CN108748749A - A kind of crystal silicon hilted broadsword shear - Google Patents
A kind of crystal silicon hilted broadsword shear Download PDFInfo
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- CN108748749A CN108748749A CN201810551047.5A CN201810551047A CN108748749A CN 108748749 A CN108748749 A CN 108748749A CN 201810551047 A CN201810551047 A CN 201810551047A CN 108748749 A CN108748749 A CN 108748749A
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- crystal silicon
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- slide unit
- take
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 78
- 239000010703 silicon Substances 0.000 title claims abstract description 78
- 239000013078 crystal Substances 0.000 title claims abstract description 75
- 238000005520 cutting process Methods 0.000 claims abstract description 95
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 210000000078 claw Anatomy 0.000 claims abstract description 15
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 241000606750 Actinobacillus Species 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 9
- 239000003550 marker Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 210000000056 organ Anatomy 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of crystal silicon hilted broadsword shears, belong to crystal silicon technical field of processing equipment, including pedestal and the conveying mechanism above pedestal and cutting mechanism, the conveying mechanism is divided axially into two-stage along crystal silicon, it is respectively to feed conveying assembly and blanking conveying assembly, movable support mechanism is equipped between charging conveying assembly and blanking conveying assembly, the cutting mechanism is located above movable support mechanism, it is provided with clip claw assembly at the blanking conveying assembly, the present invention is combined conveying mechanism with movable support mechanism, with the crystal silicon of the different Cutting Lengths of fixation, flexibility ratio is high, simultaneously, realize take-up, unwrapping wire is integrated with cutting function, it is compact-sized, both equipment manufacturing costs are reduced, Facility Layout demand is adapted to again, it is compact-sized, economy and durability, application prospect is wide.
Description
Technical field
The invention belongs to crystal silicon technical field of processing equipment, relate in particular to a kind of crystal silicon hilted broadsword shear.
Background technology
The manufacturing process for making silicon chip used in solar panel is divided into：Crystal pulling, block, evolution, mill fall, slice etc. it is several
Step.Currently, line cutting technology is more advanced crystal silicon cutting processing technology, its principle is the cutting by high-speed motion
Silk rubs to crystal silicon, to reach cutting purpose.
Multitool shear is most widely used, is reticulated cutting wire cloth by guide wheel, can be by primary from top to bottom
Property operation, complete to cut the multitool of crystal silicon.With the raising of crystal pulling technique, crystal pulling furnace melts out the silicon rod extended length come,
And the stick length for being applicable in the long range of stick and not reaching new of multitool shear in the market, meanwhile, a large amount of crystal silicon factories exist
It when founding the factory, does not account for silicon rod crystal pulling technique and has breakthrough, towards increasingly longer development, present silicon rod is caused to be transported in factory
It is difficult.In addition, for medium-sized and small enterprises, to ensure the sustained continuous of operation and production capacity, generally arrange that two equipment are continuously handed over
For operation, the phenomenon that there are excess capacities.
Invention content
For various deficiencies of the prior art, to solve the above-mentioned problems, it is proposed that a kind of crystal silicon hilted broadsword shear.
To achieve the above object, the present invention provides the following technical solutions：
A kind of crystal silicon hilted broadsword shear, including pedestal and the conveying mechanism above pedestal and cutting mechanism, it is described defeated
It send mechanism to be divided axially into two-stage along crystal silicon, is respectively to feed conveying assembly and blanking conveying assembly, be located at charging conveying
Movable support mechanism is equipped between component and blanking conveying assembly, the movable support mechanism includes the first cunning that opposite can be slided
Platform and the second slide unit are respectively provided with multiple locking support groups on first slide unit and the second slide unit；
The cutting mechanism is located above movable support mechanism, is connect with pedestal by support post, the cutting
Mechanism 4 includes braced frame, lifting assembly and cutting head, and the lifting assembly is connected with support post, and the cutting head is located at
In braced frame, the lifting assembly is connect by connecting plate with braced frame, to push braced frame to be slided along support post
It is dynamic, the braced frame be equipped with for crystal silicon by through-hole；
It is provided with clip claw assembly at the blanking conveying assembly, the clip claw assembly includes crossbeam and driving motor, described
Crossbeam and crystal silicon it is axially vertical, be equipped with the locating piece being connected to crossbeam, the driving close to the side of charging conveying assembly
Motor is located at the other side of crossbeam, and the end of the locating piece is equipped with vacuum cup, and one end of the crossbeam, which is equipped with, to be communicated therewith
Gas circuit interconnecting device.
Further, the locking support group includes two spaced locking cylinders, and the piston end surface of locking cylinder
It is obliquely installed to be bonded crystal silicon circumferential surface, the multiple locking support group is arranged along the axial direction of crystal silicon.
Further, first slide unit and/or the second slide unit are equipped with the roller group parallel with the locking support group,
The roller group includes two idler wheels, and the idler wheel is correspondingly arranged with locking cylinder, and two idler wheels pass through holder and the respectively
One slide unit or the second slide unit are rotatably connected.
Further, the cylinder body end of the locking cylinder is connected with the first slide unit or the second slide unit, and piston end periphery is arranged
There is resetting spring, and resetting spring is located on the outside of cylinder body end, the resetting spring periphery is arranged with organ shield.
Further, the lifting assembly includes lifting motor, speed reducer and the first ball-screw, first ball-screw
It is arranged in parallel with support post, the lifting motor, speed reducer and support post are connected, the connecting plate and the first ball-screw
Nut be connected.
Further, the cutting head includes unwrapping wire component, take-up component, the first cutting wheel and the second cutting wheel, described to put
Line component includes unwrapping wire driving motor and actinobacillus wheel, and the take-up component includes take-up driving motor and take-up pulley, and described first
Cutting wheel and the second cutting wheel are located at the both sides of through-hole, and the first cutting wheel, the second cutting wheel respectively can with braced frame
Rotation connection, cutting wire bypass actinobacillus wheel, the first cutting wheel, the second cutting wheel and take-up pulley to cut crystal silicon successively.
Further, the unwrapping wire driving motor and take-up driving motor are connect by mounting base with braced frame, described
Mounting base is equipped with wire-arranging component, for driving unwrapping wire driving motor and take-up driving motor along the axial movement of crystal silicon.
Further, the wire-arranging component includes winding displacement driving motor, the second ball-screw and fixed plate, second ball
Leading screw is connect with the output end of winding displacement driving motor, and nut is connected with fixed plate, and the fixed plate is located at unwrapping wire driving motor
Or the lower section of take-up driving motor, and fixed plate is connected with unwrapping wire driving motor or take-up driving motor.
Further, the braced frame is equipped with nozzle and line laser marker, and the nozzle is located above through-hole, described to swash
The laser of cursor line device outgoing is overlapped with the cutting wire between the first cutting wheel, the second cutting wheel.
Further, water fender is fixedly installed in the crossbeam both ends respectively, and the vacuum cup passes through mounting rod and locating piece
Connection.
The beneficial effects of the invention are as follows：
Conveying mechanism is combined with movable support mechanism, can be relatively moved by the first slide unit and the second slide unit, with fixation
The crystal silicon of different Cutting Lengths, flexibility ratio is high, meanwhile, lifting assembly and cutting head are integrated in braced frame, receipts are realized
Line, unwrapping wire are integrated with cutting function, compact-sized, not only reduce equipment manufacturing costs, but also adapt to Facility Layout demand, this
Outside, the crystal silicon or print that cut is needed to effectively prevent cutting error to improve cutting stability to be sucked using vacuum cup
Occur, compact-sized, economy and durability, application prospect is wide.
Description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is the combination schematic diagram of conveying mechanism and movable support mechanism；
Fig. 3 is the longitudinal profile schematic diagram of locking cylinder；
Fig. 4 is the front view of cutting mechanism；
Fig. 5 is the axonometric drawing of cutting mechanism；
Fig. 6 is the overall structure diagram of clip claw assembly.
In attached drawing：1- pedestals, 2- charging conveying assembly, 3- blankings conveying assembly, 4- cutting mechanisms, 401- braced frames,
402- lifting assemblies, 403- through-holes, 404- unwrapping wire component, 405- take-ups component, the first cutting wheels of 406-, 407- second are cut
Wheel, 408- take-ups driving motor, 409- mounting bases, 410- winding displacements driving motor, 411- fixed plates, 412- lifting motors, 413-
Speed reducer, the first ball-screws of 414-, 5- movable support mechanisms, the first slide units of 501-, the second slide units of 502-, 503- locking supports
Group, 504- locking cylinders, 505- idler wheels, 506- holders, 507- sliding rails, 508- resetting springs, 509- organs shield, 6- supports are vertical
Column, 7- connecting plates, 8- cutting wires, 9- nozzles, 10- line laser markers, 11- clip claw assemblies, 1101- crossbeams, 1102- driving electricity
Machine, 1103- locating pieces, 1104- vacuum cups, 1105- gas circuits interconnecting device, 1106- water fenders.
Specific implementation mode
It is right with reference to the attached drawing of the present invention in order to make those skilled in the art more fully understand technical scheme of the present invention
Technical scheme of the present invention carries out clear, complete description, and based on the embodiment in the application, those of ordinary skill in the art exist
The other similar embodiments obtained under the premise of not making creative work, shall fall within the protection scope of the present application.
In addition, the direction word mentioned in following embodiment, such as "upper" "lower" " left side " " right side " etc. are only the directions of refer to the attached drawing, because
This, the direction word used is for illustrative and not limiting the invention.
Embodiment one：
With reference to figure 1, a kind of crystal silicon hilted broadsword shear, including pedestal 1, conveying mechanism and cutting mechanism 4, the conveying mechanism
It is respectively positioned on 1 top of pedestal with cutting mechanism 4.The conveying mechanism is divided axially into two-stage along crystal silicon, respectively feeds defeated
Sending component 2 and blanking conveying assembly 3, crystal silicon is delivered at cutting mechanism 4 through charging conveying assembly 2 and is blocked, after blocking
Crystal silicon is exported through blanking conveying assembly 3.
For the ease of cutting the crystal silicon of different length, activity is equipped between charging conveying assembly 2 and blanking conveying assembly 3
Supporting mechanism 5.With reference to figure 2, the movable support mechanism 5 includes the first slide unit 501 and the second slide unit 502 that can be slided relatively,
The pedestal 1 is equipped with sliding rail 507, and first slide unit, 501 and/or second slide unit 502 is located on the sliding rail 507, with reality
Now opposite sliding.In the present embodiment, the second slide unit 502 can be slided along sliding rail 507.
Multiple locking support groups 503, and the multiple locking are respectively provided on first slide unit, 501 and second slide unit 502
Support group 503 is arranged along the axial direction of crystal silicon.The locking support group 503 includes two spaced locking cylinders 504, institute
The cylinder body end and the first slide unit 501 or the second slide unit 502 for stating locking cylinder 504 are connected, and piston end is used to support crystal silicon, in order to
The compactness of piston end and crystal silicon circumferential surface is improved, the piston end surface of locking cylinder 504 is obliquely installed, meanwhile, with reference to figure 3,
Piston end periphery is arranged with resetting spring 508, and resetting spring 508 is located on the outside of cylinder body end.When crystal silicon is located at movable supporting machine
When 5 top of structure, according to the length for being truncated crystal silicon, second slide unit 502 is moved to the centre position of the length, locking cylinder
504 air pressure disconnects, and resetting spring 508 pushes the piston end of locking cylinder 504 to generate upward displacement, until piston end with
Crystal silicon surface contacts, piston end stop motion, and the air pressure of locking cylinder 504 is connected, and the movable supporting of piston end is developed into solid
Fixed support, 508 periphery of the resetting spring is arranged with organ shield 509, to improve safety.
When the crystal silicon length that need to be intercepted is longer, it is equipped with and the lock on the first slide unit 501 and/or the second slide unit 502
The parallel roller group of compact schemes group 503, the roller group include two idler wheels 505, the idler wheel 505 and locking cylinder 504
It is correspondingly arranged, and two idler wheels 505 are rotatably connected by holder 506 and the first slide unit 501 or the second slide unit 502 respectively, rolls
Wheel 505 is used to support crystal silicon, prevents from toppling over.
Embodiment two：
With reference to figure 1, Fig. 4 and Fig. 5, the cutting mechanism 4 is located at 5 top of movable support mechanism, passes through support post 6
It is connect with pedestal 1.Cutting mechanism 4 includes braced frame 401, lifting assembly 402 and cutting head, wherein the lifting assembly 402
Be connected with support post 6, the cutting head is located in braced frame 401, meanwhile, the lifting assembly 402 by connecting plate 7 and
Braced frame 401 connects, and to push braced frame 401 to be slided along support post 6, the braced frame 401 is equipped with for crystalline substance
Silicon by through-hole 403.When crystal silicon is located at through-hole 403, lifting assembly 402 drives cutting head to move down and then blocks crystal silicon.
The lifting assembly 402 includes lifting motor 412, speed reducer 413 and the first ball-screw 414, the lifting electricity
The output end of machine 412 is connect with speed reducer 413, and the output end of the speed reducer 413 passes through shaft coupling and the first ball-screw 414
Connection, that is to say, that lifting motor 412 can drive the first ball-screw 414 to rotate.First ball-screw 414 and support
Column 6 is arranged in parallel, and the lifting motor 412, speed reducer 413 and support post 6 are connected, the connecting plate 7 and the first ball
The nut of leading screw 414 is connected, i.e. braced frame 401, cutting head can be driven to generate in 414 rotation process of the first ball-screw vertical
The displacement in direction.
The cutting head includes unwrapping wire component 404, take-up component 405, the first cutting wheel 406 and the second cutting wheel 407, institute
It includes unwrapping wire driving motor and actinobacillus wheel to state unwrapping wire component 404, and actinobacillus wheel is connect with the output end of unwrapping wire driving motor, described
Take-up component 405 includes take-up driving motor 408 and take-up pulley, and take-up pulley is connect with the output end of take-up driving motor 408.
Actinobacillus wheel and unwrapping wire driving motor are omitted in Fig. 5 in order to clearly show each section position relationship with reference to figure 5.Described first
Cutting wheel 406 and the second cutting wheel 407 are located at the both sides of through-hole 403, and the first cutting wheel 406, the second cutting wheel 407 are divided
It is not rotatably connected with braced frame 401, to realize that conducting wire acts on.Cutting wire 8 successively bypass actinobacillus wheel, the first cutting wheel 406,
Second cutting wheel 407 and take-up pulley are to cut crystal silicon.In the present embodiment, the first cutting wheel 406, the second cutting wheel 407 are located at same
On one horizontal line, to ensure that cutting wire 8 is in horizontal operating state, meanwhile, actinobacillus wheel uses the general BS60 lines roller in market, is not required to two
The production time is saved in secondary coiling.
The unwrapping wire driving motor and take-up driving motor 408 are connect by mounting base 409 with braced frame 401, institute
It states mounting base 409 and is equipped with wire-arranging component, for driving unwrapping wire driving motor and take-up driving motor 408 along the axial direction of crystal silicon
It is mobile.The wire-arranging component includes winding displacement driving motor 410, the second ball-screw and fixed plate 411, second ball-screw
It is connect with the output end of winding displacement driving motor 410, nut is connected with fixed plate 411, and the fixed plate 411 is located at unwrapping wire driving
The lower section of motor or take-up driving motor 408, and fixed plate 411 is connected with unwrapping wire driving motor or take-up driving motor 408.?
That is under the driving effect of winding displacement driving motor 410, the fixed plate 411 can be slided along mounting base 409, and fixed
The glide direction of plate 411 and crystal silicon are axially identical, to realize that uniform unwrapping wire and take-up operate.
In addition, the braced frame 401 is equipped with nozzle 9 and line laser marker 10, the nozzle 9 is located on through-hole 403
Side and its be provided with multiple, nozzle 9 is moved up and down with cutting head, and depth of cut is deeper, and nozzle 9 is closer apart from crystal silicon, is protected
Enough coolant liquids are demonstrate,proved to enter in cutting seam.The laser and the first cutting wheel 406, second that the line laser marker 10 is emitted are cut
Cutting wire 8 between wheel 407 overlaps, and benchmark is done in the long-range position demarcated cutting wire 8 and can cut to for crystal silicon positioning.
Embodiment three：
With reference to figure 1 and Fig. 6, clip claw assembly 11 is provided at the blanking conveying assembly 3, the clip claw assembly 11 includes cross
Beam 1101 and driving motor 1102, the crossbeam 1101 is axially vertical with crystal silicon, is set close to the side of charging conveying assembly 2
There are the locating piece 1103 being connected to crossbeam 1101, the driving motor 1102 to be located at the other side of crossbeam 1101.Pedestal 1 is equipped with
Along the axially extending feeding sliding rail of crystal silicon, driving motor 1102 drives clip claw assembly 11 to be moved along feeding sliding rail, with dragging
Crystal silicon is transmitted along conveying mechanism.
The end of the locating piece 1103 is equipped with vacuum cup 1104, and vacuum cup 1104 is used for that the crystalline substance for needing to cut is sucked
Silicon or print, meanwhile, locating piece 1103 can effectively prevent crystal silicon or print and occur shaking, displacement when clip claw assembly 11 moves,
It is detached again with vacuum cup 1104 after the completion of equal crystal silicons or print cutting.The vacuum cup 1104 passes through mounting rod and locating piece
1103 connections, one end of the crossbeam 1101 are equipped with the gas circuit interconnecting device 1105 communicated therewith, go out in gas circuit interconnecting device 1105
Carry out a vacuum tracheae and be connected to vacuum cup 1104, for controlling vacuum cup 1104 to the absorption of crystal silicon or print and dividing
From.Meanwhile a button (not shown) is set on gas circuit interconnecting device 1105, which is used for controlling the closing of vacuum tracheae
Or connection.Water fender 1106 is fixedly installed in 1101 both ends of the crossbeam respectively, can block the water of the ejection of nozzle 9, prevent water from splashing
On clip claw assembly 11, spattering circuit line with water leads to short circuit, influences cutting operation.
Referring to figs. 1 to Fig. 6, crystal silicon blocks detailed process and is：Crystalline silicon rod is docked into push-in shear, opens line laser marker
10, demarcate the first knife cutting position.Each section of segment length of blanking crystalline silicon rod is inputted, start button is clicked, nozzle 9 automatically opens, laser
Line marking device 10 is automatically closed.Cutting head cuts crystal silicon club head, and after the completion of cutting, nozzle 9 is automatically closed, and line laser marker 10 is certainly
Dynamic to open, the crystalline silicon rod under cutting is sent out by blanking conveying assembly 3.Cutting head rises, and clip claw assembly 11 advances and crystal silicon is sucked
Section drags forward, crystalline silicon rod is dragged predetermined distance according to input segment length, the first slide unit 501 or the second slide unit 502 reach quilt
The centre position of truncation part, locking cylinder 504 lock after being come into full contact with crystal silicon.Nozzle 9 is opened, and cutting head is started to work,
After the completion of cutting, locking cylinder 504 is retracted, and truncation part is hauled out cutting area by clip claw assembly 11, and waiting is taken away.Repeatedly,
Until being cut to last knife of tail portion.
When coupongs, clip claw assembly 11 is used as supporting device and slice getting device.It is disconnected that vacuum cup 1104 sucks crystal silicon
Face is pulled along 1~5mm of silicon rod according to input print thickness requirement, and after the completion of pulling, vacuum cup 1104 sucks section guarantor
Hold motionless, the opening of nozzle 9, into cutting process.After cutting, nozzle 9 is not closed, at this time print and silicon rod section adsorption capacity
Very little, vacuum cup 1104 take print out of cutting area.Hand-held print edge, presses the button on gas circuit interconnecting device 1105, sample
Sector-meeting is detached from vacuum cup 1104, you can is manually taken down print, is completed coupongs work.
The present invention is described in detail above, described above, only the preferred embodiments of the invention, when cannot
Limit the scope of the present invention, i.e., it is all according to the made equivalent changes and modifications of the application range, it all should still belong to covering scope of the present invention
It is interior.
Claims (10)
1. a kind of crystal silicon hilted broadsword shear, including pedestal (1) and the conveying mechanism above pedestal (1) and cutting mechanism (4),
It is characterized in that, the conveying mechanism is divided axially into two-stage along crystal silicon, it is respectively that charging conveying assembly (2) and blanking are defeated
Sending component (3) is located between charging conveying assembly (2) and blanking conveying assembly (3) and is equipped with movable support mechanism (5), the work
Dynamic supporting mechanism (5) include can opposite sliding the first slide unit (501) and the second slide unit (502), first slide unit (501) and
Multiple locking support groups (503) are respectively provided on second slide unit (502)；
The cutting mechanism (4) is located above movable support mechanism (5), is connect with pedestal (1) by support post (6),
The cutting mechanism (4) includes braced frame (401), lifting assembly (402) and cutting head, the lifting assembly (402) and branch
Column (6) is supportted to be connected, the cutting head is located in braced frame (401), the lifting assembly (402) by connecting plate (7) and
Braced frame (401) connects, to push braced frame (401) to be slided along support post (6), on the braced frame (401)
Equipped with for crystal silicon by through-hole (403)；
Be provided with clip claw assembly (11) at the blanking conveying assembly (3), the clip claw assembly (11) include crossbeam (1101) and
Driving motor (1102), the crossbeam (1101) is axially vertical with crystal silicon, is equipped with close to the side of charging conveying assembly (2)
The locating piece (1103) being connected to crossbeam (1101), the driving motor (1102) is located at the other side of crossbeam (1101), described
The end of locating piece (1103) is equipped with vacuum cup (1104), and one end of the crossbeam (1101) is equipped with the gas circuit communicated therewith and turns
Connect box (1105).
2. a kind of crystal silicon hilted broadsword shear according to claim 1, which is characterized in that locking support group (503) packet
Two spaced locking cylinders (504) are included, and the piston end surface of locking cylinder (504) is obliquely installed to be bonded crystal silicon circumference
Surface, the multiple locking support group (503) are arranged along the axial direction of crystal silicon.
3. a kind of crystal silicon hilted broadsword shear according to claim 2, which is characterized in that first slide unit (501) and/or
Second slide unit (502) is equipped with the roller group parallel with locking support group (503), and the roller group includes two idler wheels
(505), the idler wheel (505) is correspondingly arranged with locking cylinder (504), and two idler wheels (505) respectively by holder (506) with
First slide unit (501) or the second slide unit (502) are rotatably connected.
4. a kind of crystal silicon hilted broadsword shear according to claim 2, which is characterized in that the cylinder of the locking cylinder (504)
Body end is connected with the first slide unit (501) or the second slide unit (502), and piston end periphery is arranged with resetting spring (508), and resets
Spring (508) is located on the outside of cylinder body end, and resetting spring (508) periphery is arranged with organ shield (509).
5. a kind of crystal silicon hilted broadsword shear according to claim 1, which is characterized in that the lifting assembly (402) includes
Lifting motor (412), speed reducer (413) and the first ball-screw (414), first ball-screw (414) and support post
(6) it is arranged in parallel, the lifting motor (412), speed reducer (413) and support post (6) are connected, the connecting plate (7) and the
The nut of one ball-screw (414) is connected.
6. a kind of crystal silicon hilted broadsword shear according to claim 1, which is characterized in that the cutting head includes unwrapping wire component
(404), take-up component (405), the first cutting wheel (406) and the second cutting wheel (407), the unwrapping wire component (404) include putting
Line driving motor and actinobacillus wheel, the take-up component (405) include take-up driving motor (408) and take-up pulley, and described first cuts
It cuts wheel (406) and the second cutting wheel (407) is located at the both sides of through-hole (403), and the first cutting wheel (406), the second cutting
Wheel (407) be rotatably connected respectively with braced frame (401), cutting wire (8) successively bypass actinobacillus wheel, the first cutting wheel (406),
Second cutting wheel (407) and take-up pulley are to cut crystal silicon.
7. a kind of crystal silicon hilted broadsword shear according to claim 6, which is characterized in that the unwrapping wire driving motor and take-up
Driving motor (408) is connect by mounting base (409) with braced frame (401), and the mounting base (409) is equipped with winding displacement group
Part, for driving unwrapping wire driving motor and take-up driving motor (408) along the axial movement of crystal silicon.
8. a kind of crystal silicon hilted broadsword shear according to claim 7, which is characterized in that the wire-arranging component includes that winding displacement drives
Dynamic motor (410), the second ball-screw and fixed plate (411), second ball-screw are defeated with winding displacement driving motor (410)
Outlet connects, and nut is connected with fixed plate (411), and the fixed plate (411) is located at unwrapping wire driving motor or take-up driving electricity
The lower section of machine (408), and fixed plate (411) is connected with unwrapping wire driving motor or take-up driving motor (408).
9. a kind of crystal silicon hilted broadsword shear according to claim 6, which is characterized in that set on the braced frame (401)
There are nozzle (9) and line laser marker (10), the nozzle (9) to be located above through-hole (403), line laser marker (10) outgoing
Laser overlapped with the cutting wire (8) between the first cutting wheel (406), the second cutting wheel (407).
10. a kind of crystal silicon hilted broadsword shear according to claim 1, which is characterized in that crossbeam (1101) both ends point
Not Gu Dingshezhi water fender (1106), the vacuum cup (1104) connect by mounting rod with locating piece (1103).
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| CN110238980A (en) * | 2019-07-03 | 2019-09-17 | 青岛高测科技股份有限公司 | A kind of hilted broadsword double stick shear |
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| CN113646872A (en) * | 2019-01-21 | 2021-11-12 | 株式会社东京精密 | Wafer stripping and cleaning device |
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| CN110154256B (en) * | 2019-07-03 | 2024-05-31 | 青岛高测科技股份有限公司 | Cutting, edge cutting, grinding and polishing integrated machine |
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