CN108695418A - A kind of LED alphanumeric displays and preparation method thereof - Google Patents
A kind of LED alphanumeric displays and preparation method thereof Download PDFInfo
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- CN108695418A CN108695418A CN201810529845.8A CN201810529845A CN108695418A CN 108695418 A CN108695418 A CN 108695418A CN 201810529845 A CN201810529845 A CN 201810529845A CN 108695418 A CN108695418 A CN 108695418A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of preparation methods of LED alphanumeric displays, are used to make LED alphanumeric displays, in particular by the projective structure protection chip formed in chip outer surface and spread light source, which is characterized in that include the following steps:A. the chip for being used to form LED characters is planted admittedly on wiring board;B. trepanning steel mesh is prepared, and the trepanning steel mesh is covered on the wiring board;C. aperture segment on filler filling steel mesh is used, the wiring board is made to form projective structure in the case where being detached from steel mesh covering.It is the configuration of the present invention is simple, powerful, easy to operate, it can be mass, there is high commercial value.
Description
Technical field
The present invention relates to LED field of semiconductor illumination, and in particular to a kind of LED alphanumeric displays and preparation method thereof.
Background technology
With the development of science and technology, electronic technology is grown rapidly, what all kinds of LED flat panel display devices were shown as present information
Important media are obtained for extensive utilization in many fields, and all kinds of LED flat-panel screens are divided into LED display module and LCD
Display module, wherein light-emitting diode display integrate microelectric technique, computer technology, information processing, bright in luster with its, dynamic
State range is wide, brightness is high, clarity is high, operating voltage is low, small power consumption, long lifespan, impact resistance, beautiful in colour and the operation is stable can
By the advantages that, a new generation for becoming most advantage shows media, light-emitting diode display be widely used to large-scale square, commercial advertisement,
It is aobvious can to meet the needs of varying environment, especially LED characters for stadiums, information propagation, news briefing, securities trading etc.
Show device at the train station, sports ground, obtain at megastore and other public places arrived very extensive utilization.
At this stage, LED alphanumeric displays generally include wiring board, and set gradually LED chip on circuit boards, light
Film and packaging film etc. are learned, in order to preferably extend the service life of LED chip, it will usually to the LED numbers in LED chip
The outside of code pipe is covered using process for filling colloid, certain protects LED charactrons from external evil although can play in this way
Heat dissipation raising LED performances, optimization beam distribution raising light extraction efficiency are reinforced in the influence of bad weather, but because process for filling colloid is straight
It connects and encapsulating is carried out to entire LED chip, the damage of LED chip is be easy to cause during this encapsulating, reduce LED characters and show
The use function and service life of device.
And currently, above-mentioned technical problem can be solved there is no a kind of, one kind can protect LED charactrons and behaviour
Make convenient technology easy to use, specifically, there is no a kind of preparation methods of LED alphanumeric displays.
Invention content
For technological deficiency of the existing technology, the object of the present invention is to provide a kind of preparations of LED alphanumeric displays
The preparation method of method protects chip by the projective structure formed in chip outer surface and spreads light source, including walks as follows
Suddenly:
A. the chip for being used to form LED characters is planted admittedly on wiring board;
B. trepanning steel mesh is prepared, and the trepanning steel mesh is covered on the wiring board;
C. aperture segment on filler filling steel mesh is used, the wiring board is made to form protrusion knot in the case where being detached from steel mesh covering
Structure.
Preferably, in the step b, the position of trepanning, position, the shape of shape, size and the circuit chip on board
Shape, size are adapted.
Preferably, the step c includes:Filler is brushed repeatedly on trepanning steel mesh by painting device, is made described
Filler enters trepanning and covers the alphanumeric display sides LED and surrounding on the chip.
Preferably, the step c includes:By syringe by filler instil in trepanning steel mesh, make the filler into
Enter trepanning and is covered in the chip over and around.
Preferably, the step c includes:Filler is sprayed in trepanning steel mesh by spray equipment, makes the filling
Object enters trepanning and is covered in the chip over and around.
Preferably, further include step after the step c:
D. the wiring board prepared in the step c is pressed into reflection cavity opening direction;
E. diffusing protection film is sticked in the outer surface of the reflection cavity;
F. Pin needles are opened.
Preferably, the reflection cavity is plastics reflecting cover or isolation lid with character cavity feature.
Preferably, the shape of the reflection cavity is rectangle, circle, triangle, trapezoidal, regular or irregular curved shape
Any one of.
Preferably, the shape of the wiring board is rectangle, circle, triangle, trapezoidal, regular or irregular curved shape
Any one of.
Preferably, the filler includes the mixed of epoxy resin or silica gel silicone grease class synthetic resin or fluorescent powder hybrid resin
Close object.
Preferably, the LED alphanumeric displays show solid size that content is 0~8 or multi-code number, arrow, triangle, circle,
Rule or irregular figure.
LED alphanumeric displays a kind of according to another aspect of the present invention, including wiring board, solid plant are in wiring board outer surface
The filler of the LED chip of setting, protrusion the LED chip outer surface setting.
Preferably, the thickness of the filler is 0.5mm~1.5mm.
Preferably, further include reflection cavity, the reflection cavity partly coats the wiring board setting.
Preferably, further include diffusing protection film, the diffusing protection film is bonded the reflection cavity outer surface setting.
Preferably, further include PIN needle, the PIN needle installation assist side back side.
Beneficial effects of the present invention:The present invention is protected instead of the process for filling colloid of original LED charactrons with mode of printing
It LED chip and can use the mode for admixing fluorescent powder, so that the wrapped blue chip that closes is sent out white light, be used for each form size
Character show that the present invention, which consolidates chip, to be implanted on wiring board, is covered on wiring board with the steel mesh for opening corresponding hole, use
Epoxy resin or silica gel lipid, synthetic resin coated swiped through steel mesh are made the resin penetrate steel mesh hole, are accurately covered in core by scraper
Piece over and around, plays protection and diffusion, such as admixes fluorescent powder, while can play covering blue light action, after solidification,
The plastics reflecting cover of tape character cavity feature or isolation lid are pressed on wiring board again, make light-emitting zone can be in reflector cavity intracavitary
It shines, finally sticks protection and touch diffusion and touch, play the role of aesthetic appeal, the uniform luminosity of byte light-emitting surface and protection are formed
Integrated alphanumeric display.The display can be the solid size of 0-8 or each yardage word, variously-shaped arrow, triangle, circle or not
Round, the synthesized character light reflection device of rule.It is the configuration of the present invention is simple, powerful, easy to operate, it can be mass, have
There is high commercial value.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 shows specific implementation mode according to the present invention, a kind of preparation method of LED alphanumeric displays it is specific
Flow diagram;
Fig. 2 shows first embodiment according to the present invention, a kind of detailed process of the preparation method of LED alphanumeric displays
Schematic diagram;
Fig. 3 shows a kind of process structure making figure of LED alphanumeric displays of the present invention;
Fig. 4 shows a kind of topological diagram of LED alphanumeric displays of the present invention.
Specific implementation mode
In order to preferably technical scheme of the present invention be made clearly to show, the present invention is made into one below in conjunction with the accompanying drawings
Walk explanation.
Fig. 1 shows specific implementation mode according to the present invention, provides a kind of preparation method of LED alphanumeric displays
Preparation method, the present invention by conjunction with Fig. 1 and Fig. 2 come to the present invention specific implementation mode be described in detail, specifically, lead to
It crosses the projective structure protection chip formed in chip outer surface and spreads light source, include the following steps:
First, S101 is entered step, the chip for being used to form LED characters is planted admittedly on wiring board, it is further, described
Welding may be used in chip or the mode of insertion is planted admittedly on wiring board.Further, the shape of the wiring board is rectangle,
And in other examples, can also be any one of circle, triangle, trapezoidal, regular or irregular curved shape,
This does not affect specific embodiments of the present invention, and in the embodiment shown by the present invention, preferably by the side of rectangle
Formula is further described through the specific implementation mode of the present invention, but this does not represent can only using a kind of rectangle this shape and
Structure can specifically be made a concrete analysis of, it will not be described here as the case may be.
Further, the chip of the LED characters, can be MB chips, GB chips, TS chips, AS chips etc., above-mentioned every
All with different features, actual use is any to be determined according to actual demand kind chip.
Further, the size of the LED characters chip can be set according to the lighting power size that user actually uses
Meter, in a preferred embodiment, the LED alphanumeric displays show power, then the size of the LED characters chip is got over
Greatly.
Then, S102 is entered step, prepares trepanning steel mesh, and the trepanning steel mesh is covered on the wiring board, into
One step, the trepanning steel mesh prepared in the step S102, position, shape, size and the circuit chip on board of trepanning
Position, shape, size are adapted.
Finally, S103 is entered step using aperture segment on filler filling steel mesh, and the wiring board is made to be detached from steel mesh
Projective structure is formed under covering, it is generally the case that after being filled using filler, the filler can be made to have certain
Cooling time, the cooling treatment can be accelerated by certain mode at this time, such as drying, accelerate wind speed etc., into
One step, the filler includes the mixture of epoxy resin or silica gel silicone grease class synthetic resin or fluorescent powder hybrid resin, into
One step, the hybrid resin material for admixing fluorescent powder can make wrapped blue chip send out white light, meet more fields
The demand of conjunction, it is generally the case that often use blue chip as preparation LED alphanumeric displays in the prior art, but at other
Embodiment in, red, yellow or other colors can also be used, more specifically, after fluorescent powder is added, it can be made same
Showing white light, this depends on the ingredient of the fluorescent powder, but has no effect on specific embodiments of the present invention, and specifically
Ground, the light finally shown can also be blue, amber, green, purple, orange etc., refuse herein not just for white light
It repeats.
It, can also be it will be appreciated by those skilled in the art that the step S102 can not only be executed after step slol
It executes before step S101, i.e., first prepares the steel mesh, then plant the chip for being used to form LED characters on wiring board admittedly,
This does not affect specific embodiments of the present invention.
Further, aperture segment can be realized by three kinds of modes on the filler filling steel mesh, be specifically included:
Filler is brushed on trepanning steel mesh by painting device, the filler is made to enter trepanning by method one repeatedly
And the alphanumeric display sides LED and surrounding on the chip are covered, further, the mode of the brushing, referring to will with scraper
Epoxy resin or the mixture of silica gel lipid synthetic resin or fluorescent powder hybrid resin are directly brushed on entire steel mesh surface, this is made
Resin is accurately covered in chip over and around through steel mesh hole.
Filler is instiled in trepanning steel mesh by syringe, so that the filler is entered trepanning and be covered in by method two
Over and around, further, the mode of the instillation refers to closing the epoxy resin of filling or silica gel lipid to the chip
It is filled into syringe at the mixture etc. of resin or fluorescent powder hybrid resin, then the resin is instiled in trepanning steel mesh by syringe
Trepanning in, so that the resin is accurately covered in chip over and around.
Filler is sprayed in trepanning steel mesh by spray equipment, so that the filler is entered trepanning and cover by method three
Side on the chip and surrounding are covered, further, the mode of the spraying, referring to will be by the epoxy resin or silica gel of filling
The mixture etc. of lipid synthetic resin or fluorescent powder hybrid resin is filled into spray equipment, then by spray equipment by the resin
It is ejected into the trepanning of trepanning steel mesh, the resin is made accurately to be covered in chip over and around.
Further, after the wiring board, which is filled object, to be filled, ability after the fillers solidifications such as the steel mesh needs
It is detached from above wiring board, the hardening time of the filler, the environment temperature where when be to fill is foundation, preferably at one
It,, can be with and in another preferred embodiment if generally needing 6-8 hours or so to cure under room temperature in ground embodiment
Cured using mode of heating, hardening time is 15-30 minutes at 80 DEG C.
Fig. 2 shows specific implementation mode according to the present invention, a kind of preparation method of LED alphanumeric displays it is specific
Flow diagram specifically includes the following steps:
It will be appreciated by those skilled in the art that the step S201 to S203 can refer to S101 shown in earlier figures 1 extremely
S103, it will not be described here.
And then, further include step S204 after S203, the wiring board prepared be pressed into reflection cavity opening direction,
Further, the wiring board prepared refers to welded or has been inserted into LED chip, and is filled out with filler
Fill and cover, and filler have been cured after wiring board.
Further, the reflection cavity is plastics reflecting cover or isolation lid with character cavity feature.
Further, the shape of the reflection cavity is rectangle, circle, triangle, trapezoidal, regular or irregular Curved
Any one of shape, further, the shape of the reflection cavity is consistent with the shape of wiring board, further, at this
In the shown embodiment of invention, the shape preferably by the wiring board is rectangle, and the shape of the reflection cavity is also square
Shape, and in other examples, when the shape of the wiring board is circle, triangle, trapezoidal, regular or irregular bending
Any one of shape, the shape of the reflection cavity can also be and the circle of wiring board same shape, triangle, trapezoidal, regular
Or any one of irregular curved shape, this does not affect specific embodiments of the present invention, specifically, can be according to tool
Body situation is made a concrete analysis of, and it will not be described here.
Further, the size of the reflection cavity is the size dimension using the wiring board of its covering as foundation, into
One step, the length and width of the reflection cavity is exactly that it covers the length and width of wiring board.
Further, the main function of the reflection cavity be collect tube core side, the light that interface is sent out, to desired direction
Emit in angle, promotes the utilization rate of LED lamplight.
Then, S205 is entered step, diffusing protection film, the diffusing protection film master are sticked in the outer surface of the reflection cavity
If playing the role of the uniform luminosity of byte light-emitting surface and Protection glue, in addition it can play outside beautification LED alphanumeric displays
The effect of sight,
Further, the selection of the diffusing protection film can be the polymer sheet or thin of the microlens array prepared
Film, in a preferred embodiment, in order to preferably spread alphanumeric display indication range and protect LED alphanumeric displays
It using, the thickness of the diffusing protection film can be 0.1mm, and in other examples, the thickness of the diffusing protection film
It can be thickened or ironed according to actual demand and manufacture craft to be adjusted.
Further, the size and shape of the diffusing protection film with its covering reflection cavity be sized and shaped as according to
According in a preferred embodiment, diffusing protection film can be preferentially cut by we according to the size and shape of reflection cavity
Specification as reflection cavity size and shape, and in other examples, it is one big can also to will be greater than radiation chamber for we
After block diffusing protection film posts on reflection cavity, then redundance wiped out, this does not affect the specific implementation of the present invention
Scheme, it will not be described here.
Finally, S206 is entered step, Pin needles are opened, further, the Pin needles are " tungsten carbide " raw material, the Pin
Needle opens the back side of assist side, further, the transmission for connecting conduction and completion electric signal of the Pin needles.
Further, that the Pin needles can be specification limit φ 0.3mm~φ 0.8mm, 0.3*0.5mm~0.5*
0.8mm.Etc. plurality of specifications.
Further, multiple arrangement spacing of the Pin needles can be that 1.0mm~3.0mm, 1.0mm~5.0mm etc. are a variety of
Arrange spacing.
Fig. 3 shows a kind of process structure making figure of LED alphanumeric displays of the present invention, the present invention will in conjunction with Fig. 3 and
Fig. 4 is further described the specific implementation mode of the present invention, and in the present invention, also has the interconnecting piece being not directed to
Part is not shown in specification and attached drawing, but this does not represent the present invention and does not have these components, and the present invention is preferably
Show the important connecting component of the present invention, it will not be described here.People in the art understands that concrete operations mode is as follows:
In a preferred embodiment, LED chip 3 is planted admittedly first on wiring board 4, then with opening and LED words
The steel mesh of the symbol corresponding hole of luminescent device is covered on wiring board 4, then filler 1 is applied swiped through steel mesh with scraper, described to fill out
The mixture etc. that object 1 refers to epoxy resin or silica type synthetic resin either fluorescent powder hybrid resin is filled, the filler 1 is made to penetrate
2 hole of steel mesh, is accurately covered in LED chip 3 over and around, plays protection and diffusion, subsequently will be with word after solidification
The reflection cavity 5 of cavity feature is accorded with, the reflection cavity 5 can be plastics reflecting cover or isolation board, be pressed on wiring board 4, make hair
Light region can shine in the cavity that shines, and finally stick diffusing protection film 6, by the uniform luminosity of byte light-emitting surface and Protection glue
Play the role of aesthetic appeal while effect, and PIN needle 7 is installed at the back side of assist side 4, forms a complete character
Display.The LED alphanumeric displays can be the solid size of 0-8 or each yardage word, variously-shaped arrow, triangle, circle or not
Round, the synthesized character light reflection device of rule.
In another preferred embodiment, when LED chip 3 is planted after on wiring board 4 admittedly, those skilled in the art manage
Solution, can also inject the filler into syringe, then the mode of used needle cylinder injection, filler 1 is accurately covered in LED chip
3 over and around, after carry out next step operation again.
And in other embodiments, it is planted after on wiring board 4 when LED chip 3 is solid, it will be appreciated by those skilled in the art that may be used also
To inject the filler into spray equipment, then by spray equipment, filler is sprayed on LED chip 3 over and around.
Fig. 4 shows a kind of topological diagram of LED alphanumeric displays of the present invention, it will be appreciated by those skilled in the art that the present invention is also
A kind of LED alphanumeric displays are provided, are specifically included:Wiring board 4 plants the LED chip 3 being arranged in wiring board outer surface, is convex admittedly
Go out 3 outer surface of the LED chip setting filler 1, reflection cavity 5, diffusing protection film 6, PIN needle 7.
Further, the filler 1 of 3 outer surface of protrusion LED chip setting, as epoxy resin or silica gel lipid close
At resin or the mixture of fluorescent powder hybrid resin, the thickness of the filler 1 is 0.5mm~1.5mm, preferably real at one
It applies in example, the thickness of the filler 1 can be 0.5mm either 0.6mm or 1.1mm, these do not affect the tool of the present invention
Body is implemented, and it will not be described here.
Further, the reflection cavity 5 half coats the wiring board setting, and further, half cladding refers to described
Reflection cavity only coats this one side provided with LED chip on wiring board.Further, the reflection cavity 5 half cladding with it is described
After on wiring board, going out with the interface of wiring board can use resin to carry out adhesive seal.
Further, the diffusing protection film 6 is bonded the reflection cavity outer surface setting, and further, the diffusion is protected
Cuticula 6 is specifically fitted in the front of reflection cavity light transmission.
Further, the PIN needle 7 installs 4 back side of assist side.
In summary, in conjunction with Fig. 1 and Fig. 2 shows a kind of LED alphanumeric displays preparation method, specifically, one
In a preferred embodiment, LED chip is first consolidated plant in the circuit board by us, then the LED chip appearance to having planted admittedly
It is covered with filler, after the filler solidification of covering, in the circuit board by reflection cavity covering, and in the reflection covered
Diffusing protection film is sticked on chamber, PIN needle 7 is installed at the back side of final online road plate, and such a LED alphanumeric displays just make
It completes.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (16)
1. a kind of preparation method of LED alphanumeric displays protects chip simultaneously by the projective structure formed in chip outer surface
Spread light source, which is characterized in that include the following steps:
A. the chip for being used to form LED characters is planted admittedly on wiring board;
B. trepanning steel mesh is prepared, and the trepanning steel mesh is covered on the wiring board;
C. aperture segment on filler filling steel mesh is used, the wiring board is made to form projective structure in the case where being detached from steel mesh covering.
2. preparation method according to claim 1, which is characterized in that the position of trepanning, shape, big in the step b
It is small to be adapted with the position of the circuit chip on board, shape, size.
3. preparation method according to claim 1, which is characterized in that the step c includes:It will be filled by painting device
Object is brushed repeatedly on trepanning steel mesh, so that the filler is entered trepanning and is covered the alphanumeric display sides LED on the chip
And surrounding.
4. preparation method according to claim 1, which is characterized in that the step c includes:Filler is dripped by syringe
Note makes the filler enter trepanning and is covered in the chip over and around in trepanning steel mesh.
5. preparation method according to claim 1, which is characterized in that the step c includes:It will be filled by spray equipment
Object is sprayed in trepanning steel mesh, so that the filler is entered trepanning and is covered in the chip over and around.
6. preparation method according to any one of claim 1 to 5, which is characterized in that after the step c, also wrap
Include step:
D. the wiring board prepared in the step c is pressed into reflection cavity opening direction;
E. diffusing protection film is sticked in the outer surface of the reflection cavity;
F. Pin needles are opened.
7. preparation method according to claim 6, which is characterized in that the reflection cavity is the modeling with character cavity feature
Expect reflecting cover or isolation lid.
8. preparation method according to claim 7, which is characterized in that the shape of the reflection cavity is rectangle, circle, triangle
Any one of shape, trapezoidal, regular or irregular curved shape.
9. according to the preparation method described in any one of claim 1-5 or 7 or 8, which is characterized in that the shape of the wiring board
For any one of rectangle, circle, triangle, trapezoidal, regular or irregular curved shape.
10. preparation method according to claim 9, which is characterized in that the filler includes epoxy resin or silica gel silicon
The mixture of lipid synthetic resin or fluorescent powder hybrid resin.
11. according to the preparation method described in right 1-5 or 7 or 8 or 10, which is characterized in that in the LED alphanumeric displays are shown
Hold the solid size or multi-code number, arrow, triangle, circle, rule or irregular figure for 0~8.
12. a kind of LED alphanumeric displays, which is characterized in that including wiring board, plant the LED core being arranged in wiring board outer surface admittedly
The filler of piece, protrusion the LED chip outer surface setting.
13. display according to claim 12, which is characterized in that the thickness of the filler is 0.5mm~1.5mm.
14. display according to claim 12, which is characterized in that further include reflection cavity, the reflection cavity partly coats institute
State wiring board setting.
15. requiring the display according to right 12, which is characterized in that further include diffusing protection film, the diffusing protection film
It is bonded the reflection cavity outer surface setting.
16. requiring the display according to right 12, which is characterized in that further include PIN needle, the PIN needle is mounted on circuit
Back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810529845.8A CN108695418A (en) | 2018-05-29 | 2018-05-29 | A kind of LED alphanumeric displays and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810529845.8A CN108695418A (en) | 2018-05-29 | 2018-05-29 | A kind of LED alphanumeric displays and preparation method thereof |
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| CN108695418A true CN108695418A (en) | 2018-10-23 |
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| CN201810529845.8A Pending CN108695418A (en) | 2018-05-29 | 2018-05-29 | A kind of LED alphanumeric displays and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6491412B1 (en) * | 1999-09-30 | 2002-12-10 | Everbrite, Inc. | LED display |
| CN2899005Y (en) * | 2004-12-06 | 2007-05-09 | 贺伟 | LED display device |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
-
2018
- 2018-05-29 CN CN201810529845.8A patent/CN108695418A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6491412B1 (en) * | 1999-09-30 | 2002-12-10 | Everbrite, Inc. | LED display |
| CN2899005Y (en) * | 2004-12-06 | 2007-05-09 | 贺伟 | LED display device |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
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Application publication date: 20181023 |