CN108733244B - Wave-absorbing glue and method for forming wave-absorbing glue on touch screen body - Google Patents
Wave-absorbing glue and method for forming wave-absorbing glue on touch screen body Download PDFInfo
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- CN108733244B CN108733244B CN201710253073.5A CN201710253073A CN108733244B CN 108733244 B CN108733244 B CN 108733244B CN 201710253073 A CN201710253073 A CN 201710253073A CN 108733244 B CN108733244 B CN 108733244B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Physics & Mathematics (AREA)
- Cookers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a wave-absorbing glue which is prepared by uniformly mixing 180-220 g of blue glue and 500-750 g of iron powder. Also discloses a method for molding the wave-absorbing glue on the touch screen body, which comprises the following steps: (1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished; (2) and cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body. The invention can effectively absorb useless clutter and solve the problem of secondary interference caused by boundary echo.
Description
Technical Field
The invention relates to the technical field of ultrasonic sensing, in particular to a wave-absorbing glue and a method for forming the wave-absorbing glue on a touch screen body.
Background
With the continuous development of the existing pen touch technology, the requirement of people on pen writing is higher and higher, and the original handwriting drawing board and the original handwriting signature are generated. Among the prior art, former handwriting indicates that the ultrasonic wave pen that is equipped with ultrasonic emitter in using the pen touches and controls, and the true hand writing of simulation is with user's touch operation trace, including removal orbit, dynamics size, a pen inclination etc. the record is marked out through the colour lines to realize former handwriting drawing and signature.
For example, the prior art with chinese patent publication No. CN205880845U discloses a writing system based on ultrasonic lamb waves in 2017, month 1 and day 11, and the technical scheme is as follows: including clipboard and ultrasonic wave pen, be provided with two ultrasonic receiver on the clipboard at least, the ultrasonic wave pen includes ultrasonic transmitter and refill, and the ultrasonic wave that ultrasonic transmitter sent reachs ultrasonic receiver after refill and the inside propagation of clipboard in proper order. The working principle is that the characteristics of ultrasonic lamb waves are utilized, so that ultrasonic waves reach an ultrasonic receiver through the inside of the writing board. However, in the practical application process, because lamb waves are transmitted in the writing board and have the characteristics of stability, high efficiency and weak attenuation, the objective and complex problem is that the lamb waves have multi-mode complexity in the transmission process, and extremely easy reflection back at the boundary of the writing board is overlapped and interfered with the original emission waveform again, so that great trouble is caused to later-stage detection of useful signals, and the signals required by people cannot be correctly identified.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a wave-absorbing glue and a method for forming the wave-absorbing glue on a touch screen body.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a wave-absorbing adhesive is characterized in that: is prepared by uniformly mixing 180-220 g of blue gel and 500-750 g of iron powder.
A method for molding wave-absorbing glue on a touch screen body is characterized by comprising the following steps:
(1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished;
(2) and cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body.
And (2) printing for 5-8 times in the step (1) to obtain 5-8 layers of composite gradient gel.
And (2) baking in a tunnel furnace in the step (1), wherein the baking temperature is 150-300 ℃ each time, and the baking time is 10-15 minutes.
The invention has the advantages that:
compared with the wave-absorbing rubber purchased in the market, the wave-absorbing rubber prepared by matching the blue gel and the iron powder (nano level) has the main advantages that 1, the cost is greatly reduced on the premise that the wave-absorbing performance completely accords with the purchase of materials, and only accounts for one tenth of the purchase cost. 2. When the performance requirements are met and compared with the conditions, the weight of the nanometer grade ultrapure iron powder is greatly reduced, and the light weight requirements of corresponding products are met.
The forming method has the following advantages: 1. the periphery of the touch screen body is seamless. 2. The printing is dried from liquid to solid and is tightly attached to the screen body, so that the unpredictable problem of 3M glue self-generation bonding is avoided, and 3, the trimming treatment is convenient and quick.
Detailed Description
Example 1
The embodiment provides a wave-absorbing glue which is formed by uniformly mixing 180g of blue glue and 500g of nano-scale iron powder.
The embodiment also provides a method for molding the wave-absorbing glue on the touch screen body, which comprises the following steps:
(1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished;
in the step, the printing times are 5 times, and 5 layers of composite gradient gel are obtained.
In the step, the baking is carried out in a tunnel furnace, the baking temperature is 150 ℃ each time, and the baking time is 15 minutes.
(2) And cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body.
In the present embodiment, the gradient is a shape obtained by repeating printing a plurality of times in the same manner.
In the embodiment, after the wave-absorbing offset printing is carried out for 5 times, the thickness of the touch screen body formed by the wave-absorbing offset printing is 1.5mm, and experiments prove that 60% of clutter can be absorbed at most.
Example 2
The embodiment provides a wave-absorbing glue which is formed by uniformly mixing 220g of blue glue and 750g of nano-scale iron powder.
The embodiment also provides a method for molding the wave-absorbing glue on the touch screen body, which comprises the following steps:
(1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished;
in the step, the printing times are 8 times, and 8 layers of composite gradient gel are obtained.
In the step, the baking is carried out in a tunnel furnace, the baking temperature is 300 ℃ each time, and the baking time is 10 minutes.
(2) And cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body.
In the embodiment, after the wave-absorbing offset printing is carried out for 8 times, the thickness of the wave-absorbing offset printing formed on the touch screen body is 2mm, and experiments prove that the wave-absorbing offset printing can absorb 93% of clutter at most.
Example 3
The embodiment provides a wave-absorbing glue which is formed by uniformly mixing 200g of blue glue and 700g of nano-scale iron powder.
The embodiment also provides a method for molding the wave-absorbing glue on the touch screen body, which comprises the following steps:
(1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished;
in the step, the printing times are 6 times, and 6 layers of composite gradient gel are obtained.
In the step, the baking is carried out in a tunnel furnace, the baking temperature is 240 ℃ each time, and the baking time is 12 minutes.
(2) And cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body.
In the embodiment, after the wave-absorbing offset printing is carried out for 6 times, the thickness of the touch screen body formed by the wave-absorbing offset printing is 1.7mm, and experiments prove that 70% of clutter can be absorbed at most.
Claims (4)
1. A wave-absorbing adhesive is characterized in that: is prepared by uniformly mixing 180-220 g of blue gel and 500-750 g of iron powder.
2. The method for forming the wave-absorbing glue on the touch screen body according to claim 1, which comprises the following steps:
(1) arranging grids around the touch screen body, inverting the wave-absorbing glue on the grids, printing the wave-absorbing glue around the touch screen body in a multi-printing mode, baking after each printing, and obtaining multilayer composite gradient gel around the touch screen body after the last baking is finished;
(2) and cooling the gel, and then performing edge cutting and chamfering treatment to obtain the finished wave-absorbing touch screen body.
3. The method for forming the wave-absorbing glue on the touch screen body according to claim 2, wherein the method comprises the following steps: and (2) printing for 5-8 times in the step (1) to obtain 5-8 layers of composite gradient gel.
4. The method for forming the wave-absorbing glue on the touch screen body according to claim 2, wherein the method comprises the following steps: and (2) baking in a tunnel furnace in the step (1), wherein the baking temperature is 150-300 ℃ each time, and the baking time is 10-15 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253073.5A CN108733244B (en) | 2017-04-18 | 2017-04-18 | Wave-absorbing glue and method for forming wave-absorbing glue on touch screen body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253073.5A CN108733244B (en) | 2017-04-18 | 2017-04-18 | Wave-absorbing glue and method for forming wave-absorbing glue on touch screen body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108733244A CN108733244A (en) | 2018-11-02 |
| CN108733244B true CN108733244B (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710253073.5A Active CN108733244B (en) | 2017-04-18 | 2017-04-18 | Wave-absorbing glue and method for forming wave-absorbing glue on touch screen body |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103421383A (en) * | 2013-08-30 | 2013-12-04 | 东莞市平波电子有限公司 | Touch screen heat curing peelable blue gel and preparing method thereof |
| CN103862898A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Circuit board blue glue printing process |
| CN104250442A (en) * | 2013-06-28 | 2014-12-31 | 深圳光启创新技术有限公司 | Microwave-absorbing composite material, preparation method of microwave-absorbing composite material, metamaterial and use of metamaterial |
| CN104327794A (en) * | 2013-07-22 | 2015-02-04 | 深圳光启创新技术有限公司 | Wave absorbing composite material and preparation method thereof as well as artificial electromagnetic material and preparation method thereof |
| CN104339510A (en) * | 2013-07-23 | 2015-02-11 | 深圳光启创新技术有限公司 | Preparation method of wave absorbing member and wave absorbing member |
| CN106274101A (en) * | 2016-07-12 | 2017-01-04 | 胜宏科技（惠州）股份有限公司 | A kind of circuit Baphicacanthus cusia offset printing dataller's skill |
-
2017
- 2017-04-18 CN CN201710253073.5A patent/CN108733244B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104250442A (en) * | 2013-06-28 | 2014-12-31 | 深圳光启创新技术有限公司 | Microwave-absorbing composite material, preparation method of microwave-absorbing composite material, metamaterial and use of metamaterial |
| CN104327794A (en) * | 2013-07-22 | 2015-02-04 | 深圳光启创新技术有限公司 | Wave absorbing composite material and preparation method thereof as well as artificial electromagnetic material and preparation method thereof |
| CN104339510A (en) * | 2013-07-23 | 2015-02-11 | 深圳光启创新技术有限公司 | Preparation method of wave absorbing member and wave absorbing member |
| CN103421383A (en) * | 2013-08-30 | 2013-12-04 | 东莞市平波电子有限公司 | Touch screen heat curing peelable blue gel and preparing method thereof |
| CN103862898A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Circuit board blue glue printing process |
| CN106274101A (en) * | 2016-07-12 | 2017-01-04 | 胜宏科技（惠州）股份有限公司 | A kind of circuit Baphicacanthus cusia offset printing dataller's skill |
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| Publication number | Publication date |
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| CN108733244A (en) | 2018-11-02 |
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