CN108711562A - A kind of integrated circuit package structure and its heat dissipating method with heat sinking function - Google Patents
A kind of integrated circuit package structure and its heat dissipating method with heat sinking function Download PDFInfo
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- CN108711562A CN108711562A CN201810565431.0A CN201810565431A CN108711562A CN 108711562 A CN108711562 A CN 108711562A CN 201810565431 A CN201810565431 A CN 201810565431A CN 108711562 A CN108711562 A CN 108711562A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of integrated circuit package structure with heat sinking function,Including IC chip,Package casing and control device,The control device is fixedly connected with package casing,The package casing is fixedly connected with IC chip,Silica gel heat conductive pad is provided between the IC chip and package casing,The silica gel heat conductive pad is connected with IC chip bonding,The ic core on piece is provided with ceramic piece,The ceramic piece is fixedly connected with IC chip,It is provided with water tank on the left of the package casing,The water tank is fixedly connected with package casing,The first hose and the second hose are provided on the water tank,It is provided with water circulating pump on the right side of the package casing,The water circulating pump is fixedly connected with package casing,First hose and the second hose are bolted with water circulating pump,The water circulating pump is electrically connected with control device；The integrated circuit package structure with heat sinking function can effectively radiate.
Description
Technical field
The present invention relates to a kind of integrated circuit package structure and its heat dissipating method with heat sinking function.
Background technology
Chip is exactly the general designation of semiconductor element product.It is the carrier of integrated circuit, is split to form by wafer.Silicon chip is one
The silicon of block very little, includes integrated circuit, it is computer or a part for other electronic equipments.
Integrated antenna package not only acts as bonding point in IC chip and the external effect being electrically connected, also for
IC chip provides a reliable and stable working environment, and machinery or the work of environmental protection are played to IC chip
With, thus the function that IC chip can bring into normal play, and ensure it with high stability and reliability.In short, integrated
The quality of circuit package quality is very big to the performance quality relationship of integrated circuit totality.Therefore, encapsulation should have stronger machinery
Performance, good electric property and chemical stability.
But existing integrated antenna package heat sinking function is general, and those skilled in the art, which are desirable to provide, a kind of can effectively radiate
The integrated circuit package structure and its heat dissipating method with heat sinking function.
Invention content
The technical problem to be solved in the present invention is to provide a kind of integrated circuit envelopes with heat sinking function that can effectively radiate
Assembling structure.
To solve the above problems, the present invention adopts the following technical scheme that：
A kind of integrated circuit package structure with heat sinking function, including IC chip, package casing and control device, institute
It states control device to be fixedly connected with package casing, the package casing wraps IC chip, the package casing and collection
It is fixedly connected at circuit chip, silica gel heat conductive pad is provided between the IC chip and package casing, the silica gel is led
Heat pad is connected with IC chip bonding, and the ic core on piece is provided with ceramic piece, the ceramic piece
Through package casing, the ceramic piece is fixedly connected with IC chip, and water tank is provided on the left of the package casing,
The water tank is fixedly connected with package casing, and the first hose and the second hose are provided on the water tank, and described first is soft
Water pipe and the second hose are connected with water tank, and first hose and the second hose are detachably connected with water tank,
It is provided with water circulating pump on the right side of the package casing, the water circulating pump is fixedly connected with package casing, first hose
It is connected with water circulating pump with the second hose, first hose and the second hose connect with water circulating pump bolt
It connects, the water circulating pump is electrically connected with control device.
Preferably, the ic core on piece is provided with ceramic needle, the ceramic needle equally divides
Cloth, the ceramic needle are located in package casing, and the ceramic needle is fixedly connected with IC chip.Ceramic
Needle effectively conducts heat from IC chip.
Preferably, being provided with pedestal on the package casing, the pedestal is symmetric setting, the pedestal and envelope
Casing is fixedly connected, and is arranged fluted on the pedestal, storage battery is provided in the groove, the storage battery passes through groove
Be detachably connected with pedestal, the submounts are provided with fan, the pedestal with its respectively on fan be fixedly connected, institute
It states fan and is located at ceramic piece both sides, the fan is electrically connected with storage battery, and the fan is electrically connected with control device.
By being provided with fan, the rate of heat dissipation can effectively be made to accelerate.
Preferably, the ic core on piece is provided with pin, the pin is symmetric setting, the pin
Through package casing, the pin is welded with IC chip.Pin effectively constitutes the interface of integrated circuit, is advantageously integrated
Circuit uses.
Preferably, being provided with electric air pump on the right side of the package casing, the electric air pump is fixed with package casing to be connected
It connects, appendix is provided on the electric air pump, the appendix is connected with electric air pump, and it is outer that the appendix is located at encapsulation
In shell, the ceramic needle is inserted into appendix, and the appendix is bolted with electric air pump, the electric air pump and control
Device processed is electrically connected.By being provided with electric air pump, heat is effectively discharged by appendix.
Preferably, being provided with temperature sensor in the water tank, the temperature sensor is fixedly connected with water tank, described
Temperature sensor is electrically connected with control device.Temperature sensor can effectively detect the water temperature in water tank, feed back to control dress
It sets.
Preferably, ceramic needle end is provided with pin hole, the pin hole is located in appendix.By being provided with
Pin hole can effectively heat be transmitted in appendix.
Preferably, the ceramic on piece is provided with thermal dispersant coatings, the thermal dispersant coatings wrap ceramic piece.
By being provided with thermal dispersant coatings, heat can effectively be made preferably to be conducted in ceramic on piece.
The present invention provides a kind of heat dissipating method of the integrated circuit package structure with heat sinking function, includes the following steps：
1）When IC chip runs adstante febre, by ceramic piece and ceramic needle by heat transfer out come；
2）Then, water circulating pump is started using control device, extracts water out from water tank and flows through the first hose and the second hose,
So that it is circulated by water circulating pump, makes its cooling and heat dissipation using water-cooling pattern；
3）When temperature sensor detects that the temperature in water tank is more than 35 DEG C, control device stops water circulating pump running；
4）After water circulating pump is closed, electric air pump is started using control device, electric air pump takes the heat in appendix out of,
Wherein, electric air pump is again started up after often running a minor tick 30s, and it is 3min to start the duration every time；
5）When temperature sensor detects that the temperature in water tank will be to 20 DEG C, control device stops electric air pump running, then
Secondary startup water circulating pump carries out water-cooled cooling heat dissipation.
Beneficial effects of the present invention are：It is led by being provided with IC chip, package casing, silica gel heat conductive pad, ceramics
Backing, water tank, water circulating pump, the first hose and the second hose make IC chip pass through water-cooling pattern and radiate,
It can carry out efficient heat dissipation.In addition, ic core on piece is provided with ceramic needle, ceramic needle is equally
Distribution, ceramic needle are located in package casing, and ceramic needle is fixedly connected with IC chip.Ceramic needle is effective
Heat is conducted from IC chip.Pedestal is provided on package casing, pedestal is symmetric setting, pedestal
It is fixedly connected with package casing, is arranged fluted on pedestal, be provided with storage battery in groove, storage battery can by groove and pedestal
Dismantling connection, submounts are provided with fan, pedestal with its respectively on fan be fixedly connected, fan is located at ceramic piece
Both sides, fan are electrically connected with storage battery, and fan is electrically connected with control device.By being provided with fan, can effectively make to dissipate
The rate of heat is accelerated.Ic core on piece is provided with pin, and pin is symmetric setting, and pin runs through package casing, pipe
Foot is welded with IC chip.Pin effectively constitutes the interface of integrated circuit, is advantageously integrated circuit use.Package casing is right
Side is provided with electric air pump, and electric air pump is fixedly connected with package casing, and appendix, appendix and electricity are provided on electric air pump
Pump of taking offence is connected, and appendix is located in package casing, and ceramic needle is inserted into appendix, appendix and electric air pump bolt
Connection, electric air pump are electrically connected with control device.By being provided with electric air pump, heat is effectively discharged by appendix.
Temperature sensor is provided in water tank, temperature sensor is fixedly connected with water tank, and temperature sensor is electrically connected with control device.
Temperature sensor can effectively detect the water temperature in water tank, feed back to control device.Ceramic needle end is provided with pin hole, needle
Hole is located in appendix.By being provided with pin hole, can effectively heat be transmitted in appendix.Ceramic on piece is provided with scattered
Hot coating, thermal dispersant coatings wrap ceramic piece.By being provided with thermal dispersant coatings, it can effectively make heat preferably at ceramics
It is conducted on thermally conductive sheet.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of sectional view of the integrated circuit package structure with heat sinking function of the present invention.
Fig. 2 is a kind of structural schematic diagram of the integrated circuit package structure with heat sinking function of the present invention.
Fig. 3 is a kind of structural representation of the ceramic needle of the integrated circuit package structure with heat sinking function of the present invention
Figure.
In figure：1, IC chip；2, package casing；3, control device；4, silica gel heat conductive pad；5, ceramic piece；
6, water tank；7, the first hose；8, the second hose；9, water circulating pump；10, ceramic needle；11, pedestal；12, storage battery；
13, fan；14, pin；15, electric air pump；16, appendix；17, temperature sensor；18, pin hole.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In embodiment, it is to be understood that term " centre ", "upper", "lower", " top ", " right side ", " left end ", " on
Side ", " back side ", " middle part ", etc. instructions orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be only for
It is novel convenient for describing this implementation, it does not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore should not be understood as implementing this novel limitation.
In addition, the connection between component or fixed form if not otherwise specified in this embodiment, connection or
Fixed form can be to be fixed by bolt commonly used in the prior art or pin is fixed or axis pin connection, or be adhesively fixed,
Or it rivets the usual manners such as fixed and be not therefore described in detail in embodiment.
Embodiment 1
As shown in Figure 1, a kind of integrated circuit package structure with heat sinking function, including IC chip 1, package casing 2
With control device 3, the control device 3 is fixedly connected with package casing 2, and the package casing 2 wraps IC chip
1, the package casing 2 is fixedly connected with IC chip 1, is provided between the IC chip 1 and package casing 2
Silica gel heat conductive pad 4, the silica gel heat conductive pad 4 are connected with the bonding of IC chip 1, are provided on the IC chip 1
Ceramic piece 5, the ceramic piece 5 run through package casing 2, and the ceramic piece 5 is fixed with IC chip 1 to be connected
It connects, 2 left side of the package casing is provided with water tank 6, and the water tank 6 is fixedly connected with package casing 2, is arranged on the water tank 6
There are the first hose 7 and the second hose 8, first hose, 7 and second hose 8 to be connected with water tank 6, described
One hose 7 and the second hose 8 are detachably connected with water tank 6, and 2 right side of the package casing is provided with water circulating pump 9, institute
It states water circulating pump 9 to be fixedly connected with package casing 2, first hose, 7 and second hose 8 is connected with water circulating pump 9
Logical, first hose, 7 and second hose 8 is bolted with water circulating pump 9, the water circulating pump 9 and control device 3
It is electrically connected.By be provided with IC chip, package casing, silica gel heat conductive pad, ceramic piece, water tank, water circulating pump,
First hose and the second hose make IC chip pass through water-cooling pattern and radiate, and can carry out efficient
Heat dissipation.
The present embodiment has the beneficial effect that：By being provided with IC chip, package casing, silica gel heat conductive pad, ceramics
Thermally conductive sheet, water tank, water circulating pump, the first hose and the second hose make IC chip pass through water-cooling pattern and are dissipated
Heat can carry out efficient heat dissipation.
Embodiment 2
As shown in Figs. 1-3, a kind of integrated circuit package structure with heat sinking function, including IC chip 1, package casing
2 and control device 3, the control device 3 be fixedly connected with package casing 2, the package casing 2 wraps IC chip
1, the package casing 2 is fixedly connected with IC chip 1, is provided between the IC chip 1 and package casing 2
Silica gel heat conductive pad 4, the silica gel heat conductive pad 4 are connected with the bonding of IC chip 1, are provided on the IC chip 1
Ceramic piece 5, the ceramic piece 5 run through package casing 2, and the ceramic piece 5 is fixed with IC chip 1 to be connected
It connects, 2 left side of the package casing is provided with water tank 6, and the water tank 6 is fixedly connected with package casing 2, is arranged on the water tank 6
There are the first hose 7 and the second hose 8, first hose, 7 and second hose 8 to be connected with water tank 6, described
One hose 7 and the second hose 8 are detachably connected with water tank 6, and 2 right side of the package casing is provided with water circulating pump 9, institute
It states water circulating pump 9 to be fixedly connected with package casing 2, first hose, 7 and second hose 8 is connected with water circulating pump 9
Logical, first hose, 7 and second hose 8 is bolted with water circulating pump 9, the water circulating pump 9 and control device 3
It is electrically connected.By be provided with IC chip, package casing, silica gel heat conductive pad, ceramic piece, water tank, water circulating pump,
First hose and the second hose make IC chip pass through water-cooling pattern and radiate, and can carry out efficient
Heat dissipation.
Ceramic needle 10 is provided on the IC chip 1, the ceramic needle 10 is equally distributed, institute
It states ceramic needle 10 to be located in package casing 2, the ceramic needle 10 is fixedly connected with IC chip 1.Ceramics are led
Hot needle effectively conducts heat from IC chip.
Pedestal 11 is provided on the package casing 2, the pedestal 11 is symmetric setting, the pedestal 11 and encapsulation
Shell 2 is fixedly connected, and is arranged on the pedestal 11 fluted（It is not shown）, storage battery 12, the storage are provided in the groove
Battery 12 is detachably connected by groove and pedestal 11, and the pedestal 11 is provided with fan 13 above, the pedestal 11 and its
Fan 13 on respectively is fixedly connected, and the fan 13 is located at 5 both sides of ceramic piece, and the fan 13 is electrical with storage battery 12
Connection, the fan 13 are electrically connected with control device 3.By being provided with fan, the rate of heat dissipation can effectively be made to accelerate.
Pin 14 is provided on the IC chip 1, the pin 14 is symmetric setting, and the pin 14 passes through
Package casing 2 is worn, the pin 14 is welded with IC chip 1.Pin effectively constitutes the interface of integrated circuit, facilitates collection
It is used at circuit.
2 right side of the package casing is provided with electric air pump 15, and the electric air pump 15 is fixedly connected with package casing 2,
Appendix 16 is provided on the electric air pump 15, the appendix 16 is connected with electric air pump 15, the appendix 16
In in package casing 2, the ceramic needle 10 is inserted into appendix 16, and the appendix 16 connects with 15 bolt of electric air pump
It connects, the electric air pump 15 is electrically connected with control device 3.By being provided with electric air pump, effectively it is discharged by appendix
Heat.
Temperature sensor 17 is provided in the water tank 6, the temperature sensor 17 is fixedly connected with water tank 6, the temperature
Sensor 17 is spent to be electrically connected with control device 3.Temperature sensor can effectively detect the water temperature in water tank, feed back to control dress
It sets.
10 end of ceramic needle is provided with pin hole 18, and the pin hole 18 is located in appendix 16.By being provided with
Pin hole can effectively heat be transmitted in appendix.
It is provided with thermal dispersant coatings on the ceramic piece 5（It is not shown）, the thermal dispersant coatings wrap ceramic piece.
By being provided with thermal dispersant coatings, heat can effectively be made preferably to be conducted in ceramic on piece.
The present embodiment has the beneficial effect that：By being provided with IC chip, package casing, silica gel heat conductive pad, ceramics
Thermally conductive sheet, water tank, water circulating pump, the first hose and the second hose make IC chip pass through water-cooling pattern and are dissipated
Heat can carry out efficient heat dissipation.In addition, ic core on piece is provided with ceramic needle, ceramic needle in etc.
Spacing is distributed, and ceramic needle is located in package casing, and ceramic needle is fixedly connected with IC chip.Ceramic needle
Effectively heat is conducted from IC chip.Pedestal is provided on package casing, pedestal is symmetric setting,
Pedestal is fixedly connected with package casing, is arranged fluted on pedestal, storage battery is provided in groove, storage battery passes through groove and bottom
Seat is detachably connected, and submounts are provided with fan, pedestal with its respectively on fan be fixedly connected, fan is led positioned at ceramics
Backing both sides, fan are electrically connected with storage battery, and fan is electrically connected with control device.It, can be effective by being provided with fan
The rate of heat dissipation is set to accelerate.Ic core on piece is provided with pin, and pin is symmetric setting, and pin is outer through encapsulation
Shell, pin are welded with IC chip.Pin effectively constitutes the interface of integrated circuit, is advantageously integrated circuit use.Encapsulation
It is provided with electric air pump on the right side of shell, electric air pump is fixedly connected with package casing, and appendix, gas transmission are provided on electric air pump
Pipe is connected with electric air pump, and appendix is located in package casing, and ceramic needle is inserted into appendix, appendix and electronic gas
Pump is bolted, and electric air pump is electrically connected with control device.By being provided with electric air pump, effectively it is discharged by appendix
Heat.Temperature sensor is provided in water tank, temperature sensor is fixedly connected with water tank, and temperature sensor is electrical with control device
Connection.Temperature sensor can effectively detect the water temperature in water tank, feed back to control device.Ceramic needle end is provided with needle
Hole, pin hole are located in appendix.By being provided with pin hole, can effectively heat be transmitted in appendix.Ceramic on piece is set
Thermal dispersant coatings are equipped with, thermal dispersant coatings wrap ceramic piece.By being provided with thermal dispersant coatings, it can effectively make heat better
It is conducted in ceramic on piece.
The present invention provides a kind of heat dissipating method of the integrated circuit package structure with heat sinking function, includes the following steps：
1）When IC chip runs adstante febre, by ceramic piece and ceramic needle by heat transfer out come；
2）Then, water circulating pump is started using control device, extracts water out from water tank and flows through the first hose and the second hose,
So that it is circulated by water circulating pump, makes its cooling and heat dissipation using water-cooling pattern；
3）When temperature sensor detects that the temperature in water tank is more than 35 DEG C, control device stops water circulating pump running；
4）After water circulating pump is closed, electric air pump is started using control device, electric air pump takes the heat in appendix out of,
Wherein, electric air pump is again started up after often running a minor tick 30s, and it is 3min to start the duration every time；
5）When temperature sensor detects that the temperature in water tank will be to 20 DEG C, control device stops electric air pump running, then
Secondary startup water circulating pump carries out water-cooled cooling heat dissipation.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
The change or replacement expected without creative work, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of integrated circuit package structure with heat sinking function, it is characterised in that：Including IC chip, package casing
And control device, the control device are fixedly connected with package casing, the package casing wraps IC chip, described
Package casing is fixedly connected with IC chip, and silica gel heat conduction is provided between the IC chip and package casing
Pad, the silica gel heat conductive pad are connected with IC chip bonding, and the ic core on piece is provided with ceramic piece, institute
It states ceramic piece and runs through package casing, the ceramic piece is fixedly connected with IC chip, and the package casing is left
Side is provided with water tank, and the water tank is fixedly connected with package casing, and the first hose and the second soft water are provided on the water tank
Pipe, first hose and the second hose be connected with water tank, and first hose and the second hose are and water
Case is detachably connected, and is provided with water circulating pump on the right side of the package casing, the water circulating pump is fixedly connected with package casing, institute
State the first hose and the second hose be connected with water circulating pump, first hose and the second hose with cycle
Bolt of water connects, and the water circulating pump is electrically connected with control device.
2. a kind of integrated circuit package structure with heat sinking function according to claim 1, it is characterised in that：The collection
At ceramic needle is provided on circuit chip, the ceramic needle is equally distributed, and the ceramic needle is located at envelope
In casing, the ceramic needle is fixedly connected with IC chip.
3. a kind of integrated circuit package structure with heat sinking function according to claim 2, it is characterised in that：The envelope
Pedestal is provided on casing, the pedestal is symmetric setting, and the pedestal is fixedly connected with package casing, the pedestal
Upper setting is fluted, storage battery is provided in the groove, the storage battery is detachably connected by groove and pedestal, the bottom
Seat is provided with fan above, the pedestal with its respectively on fan be fixedly connected, the fan is located at ceramic piece two
Side, the fan are electrically connected with storage battery, and the fan is electrically connected with control device.
4. a kind of integrated circuit package structure with heat sinking function according to claim 3, it is characterised in that：The collection
At being provided with pin on circuit chip, the pin is symmetric setting, and the pin runs through package casing, the pin with
IC chip welds.
5. a kind of integrated circuit package structure with heat sinking function according to claim 4, it is characterised in that：The envelope
It is provided with electric air pump on the right side of casing, the electric air pump is fixedly connected with package casing, is provided on the electric air pump
Appendix, the appendix are connected with electric air pump, and the appendix is located in package casing, and the ceramic needle is inserted into
In appendix, the appendix is bolted with electric air pump, and the electric air pump is electrically connected with control device.
6. a kind of integrated circuit package structure with heat sinking function according to claim 5, it is characterised in that：The water
Temperature sensor is provided in case, the temperature sensor is fixedly connected with water tank, the temperature sensor and control device electricity
Property connection.
7. a kind of integrated circuit package structure with heat sinking function according to claim 6, it is characterised in that：The pottery
Porcelain heat conduction needle end is provided with pin hole, and the pin hole is located in appendix.
8. a kind of heat dissipating method of the integrated circuit package structure with heat sinking function, which is characterized in that include the following steps：
1）When IC chip runs adstante febre, by ceramic piece and ceramic needle by heat transfer out come；
2）Then, water circulating pump is started using control device, extracts water out from water tank and flows through the first hose and the second hose,
So that it is circulated by water circulating pump, makes its cooling and heat dissipation using water-cooling pattern；
3）When temperature sensor detects that the temperature in water tank is more than 35 DEG C, control device stops water circulating pump running；
4）After water circulating pump is closed, electric air pump is started using control device, electric air pump takes the heat in appendix out of,
Wherein, electric air pump is again started up after often running a minor tick 30s, and it is 3min to start the duration every time；
5）When temperature sensor detects that the temperature in water tank will be to 20 DEG C, control device stops electric air pump running, then
Secondary startup water circulating pump carries out water-cooled cooling heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565431.0A CN108711562B (en) | 2018-06-04 | 2018-06-04 | Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565431.0A CN108711562B (en) | 2018-06-04 | 2018-06-04 | Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof |
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| Publication Number | Publication Date |
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| CN108711562A true CN108711562A (en) | 2018-10-26 |
| CN108711562B CN108711562B (en) | 2019-12-24 |
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| CN201810565431.0A Active CN108711562B (en) | 2018-06-04 | 2018-06-04 | Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164681A (en) * | 2020-09-21 | 2021-01-01 | 安徽工程大学 | Computer chip heat abstractor |
| CN113725302A (en) * | 2021-08-31 | 2021-11-30 | 长春电子科技学院 | Photoelectron packaging assembly |
| CN116741711A (en) * | 2023-07-03 | 2023-09-12 | 北京致盈科技有限公司 | Integrated circuit package |
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| US20050006756A1 (en) * | 2003-02-26 | 2005-01-13 | Tsung-Yueh Tsai | Package structure compatible with cooling system |
| CN1768425A (en) * | 2003-03-31 | 2006-05-03 | 英特尔公司 | Electronic assemblies with fluid cooling and associated methods |
| CN206058098U (en) * | 2016-07-26 | 2017-03-29 | 李婷 | A kind of heat radiator of computer CPU |
| CN207217513U (en) * | 2017-10-09 | 2018-04-10 | 浙江东和电子科技有限公司 | A kind of DIP encapsulation |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112164681A (en) * | 2020-09-21 | 2021-01-01 | 安徽工程大学 | Computer chip heat abstractor |
| CN113725302A (en) * | 2021-08-31 | 2021-11-30 | 长春电子科技学院 | Photoelectron packaging assembly |
| CN113725302B (en) * | 2021-08-31 | 2023-10-27 | 长春电子科技学院 | Optoelectronic packaging assembly |
| CN116741711A (en) * | 2023-07-03 | 2023-09-12 | 北京致盈科技有限公司 | Integrated circuit package |
| CN116741711B (en) * | 2023-07-03 | 2024-01-12 | 杭州池昊科技有限公司 | Integrated circuit package |
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| CN108711562B (en) | 2019-12-24 |
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