C7 chip corresponding on the chip 4 respectively
Contact surface pad 10 is electrically connected；The contact surface of contact where the antenna LA solder pads 6 and the antenna LB solder pads 7
Pad 5 is electrically connected with the chip LA pads 8 and the chip LB pads 9 respectively；
The antenna LA solder pads 6 and the antenna LB solder pads 7 respectively with antenna LA pads 22 and described
Antenna LB pads 23 are electrically connected.
Wherein, the side where C5-C7 is set to the width of single interface stripe cell, the side where C3, C7 is set as single
The height of interface stripe cell establishes reference axis using the center of single interface stripe cell as origin, if the axis with width parallel is x
Axis, the axis parallel with height are y-axis, and the actual height that single interface stripe cell is arranged is l (including both sides insulating tape), contact
Minimum Bock Altitude is that the width of p, C2 and C6 are c (not including both sides insulating tape), and the width of C1, C3, C5, C7 are that d (does not include
Both sides insulating tape), be highly m (do not include both sides insulating tape), if the height of the insulating tape between two contacts of isolation is s,
Then there is third contact ranging from：
Wherein,
4th contact is ranging from：
Wherein,
According to the minimum allowable height 2.0mm of each contacts defined ISO/IEC 7816-2, minimum Bock Altitude is
9.62mm, the maximum height that can calculate third contact 11 and the 4th contact 12 is 9.62-2*2-2*0.15=5.32mm,
The third contact 11 being arranged between C1 and C5 is by the uniform deciles of C1 and C5；The 4th contact 12 being arranged between C3 and C7 by C3 and
The uniform deciles of C7, the width of third contact 11 are the width of C1, and the width of the 4th contact 12 is the width of C3.
The size of antenna LA, LB solder pad is set to the ellipse that length and width are 1.5*0.8mm or runway annular.
The method of the gold thread welding of other contacts, the encapsulating method of module, the setting of antenna LA, LB pad, mould on card base
The embodiment one of connection method of block and card antenna etc. and 8 contact double-interface smart cards is identical.
In the above-mentioned methods, as another optional embodiment, if arbitrary all the way with C6's in its two-way bridge region
It bridges to replace, it is also feasible.The reverse side in C6 copper foils area is arranged in its corresponding antenna LA or LB solder pads at this time.
And in such cases if it is necessary, C6 and its solder pad also can suitably extend borrow C5, the area of C7, and implementation
Example one is similar, sets the side where C5, C6, C7 on double-interface smart card to the width of module, and the side where C3, C7 is set as
The height of module establishes reference axis using the center of module as origin, if the axis with width parallel is x-axis, the axis parallel with height
For y-axis, setup module actual height is l, and the minimum Bock Altitude of module is h (minimum Bock Altitude is with reference to figure 3), C1, C3,
The width of C5, C7 are all d (not including both sides insulating tape), and the width of C2, C6 are all c (not including both sides insulating tape)；
The extension area that then C6 extends in the regions C5 is ranging from：
The extension area that then C6 extends in the regions C7 is ranging from：
If also needing to take into account other professional standards in bridge region design size, size separately calculates.
Embodiment three：
Double-interface smart card in the present embodiment uses 6pin modules, as shown in figure 5, having C1, C2, C3, C5, C6, C7 total
The copper-clad surface of totally 6 contacts, 6pin modules is provided with center, and center is provided with C1, C2, C3, C5, C6, C7
Totally 6 contacts；It is electrically isolated from each other by insulating tape between contact；
5th contact 27 is set between the contacts C1 and the contacts C5, the 6th contact 28 is set between C3 and C7；Wherein, institute
It states center and is extended the encirclement of copper foil area 25；It is described extend extension copper foil area that copper foil area 25 can be the 5th contact, can also
It is the combination for extending copper foil area in the extension copper foil area or the 5th contact and the 6th contact of the 6th contact；
It is electrically isolated by insulating tape between 5th contact, the 6th contact；5th contact, the 6th contact and other contacts
Between be electrically isolated respectively by insulating tape.
The case where being shown in Fig. 5 around the copper foil area for extending 25 all 5th contacts 27 of copper foil area of center,
In this case, contact surface pad is respectively set on the 5th contact 27, the 6th contact 28 and other 6 contact regions；The
Datum hole is respectively set on 28 corresponding base material of five contacts 27 and the 6th contact, antenna LA, LB weldering is respectively set on two datum holes
Connect pad；
According to Fig. 5 it will be seen that the hole setting where the contact surface pad of the 5th contact is extending copper foil area
On, a part for the whole of described hole or hole can also be arranged in the extension copper foil area of corresponding contacts, in this implementation
In example, in order to encapsulate conveniently, the contact surface pad is all disposed in encapsulating compound range 26, antenna LA, LB solder pad
It is arranged other than encapsulating compound range 26.
Similarly embodiment two, chip corresponding on the chip 4 connects the contact surface pad 5 of C1, C2, C3, C5, C7 respectively
Contacting surface pad is electrically connected；The contact surface pad of contact where antenna LA, LB solder pad respectively with described chip LA, LB
Pad is electrically connected；
Antenna LA, LB solder pad is electrically connected with antenna LA, LB pad respectively.
Wherein, the side where C5-C7 is set to the width of single interface stripe cell, the side where C3, C7 is set as single
The height of interface stripe cell establishes reference axis using the center of single interface stripe cell as origin, if the axis with width parallel is x
Axis, the axis parallel with height are y-axis, and the actual height that single interface stripe cell is arranged is l (including both sides insulating tape), contact
Minimum Bock Altitude is p (do not include both sides insulating tape), and the width of C2 and C6 is c (not including both sides insulating tape), C1, C3, C5,
The width of C7 is d (not including both sides insulating tape), is highly m (not including both sides insulating tape), if between two contacts of isolation
The height of insulating tape is s,
Then have the 5th contact between C1 and C5 ranging from：
Wherein,
6th contact between C3 and C7 ranging from：Its
In,
The method of the gold thread welding of other contacts, the encapsulating method of module, the setting of antenna LA, LB pad, mould on card base
Connection method of block and card antenna etc. and embodiment two are identical.
In the above-mentioned methods, as another optional embodiment, if arbitrary all the way with C6's in its two-way bridge region
It bridges to replace, it is also feasible.The reverse side in C6 copper foils area is arranged in its corresponding antenna LA or LB solder pads at this time.
And in such cases if it is necessary, C6 and its solder pad also can suitably extend to C5, the copper foil area of C7 specifically may be used
It is identical as embodiment two with the range of extension.
If also needing to take into account other professional standards in bridge region design size, size separately calculates.
Although the preferred embodiment of the application has been described, created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.
So the following claims are intended to be interpreted as including preferred embodiment and falls into being had altered for the application range
And modification.Obviously, those skilled in the art can carry out the application essence of the various modification and variations without departing from the application
God and range.In this way, if these modifications and variations of the application belong to the range of the application claim and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (32)
1. a kind of list interface stripe cell, including base material, the base material are covered with copper foil on one side, as copper-clad surface, in the copper
It is provided with totally 8 contacts C1-C8 on foil face, is electrically isolated from each other by insulating tape between contact；
Using any two contacts in C4, C6 and C8 as the first contact and the second contact；With the first contact, the second contact, C1,
It is both provided with hole in the corresponding substrate regions in the contact C2, C3, C5 and C7；
Region where first contact and the second contact is extended to adjacent contact respectively, formed the first extension area and
Second extension area；It is respectively arranged with the first datum hole and second in first extension area and the corresponding substrate regions of the second extension area
Datum hole.
2. list interface according to claim 1 stripe cell, wherein set the side where the contacts C5-C8 to the list
The width of interface stripe cell, the side where C1, C5 are set as the height of single interface stripe cell, with single interface item
The center of tape cell is that origin establishes reference axis, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and institute is arranged
The actual height for stating single interface stripe cell is l, and the minimum Bock Altitude of single interface stripe cell is h, the width of C2, C3, C6, C7
Degree is all a, and the width of C1, C4, C5, C8 are all b, if the height of the insulating tape between two contacts of isolation is s；
Then it can be obtained：
Extension areas of the C8 on C6, C7 is ranging from：Extension area range on C5
For：
Extension areas of the C6 on C5 is ranging from：Extension area model on C7
Enclose for：Extension area on C8 is ranging from：
Extension areas of the C4 on C3, C2 is ranging from：Extension areas of the C4 on C1
Ranging from：
3. a kind of single interface band using single interface stripe cell as claimed in claim 1 or 2, wherein the list interface
Band is made of at least two single interface stripe cells.
4. a kind of module using single interface stripe cell as claimed in claim 1 or 2, wherein the module includes single boundary
Noodles tape cell and chip；
Wherein, in single interface stripe cell, the face opposite with the copper-clad surface is welding surface, and the chip is arranged described
On welding surface；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole, and described hole makes the contact and phase
The contact surface pad answered conducts；
It is provided with chip LA pads, chip LB pads on the chip, and is welded with the contact surface of the contact C1, C2, C3, C5 and C7
Disk corresponds to the chip contact surface pad of electrical connection；
If the contact surface pad of first contact and the second contact is respectively LA contact surfaces pad and LB contact surface pads；
The LA contact surfaces pad and LB contact surfaces pad are electrically connected with the chip LA pads and the chip LB pads respectively；
On the welding surface of list interface stripe cell, antenna LA is respectively set on the position of first datum hole and the second datum hole
Solder pad and antenna LB solder pads；First datum hole and the second datum hole make the first contact and the second contact be welded with antenna LA
It connects pad and antenna LB solder pads conducts.
5. a kind of smart card using module as claimed in claim 4, including card base, module and aerial coil, the antenna
Coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electrically connected with the both ends in the aerial coil circuit respectively.
6. smart card according to claim 5, wherein antenna LA pads and antenna LB pads, institute are arranged on the card base
It states antenna LA pads and antenna LB pads is separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads are welded with the antenna LA pads and the antenna LB respectively
Disk is electrically connected.
7. smart card according to claim 6, wherein the antenna LA pads and antenna LB pads are separately positioned on described
The opposite end of groove milling on card base, the antenna LA solder pads and the antenna LB solder pads are separately positioned on and the day
Line LA pads and the corresponding position of the antenna LB pads.
8. smart card according to claim 5, wherein the antenna LA solder pads and the antenna LB solder pads with
Take the method connection that antenna enameled wire directly welds in the both ends in the aerial coil circuit.
9. smart card according to claim 6, wherein the antenna LA pads and the LB pads are welded with the antenna LA
The connection type for connecing pad and the antenna LB solder pads is welding or conductive glue connection.
10. a kind of list interface stripe cell, including base material, the base material are covered with copper foil on one side, as copper-clad surface, the copper foil
Face is provided with center, center is provided with totally 6 contacts C1, C2, C3, C5, C6, C7, wherein the copper foil area of the contacts C5
Surround the center；It is electrically isolated from each other by insulating tape between contact；
Third contact is set between the contacts C1 and the contacts C5, the 4th contact is set between C3 and C7；The third contact,
It is electrically isolated respectively by insulating tape between four contacts and other contacts；
The third contact, the 4th contact are both provided with hole in the corresponding substrate regions in the contact C1, C2, C3, C5, C7；
The third contact and the 4th contact are respectively arranged with third datum hole and the 4th datum hole on the position of corresponding substrate regions.
11. list interface according to claim 10 stripe cell, wherein set the side where C5-C7 to single interface item
The width of tape cell, the side where C3, C7 are set as the height of single interface stripe cell, and the center with single interface stripe cell is
Origin establishes reference axis, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and single interface stripe cell is arranged
Actual height is l, and the minimum Bock Altitude of contact is that the width of p, C2 and C6 are c, and the width of C1, C3, C5, C7 are d, are highly
M, if the height of the insulating tape between two contacts of isolation is s,
Then there is third contact ranging from：
Wherein,
4th contact is ranging from：Wherein,
12. list interface according to claim 10 stripe cell, wherein prolonged to what adjacent contacts extended with C6 and/or C6
It stretches area and replaces any of third contact or the 4th contact.
13. list interface according to claim 12 stripe cell, wherein set the side where C5, C6, C7 to single interface
The width of stripe cell, the side where C3, C7 are set as the height of single interface stripe cell, with the center of single interface stripe cell
Reference axis is established for origin, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and single interface stripe cell is arranged
Actual height is l, and the minimum Bock Altitude of module is h, and the width of C1, C3, C5, C7 are all d, and the width of C2, C6 are all c, every
The height of insulating tape between from two contacts is s；
The extension area that then C6 extends in the regions C5 is ranging from：
The extension area that then C6 extends in the regions C7 is ranging from：
14. a kind of single interface band using such as claim 10-13 any one of them lists interface stripe cell, wherein institute
Single interface band is stated to be made of at least two single interface stripe cells.
15. a kind of module using such as claim 10-13 any one of them lists interface stripe cell, wherein the module
Including single interface stripe cell and chip；
Wherein, face opposite with the copper-clad surface in single interface stripe cell is welding surface, and the chip is arranged in the welding
On face；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole；Described hole makes the contact and phase
The contact surface pad answered conducts；
It is provided with chip LA pads, chip LB pads on the chip and is welded with the contact surface of the contact C1, C2, C3, C5 and C7
Disk corresponds to the chip contact surface pad of electrical connection；
The third contact, corresponding hole location is respectively arranged with LA contact surfaces pad on welding surface and LB connects for the 4th contact
Contacting surface pad；The third contact, the 4th contact pass through corresponding hole and the LA contact surfaces pad and LB contact surface pads
It conducts；
The LA contact surfaces pad and LB contact surfaces pad are electrically connected with the chip LA pads and the chip LB pads respectively；
On the welding surface of list interface stripe cell, antenna is respectively arranged on the position of the third datum hole and the 4th datum hole
LA solder pads and antenna LB solder pads, the third datum hole and the 4th datum hole make third contact and the 4th contact and antenna LA
Solder pad and antenna LB solder pads conduct.
16. a kind of smart card using module as claimed in claim 15, including card base, module and aerial coil, the day
Line coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electrically connected with the both ends in the aerial coil circuit respectively.
17. smart card according to claim 16, wherein antenna LA pads and antenna LB pads are set on the card base,
The antenna LA pads and antenna LB pads are separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads are welded with the antenna LA pads and the antenna LB respectively
Disk is electrically connected.
18. smart card according to claim 17, wherein the antenna LA pads and antenna LB pads are separately positioned on institute
State the opposite end of groove milling on card base, the antenna LA solder pads and the antenna LB solder pads be separately positioned on it is described
Antenna LA pads and the corresponding position of the antenna LB pads.
19. smart card according to claim 16, wherein the antenna LA solder pads and the antenna LB solder pads
The method for taking antenna enameled wire directly to weld with the both ends in the aerial coil circuit is connect.
20. smart card according to claim 17, wherein the antenna LA pads and the LB pads and the antenna LA
The connection type of solder pad and the antenna LB solder pads is welding or conductive glue connection.
21. a kind of list interface stripe cell, including base material, the base material are covered with copper foil on one side, as copper-clad surface, the copper foil
Face is provided with center, and center is provided with totally 6 contacts C1, C2, C3, C5, C6, C7；Pass through insulating tape between contact
It is electrically isolated from each other；
5th contact is set between the contacts C1 and the contacts C5, the 6th contact is set between C3 and C7；Wherein, the center
Copper foil area is extended to surround；It is described extend copper foil area be the 5th contact extend copper foil area, the 6th contact extension copper foil area or
The combination for extending copper foil area of 5th contact and the 6th contact；
It is isolated by insulating tape between 5th contact, the 6th contact；Divide between 5th contact, the 6th contact and other contacts
It is not electrically isolated by insulating tape；
5th contact, the 6th contact are both provided with hole in the corresponding substrate regions in the contact C1, C2, C3, C5, C6, C7；
5th contact and the 6th contact are respectively arranged with third datum hole and the 4th datum hole on the position of corresponding substrate regions.
22. list interface according to claim 21 stripe cell, wherein all or part of of described hole is arranged corresponding
In the extension copper foil area of contact.
23. list interface according to claim 21 stripe cell, wherein set the side where C5-C7 to single interface item
The width of tape cell, the side where C3, C7 are set as the height of single interface stripe cell, and the center with single interface stripe cell is
Origin establishes reference axis, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and single interface stripe cell is arranged
Actual height is l, and the minimum Bock Altitude of contact is that the width of p, C2 and C6 are c, and the width of C1, C3, C5, C7 are d, are highly
M, if the height of the insulating tape between two contacts of isolation is s,
Then there is the copper foil area that the 5th contact is arranged between C1 and C5 ranging from：
Wherein,
The copper foil area that 6th contact is arranged between C3 and C7 is ranging from：
Wherein,
24. list interface according to claim 21 stripe cell, wherein prolonged to what adjacent contacts extended with C6 and/or C6
Area is stretched instead of any of the 5th contact or the 6th contact.
25. list interface according to claim 24 stripe cell, wherein set the side where C5, C6, C7 to single interface
The width of stripe cell, the side where C3, C7 are set as the height of single interface stripe cell, with the center of single interface stripe cell
Reference axis is established for origin, if the axis with width parallel is x-axis, the axis parallel with height is y-axis, and single interface stripe cell is arranged
Actual height is l, and the minimum Bock Altitude of module is h, and the width of C1, C3, C5, C7 are all d, and the width of C2, C6 are all c, every
The height of insulating tape between from two contacts is s；
The extension area that then C6 extends in the regions C5 is ranging from：
The extension area that then C6 extends in the regions C7 is ranging from：
26. a kind of single interface band using such as claim 22-25 any one of them lists interface stripe cell, wherein institute
Single interface band is stated to be made of at least two single interface stripe cells.
27. a kind of module using such as claim 22-25 any one of them lists interface stripe cell, wherein the module
Including single interface stripe cell and chip；
Wherein, face opposite with the copper-clad surface in single interface stripe cell is welding surface, and the chip is arranged in the welding
On face；
On the welding surface, in contact, contact surface pad is arranged in the position of corresponding hole；Described hole makes the contact and phase
The contact surface pad answered conducts；
It is provided with chip LA pads, chip LB pads on the chip and is welded with the contact surface of the contact C1, C2, C3, C5 and C7
Disk corresponds to the chip contact surface pad of electrical connection；
The third contact, corresponding hole location is respectively arranged with LA contact surfaces pad on welding surface and LB connects for the 4th contact
Contacting surface pad；The third contact, the 4th contact pass through corresponding hole and the LA contact surfaces pad and LB contact surface pads
It conducts；
The LA contact surfaces pad and LB contact surfaces pad are electrically connected with the chip LA pads and the chip LB pads respectively；
On the welding surface of list interface stripe cell, antenna is respectively arranged on the position of the third datum hole and the 4th datum hole
LA solder pads and antenna LB solder pads, the third datum hole and the 4th datum hole make third contact and the 4th contact and antenna LA
Solder pad and antenna LB solder pads conduct.
28. a kind of smart card using module as claimed in claim 27, including card base, module and aerial coil, the day
Line coil is arranged inside the card base, and the card primary surface is provided with groove milling, and the module is embedded in groove milling；
The antenna LA solder pads and the antenna LB solder pads are electrically connected with the both ends in the aerial coil circuit respectively.
29. smart card according to claim 28, wherein antenna LA pads and antenna LB pads are set on the card base,
The antenna LA pads and antenna LB pads are separately connected the both ends in the aerial coil circuit；
The antenna LA solder pads and the antenna LB solder pads are welded with the antenna LA pads and the antenna LB respectively
Disk is electrically connected.
30. smart card according to claim 29, wherein the antenna LA pads and antenna LB pads are separately positioned on institute
State the opposite end of groove milling on card base, the antenna LA solder pads and the antenna LB solder pads be separately positioned on it is described
Antenna LA pads and the corresponding position of the antenna LB pads.
31. smart card according to claim 28, wherein the antenna LA solder pads and the antenna LB solder pads
The method for taking antenna enameled wire directly to weld with the both ends in the aerial coil circuit is connect.
32. smart card according to claim 29, wherein the antenna LA pads and the LB pads and the antenna LA
The connection type of solder pad and the antenna LB solder pads is welding or conductive glue connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436A (en) | 2018-08-17 | 2018-08-17 | A kind of list interface stripe cell, single interface band, module and smart card |
| PCT/CN2019/099598 WO2020034885A1 (en) | 2018-08-17 | 2019-08-07 | Single interface stripe unit, single interface stripe, module and smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436A (en) | 2018-08-17 | 2018-08-17 | A kind of list interface stripe cell, single interface band, module and smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108764436A true CN108764436A (en) | 2018-11-06 |
Family
ID=63966328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810942969.9A Pending CN108764436A (en) | 2018-08-17 | 2018-08-17 | A kind of list interface stripe cell, single interface band, module and smart card |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108764436A (en) |
| WO (1) | WO2020034885A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034885A1 (en) * | 2018-08-17 | 2020-02-20 | 恒宝股份有限公司 | Single interface stripe unit, single interface stripe, module and smart card |
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| CN108764436A (en) * | 2018-08-17 | 2018-11-06 | 恒宝股份有限公司 | A kind of list interface stripe cell, single interface band, module and smart card |
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| CN205845082U (en) * | 2016-06-17 | 2016-12-28 | 北京同方微电子有限公司 | A kind of Novel double-interface smart card band |
| CN206639242U (en) * | 2017-04-14 | 2017-11-14 | 恒宝股份有限公司 | A kind of double-interface smart card using single interface band |
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| WO2020034885A1 (en) * | 2018-08-17 | 2020-02-20 | 恒宝股份有限公司 | Single interface stripe unit, single interface stripe, module and smart card |
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| WO2020034885A1 (en) | 2020-02-20 |
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