CN108713356A

CN108713356A - EMI shielding constructions and its manufacturing method

Info

Publication number: CN108713356A
Application number: CN201780012468.4A
Authority: CN
Inventors: 金敬镒; 鞠健; 文溢柱; 白五贤
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2016-04-08
Filing date: 2017-03-08
Publication date: 2018-10-26
Anticipated expiration: 2037-03-08
Also published as: KR20170115930A; CN108713356B; KR102615926B1

Abstract

Provide a kind of electromagnetic interference (EMI) shielding construction and manufacturing method.EMI shielding constructions include printed circuit board (PCB), insulation molded structure, conductive shield dam and conductive shield component, wherein, multiple element is installed on a printed circuit, insulation molded structure is configured to covering multiple element, conductive shield dam is formed along the side surface of insulation molded structure, and conductive shield component is formed on the top surface of insulation molded structure.

Description

EMI shielding constructions and its manufacturing method

Technical field

This disclosure relates to electromagnetic interference (EMI) shielding construction and the method for manufacturing EMI shielding constructions.More specifically, this The open method for being related to manufacturing EMI shielding constructions, this method form insulation molded structure using mold and are formed for covering The shielding material of insulation molded structure.

Background technology

Currently, the demand to the portable device in electronics market is increasing, and continue portable in the presence of making Device miniaturization and lightweight are so that the demand that they are easy to carry about with one.In order to make portable device miniaturization and lightweight, it is used for Multiple circuit elements in installation on a printed circuit board (pcb) are integrated into encapsulation technology in single package and for reducing The technology that the size of each electronic unit in a portable device is arranged is necessary.Specifically, the half of high-frequency signal is handled Conductor encapsulation advantageously comprise a variety of electromagnetic interferences (EMI) shielding construction, with improve the realization of EMI or electromagnetic wave impedance operator with And help to minimize.

To achieve it, the EMI shielding constructions of related field shield including the use of made of the metal press process The shielding dam that the structure and formation for covering cover to cover various circuit elements are made of an electrically conducting material is with around the knot of circuit element The EMI shielding constructions of structure, the related field are shielded by the way that insulator to be injected into shielding dam and then be formed on insulator Layer is covered to cover all circuit elements.

In the shielding construction of application shielding case, shielding case should have constant thickness to keep its shape, and answer It should be with each circuit element spacing preset distance to prevent and circuit element short circuit.However, due to the thickness and screen of shielding case The distance between cover and circuit element are covered, there is the limitation for the height for reducing shielding case.This limitation, which may be obstruction, makes shielding The factor of miniaturized structure.In addition, the air gap is formed between shielding case and circuit element.The air gap, which executes, interferes discharge The insulation behavior for the heat released from circuit element.In order to radiate glibly, it should be formed on the top or side of shielding case Venthole.However, since electromagnetic wave is by the venthole leakage being formed on shielding case, there are the reductions of EMI screen effects The problem of.

In addition, as technology develops, high-density installation is used more and more.In the case, due to circuit element it Between gap setting obtain it is very narrow, therefore, it is difficult to by the relevant technologies process manufacture meet needed for the ratio of width to height shielding dam.

Information above is only used as background technical information to present to help to understand the disclosure.About any interior in the above Appearance whether can be used as with the relevant prior art of the disclosure, do not make any determination, and assert any.

Invention content

Technical problem

The aspect of the disclosure will at least solve the problems, such as mentioned above and/or disadvantage, and will at least provide and be described below The advantages of.Therefore, the one side of the disclosure provides a kind of electromagnetic interference (EMI) shielding construction and is resisted against use by being formed In the shielding dam on the insulation molded structure of covering circuit element come the method for manufacturing EMI shielding constructions, which can With applied to the printed circuit board (PCB) for being equipped with circuit element to high-density.

Another aspect of the present disclosure provide a kind of insulating materials that can prevent from being injected into mold mold and PCB it Between the mold encapsulating method that leaks and EMI shielding constructions and the method using this method manufacture EMI shielding constructions.

Technical solution

According to one aspect of the disclosure, a kind of EMI shielding constructions are provided.The EMI shielding constructions include PCB, insulation Molded structure, conductive shield dam and conductive shield component, wherein multiple element is mounted on PCB, and insulation molded structure is configured to Multiple element is covered, conductive shield dam is formed along the side surface of insulation molded structure, and conductive shield component is formed in insulator die On the top surface of plastic composite structural element.

Shield dam can have withThe longitudinal section that shape is formed is to cover side surface and the top table of insulation molded structure Face.

1 can be greater than or equal to by shielding the ratio of width to height on dam:3.In the case, the viscosity for the material for forming shielding dam can be more than Or it is equal to 20000cps.

Installation gap between element may be less than or equal to 0.8mm.

The gradient for shielding the inner surface on dam can be identical as the insulation gradient of side surface of molded structure.Shield the interior of dam Surface can vertically or angularly be formed.

Conductive shield component can be attached to the conductive shield film of the top surface of insulation molded structure.

Conductive shield component can be formed by liquid conduction shielding material, and the liquid conduction shielding material is by nozzle discharge and applies It overlays on the top surface of insulation molded structure.

EMI shielding constructions may also include what conductive and covering shielding dam contacted each other with conductive shield component Partial edge bridge.

Shielding dam can have the lower end being electrically connected with the earth point being formed on PCB.

According to another aspect of the present disclosure, a kind of EMI shielding constructions are provided.The EMI shielding constructions include PCB, mold, Insulate molded structure, conductive shield dam and conductive shield component, wherein multiple element is mounted on PCB, and mold is located on PCB To surround multiple element, aftershaping of the insulation molded structure in being injected into mold simultaneously covers multiple element, conductive shield dam edge The side surface for mold is formed, and conductive shield component covers the top surface of the top surface and insulation molded structure of mold.

Shield dam can have withThe longitudinal section that shape is formed is to cover side surface and the top surface of mold.

Sealant may be provided between the lower end of mold and the top surface of PCB.

According to another aspect of the present disclosure, a kind of method of manufacture EMI shielding constructions is provided.This method includes to mold Fluid sealant, setting mold are provided so that fluid sealant contacts with the surface for being equipped with circuit element thereon of PCB, passes through Insulating materials is injected into and forms insulation molded structure for covering circuit element in mold, removes mold and shape from PCB At the conductive shielding material for covering insulation molded structure.

According to another aspect of the present disclosure, a kind of method of manufacture EMI shielding constructions is provided.This method includes by mold Be arranged to be spaced apart with the PCB for being equipped with circuit element thereon, fluid sealant be injected between mold and PCB, pass through by Insulating materials is injected into and forms insulation molded structure for covering circuit element in mold, removes mold and formation from PCB Conductive shielding material for covering insulation molded structure.

According to another aspect of the present disclosure, a kind of method of manufacture EMI shielding constructions is provided.This method includes on it Being equipped with setting on the PCB of circuit element has the mold for the lower end being connect with sealant, by the way that insulating materials is injected into mould Insulation molded structure for covering circuit element is formed in tool and is formed for covering leading for mold and insulation molded structure Electrical shielding material.

According to another aspect of the present disclosure, a kind of nozzle for forming shielding dam by discharging conductive material is provided. The nozzle includes outlet and leader, wherein conductive material is by outlet drain, and leader is on the longitudinal direction of nozzle Extend from the side of outlet.

In conjunction with the various embodiments described in detail below for disclosing the disclosure of attached drawing, according to described in detail below, sheet Disclosed other aspects, advantage and notable feature will become obvious to those skilled in the art.

Description of the drawings

By following description with reference to the accompanying drawings, the above and other aspects of the certain embodiments of the disclosure, feature and excellent Point will become more apparent from, in the accompanying drawings：

Figure 1A is the sectional view for showing electromagnetic interference (EMI) shielding construction according to embodiment of the present disclosure；

Figure 1B and Fig. 1 C are to show vertically or to be inclined according to the inner surface on the shielding dam of the numerous embodiments of the disclosure The view of the structure tiltedly formed；

Fig. 2A, Fig. 2 B, Fig. 2 C, Fig. 2 D, Fig. 2 E and Fig. 2 F are the manufacture Fig. 1 shown according to the numerous embodiments of the disclosure Shown in EMI shielding constructions process view；

Fig. 3 is shown according to embodiment of the present disclosure using nozzle in the printing for being equipped with circuit element to high-density The exemplary view of the process on shielding dam is formed on the side of insulation molded structure on circuit board (PCB).

Fig. 4 is the block diagram for showing the discharge material equipment for being used to form shielding construction according to embodiment of the present disclosure；

Fig. 5 is to show inputting by the loader being arranged in discharge material equipment according to embodiment of the present disclosure The view of the mobile route of nozzle；

Fig. 6 is the view for the nozzle for showing the discharge material equipment according to embodiment of the present disclosure；

Fig. 7 is the sectional view for showing the EMI shielding constructions according to embodiment of the present disclosure；

Fig. 8 A, Fig. 8 B, Fig. 8 C, Fig. 8 D, Fig. 8 E and Fig. 8 F are shown in the Fig. 7 shown according to the numerous embodiments of the disclosure The view of the process of the EMI shielding constructions gone out；

Fig. 9 is shown according to embodiment of the present disclosure for the screen in EMI shielding constructions shown in electrical connection graph 7 Cover the exemplary sectional view of the shielding bridge of dam and screened film；

Figure 10 A and Figure 10 B are shown according to the numerous embodiments of the disclosure on the top surface of insulation molded structure Coat the exemplary explanatory view of the process of shield member；

Figure 11 A and Figure 11 B are to show to shield dam and shielding according to being formed with cladding process for numerous embodiments of the disclosure The exemplary explanatory view of the process of component；

Figure 12 A and Figure 12 B are shown according to the numerous embodiments of the disclosure when by by the sealing structure of rubber material The view for the phenomenon that part may occur when being applied to the lower end of mold and forming insulation molded structure in the molded structure that insulate；

Figure 13 is the view for showing the mold according to embodiment of the present disclosure, wherein mold is moved to filled with liquid The pallet of sealant is so that the lower end of mold is coated with fluid sealant；

Figure 14 A, Figure 14 B, Figure 14 C, Figure 14 D and Figure 14 E are to show to pass through steaming according to the numerous embodiments of the disclosure Send out the view of the process of fluid sealant manufacture EMI shielding constructions；

Figure 15 A, Figure 15 B, Figure 15 C, Figure 15 D and Figure 15 E are shown according to after the passing through of the numerous embodiments of the disclosure The view of the process of the manufacture EMI shielding constructions of continuous processing removal fluid sealant；

Figure 16 A, Figure 16 B, Figure 16 C, Figure 16 D, Figure 16 E and Figure 16 F are the numerous embodiments shown according to the disclosure The processes of EMI shielding constructions is manufactured between mold and PCB regard by the way that fluid sealant to be injected into after mold is set Figure；

Figure 17 A, Figure 17 B, Figure 17 C, Figure 17 D, Figure 17 E and Figure 17 F are the numerous embodiments shown according to the disclosure By injecting fluid sealant between mold and PCB after mold is arranged and removing fluid sealant by subsequent processing Come manufacture EMI shielding constructions process view；

Figure 18 A, Figure 18 B and Figure 18 C are the processes for showing the manufacture EMI shielding constructions according to disclosed numerous embodiments View, wherein when forming multiple shielding constructions, differently controlled by controlling the amount of insulating materials being injected into mold The height of system insulation molded structure；

Figure 19 A, Figure 19 B, Figure 19 C, Figure 19 D, Figure 19 E, Figure 20 A, Figure 20 B, Figure 20 C, Figure 20 D and Figure 20 E are to show root According to the disclosure numerous embodiments in the case where being removed without mold by including being made in shielding construction by mold Make the view of the process of EMI shielding constructions；

Figure 21 is the stereogram for the mobile telephone terminal for showing the EMI shielding constructions according to embodiment of the present disclosure；With And

Figure 22 is the stereogram for showing the smartwatch with EMI shielding constructions according to embodiment of the present disclosure.

Specific implementation mode

Provide refer to the attached drawing be described below with help comprehensive understanding by claim and its it is equivalent defined by this public affairs The various embodiments opened.It is described below including various details to help to understand, but these descriptions are considered only as example Property.Therefore, those skilled in the art it will be recognized that without departing substantially from the scope of the present disclosure and spirit in the case of, can To be made various changes and modifications to various embodiments described herein.In addition, for clear and brief purpose, can save Slightly to the description of well-known function and structure.

The term and word used in following specifications and appended claims is not limited to dictionary meanings, but only by inventing People is used so that the disclosure can be understood clearly and consistently.Therefore, it copes with obvious in those skilled in the art It is to provide being described below for illustration purposes only and not in order to limit by appended power for the various embodiments of the disclosure The purpose of profit requirement and its disclosure equally limited.

It will be appreciated that unless the context clearly determines otherwise, otherwise singulative " one (a) ", " one (an) " and " this (the) " include plural referents.Thus, for example, including to one or more this surfaces to the citation of " parts surface " Citation.

It will be understood that when element is referred to as in another element "upper" or when with another element " contact ", the element can with it is another One element is in direct contact, or is connect with another element and there are intermediary elements between the element and another element.In addition, will Understand, when element is referred to as directly in another element "upper" or when with another element " being in direct contact ", in the element and another member Intermediary element is not present between part.It will be also understood that other expression of the relationship between explaining element, for example, " ... between ", " between directly existing ... " etc..

Such as term of " first " and " second " used in various embodiments can be used for explaining various elements, and The element is not answered limited by these terms.The purpose that these terms can be used for distinguishing an element and another element.For example, Without departing substantially from the interest field of the various embodiments of the disclosure, first element is referred to alternatively as second element, and Similarly, second element is referred to alternatively as first element.

Term " comprising " or " having " indicate there are feature, number, operation, element and the component described in specification or its Combination, and be not excluded for adding one or more of the other feature, number, operation, element or components or groups thereof.

Unless otherwise defined, the term for otherwise being used to describe various embodiments is to be interpreted as with people in the art Meaning well known to member.

Electromagnetic interference (EMI) shielding construction according to various embodiments can be applied to smart phone, display equipment, can wear Wear equipment etc..

Insulation molded structure is formed using mold according to the EMI shielding constructions of numerous embodiments, and by along exhausted The side moving nozzle of edge molded structure forms shielding dam.Since the side of shielding dam against insulation molded structure is formed, institute High the ratio of width to height is may be formed to have to shield dam.As described above, when the side along insulation molded structure forms shielding dam, The nozzle segment of discharging material can have narrow width so that and EMI shielding constructions can be applied to highly integrated mounting substrate, In the highly integrated mounting substrate, there is very narrow gap between circuit element.

In addition, fluid sealant can be applied according to the EMI shielding constructions of numerous embodiments, to prevent from being injected into mold Insulating materials between mold and printed circuit board (PCB) gap leakage.Fluid sealant can be than insulation It evaporates, and can be removed from PCB at the high temperature of the solidification temperature determined by material of molded structure.When fluid sealant is not by When the material formation of evaporation, fluid sealant can be removed from PCB by subsequent processing after insulation molded structure solidification.

In addition, EMI shielding constructions according to various embodiments shield multiple circuit elements.However, this is not construed as Limitation, and EMI shielding constructions are formed as only shielding single circuit element.

Hereinafter, by be described in detail with reference to the attached drawings said nozzle structure and using nozzle formed shielding dam process with And the example of fluid sealant is used when forming insulation molded structure.

Figure 1A is the sectional view for showing the EMI shielding constructions according to embodiment of the present disclosure.

With reference to figure 1A, EMI shielding constructions 100 may include PCB 110 and multiple circuit elements on PCB 110 115,117 and 119.Multiple circuit elements as heterogeneous circuit element may include integrated circuit (IC) chip, passive element and Dissimilar components.For example, IC chip can be application processor (AP), memory, radio frequency (RF) chip etc., passive element can be Resistor, capacitor, coil etc., and dissimilar components can be connector, card insertion seat, EMI shield members etc..

First connection pad 111 and second connect pad 112 can be patterned on the top surface of PCB 110, with it is multiple Circuit element 115,117 and 119 is electrically connected.Multiple first connection pads 111 and multiple second connection pads 112 can be formed.The One connection pad 111 and second connects pad 112 and is formed as that multiple circuit elements 115,117 and 119 is made to be grounded or transmit letter Number.

Ground pad 114 can pattern on PCB 110.Ground pad 114 may be formed at the top surface exposure of PCB 110 Inside, to prevent the top surface of PCB 110 to be exposed.In the case, ground pad 114 can be formed in PCB 110 The ground plane (not shown) in portion is integrally formed.

Ground pad 114 is formed as that multiple circuit elements 115,117 and 119 is made to be grounded or send signal.When shielding dam 130 when being formed on PCB 110, and the shielding dam 130 that will be described below can be grounded along the formation path on shielding dam 130, or Person is electrically connected with the ground pad 114 in the part for being formed on path and is grounded.

Circuit element 115 may include the multiple connection terminals 116 for connecting the electrical connection of pad 111 with the first of PCB 110.It is more A connection terminal 116 can be formed in ball grid array (BGA) method, such as soldered ball.However, connection terminal 116 is not limited to the side BGA Method, and can in a variety of ways be formed according to the lead format of element 115, for example, Quad Flat No-leads (QFN), plastics draw Line chip carrier (PLCC), quad flat package (QFP), compact package (SOP), the thin shrinkage types of slim SOP/ shrinkage types SOP/ SOP(TSOP/SSOP/TSSOP)。

Other circuit elements 117 and 119 may include connecting at least one of the electrical connection of pad 112 with the second of PCB 110 Connection terminal (not shown).When multiple circuit elements 117 and 119 are mounted on PCB 110, multiple circuit elements 117 and 119 It is low or high than foregoing circuit element 115.Each of circuit element 115,117 and 119 can be spaced pre- spacing with shielding dam 130 From not contacted with shielding dam 130.

It may include for covering multiple circuit elements 115,117 and 119 according to the EMI shielding constructions 100 of embodiment Insulation molded structure 120, along insulation molded structure 120 side formed shielding dam 130 and be formed in insulation molding structure Shield member 140 on the top surface of part 120.

Insulation molded structure 120 can make to insulate between circuit element 115,117 and 119, make each circuit element 115, 117, it insulate between 119 and shielding dam 130 and makes to insulate between each circuit element and shield member 140.

Insulation molded structure 120 can be by the way that insulating materials to be injected into mold 10 and curable dielectric material by is formed. In this case, insulating materials can be in close contact with the outer surface of circuit element 115,117 and 119, and can be by with mobility Material formed, to be flowed into the gap between being formed in 115,117, each of 119 and PCB of circuit element.Insulation Molded structure 120 can be cured by a variety of curing process, such as, room temperature vulcanization, heat cure, ultraviolet curing etc..

Insulating materials can be the thixotropic material or phase-change material (thermoplastic material or thermosetting material for having mobility Material).

Thixotropic material may include synthesizing micronized silica, bentonite, the calcium carbonate of particle surface processing plus hydrogen castor At least one of sesame oil, metallic soap, aluminum stearate, polyamide wax, polyethylene oxide and linseed godied oil.For example, metal Soap may include aluminum stearate.

Phase-change material may include polyurethane, polyureas, polyvinyl chloride, polystyrene, acronitrile-butadiene-styrene (ABS), At least one of polyamide, acrylic acid, epoxy resin, silicones and polybutylene terephthalate (PBT) (PBTP).

Shielding dam 130 can be formed along the side of cured insulation molded structure 120.In the case, shielding dam 130 can Against be formed in insulation molded structure 120 side on, and can cover insulation molded structure 120 side surface and insulation mold A part for the top surface of component 120.As described above, when shielding dam 130 is predetermined such as insulation molded structure 120 against being formed in When in structure, shielding dam 130 is not against other structures (that is, stand alone type) than by shielding dam 130 and forming shape by itself In the case of have higher the ratio of width to height.Herein, the ratio of width to height for shielding dam is height divided by the shielding by that will shield dam 130 The width on dam and the value obtained.As described above, working as against the shielding dam 130 being formed on the side surface of insulation molded structure 120 When with viscosity greater than or equal to about 20000cps, shielding dam 130 may be formed to have more than or equal to 1:3 the ratio of width to height. On the other hand, when the shielding dam 130 formed in a free-standing has the viscosity greater than or equal to about 80000cps, dam 130 is shielded It may be formed to have and be greater than or equal to 1:2 the ratio of width to height.Therefore, as described in embodiment of above, when shielding dam 130 supports By insulate molded structure 120 side surface formed and with low viscosity when, shielding dam 130 can have than when shielding dam 130 with Stand alone type higher the ratio of width to height when being formed.

Shielding dam 130 can be by with can prevent the conductive material of the EMI shielding characters of EMI from being formed.Therefore, dam is shielded 130 can prevent EMI in advance by being blocked in the electromagnetic wave generated in multiple circuit elements 115,117 and 119, these EMI It may influence to include other electronic units in the electronic equipment of EMI shielding constructions 100.In the electricity for including EMI shielding constructions 100 In sub- equipment, it may finally stop the interference of such as electromagnetic wave noise or failure so that can prevent the reliability of product from reducing. As described above, shielding dam 130 can prevent the electricity unavoidably generated during the operating process of circuit element 115,117 and 119 Magnetic wave influences external.

Conductive material can have high viscosity (being greater than or equal to 100000cps) so that shielding dam 130 is formed to have high The ratio of width to height, and keep shape without flowing down in discharge.When material has high viscosity as described above, screen can be increased The ratio of width to height on dam 130 is covered, and therefore can increase the height on shielding dam.

In addition, in the case of two-sided PCB, shielding dam may be formed in front surface, and PCB then may be reversed so that screen Dam is covered to be formed in the rear surface of PCB.In the case, when using having highly viscous conductive material, it is formed in front surface On shielding dam can not flow downward and keep its shape as it is.Therefore, entire worked with can quickly carry out The advantages of journey.

Specifically, the conductive material for being used to form shielding dam 130 can be with leading more than or equal to 1.0E+04S/m The conductive material of electric rate.This conductive material may include conductive filler and binder resin.

The metals such as Ag, Cu, Ni, Al, Sn can be used, using such as carbon black, carbon nanotube (CNT), stone in conductive filler The conductive carbons such as ink, using the metal coating materials such as Ag/Cu, Ag/ glass fibre, Ni/ graphite or using such as polypyrrole, The conducting polymer materials such as polyaniline.In addition, conductive filler can be with Type of laminate, sphere type, bar type and dendroid class The formation of any one or combination of type.

Silicon resin, epoxy resin, polyurethane resin, alkyd resin etc. can be used in binder resin.It is used to form shielding dam 130 material can include additionally additive (viscosity agent, antioxidant, polymeric surfactant etc.) and solvent (water, alcohol Deng) to enhance other functions.

Figure 1B and Fig. 1 C are to show vertically or to be inclined according to the inner surface on the shielding dam of the numerous embodiments of the disclosure The view of the structure tiltedly formed.

Referring to figs. 1A to Fig. 1 C, shielding dam 130 can be resisted against on the side of insulation molded structure 120 and be formed, and can A part for the side surface of covering insulation molded structure 120 and the top surface of insulation molded structure 120.Therefore, such as institute in Figure 1B Show, shield dam 130 longitudinal cross-section withShape formed.In the case, the inner surface 130c on shielding dam 130 can be with The inner surface gradient having the same of the side surface 120c of insulation molded structure 120.As shown in fig. 1b, when insulation molds structure When the side surface 120c of part 120 is perpendicular to the top surface of PCB 110, the inner surface 130c on shielding dam 130 can be vertical.This Outside, as is shown in fig. 1C, when insulation molded structure 120 is formed to have the lower part longer than upper part and therefore insulation molding When the side surface 120d of component 120 is tilted, the inner surface 130d for shielding dam 130 can be with the side surface of insulation molded structure 120 The inner surface gradient having the same of 120d.On the other hand, when shielding dam is formed in a free-standing, (shielding dam is formed to have pre- Fixed the ratio of width to height and be not against other structures) when, the width of upside can be more than by shielding the width of the downside on dam.Therefore, with independence The inner surface on the shielding dam that formula is formed is in the direction opposite with the shielding inclined direction of inner surface 130d on dam 130 of embodiment It is upper that there is gradient.

With reference to figure 1B, the upper end 130e and shield member being formed on the upside of insulation molded structure 120 on shielding dam 130 140 edge 140e contacts so that shielding dam 130 can fully cover the outer surface of insulation molded structure 120.In this situation Under, shielding a part of the upper end 130e on dam 130 can be covered by the edge 140e of shield member 140.

Shield member 140 can by as shielding dam 130 like that have mobility conductive material be formed, and can by with shielding The identical material of above-mentioned material on dam 130 is formed.

Shield member 140 may be formed on the top surface of insulation molded structure 120.When shielding dam 130 is molded along insulation When the side of component 120 is formed, the upper end 131 on shielding dam 130 protrudes the top surface higher than insulation molded structure 120.Therefore, Space for filling shield member 140 may be provided at the top surface of insulation molded structure 120.

When the top surface for the molded structure 120 that insulate is filled with shield member 140, shield member 140 can be with shielding dam 130 Upper end 131 contact and with shielding dam 130 upper end 131 be electrically connected.Therefore, it shields dam 130 and shield member 140 wraps completely Enclose the outside of insulation molded structure 120 so that best shielding construction may be implemented.

Hereinafter, the manufacture of EMI shielding constructions 100 according to embodiment will successively be described with reference to figure 2A to Fig. 2 F Journey.

Fig. 2A to Fig. 2 F is the manufacturing process for the EMI shielding constructions for showing the various embodiments according to the disclosure successively View.

With reference to figure 2A and Fig. 2 B, when being equipped with thereon in such as Fig. 2A of PCB 110 of multiple circuit elements 115,117 and 119 It is shown when being loaded into operating position, as shown in Figure 2 B, insulation molding structure is used to form by what mold 10 was arranged in PCB 110 On the position of part 120.

With reference to figure 2C, the insulating materials with mobility is injected into the inside 11 of mold 10, and then PCB 110 It is put into baking oven (not shown) and is heated during the scheduled time with curable dielectric material with predetermined temperature.It is solidificated in mold 10 Inside 11 in insulating materials become insulate molded structure 120.

With reference to figure 2D, in response to forming the molded structure 120 that insulate, PCB 110 is pulled out from baking oven, and then by mold 10 remove from PCB 110.

With reference to figure 2E and Fig. 2 F, by the side along insulation molded structure 120, continuously discharge is predetermined as shown in fig. 2e The conductive material of amount forms the one of the side surface for covering insulation molded structure 120 and the top surface of insulation molded structure 120 The partly shielding dam 130 at (edge).As shown in figure 2f, insulation molded structure 120, which has, is formed in insulation molded structure 120 Shield member 140 on upper surface.Discharge (the ginseng of nozzle 216 that conductive material is moved from the side along insulation molded structure 120 See Fig. 3).

With reference to figure 3, nozzle 216 has the outlet 216a being formed at its lower end and on the longitudinal direction of nozzle 216 From the leader 216b of the side definite length extended of outlet 216a.In the case, nozzle 216 may be arranged such that outlet 216a is higher than the top surface of insulation molded structure 120, and leader 216b is in the side surface of insulation molded structure 120 and in advance Determine to move between circuit element 20.Leader 216b is by the material guiding discharged from outlet 216a at direction insulation molded structure 120 side surface movement.

In view of nozzle 216 should smoothly move on the PCB of highly integrated installation, the discharge material of nozzle 216 is formed The shape of the part of material.That is, in the case of the PCB of highly integrated installation, between circuit element 115 and circuit element 20 between Gap (g1) be arranged to it is very narrow, be less than or equal to 0.8 millimeter.When assuming that the gap (g1) between element is 0.8 millimeter, nozzle 216 overall diameter (D) may be configured as 0.9 millimeter, and thickness (t) may be configured as 0.1 millimeter, and interior diameter (d) may be configured as 0.8 Millimeter.Herein, the interior diameter (d) of nozzle 216 can be identical as the outlet diameter of 216a.What from outlet, 216a was extended downwardly draws Predetermined length (L) and preset width (w) can be had by leading part 216b.In the case, when leader 216b settings are being insulated When between the side surface and circuit member 20 of molded structure 120, as long as maintaining side and the insulation molding structure of leader 216a Gap between the side surface of part 120, and maintain the gap between the other side of leader 216b and circuit element 20, then The width (w) of leader 216b is just enough.For example, when from the other side of leader 216b to insulation molded structure When the distance (g2) of 120 side surface is 0.5 millimeter, the side surface of the side and insulation molded structure 120 of leader 216b Between gap (g3) 0.1 millimeter can be remained.

A part by exporting the material of 216a discharges is contiguously discharged with leader 216b.In the case, material The part of material contacted with leader 216b can be in material and leader in the inner surface of contact guidance part 216b Frictional resistance is generated between 216b, and the another part of material not contacted with leader 216b will not pass through leader 216b generates frictional resistance, or is hardly influenced by frictional resistance, and therefore, material is relatively rapidly discharged.

As described above, occurring when by exporting the material of 216a discharges, from exporting when 216a overflows, there are the differences of mass rate of emission Different phenomenon.The length (L) of this phenomenon setting leader 216b can be directed to.For example, nozzle 216 can be connected by exporting 216a Continuous ground discharging material, while being moved along the side of insulation molded structure 120 with constant speed.In the case, work as guiding When the length of part 216b is too long, existing with leader 216b adjacent portion materials in the material that 216a is discharged from outlet It is moved before being directed into the lower end of leader 216b towards insulation molded structure 120.For this purpose, shielding dam 130 can have The lower part thinner than upper part, or the lower part of the side surface of insulation molded structure 120 may not be covered.In addition, when guiding Too in short-term, shielding 130 lower part of dam may be thicker than upper part for the length of part 216b, or shielding dam 130 may not cover absolutely The upper part of the side surface of edge molded structure 120.Therefore, because the length (L) of leader 216b can influence to shield dam 130 It is formed, therefore can be according to the length (L) for highly appropriately forming leader 216b of insulation molded structure 120.

In addition, the inner surface of leader 216b is formed as towards insulation molded structure 120, to work as 216 edge of nozzle Makes to move towards insulation molded structure 120 by exporting the material of 216a discharges when insulation molded structure 120 moves, to shape At shielding dam 130.

Fig. 4 is the block diagram for showing the discharge material equipment for being used to form shielding construction according to embodiment of the present disclosure.

Can be 3D printer according to the discharge material equipment for being used to form EMI shielding constructions of embodiment.

With reference to figure 4, as an example, discharge material equipment 200 may include a nozzle 216.However, this is understood not to Limitation, and discharge material equipment 200 may include multiple nozzles.Specifically, discharge material equipment 200 may include thering is different length Multiple nozzles of the leader 216b of degree, to form the screen with different height on the side of insulation molded structure 120 Cover dam 130.

Discharge material equipment 200 may include distributor 212 to discharge the material of predetermined amount.Distributor 212 may include being used for The storage room 211 of storage material and nozzle 216 for discharging the material provided from storage room 211.

In addition, distributor 212 may include the X-Y- for the moving nozzle 216 in X-direction, Y direction and Z-direction Z axis mobile unit 231 and in the clockwise direction or in the counterclockwise direction swivel nozzle 216 or the nozzle that stops rotating 216 rotating driver 219.X-Y-Z axis mobile unit 231 may include for being moved up in X-direction, Y direction and Z-direction Multiple motor (not shown) of dynamic nozzle 216, and may be connected to and the nozzle installation unit of nozzle 216 is wherein installed (does not show Go out), to which the driving force of stepper motor is transferred to nozzle 216.Rotating driver 219 may include for providing rotary power Motor (not shown) and (do not show to control the encoder of the rotation angle of nozzle 216 for the number of the rotation by detection-sensitive motor Go out).X-Y-Z axis mobile unit 231 and rotating driver 219 may be electrically connected to controller 250 and can be controlled by controller 250 System.

In discharge material equipment 200, when the outlet of nozzle 216 is cleaned or replaces nozzle 216 with new nozzle, spray The end of the discharging material of mouth may not overlap accurately with preset installation position.Therefore, nozzle location detection is provided with to pass Sensor 232 is nozzle 216 to be set in installation position.

Vision camera can be used in nozzle location detection sensor 232, and can be with the pre- spacing in downside interval of nozzle 216 From.The position of the end of nozzle can refer to the calibration of nozzle by the image reading that is shot by nozzle location detection sensor 232, And it can be compared with the origin value for the nozzle being stored in advance in memory 251, and nozzle 216 can be in X-axis and Y-axis Mobile value identical with difference so that the end of nozzle is overlapped with the origin of nozzle.In the case, nozzle 216 can pass through drive It moves 231 moving nozzle installation unit of X-Y-Z axis mobile unit and moves.

When PCB, which is loaded into, to be used to form in shielding dam location, discharge material equipment 200 can detect PCB and be placed with Posture in the X-Y plane state of PCB, and the starting point (Ap) of nozzle 216 can be set for discharging material.Discharge material is set Standby 200 may include the reference positions PCB detection sensor 233 and PCB height detection sensors 234, to be detected after loading PCB The posture of PCB.

The reference positions PCB detection sensor 233 is the sensor for determining PCB loading original positions, and can be used and regard Feel camera.The reference positions PCB detection sensor 233 is detectable be loaded into working space with formed shielding construction PCB whether In predeterminated position or how much PCB deviates predeterminated position.For example, when PCB is loaded into operating position, controller 250 The first reference that the reference positions PCB detection sensor 233 can be moved to the coordinate of preset first reference marker, shoot PCB Label, and then compare the first reference marker of current shooting and preset first reference marker, and the reference positions PCB are examined It surveys sensor 233 and can determine whether PCB is in original position.

Determine that PCB is in original position in response to the reference positions PCB detection sensor 233, controller 250 can calculate current Alternate position spike between the coordinate of first reference marker and the coordinate of preset first reference marker.Controller 250 can be by in terms of Calculate the coordinate and preset second of the first reference marker sat the identical method of calibration method and calculate the second current reference marker Alternate position spike between the coordinate of reference marker.

Discharge material equipment 200 may include PCB supply and removable unit 235, for by PCB be loaded into operating position with Shielding dam is formed on PCB, and unloads PCB after forming shielding dam.

Discharge material equipment 200 may include PCB heater 236 PCB is heated to predetermined temperature, to reduce dry formed Shielding dam 130 needed for time.

Discharge material equipment 200 may include that loader 253, user directly input the movement of nozzle 216 by loader 253 Path.

Loader 253 can by using for executing touch input touch screen or regular keypad realize.User Ke Tong Cross the path of 253 input nozzle of loader.For example, user can input nozzle path spray that is primary, and inputting by this method The path data of mouth is storable in memory 251.The path data of nozzle can be changed later.

The process in the path as described above by 253 input nozzle of loader is described below.

First, using the reference positions PCB detection sensor 233 (for example, it may be vision camera and hereinafter can quilt Referred to as vision camera) at least two reference markers being shown on the PCB being loaded into operating position are shot, measure two references The distance between label, and the distance between two reference markers value and reference picture are then collectively stored in memory In 251.When PCB has rectangular shape, two reference markers can be displayed under the upper end in left side and the right side of PCB of PCB At end.In the case, the distance between two reference markers can substantially indicate cornerwise length of PCB.

Specifically, be loaded onto in operating position in response to PCB, user can by the forward button of loader 253, backward Vision camera is moved to the position for including the first reference marker at the upper end in left side by button, left button and right button (for example, with reference to the center of the first reference marker or part of the first reference marker), and then, in response to pressing loader 253 save button, controller 250 can be obtained by calculating distance of first reference marker away from preset origin (0,0,0) The coordinate (X1, Y1, Z1) of first reference marker, and coordinate is stored in memory 251.The vision phase moved together with nozzle The camera site of machine can offset nozzle center preset distance.Therefore, deviant can be considered by controller 250 to calculate the first ginseng Examine the coordinate (X1, Y1, Z1) of label.In addition, pressing shooting button in response to user, the image of the first reference marker is stored in In memory 251.

User can be moved vision camera by the forward button of loader 253, back button, left button and right button The position for the second reference marker being shown at the lower end on right side is moved (for example, with reference to the center of the second reference marker or second A part for reference marker), and then, in response to pressing the save button of loader 253, controller 250 can pass through calculating Distance of second reference marker away from default origin (0,0,0) obtains the coordinate (X2, Y2, Z2) of the second reference marker, and will sit Mark is stored in memory 251.In addition, pressing shooting button in response to user, the image of the second reference marker is stored in and is deposited In reservoir 251.It can be in the identical mode of process with the coordinate (X1, Y1, Z1) described above for calculating the first reference marker Deviant is considered by controller 250 to calculate the coordinate (X2, Y2, Z2) of the second reference marker.

The position of the first reference marker detected as described above and the second reference marker can be used to count in controller 250 The distance between two positions are calculated, and the distance is stored in memory 251.

User can be used forward button, back button, left button and the right button of loader 253 along will be formed in The path moving-vision camera on the shielding dam on PCB, and multiple coordinates on the mobile route of nozzle can be inputted, simultaneously It is visually inspected the realtime graphic shot by vision camera.At the specified point that vision camera is located on the mobile route of nozzle When, corresponding coordinate can be inputted by pressing the coordinate load button of loader 253.The coordinate inputted by this method is stored in In reservoir 251.

As will be described below, multiple coordinates may include that nozzle starts the seat of the point (Ap, referring to Fig. 5) of discharging material Mark, nozzle complete the point (almost adjacent with starting point (Ap) when forming shielding dam, to depict the curve of closure) of discharge Coordinate and nozzle should change the coordinate of the point (Bp, Cp, Dp, Ep and Fp, referring to Fig. 5) at direction when moving.

In addition, in order to which the mobile route to nozzle is programmed, loader 253 may include various order buttons, such as with The line button that is moved while nozzle to be moved to the movable button of specified coordinate, is used to indicate nozzle in discharging material and For changing the rotation button of the moving direction of nozzle.User can be generated by matching order button with coordinate and rotation angle The mobile route of nozzle.

In response to by the mobile route of the nozzle of user program, controller 250 can be by making nozzle edge as described above Discharging material automatically forms shielding dam when mobile route movement.

The nozzle path data inputted as described above by loader 253 are storable in memory 251.According to storage Nozzle path data in memory 251, controller 250 can be by driving X-Y-Z axis mobile unit 231 and rotating driver 219 come along the path moving nozzle pre-entered.Nozzle path data may include top surface of the nozzle 216 along PCB 110 The distance of linear movement and direction of rotation and the rotation angle of nozzle 216.

In the present embodiment, user directly inputs the mobile route of nozzle by loader 253.However, this should not be by It is construed to limit, and nozzle mobile route can be stored in advance in memory 251.In the case, it can prestore and root The corresponding multiple nozzle mobile routes of pattern on the different shielding dams formed according to product are with corresponding with the pattern.In addition, in addition to Except the mobile route of nozzle, the calibration information of nozzle, the reference position information of nozzle, the reference positions PCB information, PCB references Elevation information can be stored in advance in by loader 253 in memory 251.

Fig. 5 is to show inputting by the loader being arranged in discharge material equipment according to embodiment of the present disclosure The view of the mobile route of nozzle.

With reference to figure 5, nozzle 216 can be moved based on nozzle path data along the path for being used to form shielding dam.

Nozzle 216 is arranged at coordinate corresponding with starting point (Ap).In the case, controller 250 can determine molding structure Direction set by part 120 and by driving swivel nozzle 216 at a predetermined angle of rotating driver 219 so that leader 216 Inner surface towards insulation molded structure 120 side surface.

The nozzle 216 at coordinate corresponding with starting point (Ap) is set in by X-Y-Z axis mobile unit 231 in+Y direction The upper distance identical with section A that moves linearly.Next, section that nozzle 216 is bent along path (including jointing A and The section of the point (Bp) of section B) it is mobile.In the case, nozzle 216 by X-Y-Z axis mobile unit 231 along nozzle road While diameter moves, nozzle 261 can be rotated by rotating driver 219 so that the inner surface of leader 216b keep towards Insulate molded structure 120.

In response to the section of 216 passage path of nozzle bending, nozzle 216 is by X-Y-Z axis mobile unit 231 in X-axis side Linear movement distance identical with section B upwards.By this method, nozzle 216 can be moved by rotating driver 219 and X-Y-Z axis Moving cell 231 is linearly moved and is rotated through other section B, C, D, E and F, and is subsequently returned to starting point (Ap).Then, Nozzle 216 completes moving along path.

Fig. 6 is the view for showing the outlet according to embodiment of the present disclosure, and the material for being used to form shielding dam passes through this Export the nozzle discharge from discharge material equipment.

With reference to figure 6, nozzle 216 is being moved by X-Y-Z axis mobile unit 231 and is being rotated by rotating driver 219 When pass through export 216a discharging materials.

Outlet 216a can be formed towards the downside of nozzle 216, and leader 216b can be in the longitudinal direction of nozzle 216 On from outlet 216a lower end extend downwardly.

As shown in Figure 3, it is arranged in the position for discharging material with along insulation molded structure in response to nozzle 216 120 side forms shielding dam 130, and outlet 216a can have the part being located on the top surface of insulation molded structure 120, So that a part (edge) for the top surface of material covering insulation molded structure 120.Leader 216b settings are molded in insulation Between component 120 and circuit element 20, and it is arranged to not touch insulation molded structure 120 and circuit when nozzle 216 moves Element 20.

The downside that leader 216b guiding passes through the material towards the insulation molded structure 120 that export 216a discharges is moved, And at the same time being molded towards insulation by preventing material to be moved upward to guiding material in the side far from insulation molded structure 120 Component 120 moves.

Nozzle 216 along the path for being preset as being formed shielding dam 130 while moving in insulation 120 side table of molded structure Shielding dam 130 is formed on face and top surface, and at the same time directing material into ground pad 114 to be contacted with ground pad 114.

EMI shielding constructions 100 described above by the conductive material with mobility with by being injected into insulation molding The shield member 140 formed on the top surface of component 120, to the top surface of shielding insulation molded structure 120.Below In, the knot shielded by the way that the shield member 140 of film type to be attached to the top surface of insulation molded structure 120 will be described Structure.

Fig. 7 is the sectional view for showing the EMI shielding constructions according to embodiment of the present disclosure.

Fig. 8 A to Fig. 8 F are the mistakes of EMI shielding constructions shown in Fig. 7 for showing according to the numerous embodiments of the disclosure The view of journey.

With reference to figure 7, EMI shielding constructions 100a has to be used in method identical with EMI shielding constructions 100 described above The insulation molded structure 120 that mold 10 is formed, and EMI shielding constructions 100a and above-mentioned EMI shielding constructions 100 is slightly different Place is to have used conductive shield film 150, and shielding dam 130 is formed after forming conductive shield film 150.

Hereinafter, the manufacture of EMI shielding constructions 100a according to embodiment will successively be described with reference to figure 8A to Fig. 8 F Process.

With reference to figure 8A and Fig. 8 B, when the PCB 110 for being equipped with multiple circuit elements thereon is loaded into operating position, mould Tool 10 is arranged in being formed on the position of insulation molded structure 120 for PCB 110 as shown in figure 8B.

With reference to figure 8C, the insulating materials with mobility is injected into the inside 11 of mold 10, and then 110 quilts of PCB It puts into and is heated with curable dielectric material in baking oven (not shown) and during the scheduled time with predetermined temperature.In the inside of mold 10 Cured insulating materials becomes the molded structure 120 that insulate in 11.

PCB 110 is pulled out from baking oven, and then by mould in response to foring insulation molded structure 120 with reference to figure 8D Tool 10 is removed from PCB 110.

With reference to figure 8E and Fig. 8 F, conductive shield film 150 is attached to the top surface of insulation molded structure 120.In the case, The size of conductive shield film 150 can be identical as the insulation size of top surface of molded structure 120.This is in order to by forming screen Covering makes the upper end 131 on shielding dam 130 be realized completely with partly overlapping on conductive shield film 150 in the subsequent processing on dam 130 Shielding is without generating gap.The size of conductive shield film 150 can be slightly less than the size of the top surface of insulation molded structure 120. In this case it is desirable to which the upper end 131 for shielding dam 130 is formed to have certain length to cover the side of conductive shield film 150 Edge.

After the top surface that conductive shield film 150 is attached to insulation molded structure 120, by nozzle 216 along exhausted The conductive material that predetermined amount is continuously discharged while the side movement of edge molded structure 120 is formed for covering insulation molding structure The shielding dam 130 of the side surface of part 120 and a part (edge) for conductive shield film 150.

Fig. 9 be shielding dam in the EMI shielding constructions for electrical connection graph 7 shown according to embodiment of the present disclosure and The exemplary sectional view of the shielding bridge of conductive shield film.

With reference to figure 9, in EMI shielding constructions 100b, when the size of conductive shield film 150 is less than insulation molded structure 120 Top surface size when, conductive shield film 150 do not cover insulation molded structure 120 top surface edge, so as to cause There are predetermined gaps between the upper end 131 and conductive shield film 150 on shielding dam 150.Therefore, electromagnetic wave can be let out by this gap Leakage, and shield effectiveness can deteriorate.

In the case, the gap generated between the upper end 131 and conductive shield film 150 in order to fill shielding dam 130, side Edge bridge 160 is formed as Chong Die with the upper end 131 on shielding dam 130 and conductive shield film 150 simultaneously.Edge bridge 160 can by with screen The conductive material with mobility for covering the material identical on dam 130 is formed.The material for being used to form edge bridge 160 has flowing Property so that the material can effectively be filled in the gap generated between the upper end 131 and conductive shield film 150 on shielding dam 130.

Edge bridge 160 can be in electrical contact with shielding dam 130 and conductive shield film 150, and can be by being covered in shielding dam The gap generated between 130 upper end 131 and conductive shield film 150 prevents shield effectiveness from deteriorating.

Figure 10 A and Figure 10 B are shown according to the numerous embodiments of the disclosure on the top surface of insulation molded structure Coat the exemplary explanatory view of the process of shield member.

With reference to figure 10A and Figure 10 B, as described above, conductive shield film 150 could attach to the top table of insulation molded structure 120 Face, but this is understood not to limit.Shield member can be formed in painting method on the top surface of insulation molded structure.

That is, forming insulation molded structure 120 using mold 10 and forming shielding dam on the side of insulation molded structure 120 130 to form EMI shielding constructions 100'Process it is identical as the process of formation EMI shielding constructions 100 described above.It is being formed After shielding dam 130, as shown in Figure 10 B, insulation molding structure can be ejected by the conductive material of self-injection in future nozzle 190 The shield member 150&apos with predetermined thickness is formed on the top surface of part;, as shown in Figure 10 A, by making 190 edge of injection nozzle Conductive material is ejected on the top surface of insulation molded structure 120 by the upside movement for insulation molded structure 120.In this feelings Under condition, as long as not exposing insulation molded structure 120, then quantity of material to be sprayed is enough.

When spraying conductive material, the sprayable upper part at covering shielding dam 130 of conductive material, and can not shield Component 150'Gap is generated between shielding dam 130, so as to realize complete shielding.

In the examples described above, the coating shield member 150&apos after forming shielding dam 130;.However, this is understood not to Limitation.It can be in shield member 150'Shielding dam 130 is formed after on top surface coated in insulation molded structure 120.

In addition, shield member 150'Can with replace spray coating method described above a variety of methods (such as, silk-screen printing, Inkjet printing etc.) it is coated on the top surface of insulation molded structure 120.

Although not shown in figures, in shield member 150'On top surface coated in insulation molded structure 120 Later, shielding dam 130 can be formed along the side surface of insulation molded structure 120.

In the case, shield member 150&apos is formed;The viscosity of material can be greater than or equal to about 10000cps, to prevent Shield member 150 flows downward from the top surface of insulation molded structure 120.

Figure 11 A and Figure 11 B are to show to shield dam and shielding according to being formed with cladding process for numerous embodiments of the disclosure The exemplary explanatory view of the process of component.

With reference to figure 11A and Figure 11 B, insulation molded structure 120 is formed to form EMI shielding constructions 100&quot using mold 10;'s Process is identical as the process of EMI structures 100 described above is formed.After forming insulation molded structure 120, it can pass through and such as scheme Shown in 11A while so that injection nozzle 190 is moved along the upside of insulation molded structure 120 self-injection in future nozzle 190 Conductive material be ejected into ground pad 114 and insulate molded structure 120 side surface and top surface on and such as institute in Figure 11 B Show and forms shielding dam 130&quot together each other;With shield member 150".In the case, due to shielding dam 130"It may be formed to have With shield member 150"Thickness is identical or similar thickness, therefore shield dam 130"Than shielding dam 130&apos described above; It is thin.

Due to shielding dam 130"With shield member 150"Insulation molded structure is coated in during single by spray coating method On 120, therefore processing time can be reduced, and be less likely in shield member 130"With shielding dam 150"Between generate between Gap.

In addition, shielding dam 130"With shield member 150"It can be to replace a variety of typical methods of spray coating method described above (such as, silk-screen printing, inkjet printing etc.) is coated on the top surface of insulation molded structure 120.

Figure 12 A and Figure 12 B are shown according to the numerous embodiments of the disclosure when by by the sealing structure of rubber material Part is applied to the lower end of mold to form view the phenomenon that may occurring in the molded structure that insulate when insulation molded structure.

With reference to figure 12A and Figure 12 B, during forming insulation molded structure 120 on PCB 110, when under mold 10 When end 15 is not in close contact with the top surface of PCB 110 completely, the insulating materials being injected into the inside 11 of mold 10 may lead to Cross the clearance leakage being formed between the lower end 15 of mold 10 and the top surface of PCB 110.

In order to prevent this situation, the containment member 12 made of rubber material can be connect with the lower end 15 of mold 10. In this case, due to containment member 12 have elasticity, when mold 10 be arranged on PCB 110 when, containment member 120 with The top surface of PCB 110 is in close contact, outer so as to prevent the insulating materials being injected into the inside 11 of mold 10 from leaking into Portion.

However, when long-time uses containment member 12, elasticity can reduce.Therefore, as shown in figure 12a, containment member 120 may be deformed to the inside and outside protrusion for making its opposite side be respectively facing mold 10.The side surface of insulation molded structure 120 Lower part can be cured into recessed groove 120a, recessed groove 120a by containment member 12 11 side outstanding of inside towards mold 10 Portion 12a is formed.However, when the side surface for the molded structure 120 that insulate is not formed flatly, it may be difficult to according to scheduled wide high Than forming shielding dam 130 on the side of insulation molded structure 120.This may lead to the defects of product, such as from nozzle 216 A part for the conductive material of the predetermined amount for being used to form shielding dam 130 of discharge is flowed into slot 120a, and is therefore reduced Shield the height on dam 130.

In addition, as shown in Figure 12B, after insulation molded structure 120 cures, when removing mold 10 from PCB 110, The a part of of side surface of insulation molded structure 120 may be by 11 side outstanding of inside towards mold 10 of containment member 12 12a is pulled up in the side for removing mold 10, and the lower part 120b for the molded structure 120 that insulate may be with the top table of PCB 100 Face 110a is detached.

In order to avoid this problem, it should replace the containment member 120 of deformation with new containment member 120, this leads to inconvenience Property.Additionally, there are while replacing containment member 12 should stopped process the problem of.

The disclosure can be solved using fluid sealant since the containment member 12 of rubber material is applied to mold 10 and The above problem of appearance.Fluid sealant can replace containment member 12.Since the insulating materials in being injected into mold 10 is complete Fluid sealant is evaporated after solidification, therefore fluid sealant will not be such that the side surface of insulation molded structure 120 deforms.This Outside, when removing mold 10 from PCB 110 after being fully cured in the molded structure 120 that insulate, fluid sealant has evaporated simultaneously It disappears.Therefore fluid sealant does not interfere with insulation molded structure 120.

Fluid sealant should use the material not mixed with the liquid insulating material being injected into inside mold 10, and answer There should be good wetability (or spreadability), it is on the lower end 15 of mold 10 and not disconnected to be coated in well, Fluid sealant should be with low dispersibility with predetermined shape, and should be solid by mold component after the mold is removed Change condition or subsequent processing and be readily removable, and residue should not be left.To achieve it, fluid sealant exists Spreadability and dispersibility on the surface of PCB should be than weak on the surface of mold.

Herein, the spreadability of fluid sealant refers to keep through the coating liquid on the lower end of mold 10 15 Body sealant and the property of the shape of continuous film formed.Dispersibility is referred to being kept the shape of film in the form of wall and prevents film Shape be thin and wide coated shape property.Unit for measuring spreadability and dispersibility can be that contact angle (works as liquid Body is in the angle formed the when of thermodynamically balancing on a solid surface).In addition, the unit for measuring spreadability and dispersibility Can be the surface tension of fluid sealant or the surface energy of mold and PCB.

In addition, fluid sealant should have the boiling point higher than the solidification temperature of insulating materials so that fluid sealant can To evaporate and be removed under the solidification temperature of insulating materials.This is because when the boiling point of fluid sealant is close to insulating materials Solidification temperature when, bubble may be generated by boiling while insulating materials cures, and therefore exist and cause defect High likelihood.In addition, fluid sealant at room temperature should with low vapor pressure, should with than insulate molded structure The slow evaporation rate of 120 curing rates, and should be formed by non-fusible or change insulation molded structure material.

Homogenous material or the mixing material based on water can be used in the fluid sealant for meeting above-mentioned condition.Work as fluid sealant For homogenous material when, fluid sealant can be diethylene glycol monobutyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, three sweet Alcohol monobutyl ether, diethylene glycol monomethyl ether, glycol monoethyl ether, triethylene glycol monomethyl ether etc..

When fluid sealant is mixing material, fluid sealant can be based on water and methoxypropanol, isopropyl can be used Alcohol (IPA), ethyl alcohol, methanol, anion surfactant, cationic surfactant, nonionic surfactant etc. are as use In control wetability additive, and can be used glycerine, ethylene glycol, diethylene glycol (DEG), triethylene glycol, propylene glycol, dipropylene glycol, oneself two Alcohol, 1,3 butylene glycol, 1,4- butanediols, 1,5- pentanediols, 2- butylene-1,4-diols, 2- methyl -2- pentanediols etc. are used as and are used for Control volatile additive.

Fluid sealant can be formed by mixing water and for controlling the additive of wetability.In addition, fluid sealant It can be formed by mixing water, the additive for controlling wetability and for controlling volatile additive.It can be according to material Material differently sets the component ratio of fluid sealant.

Hereinafter, description is formed into insulation molded structure 120 according to numerous embodiments using fluid sealant Process.

Figure 13 is the view for showing the mold according to embodiment of the present disclosure, wherein mold is moved to filled with liquid The pallet of sealant is so that the lower end of mold is coated with fluid sealant.

Figure 14 A to Figure 14 E are to show to be manufactured by evaporating fluid sealant according to the numerous embodiments of the disclosure The view of the process of EMI shielding constructions.

With reference to figure 13, mold 10 may be connected to robotic arm 50 (or being held by robotic arm 50) and be moved to close filled with liquid Seal the pallet 31 of agent 30 and the die location for forming insulation molded structure 120 on PCB.On being placed on PCB 110 Before, mold 10 can be moved to the upside of pallet 31 by robotic arm 50, and then decline so that the lower end 15 of mold 10 applies It is covered with fluid sealant 30.

With reference to figure 14A to Figure 14 E, in the case where lower end 15 is coated with fluid sealant 30 as shown in fig. 14 a, mold 10 are moved to die location by robotic arm 50, and as shown in Figure 14 B, mold 10 is placed on PCB 110.Since liquid is close The intimate surface contact of agent 30 and PCB 110 is sealed, therefore as shown in Figure 14 C, the insulation material being injected into the inside of mold 10 Material will not leak between mold 10 and PCB.

After insulating materials is injected into 10 inside of mold and PCB 110 is placed in baking oven, it is arranged in response to PCB 110 To predetermined temperature, insulating materials cures at the first temperature.It is increased above consolidating for insulating materials in response to the temperature in baking oven Change the evaporating temperature of the fluid sealant of temperature, fluid sealant 30 evaporates.Therefore, as shown in fig. 14d, fluid sealant 30 It disappears between mold 10 and PCB 110, and forms empty space.

In this case, as shown in Figure 14 E, in response to removing mold 10 from PCB 110, insulation molded structure 120 can Flat side surface is formed to have without being damaged by mold 10 or containment member 12.Although subsequently mistake is not shown Journey, but after removing mold 10 as described above, it can be by driving nozzle 216 (referring to Fig. 2 E) along insulation molded structure 120 side forms shielding dam 130, and then, can be by the way that conductive material to be injected into the top surface of insulation molded structure 120 Upper (referring to Fig. 2 F) forms shield member 140.

As shown in Figure 14 E, after removing mold 10 from PCB 110, as described above, screened film 150 could attach to absolutely The top surface (referring to Fig. 8 E) of edge molded structure 120, and can be by driving nozzle 216 along the side of insulation molded structure 120 Portion forms shielding dam 130 (referring to Fig. 8 F).

Figure 15 A to Figure 15 E are to show to remove hydraulic seal by subsequent processing according to the numerous embodiments of the disclosure Agent manufactures the view of the process of EMI shielding constructions.

Due to the process in Figure 15 A to Figure 15 C and the process phase in Figure 14 A to Figure 14 C in above-mentioned numerous embodiments Together, therefore description to identical process is omitted, and subsequent process will be described.

With reference to figure 15D, fluid sealant 30 can by cure in an oven insulation molded structure 120 during it is unvaporized Material is formed.

With reference to figure 15E, after removing mold 10 from PCB 110, can liquid be scraped by using scheduled exfoliation tool Sealant 30 completely removes fluid sealant 30 from PCB 110.

In the case, without using exfoliation tool, the fluid sealant 30 remained on PCB 110 can lead to It crosses and heats and remove at high temperature.Specifically, the fluid sealant 30 remained on PCB 110 can be by insulation molded structure Temperature range between 120 solidification temperature and the boiling point of fluid sealant 30 or the solidification temperature for the molded structure 120 that insulate with It heats and removes in temperature range between the heat resisting temperature of insulation molded structure 120.In the case, treatment conditions can be The temperature that curing oven (not shown) is arranged changes in two steps：The solidification temperature of insulation molded structure 120；And for steaming The temperature of hair and removal fluid sealant 30 (temperature is higher than above-mentioned solidification temperature).

Figure 16 A to Figure 16 F be show to explain according to the numerous embodiments of the disclosure after mold is set by The example of fluid sealant is injected between mold and PCB to manufacture the view of the process of EMI shielding constructions.

With reference to figures 16A to Figure 16 F, in the case where lower end 15 is not coated with fluid sealant 130 as shown in fig. 16, Mold 10 is moved to die location as illustrated in figure 16b.In the case, mold 10 can be supported by robotic arm 50 and It is spaced a predetermined distance with PCB 110 on PCB 110.As shown in fig. 16 c, fluid sealant 130 be injected into mold 10 with In space between PCB 110.As shown in figure 16d, it is completely implanted in response to fluid sealant 30, insulating materials is injected Into the inside of mold 10.In the case, insulating materials is because fluid sealant 30 between mold 10 and PCB without letting out Leakage.

After insulating materials is put by the inside of injection mold 10 and PCB 110 in baking oven, set in response to PCB 110 To predetermined temperature, insulating materials cures at a predetermined temperature, and fluid sealant 30 gradually evaporates at curing temperatures.It replaces Dai Di is increased above the evaporating temperature of the fluid sealant of the solidification temperature of insulating materials, liquid in response to the temperature in baking oven Body sealant 30 evaporates.Therefore, as shown in Figure 16 E, fluid sealant 30 disappears between mold 10 and PCB 110, and Form empty space.

As shown in Figure 16 F, in this case, in response to removing mold 10 from PCB 110, insulation molded structure 120 can Flat side surface is formed to have without being damaged by mold 10 or containment member 12.

Figure 17 A to Figure 17 F be show according to the numerous embodiments of the disclosure by after mold is set in mold Fluid sealant is injected between PCB and fluid sealant is removed by subsequent processing to manufacture the process of EMI shielding constructions View.

Due to the process in Figure 17 A to Figure 17 D and the process phase in Figure 16 A to Figure 16 D in above-mentioned numerous embodiments Together, therefore description to identical process is omitted, and subsequent process will be described.

With reference to figure 17E, fluid sealant 30 can by cure in an oven insulation molded structure 120 during it is unvaporized Material is formed.

With reference to figure 17F, after removing mold 10 from PCB 110, can liquid be scraped by using scheduled exfoliation tool Sealant 30 completely removes fluid sealant 30 from PCB 110.

Figure 18 A to Figure 18 C are to show that the process of manufacture EMI shielding constructions according to disclosed numerous embodiments regards Figure, wherein when forming multiple shielding constructions, differently controlled absolutely by controlling the amount for the insulating materials being injected into mold The height of edge molded structure.

With reference to figure 18A, three molds 10-1,10-2 and 10-3 are arranged on PCB 110.In the case, it is mounted on screen Different height can be had by covering the circuit element in area, and high with reference to the maximum for the circuit element being mounted in each blind zone Different amounts of insulating materials is injected into each mold 10-1,10-2 and 10-3 by degree.That is, being injected into the mould being arranged on left side The amount of insulating materials in tool 10-1 is more than the amount for being injected into the insulating materials being arranged in supermedial mold 10-2, but small In the amount for the insulating materials being injected into the mold 10-3 being arranged on right side.In the case, three molds 10-1,10-2 and 10-3 can be integrally formed with one another, and can be mobile simultaneously by individual machine arm 50.

It is fully impregnated into each mold 10-1,10-2 and 10-3 in response to different amounts of insulating materials, PCB 110 is put Insulation molded structure 120-1,120-2 and 120-3 are formed into baking oven, and by curable dielectric material.In this during, liquid Body sealant 30 is evaporated, but when fluid sealant 30 is formed by unvaporized material, can remove mold 10-1,10-2 With after 10-3 fluid sealant 30 is removed from PCB 110 using tool.

With reference to figure 18B and Figure 18 C, in response to forming insulation molded structure 120-1,120-2 and 120-3 of different height, Shielding dam 130-1,130-2 and 130-3 can be formed along the side of insulation molded structure 120-1,120-2 and 120-3.In this feelings Under condition, shielding dam 130-1,130-2 and 130-3 can be formed according to the height of insulation molded structure 120-1,120-2 and 120-3 For with different height.According to the length of shielding dam 130-1,130-2 and 130-3, the guide portion with different length is used The nozzle divided forms shielding dam 130-1,130-2 and 130-3.

Formed shield dam 130-1,130-2 and 130-3 after, can by using conductive material fill shielding dam 130-1, The top surface of 130-2 and 130-3 forms shield member 140-1,140-2 and 140-3.According to the numerous embodiments of proposition, Have the advantages that while manufacturing multiple shielding constructions.

In numerous embodiments described above, using mold using insulation molded structure, and remove mold it Shielding dam and shield member are formed afterwards.Hereinafter, it will describe according to numerous embodiments in the case where not removing mold Form the process of a part for shielding construction.

Figure 19 A to Figure 20 E are to show passing through in the case where not removing mold according to the numerous embodiments of the disclosure By mold include in EMI shielding constructions come manufacture EMI shielding constructions process view.

With reference to figure 19A, sealant 30'It is connected to the lower end of mold 10.Due to not removing sealant 30&apos from mold 10;, because This sealant 30'The fluent material that can be evaporated is needed not be, and can be flexible sealed solid agent.

With reference to figure 19B, mold 10 is moved to die location by robotic arm 50, and is subsequently placed on PCB 110.It is close Seal agent 30'Intimate surface contact that can be due to elasticity with PCB 110.

With reference to figure 19C, in sealant 30'In the state being in close contact with PCB 110, by the way that insulating materials is injected into mould The inside of tool 10 forms insulation molded structure 120.In the case, liquid insulating material has mobility, but due to sealing Agent 30'Without being leaked between mold 10 and PCB 110.Make the insulating materials being injected into mold 10 by adjusting injection volume It is filled up to the top surface 13a of mold 10, and is cured.

With reference to figure 19D, by driving nozzle 216 (participating in Fig. 2 E) to form shielding along the side of insulation molded structure 120 Dam 130.In the case, the upper end 131 on shielding dam 130 is formed as the top surface 13a of covering mold 10.

With reference to figure 19E, the top surface of top surface and insulation molded structure 120 by the way that conductive material to be discharged into mold 10 And then cured to form shield member 140.In the case, it is carried out from the conductive material of nozzle discharge with predetermined amount Discharge so that conductive material does not overflow the upper end 131 on shielding dam 130.

As described above, mold 10 can be used as being formed the single component of shielding construction without with removing in the process.In this feelings Under condition, mold 10 can be formed by conductive material or insulating materials.

Figure 20 A to Figure 20 E are shown according to the numerous embodiments of Figure 19 A to Figure 19 E the case where not removing mold The lower embodiment for forming shielding construction.

With reference to figure 20A and Figure 20 B, there is the sealant 30&apos for being connected to its lower end;Mold 10 pass through as shown in fig. 20a Robotic arm 50 is moved to die location, and is then placed on as illustrated in figure 2 ob on PCB 110.

In this state, by the way that insulating materials is injected into 10 inside of mold and curable dielectric material formation insulation molding structure Part 120.

With reference to figure 20C to Figure 20 E, conductive shield film 150 is attached to top surface and the insulation of mold 10 as shown in FIG. 20 D The top surface of molded structure 120, and then as shown in Figure 20 E by drive nozzle 216 along insulate molded structure 120 Side forms shielding dam 130.In the case, the upper end 131 on shielding dam 130 can cover the top surface of conductive shield film 150 Edge, and can be electrically connected with conductive shield film 150.

Figure 21 is to show that the application according to embodiment of the present disclosure has the solid of the mobile telephone terminal of EMI shielding constructions Figure.

With reference to figure 21 and Figure 22, the EMI shielding constructions with above-mentioned various structures can be applied to various electronic. That is, EMI shielding constructions can be mounted in smart phone 310 as shown in Figure 21, or intelligence as shown in Figure 22 can be mounted on In energy wrist-watch 320.

Although the disclosure, those skilled in the art has shown and described in the various embodiments by reference to the disclosure Member it will be understood that, can be in the case of the spirit and scope of the present disclosure for not departing from by appended claims and its equally limiting A variety of changes are made to the disclosure in terms of form and details.

Claims

Electromagnetic interference 1. (EMI) shielding construction, including：

Printed circuit board (PCB), is equipped with multiple element on the printed circuit board；

Insulate molded structure, and the insulation molded structure is configured to cover the multiple element；

Conductive shield dam, the conductive shield dam are formed along the side surface of the insulation molded structure；And

Conductive shield component, the conductive shield component are formed on the top surface of the insulation molded structure.
2. EMI shielding constructions according to claim 1, wherein the conductive shield dam have withWhat shape was formed Longitudinal section is to cover side surface and the top surface of the insulation molded structure.
3. EMI shielding constructions according to claim 2, wherein the ratio of width to height on the conductive shield dam is greater than or equal to 1: 3, and

Wherein, the viscosity for forming the material on the conductive shield dam is greater than or equal to 20000cps.
4. EMI shielding constructions according to claim 1, wherein the installation gap between the multiple element is less than or waits In 0.8mm.
5. EMI shielding constructions according to claim 1, wherein the gradient of the inner surface on the conductive shield dam and institute The gradient for stating the side surface of insulation molded structure is identical.
6. EMI shielding constructions according to claim 1, wherein the conductive shield component is attached to the insulator die The conductive shield film of the top surface of plastic composite structural element.

EMI shielding constructions according to claim 1, wherein the conductive shield component is by liquid conduction shielding material shape At the liquid conduction shielding material is by nozzle discharge and on the top surface coated in the insulation molded structure.
7. EMI shielding constructions according to claim 1, further include：

Edge bridge, the edge bridge is conductive and covers the conductive shield dam and the conductive shield component mutually The part being in contact.
Electromagnetic interference 8. (EMI) shielding construction, including：

Printed circuit board (PCB), is equipped with multiple element on the printed circuit board；

Mold, the mold are located on the PCB to surround the multiple element；

Insulate molded structure, and the aftershaping of the insulation molded structure in being injected into the mold simultaneously covers the multiple member Part；

Conductive shield dam, the conductive shield dam are formed along the side surface of the mold；And

Conductive shield component, the conductive shield component cover the top table of the top surface and the insulation molded structure of the mold Face.
9. EMI shielding constructions according to claim 8, wherein the conductive shield dam have withWhat shape was formed Longitudinal section is to cover side surface and the top surface of the mold.
10. the method for manufacturing electromagnetic interference (EMI) shielding construction, the method includes：

Fluid sealant is provided to mold；

The mold is set so that the surface for being equipped with circuit element of the fluid sealant and printed circuit board (PCB) connects It touches；

By the way that insulating materials to be injected into the insulation molded structure formed in the mold for covering the circuit element；

The mold is removed from the PCB；And

Form the conductive shielding material for covering the insulation molded structure.
11. according to the method described in claim 10, wherein, forming the insulation molded structure includes：

Cure the insulation molded structure at the first temperature；And

The fluid sealant is evaporated at the second temperature higher than first temperature.
12. according to the method described in claim 10, wherein, forming the insulation molded structure includes：

Cure the insulation molded structure at a predetermined temperature；And

By using the liquid under the predetermined temperature with the evaporation rate slower than the curing rate of the insulation molded structure Body sealant cures the insulation molded structure under the predetermined temperature and evaporates the fluid sealant.
13. according to the method described in claim 10, wherein, providing the fluid sealant to the mold includes：With described Fluid sealant coats the lower end of the mold.
14. according to the method described in claim 10, wherein, the fluid sealant is of a material that, this material Boiling temperature be higher than formed it is described insulation molded structure material solidification temperature or this material boiling temperature be equal to shape At the solidification temperature of the material of the insulation molded structure.
15. according to the method described in claim 10, wherein, the material that forms the insulation molded structure be physically not with The material that the fluid sealant mixes.