CN108727813A - A kind of LED light sheathing material - Google Patents
A kind of LED light sheathing material Download PDFInfo
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- CN108727813A CN108727813A CN201810518702.7A CN201810518702A CN108727813A CN 108727813 A CN108727813 A CN 108727813A CN 201810518702 A CN201810518702 A CN 201810518702A CN 108727813 A CN108727813 A CN 108727813A
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- polyamide
- led light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention relates to a kind of LED light sheathing materials, are made of aluminium and polyamide compoiste material, and for polyamide as high crystallinity polymer, the heat conductivility of itself is poor, are easy water suction, are easy warpage.The prior art is usually compensated its defect by filling come filler, the application introduces and the close polyamidoimide type liquid crystal polymer of polyamide structure in the polymeric system of polyamide, the melt viscosity that polyamide can be reduced improves the loading of filler and the processing performance of material；Using the high fluidity of liquid crystal, the dispersibility of filler in a polymer matrix can be improved by being mixed with filler, reduce the warpage of material surface；Bat wool is handled using liquid-state epoxy resin, substantially reduces the surface tension between filler and polymeric matrix；Nano graphene platelet and boron nitride together form the solid netted heat conduction system being made of threadiness, sheet, particulate filler with carbon fiber, substantially increase the thermal diffusivity of material and the stickiness of itself and aluminium, are very suitable for the use of LED shells.
Description
Technical field
The present invention relates to a kind of LED light sheathing materials, belong to field of functional polymer composites.
Background technology
LED light shell is typically aluminium packet plastic construction on the market, by aluminium and plastics by hot-forming, still, aluminium and modeling
Linear expansion coefficient between material is not close, therefore there is the phenomenon that being bubbled in the long-term use, leads to service life
It is shorter, and the thermal coefficient using raising polyamide main at present and the linear expansion coefficient between diminution two-phase, still
For polyamide as high crystallinity polymer, the heat conductivility of itself is poor, be easy water suction, poor dimensional stability, limit its
The application of LED light shell etc..The prior art is usually compensated its defect by filling come filler, however, heat filling is usual
It needs largely to add and could form heat conduction continuous phase in a polymer matrix, such as introduce in PA6 graphite as heat filling,
It needs 30% or more addition that could form heat conduction network, and considers the factors such as cost, usually other can be also introduced in polymer
Filler such as glass fibre carrys out reinforced resin matrix, and on the one hand a large amount of filler can cause material not allow easy processing, on the other hand
Filler unevenly distributed can make the mechanical property of material decline to a great extent, and bat wool can also cause warpage, influence material
Apparent property.Therefore, herein by the linear expansion system of the thermal conductivity and improvement polyamide that improve LED polyamides
Number, obtains a kind of LED light sheathing material with superperformance.
Invention content
The object of the present invention is to provide a kind of LED light sheathing materials, by aluminium and polyamide compoiste material by being hot pressed into
Type obtains, and the LED light sheathing material of preparation, which has, leads improved thermal conductivity, excellent mechanical property and dimensional stability, good
Surface nature.
To achieve the goals above, the present invention uses following technical scheme：
90-120 parts of polyamide
10-15 parts of LCP
40-50 parts of glass fibre
10-15 parts of heat conducting nano filler
Carbon fiber 15-20
5-8 parts of liquid-state epoxy resin
3-5 parts of antioxidant
5-10 parts of toughener.
Wherein, the polyamide is preferably PA9T.
Although PA6 and PA66 has excellent mechanical property, the most frequently used in field of polyamides, its water imbibition is larger,
Not as good as aromatic polyamide, PA9T is no less than full aliphatic as aromatic polyamide, toughness for heat resistance and dimensional stability
Polyamide, water imbibition is minimum in polyamide, has excellent dimensional stability；In addition, its crystallization temperature is high, it can be quick
Molding has high temperature rigid, the excellent feature of machine-shaping property.
Liquid crystal polymer LCP has anisotropy, and mobility is excellent, it is mixed with daiamid composition, on the one hand may be used
To reduce melt viscosity, the additive amount of filler is improved, and the dispersibility of filler in the base can be improved；On the other hand,
Also surface warp caused by glass fibre can be reduced.
The LCP preferred polyamide imide-type liquid crystal polymers, polyamidoimide is close with polyamide structure, with
The compatibility of polyamide is preferable.
Liquid-state epoxy resin is on the one hand good to the wetting effect of glass fibre, on the other hand, with carbon fiber and polyamide
Compatibility it is good, can improve the interfacial property of glass fibre, carbon fiber and polymeric matrix, liquid-state epoxy resin plus
Enter, the adhesive property between filler and matrix resin can be improved, reduce the tension of interface cohesion, further plays the increasing of filler
Strong or heat conductivility.
The preferred asphaltic base heat conducting fiber of carbon fiber.
Matching is good between the molecular geometry of polyamide and the surface of carbon fiber, can be formed across crystal structure, no
The thermal conductive property that polyamide can only be improved, since polyamide molecule chain is very accurate in the arrangement of carbon fiber surface, shape
At composite material strength it is very high.
The preferred alkali-free glass fibre of glass fibre, the water imbibition of alkali-free glass fibre is small, preferably 6 μm of diameter.
The heat conducting nano filler is nano graphene platelet and nm-class boron nitride powder mass ratio is 1:1 mixture,
The number of plies of nano-graphene is preferably 4, when the number of plies of nano-graphene is 4, also has preferable enhancing effect.
Nano graphene platelet and boron nitride have very high Debye temperature, they are together formed with carbon fiber by line
The solid netted heat conduction system that shape, sheet, particulate filler are constituted, substantially increases the heat conductivility of polyamide.
The antioxidant is preferably antioxidant 1010.
The preferred maleic anhydride stem grafting polyolefin elastomer of toughener, the maleic anhydride stem grafting polyolefin elastomer are excellent
Select POE-g-MAH, PE-g-MAH, EPDM-g-MAH.
The application uses following preparation method：
The first step, first by polyamide 90-120 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 5-8 parts
Liquid-state epoxy resin gluing processing 40-50 parts of glass fibres and 15-20 parts of carbon fibers, obtain modified glass fibre and carbon
Fiber；
10-15 parts of 10-15 parts of LCP and heat conducting nano filler are pre-mixed, so by second step in high-speed mixer
90-120 parts of polyamide, 5-10 parts of toughener, 3-5 parts of antioxidant are added afterwards, is thoroughly mixed to obtain mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step is added in charge door, and melting extrusion is granulated, and obtains the combination of heat conduction polyamide
Object material；Wherein, extruder barrel temperature is 310-330 DEG C, screw speed 250-270r/min.
Compared with prior art, the present invention has the following advantages：
1. introducing and the close polyamidoimide type liquid crystal polymer of polyamide structure, can drop in polymeric system
The melt viscosity of oligoamide improves the loading of filler and the processing performance of material；Using the high fluidity of liquid crystal, it is allowed to
It is preferentially mixed with filler, the dispersibility of filler in a polymer matrix can be improved, reduce the warpage of material surface；
2. using liquid-state epoxy resin handle bat wool, due to liquid-state epoxy resin simultaneously with polyamide and glass
Fiber, carbon fiber, conductive nano filler all have preferable compatibility, can substantially reduce between filler and polymeric matrix
Surface tension further increases the surface nature of material.
It is made of threadiness, sheet, particulate filler 3. nano graphene platelet and boron nitride are together formed with carbon fiber
Solid netted heat conduction system, substantially increases the heat conductivility of polyamide.
4. using with aluminium there is the polyamide compoiste material of similar linear coefficient of thermal expansion to make the service life of product big
Big enhancing.
Specific implementation mode
The technical solution of the application is further illustrated below by embodiment 1-3 and comparative example 1-4.
Embodiment 1
The first step, first by PA9T 90 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 8 parts of liquid
Epoxy resin gluing 50 parts of glass fibres of processing and 20 parts of carbon fibers, obtain modified glass fibre and carbon fiber；
Second step, by 15 parts of polyamidoimide type liquid crystal polymer and 7.5 parts of nano graphene platelet and nano silicon nitride
7.5 parts of boron powder is pre-mixed in high-speed mixer, and 90 parts of PA9T, 5 parts of POE-g-MAH, antioxidant 1010 is then added
3 parts of mixed at high speed obtain mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step, melting mixing is added in charge door, and it is compound to obtain heat conduction polyamide for extruding pelletization
Material.310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 270r/min.
Embodiment 2
The first step, first by PA9T 110 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 7 parts of liquid
Epoxy resin gluing 45 parts of glass fibres of processing and 18 parts of carbon fibers, obtain modified glass fibre and carbon fiber；
Second step, by 13 parts of polyamidoimide type liquid crystal polymer and 6.5 parts of nano graphene platelet and nano silicon nitride
6.5 parts of boron powder is pre-mixed in high-speed mixer, and 110 parts of PA9T, 8 parts of POE-g-MAH, antioxidant 1010 is then added
4 parts of mixed at high speed obtain mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step, melting mixing is added in charge door, and it is compound to obtain heat conduction polyamide for extruding pelletization
Material, 310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 260r/min.
Embodiment 3
The first step, first by PA9T 120 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 5 parts of liquid
Epoxy resin gluing 40 parts of glass fibres of processing and 15 parts of carbon fibers, obtain modified glass fibre and carbon fiber；
Second step, by 10 parts of polyamidoimide type liquid crystal polymer and 5 parts of nano graphene platelet and nm-class boron nitride
5 parts of powder is pre-mixed in high-speed mixer, and 120 parts of PA9T, POE-g-MAH10 parts, 5 parts of antioxidant 1010 is then added
Mixed at high speed obtains mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step, melting mixing is added in charge door, and it is compound to obtain heat conduction polyamide for extruding pelletization
Material；310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 250r/min.
Comparative example 1
The first step, first by PA9T 90 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 8 parts of liquid
Epoxy resin gluing 50 parts of glass fibres of processing and 20 parts of carbon fibers, obtain modified glass fibre and carbon fiber；
Second step, by 7.5 parts of nano graphene platelet and 7.5 parts of nm-class boron nitride powder, 90 parts of PA9T, POE-g-MAH 5
3 parts of part, antioxidant mixed at high speed obtain mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step, melting mixing is added in charge door, and it is compound to obtain heat conduction polyamide for extruding pelletization
Material, 310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 270r/min.
Comparative example 2
The first step, first by PA9T 90 parts be placed in air dry oven, 120 DEG C of fully dry 5h；By polyamidoimide
15 parts of type liquid crystal polymer carries out in advance with 7.5 parts of 7.5 parts of nano graphene platelet and nm-class boron nitride powder in high-speed mixer
Then mixing is added 3 parts of 90 parts of PA9T, 5 parts of POE-g-MAH, antioxidant 1010 mixed at high speed and obtains mixture；
The mixture that the first step obtains is added in double screw extruder by second step, from the glass of double screw extruder
20 parts of 50 parts of glass fibre and carbon fiber, melting mixing is added in charge door, and extruding pelletization obtains heat conduction polyamide compoiste material,
310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 270r/min.
Comparative example 3
The first step, first by PA9T 90 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Nano-graphene is thin
7.5 parts of piece and 3 parts of 7.5 parts of nm-class boron nitride powder, 90 parts of PA9T, 5 parts of POE-g-MAH, antioxidant mixed at high speed are mixed
Material；
The mixture that the first step obtains is added in double screw extruder by second step, from the glass of double screw extruder
20 parts of 50 parts of glass fibre and carbon fiber, melting mixing is added in charge door, and extruding pelletization obtains heat conduction polyamide compoiste material；
310 DEG C of one area of extruder barrel temperature, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 270r/min.
Comparative example 4
The first step, first by PA9T 90 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Nano-graphene is thin
3 parts of 45 parts of piece, 90 parts of PA9T, 5 parts of POE-g-MAH, antioxidant mixed at high speed obtain mixture；
The mixture that the first step obtains is added in double screw extruder by second step, from the glass of double screw extruder
50 parts of glass fibre, melting mixing is added in charge door, and extruding pelletization obtains heat conduction polyamide compoiste material；Extruder barrel temperature
Spend 310 DEG C of an area, two 320 DEG C of areas, three 330 DEG C of areas, screw speed 270r/min.
After the above various embodiments and comparative example melting extrusion are granulated, by gained pellet at 120 DEG C after dry 4h, with injection molding
Machine tests tensile strength in 320 DEG C of injection molding standard testing battens, according to national standards GB/T1040-2006；According to country
Standard GB/T9314-2008 tests bending strength, and GB/T1843-2008 tests impact strength according to national standards；According to ISO
22007-2-2008 tests thermal coefficient, and GB/T1034-1998 tests water imbibition according to national standards, using polymer melt
Viscosity determinator measures the melt viscosity of material.The thermal linear expansion coefficient of composite material and aluminium is used the aluminium flake and 1mm of 1mm
Polyamide compoiste material sheet material be bonded, carried out at -20~30 DEG C hot and cold alternation test (heating, cooling with 10 DEG C/
The speed of s carries out, and is carried out alternately once per 1min, terminates until there is bubbling phenomenon experiment), embodiment 1-3 and comparative example
The performance data of 1-4 is shown in Table 1.
Table 1
Wherein, embodiment 1-3, the spline surfaces of comparative example 2 are smooth, no warpage, and 1,3,4 surface of comparative example can be observed to float
It is fine, it is seen that even if LCP is not premixed with bat wool, taking for bat wool is still affected during melting mixing
To, hence it is evident that improve the surface nature of material；The water imbibition of PA9T is inherently small, by the data of table 1 it is found that being added filler modified
Later, water imbibition is further decreased.Comparing embodiment 1 and comparative example 1, when not adding LCP, melt viscosity increases,
Filler cannot effectively disperse in resin matrix, and thermal conductivity, tensile strength and the bending strength of material are presented decline and become
Gesture；Comparing embodiment 1 and comparative example 2, when not adding liquid-state epoxy resin, the thermal conductivity of material is declined, compared to not
Include the polymer material of liquid crystal polymer, fall is smaller, and viscosity slightly increases, this illustrates epoxy resin in certain journey
The uniformity that filler distribution is affected on degree, to the influence power of filler not as good as LCP；Comparative example 4 is added to more single kind
Heat filling, heat-conducting effect is still not as good as the application；Comparing embodiment 1 and comparative example 1-3 lack LCP and liquid when simultaneously
When state epoxy resin, the thermal conductivity of material declines to a great extent, and melt viscosity increases；This illustrates that LCP and liquid-state epoxy resin have one
Fixed synergistic effect, can improve dispersibility of the heat filling in resin matrix, this is primarily due to polyamidoimide type
Liquid crystal polymer is close with polyamide structure, preferable with the compatibility of polyamide, high fluidity, can improve filler and polymerize
Dispersibility in object matrix, and the amino or carboxyl of the epoxy group and polyamides amine end in liquid-state epoxy resin are with higher
Reactivity, epoxy group also have certain reactivity with amide group, this allows for LCP and liquid-state epoxy resin and polyamides
The compatibility of amine is high, and after being mixed with filler, isolated existing material of different shapes is passed through by bridging action and resin matrix
It wears, collaboration promotes the formation of heat conduction network in material.And it can be seen that the present invention obtained from embodiment and comparative example
Material still has preferable stickiness after multiple hot and cold alternation with aluminium, and the application in LED light material has good
Value is used for a long time.
The present invention illustrates the method detailed of the present invention by above-described embodiment, but the invention is not limited in above-mentioned sides
Method, the addition etc. of equivalence replacement and auxiliary element to each raw material of product of the present invention all fall within the protection and openly of the present invention
Within the scope of.
Claims (9)
1. a kind of LED light sheathing material, which is characterized in that be combined, gathered by hot pressing by aluminium and polyamide compoiste material
Amide composite material is made of the component of following components by weight percent：
90-120 parts of polyamide
LCP10-15 parts
40-50 parts of glass fibre
10-15 parts of heat conducting nano filler
Carbon fiber 15-20
5-8 parts of liquid-state epoxy resin
3-5 parts of antioxidant
5-10 parts of toughener.
2. LED light sheathing material according to claim 1, which is characterized in that the preferred PA9T of the polyamide.
3. LED light sheathing material according to claim 1, which is characterized in that the LCP preferred polyamide imide-types
Liquid crystal polymer.
4. LED light sheathing material according to claim 1, the preferred alkali-free glass fibre of glass fibre, diameter are excellent
Select 6 μm.
5. LED light sheathing material according to claim 1, which is characterized in that the heat conducting nano filler is mass ratio
1:The number of plies of the mixture of 1 nano graphene platelet and nm-class boron nitride powder, nano-graphene is preferably 4.
6. LED light sheathing material according to claim 1, which is characterized in that the preferred asphaltic base heat conduction of carbon fiber is fine
Dimension.
7. LED light sheathing material according to claim 1, which is characterized in that the preferred antioxidant 1010 of the antioxidant.
8. the LED light sheathing material according to claim 1-8, which is characterized in that the preferred POE-g-MAH of toughener,
PE-g-MAH, EPDM-g-MAH.
9. LED light sheathing material according to claim 1, which is characterized in that the preparation of polyamide compoiste material include with
Lower step：
The first step, first by polyamide 90-120 parts be placed in air dry oven, 120 DEG C of fully dry 5h；Using 5-8 parts of liquid
State epoxy resin gluing 40-50 parts of glass fibres of processing and 15-20 parts of carbon fibers, obtain modified glass fibre and carbon fiber
Dimension；
10-15 parts of 10-15 parts of LCP and heat conducting nano filler are pre-mixed by second step in high-speed mixer, then plus
Enter 90-120 parts of polyamide, 5-10 parts of toughener, 3-5 parts of antioxidant, is thoroughly mixed to obtain mixture；
Third walks, and the mixture that second step obtains is added in double screw extruder, feeds from the glass of double screw extruder
The modified glass fibre and carbon fiber of the first step is added in mouth, and melting extrusion is granulated, and obtains heat conduction Amilan polyamide resin composition material
Material；Wherein, extruder barrel temperature is 310-330 DEG C, screw speed 250-270r/min.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113462158A (en) * | 2021-06-26 | 2021-10-01 | 华为技术有限公司 | Wireless charger shell and wireless charger |
| CN117511198A (en) * | 2024-01-05 | 2024-02-06 | 陕西普利美材料科技有限公司 | PPA/PI/LCP alloy, preparation method and application thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5321096A (en) * | 1992-04-02 | 1994-06-14 | Mitsui Toatsu Chemical, Incorporated | Polyimide composition |
| EP0738746A1 (en) * | 1995-04-13 | 1996-10-23 | MITSUI TOATSU CHEMICALS, Inc. | Liquid crystal polyamide-imide copolymer |
| JPH09227694A (en) * | 1996-02-26 | 1997-09-02 | Sumitomo Rubber Ind Ltd | Fibrous reinforcement, production of the fibrous reinforcement, and structural material containing the fibrous reinforcement |
| WO2008130140A1 (en) * | 2007-04-19 | 2008-10-30 | Lg Innotek Co., Ltd | Light emitting device package and light unit having the same |
| CN102702748A (en) * | 2012-06-15 | 2012-10-03 | 昆山聚威工程塑料有限公司 | Heat-conducting polyphenylene sulfide and polyamide composite material |
| CN102757640A (en) * | 2012-07-25 | 2012-10-31 | 东莞市意普万尼龙科技股份有限公司 | Heat conduction nylon composite material and preparation method thereof |
| CN103862589A (en) * | 2012-12-18 | 2014-06-18 | 杭州千石科技有限公司 | Method for preparing polyamide-based heat conduction composite material through melt blending |
| CN104559148A (en) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | High-thermal-diffusion-coefficient high molecular material and preparation method thereof |
| CN105218940A (en) * | 2014-06-05 | 2016-01-06 | 中国科学院宁波材料技术与工程研究所 | A kind of high filler loading capacity fibre reinforced composite polyolefine material and preparation method thereof |
| CN106433107A (en) * | 2016-08-30 | 2017-02-22 | 华东交通大学 | High-strength carbon fiber reinforced thermoplastic resin composite particles and preparation method |
| CN107011617A (en) * | 2017-04-13 | 2017-08-04 | 长沙天科知识产权代理有限公司 | One kind mixes graphene, carbon fiber and boron nitride nanosheet 3D printing modified ABS material and preparation method thereof |
| CN107141784A (en) * | 2016-03-01 | 2017-09-08 | 彭昌兰 | Heat conducting nano composite material based on polyamide and preparation method thereof |
-
2018
- 2018-05-25 CN CN201810518702.7A patent/CN108727813A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5321096A (en) * | 1992-04-02 | 1994-06-14 | Mitsui Toatsu Chemical, Incorporated | Polyimide composition |
| EP0738746A1 (en) * | 1995-04-13 | 1996-10-23 | MITSUI TOATSU CHEMICALS, Inc. | Liquid crystal polyamide-imide copolymer |
| JPH09227694A (en) * | 1996-02-26 | 1997-09-02 | Sumitomo Rubber Ind Ltd | Fibrous reinforcement, production of the fibrous reinforcement, and structural material containing the fibrous reinforcement |
| WO2008130140A1 (en) * | 2007-04-19 | 2008-10-30 | Lg Innotek Co., Ltd | Light emitting device package and light unit having the same |
| CN102702748A (en) * | 2012-06-15 | 2012-10-03 | 昆山聚威工程塑料有限公司 | Heat-conducting polyphenylene sulfide and polyamide composite material |
| CN102757640A (en) * | 2012-07-25 | 2012-10-31 | 东莞市意普万尼龙科技股份有限公司 | Heat conduction nylon composite material and preparation method thereof |
| CN103862589A (en) * | 2012-12-18 | 2014-06-18 | 杭州千石科技有限公司 | Method for preparing polyamide-based heat conduction composite material through melt blending |
| CN105218940A (en) * | 2014-06-05 | 2016-01-06 | 中国科学院宁波材料技术与工程研究所 | A kind of high filler loading capacity fibre reinforced composite polyolefine material and preparation method thereof |
| CN104559148A (en) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | High-thermal-diffusion-coefficient high molecular material and preparation method thereof |
| CN107141784A (en) * | 2016-03-01 | 2017-09-08 | 彭昌兰 | Heat conducting nano composite material based on polyamide and preparation method thereof |
| CN106433107A (en) * | 2016-08-30 | 2017-02-22 | 华东交通大学 | High-strength carbon fiber reinforced thermoplastic resin composite particles and preparation method |
| CN107011617A (en) * | 2017-04-13 | 2017-08-04 | 长沙天科知识产权代理有限公司 | One kind mixes graphene, carbon fiber and boron nitride nanosheet 3D printing modified ABS material and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 严伟 等: "环氧树脂对玻纤增强PA6力学性能的影响", 《塑料》 * |
| 卓昌明: "《塑料应用技术手册》", 31 May 2013, 机械工业出版社 * |
| 杨桂生等: "《中国战略性新兴产业.新材料.工程塑料》", 31 December 2017, 中国铁道出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113462158A (en) * | 2021-06-26 | 2021-10-01 | 华为技术有限公司 | Wireless charger shell and wireless charger |
| CN113462158B (en) * | 2021-06-26 | 2023-12-08 | 华为数字能源技术有限公司 | Wireless charger shell and wireless charger |
| CN117511198A (en) * | 2024-01-05 | 2024-02-06 | 陕西普利美材料科技有限公司 | PPA/PI/LCP alloy, preparation method and application thereof |
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