CN108707870A - The preparation method of the sial rotary target material of high-compactness - Google Patents

The preparation method of the sial rotary target material of high-compactness Download PDF

Info

Publication number
CN108707870A
CN108707870A CN201810509361.7A CN201810509361A CN108707870A CN 108707870 A CN108707870 A CN 108707870A CN 201810509361 A CN201810509361 A CN 201810509361A CN 108707870 A CN108707870 A CN 108707870A
Authority
CN
China
Prior art keywords
target
sial
penstock
preparation
target material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810509361.7A
Other languages
Chinese (zh)
Inventor
刚爽
杨晔
朱永明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunlee Electronic Materials Co Ltd
Original Assignee
Ningbo Sunlee Electronic Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunlee Electronic Materials Co Ltd filed Critical Ningbo Sunlee Electronic Materials Co Ltd
Priority to CN201810509361.7A priority Critical patent/CN108707870A/en
Publication of CN108707870A publication Critical patent/CN108707870A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06Metallic material
    • C23C4/067Metallic material containing free particles of non-metal elements, e.g. carbon, silicon, boron, phosphorus or arsenic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134Plasma spraying

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

The invention discloses a kind of preparation methods of the sial rotary target material of high-compactness, including prepare dusty spray, pretreatment target penstock, prepare in target penstock to target penstock spraying prime coat, with plasma spray coating process sial target.Wherein, the method for preparing dusty spray is:By percentage to the quality, after the silica flour of 90%-92% being mixed with the aluminium powder of 8%-10%, powder is uniformly mixed in V-type mixes powder machine 4-6 hours, then dried 4-6 hours in 90-110 ° of drying box.It is an advantage of the invention that:Simple for process, prepared target quality is preferable.

Description

The preparation method of the sial rotary target material of high-compactness
Technical field
The present invention relates to target technical fields, more particularly, to a kind of preparation side of the sial rotary target material of high-compactness Method.
Background technology
Magnetron sputtering technique is a kind of advanced high-quality thin film deposition approach.Its working principle is that:Electronics is in electric field Effect is lower to be accelerated to collide with sputter gas atom during flying to substrate, ionizes out a large amount of cation and electronics.Electricity Son flies to substrate, and cation accelerates to bombard target under the action of electric field, sputters a large amount of target atom, the target being in neutrality Atom (or molecule), which is deposited on, ultimately forms required film on substrate.
Silicon (Si) based sputtering target material is with the fastest developing speed in numerous sputtering target materials and applies a kind of wider target.Si is A kind of traditional semi-conducting material, in recent years since the development that magnetron sputtering prepares thin film technique makes it be obtained in many fields New application.The silica-base film of magnetron sputtering deposition has been applied in touch sensor, building energy conservation Low-E glass at present, And the fields such as car coated glass.
Magnetron sputtering is generally made up of plasma spray coating process with sial target, but obtained target consistency is relatively low, Relative density only has 90% or so.Easily there is the defects of dross, picking in sputtering process in the target of low-density, influences plated film production The quality and production stability of product.Application publication number is the Chinese invention patent application of CN106498350A:Sial sputtering target material Preparation method, disclose a kind of by vacuum atm plasma spraying technology, relative density be made up to 97% sial target. But do not state that it actually prepares the density of target with this method in the patent.And vacuum plasma spray coating is compared with air etc. Plasma spray, increase penstock preheat, vacuumize, be filled with the series of steps such as inert protective gas, complex process and cost compared with It is high.
Invention content
The object of the present invention is to provide a kind of preparation methods of the sial rotary target material of high-compactness, it has technique letter Feature single, prepared target quality is preferable.
The technical solution adopted in the present invention is:
The preparation method of the sial rotary target material of high-compactness, includes the following steps:
(1) dusty spray is prepared;
(2) target penstock is pre-processed;
(3) prime coat is sprayed to target penstock;
(4) sial target is prepared in target penstock with plasma spray coating process.
In the step (1), the method for preparing dusty spray is:By percentage to the quality, by the silica flour of 90%-92% with After the aluminium powder mixing of 8%-10%, powder is uniformly mixed in V-type mixes powder machine 4-6 hours, then dried in 90-110 ° of drying box It is 4-6 hours dry.
The silica flour purity is not less than 99.9%, in the silica flour, by percentage to the quality, the grain of the silica flour of 20%-50% Degree is 125-160 μm, remaining silicon particle size is 45-125 μm.
The aluminium powder purity is 75-100 μm not less than 99.9%, granularity.
In the step (2), the method for pretreatment target penstock is:Ultrasonic cleaning, then sandblasting are roughened.
In the step (3), it is to target penstock spraying prime coat:Using electric arc spraying in target penstock surface spraying Nickel alumin(i)um alloy.
In the step (4), with plasma spray coating process during preparing sial target in target penstock, work is sprayed The speed of mainshaft of dress is 200-240r/min, and the spray distance control between spray gun and penstock is 100-130mm, the mobile speed of spray gun Degree is 2000-2400mm/min.
In the step (4), with plasma spray coating process during preparing sial target in target penstock, target is controlled Material surface temperature is no more than 90 DEG C.
The invention has the advantages that compared with the prior art,:Simple for process, prepared target quality is preferable.This hair Target material structure prepared by the preparation method of the sial rotary target material of bright high-compactness is fine and close, ingredient uniformly, good conductivity, nothing Crackle, spraying length and diameter is unrestricted, and thickness is not less than 93% up to 13mm, relative density, and provided by the invention Preparation method, production process is simple and convenient, and cost is relatively low.
Specific implementation mode
Embodiment 1
The preparation method of the sial rotary target material of high-compactness, specially in outer diameter 133mm, the target of length 850mm is carried on the back Guan Shang, sial target of the spraying not less than 4mm thickness.Include the following steps:
(1) dusty spray is prepared;
(2) target penstock is pre-processed;
(3) prime coat is sprayed to target penstock;
(4) sial target is prepared in target penstock with plasma spray coating process.
Wherein:
In step (1), the method for preparing dusty spray is:By percentage to the quality, by 90% silica flour and 10% aluminium After powder mixing, powder is uniformly mixed in V-type mixes powder machine 4 hours, then dried 4 hours in 90 ° of drying box.
Meanwhile the silica flour purity of use is not less than 99.9%.In the silica flour, by percentage to the quality, 20% silica flour Average particle size is 125 μm, and the average particle size of remaining silica flour is 45 μm.Aluminium powder purity is 75 μm not less than 99.9%, average particle size.
In step (2), the method for pretreatment target penstock is:By sial target in supersonic wave cleaning machine ultrasonic cleaning 40 minutes, then sandblasting was roughened.
In step (3), it is to target penstock spraying prime coat:Using electric arc spraying in target penstock surface spraying thickness For 0.1mm nickel alumin(i)um alloys.The specific process parameter of electric arc spraying can be shown in Table 1:
The technological parameter of 1 electric arc spraying prime coat of table
Technological parameter Voltage Electric current Silk material diameter Wire feed rate Spray pressure
Parameter value 40V 350A 2.5mm 130mm/s 0.5MPa
In step (4), with plasma spray coating process during preparing sial target in target penstock, spraying frock The speed of mainshaft is 200r/min, and the spray distance control between spray gun and penstock is 100mm, and the movement speed of spray gun is 2000mm/ min。
In step (4), with plasma spray coating process during preparing sial target in target penstock, target table is controlled Face temperature is no more than 90 DEG C.For example, integrated use water cooling tube and compressed gas cooling spraying target.
Sial rotary target material prepared by the present embodiment 1 is black, thickness 4.2mm, with Archimedes's drainage detection density For 2.201g/cm3, relative density 93.3%, resistivity is 11.7m Ω .cm, illustrates that its compact structure, electric conductivity are preferable, and Detect flawless.Meanwhile compared with the modes such as vacuum plasma spray coating, the preparation method of the present embodiment without being vacuumized, Protective gas is filled, to which cost is relatively low, production process is simple and convenient.The present embodiment is introduced into carries out mixed powder in V-type machine The step of, it is ensured that product composition is more uniform.
Embodiment 2
The preparation method of the sial rotary target material of high-compactness, specially in outer diameter 133mm, the target of length 3191mm is carried on the back Guan Shang, sial target of the spraying not less than 9mm thickness.Include the following steps:
(1) dusty spray is prepared;
(2) target penstock is pre-processed;
(3) prime coat is sprayed to target penstock;
(4) sial target is prepared in target penstock with plasma spray coating process.
Wherein:
In step (1), the method for preparing dusty spray is:By percentage to the quality, by 91% silica flour and 9% aluminium powder After mixing, powder is uniformly mixed in V-type mixes powder machine 5 hours, then dried 5 hours in 100 ° of drying box.
Meanwhile the silica flour purity of use is not less than 99.9%.In the silica flour, by percentage to the quality, 35% silica flour Average particle size is 135 μm, remaining silica flour average particle size is 80 μm.Aluminium powder purity is 80 μm not less than 99.9%, average particle size.
In step (2), the method for pretreatment target penstock is:By sial target in supersonic wave cleaning machine ultrasonic cleaning 30 minutes, then sandblasting was roughened.
In step (3), it is to target penstock spraying prime coat:Using electric arc spraying in target penstock surface spraying thickness For 0.2mm nickel alumin(i)um alloys.The specific process parameter of electric arc spraying can be shown in Table 2:
The technological parameter of 2 electric arc spraying prime coat of table
Technological parameter Voltage Electric current Silk material diameter Wire feed rate Spray pressure
Parameter value 40V 370A 2.5mm 150mm/s 0.5MPa
In step (4), with plasma spray coating process during preparing sial target in target penstock, spraying frock The speed of mainshaft is 230r/min, and the movement speed of spray distance 110mm, spray gun are 2200mm/min,
In step (4), with plasma spray coating process during preparing sial target in target penstock, target table is controlled Face temperature is no more than 90 DEG C.For example, integrated use water cooling tube and compressed gas cooling spraying target.
Sial rotary target material prepared by the present embodiment 2 is black, thickness 9.1mm, with Archimedes's drainage detection density For 2.209g/cm3, relative density 93.6%, resistivity is 11.2m Ω .cm, illustrates that its compact structure, electric conductivity are preferable, and Detect flawless.Meanwhile compared with the modes such as vacuum plasma spray coating, the preparation method of the present embodiment without being vacuumized, Protective gas is filled, to which cost is relatively low, production process is simple and convenient.The present embodiment is introduced into carries out mixed powder in V-type machine The step of, it is ensured that product composition is more uniform.
Embodiment 3
The preparation method of the sial rotary target material of high-compactness, specially in outer diameter 133mm, the target of length 850mm is carried on the back Guan Shang, sial target of the spraying not less than 4mm thickness.Include the following steps:
(1) dusty spray is prepared;
(2) target penstock is pre-processed;
(3) prime coat is sprayed to target penstock;
(4) sial target is prepared in target penstock with plasma spray coating process.
Wherein:
In step (1), the method for preparing dusty spray is:By percentage to the quality, by 92% silica flour and 8% aluminium powder After mixing, powder is uniformly mixed in V-type mixes powder machine 6 hours, then dried 6 hours in 110 ° of drying box.
Meanwhile the silica flour purity of use is not less than 99.9%.In the silica flour, by percentage to the quality, 40% silica flour Average particle size is 150 μm, remaining silica flour average particle size is 125 μm.Aluminium powder purity is 100 μm not less than 99.9%, average particle size.
In step (2), the method for pretreatment target penstock is:By sial target in supersonic wave cleaning machine ultrasonic cleaning 50 minutes, then sandblasting was roughened.
In step (3), it is to target penstock spraying prime coat:Using electric arc spraying in target penstock surface spraying thickness For 0.2mm nickel alumin(i)um alloys.The specific process parameter of electric arc spraying can be shown in Table 3:
The technological parameter of 32 electric arc spraying prime coat of table
Technological parameter Voltage Electric current Silk material diameter Wire feed rate Spray pressure
Parameter value 45V 350A 2.5mm 150mm/s 0.5MPa
In step (4), with plasma spray coating process during preparing sial target in target penstock, spraying frock The speed of mainshaft is 240r/min, and the spray distance control between spray gun and penstock is 130mm, and the movement speed of spray gun is 2400mm/ min。
In step (4), with plasma spray coating process during preparing sial target in target penstock, target table is controlled Face temperature is no more than 90 DEG C.For example, integrated use water cooling tube and compressed gas cooling spraying target.
Sial rotary target material prepared by the present embodiment 3 is black, and thickness 13mm is with Archimedes's drainage detection density 2.197g/cm3, relative density 93.07%, resistivity are 9m Ω .cm, illustrate that its compact structure, electric conductivity are preferable, and are detected Flawless.Meanwhile compared with the modes such as vacuum plasma spray coating, the preparation method of the present embodiment is without being vacuumized, filling guarantor Shield gas and etc., to which cost is relatively low, production process is simple and convenient.The present embodiment is introduced into the step that mixed powder is carried out in V-type machine Suddenly, it is ensured that product composition is more uniform.
In conclusion the preparation method of the sial rotary target material of the high-compactness of the present invention mainly passes through silica flour different-grain diameter Changes of contents, form highdensity effect.That is, under identical plasma spraying power, the powder thawing of fine grain is more filled Point, it is easy to be accelerated to higher speed, obtained spray-on coating density is high, but coating thermal stress is big, easy to crack, does not have to generally In spraying relatively thick coating;The powder thawing of coarse grain diameter is insufficient, and dusty spray speed is smaller, and gained coating porosity is high, density It is low, but coating thermal stress is smaller, it is not easy to crack, it can be used for spraying relatively thick coating.The content that the present invention passes through silica flour different-grain diameter Variation, under the premise of not improving target tearing tendency, improves target density.The relative density by silicon target is embodied in by 90% It improves to 93% or more.Due to the raising of density, the abnormal appearance such as reduction target dross occurs, beats arc in use, Improve coating quality and efficiency.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every utilization Equivalent process transformation made by present specification is applied directly or indirectly in other relevant technical fields, same Reason is included within the scope of the present invention.

Claims (8)

1. the preparation method of the sial rotary target material of high-compactness, includes the following steps:
(1) dusty spray is prepared;
(2) target penstock is pre-processed;
(3) prime coat is sprayed to target penstock;
(4) sial target is prepared in target penstock with plasma spray coating process.
2. the preparation method of the sial rotary target material of high-compactness according to claim 1, it is characterised in that:The step (1) in, the method for preparing dusty spray is:By percentage to the quality, the aluminium powder of the silica flour of 90%-92% and 8%-10% is mixed After conjunction, powder is uniformly mixed in V-type mixes powder machine 4-6 hours, then dried 4-6 hours in 90-110 ° of drying box.
3. the preparation method of the sial rotary target material of high-compactness according to claim 2, it is characterised in that:The silica flour Purity is not less than 99.9%, and in the silica flour, by percentage to the quality, the granularity of the silica flour of 20%-50% is 125-160 μm, Remaining silicon particle size is 45-125 μm.
4. the preparation method of the sial rotary target material of high-compactness according to claim 2, it is characterised in that:The aluminium powder Purity is 75-100 μm not less than 99.9%, granularity.
5. the preparation method of the sial rotary target material of high-compactness according to claim 1, it is characterised in that:The step (2) in, the method for pretreatment target penstock is:Ultrasonic cleaning, then sandblasting are roughened.
6. the preparation method of the sial rotary target material of high-compactness according to claim 1, it is characterised in that:The step (3) in, it is to target penstock spraying prime coat:Using electric arc spraying in target penstock surface spraying nickel alumin(i)um alloy.
7. the preparation method of the sial rotary target material of high-compactness according to claim 1, it is characterised in that:The step (4) in, with plasma spray coating process during preparing sial target in target penstock, the speed of mainshaft of spraying frock is 200-240r/min, the spray distance control between spray gun and penstock are 100-130mm, and the movement speed of spray gun is 2000- 2400mm/min。
8. the preparation method of the sial rotary target material of high-compactness according to claim 1, it is characterised in that:The step (4) in, with plasma spray coating process during preparing sial target in target penstock, control target material surface temperature is no more than 90℃。
CN201810509361.7A 2018-05-24 2018-05-24 The preparation method of the sial rotary target material of high-compactness Pending CN108707870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810509361.7A CN108707870A (en) 2018-05-24 2018-05-24 The preparation method of the sial rotary target material of high-compactness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810509361.7A CN108707870A (en) 2018-05-24 2018-05-24 The preparation method of the sial rotary target material of high-compactness

Publications (1)

Publication Number Publication Date
CN108707870A true CN108707870A (en) 2018-10-26

Family

ID=63869631

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810509361.7A Pending CN108707870A (en) 2018-05-24 2018-05-24 The preparation method of the sial rotary target material of high-compactness

Country Status (1)

Country Link
CN (1) CN108707870A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109881162A (en) * 2018-11-29 2019-06-14 芮瑛 A kind of sputtering target material preparation process based on plasma spraying technology
CN112899628A (en) * 2021-01-18 2021-06-04 福建阿石创新材料股份有限公司 Rotary silicon target material capable of being uniformly sputtered and preparation method thereof
CN113862621A (en) * 2021-09-17 2021-12-31 芜湖映日科技股份有限公司 Preparation method of rotary silicon-chromium target

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030103857A1 (en) * 2001-08-18 2003-06-05 W.C. Heraeus Gmbh & Co. Kg Sputter target made of a silicon alloy and process for producing a sputter target
CN102286717A (en) * 2011-09-01 2011-12-21 基迈克材料科技(苏州)有限公司 Cylindrical large-area film coating target prepared through plasma spray coating and method
CN202148348U (en) * 2011-06-30 2012-02-22 厦门映日光电科技有限公司 Rotary target
CN104451582A (en) * 2014-12-30 2015-03-25 北京恒隆科技有限公司 Conductive zirconia revolving target and preparation method thereof
CN106498350A (en) * 2016-10-13 2017-03-15 法柯特科技(江苏)有限公司 The preparation method of sial sputtering target material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030103857A1 (en) * 2001-08-18 2003-06-05 W.C. Heraeus Gmbh & Co. Kg Sputter target made of a silicon alloy and process for producing a sputter target
CN202148348U (en) * 2011-06-30 2012-02-22 厦门映日光电科技有限公司 Rotary target
CN102286717A (en) * 2011-09-01 2011-12-21 基迈克材料科技(苏州)有限公司 Cylindrical large-area film coating target prepared through plasma spray coating and method
CN104451582A (en) * 2014-12-30 2015-03-25 北京恒隆科技有限公司 Conductive zirconia revolving target and preparation method thereof
CN106498350A (en) * 2016-10-13 2017-03-15 法柯特科技(江苏)有限公司 The preparation method of sial sputtering target material

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
粟祜: "《等离子喷涂和燃烧火焰喷涂技术》", 31 December 1984, 国防工业出版社 *
铁路机车车辆科技手册编委会: "《铁路机车车辆科技手册 第3卷 制造技术》", 31 May 2002, 中国铁道出版社 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109881162A (en) * 2018-11-29 2019-06-14 芮瑛 A kind of sputtering target material preparation process based on plasma spraying technology
CN112899628A (en) * 2021-01-18 2021-06-04 福建阿石创新材料股份有限公司 Rotary silicon target material capable of being uniformly sputtered and preparation method thereof
CN113862621A (en) * 2021-09-17 2021-12-31 芜湖映日科技股份有限公司 Preparation method of rotary silicon-chromium target

Similar Documents

Publication Publication Date Title
CN108707870A (en) The preparation method of the sial rotary target material of high-compactness
CN103668095B (en) A kind of high power pulse plasma enhancing combined magnetic-controlled sputter deposition apparatus and using method thereof
CN104805406B (en) Aluminium scandium rotary target material and preparation method thereof
CN106498350A (en) The preparation method of sial sputtering target material
CN103360122B (en) Method for improving metalized surface performance of ceramic workpiece
CN103436837B (en) Improve rotary target material paint finishing
CN105506564A (en) Rotating silicon-magnesium alloy target and preparation method thereof
CN106567045B (en) The preparation method of tubular rotary HIGH-PURITY SILICON sputtering target material
CN104404454B (en) Tool for depositing coating on multi-arc ion plating equipment and usage method thereof
CN104831244A (en) Aluminum tantalum rotating target material, and method used for preparing aluminum tantalum rotating target material via controlled atmosphere cold spraying
CN104775097A (en) Low-resistivity micro-boron doped rotary sputtering silicon target material and preparation method thereof
CN104862654B (en) Integrated large-diameter high-purity superconduction yttrium barium copper oxide rotary target material and preparation method thereof
CN107299345A (en) A kind of environmental protection coating of SiCf/SiC composites stator blade and preparation method thereof
CN109280881A (en) A kind of composite base material and preparation method thereof
CN101654770B (en) Production process for preparing indium tin oxide conductive film on flexible base material
CN105603354A (en) Method for preparing metal zinc alloy target by arc-spraying process
CN110257790B (en) Aluminum oxide-TiOxTarget material and preparation method and application thereof
CN104775118B (en) A kind of laser cladding powder pre-setting method
CN202139478U (en) Device for depositing thin films on silicon carbon (SiC) fiber surface
CN103643075B (en) Cu-base composites of nano-particle reinforcement and preparation method thereof
CN104593714B (en) The SiC bases rotary target material and its manufacture method of a kind of doping metals
CN104046942A (en) Metal tantalum coating preparation method
CN105063557A (en) Method for directional resistance value increase of ITO conducting film
CN113897585A (en) Silicon-chromium rotary sputtering target material and preparation method thereof
CN209307474U (en) A kind of device improving hard coat and substrate binding force

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181026

RJ01 Rejection of invention patent application after publication