CN108695285A - 半导体装置以及电子装置 - Google Patents
半导体装置以及电子装置 Download PDFInfo
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Abstract
本发明涉及半导体装置以及电子装置。提供一种能够高精度地调整将半导体装置安装于安装基板时的装配高度的半导体装置以及电子装置。设置从覆盖半导体芯片的圆柱形状的树脂密封体(10)的一个主面(4)沿轴向引出的直线状引线(3)以及以将其围绕的方式设置多个螺旋状引线(2a)和(2b)来做成多级螺旋构造。构成多级螺旋构造的多个螺旋状引线为相同的间距。
Description
技术领域
本发明涉及能够对针对安装半导体基板的安装基板的装配高度任意地进行调整的半导体装置以及电子装置。
背景技术
图8是将以往的半导体装置安装于安装基板后的电子装置的侧面图。
半导体装置11的引线12经由焊锡9安装于安装基板13,安装基板13与半导体装置11电连接。半导体装置11在装载有磁传感器那样的对磁进行检测的元件的情况下,与感测的被测定物(例如,磁铁)的距离15对其检测灵敏度带来重要的影响。作为传感器发挥作用的半导体装置与被测定物的距离15对于检测灵敏度是重要的主要原因,需要高精度地调整向安装基板13的半导体装置11的装配高度14。
在专利文献1中,公开了将半导体集成电路装置的多个引线引脚以将由金属构成的固定用构件介于半导体集成电路装置与基板之间的方式***到具有分别对应的电路布线的基板的安装孔中并且将由金属构成的固定用构件装配于引线引脚的规定位置来将半导体集成电路装置固定于基板的电子装置。
此外,在专利文献2中,公开了使多个引线的中间部分弯曲成圆弧状以使向侧方突出并且利用其弯曲部将半导体装置固定于布线基板这样的半导体引线构造。
现有技术文献
现有文献
专利文献1:日本特开平7-235628号公报;
专利文献2:日本特开2002-93978号公报。
发明要解决的课题
可是,在专利文献1所公开的电子装置中,由于为将固定用构件装配于直线形状的引线引脚的规定位置来进行固定的方式所以高度偏差较大,难以高精度控制装配高度。
此外,在专利文献2所公开的半导体引线构造中,能够使向安装基板的装配高度为规定的高度,但是,弯曲部的位置被决定,不能在安装半导体装置的顾客侧自由地进行高度调节。因此,按照每个顾客生产许多虽然作为半导体装置的电特性相同但是只有引线形状不同的制品,存在生产管理繁杂这样的问题。
发明内容
本发明是鉴于这样的情况而完成的,其目的在于提供在将半导体装置安装于安装基板时能够高精度地调整装配高度的半导体装置以及电子装置。
用于解决课题的方案
为了解决上述课题,在本发明中使用了以下的方案。
是一种半导体装置,由从覆盖半导体芯片的密封体引出的多个引线构成,其中,所述半导体装置具备:
所述引线从所述密封体的一个主面引出而沿与所述一个主面垂直方向延伸的直线状引线;以及
与所述直线状引线分离且呈螺旋状地围绕所述直线状引线的螺旋状引线。
此外,是一种电子装置,将半导体装置安装于安装基板,其特征在于,
在接合有所述螺旋状引线的所述安装基板设置有所述螺旋状引线贯通的贯通孔,
所述贯通孔为按照所述螺旋状引线的形状。
发明效果
通过使用上述方案,能够提供在将半导体装置安装于安装基板时能够高精度地调整装配高度的半导体装置以及电子装置。
附图说明
图1是本发明的第一实施方式的半导体装置的立体图。
图2是本发明的第一实施方式的半导体装置的底视图。
图3是将本发明的第一实施方式的半导体装置安装于安装基板后的电子装置的侧面图。
图4是安装有本发明的第一实施方式的半导体装置的安装基板的贯通孔部放大图。
图5是将本发明的第一实施方式的半导体装置安装于安装基板时的顶视图。
图6是本发明的第二实施方式的半导体装置的立体图。
图7是本发明的第三实施方式的半导体装置的立体图。
图8是将以往的半导体装置安装于安装基板后的电子装置的侧面图。
具体实施方式
以下,参照图来对本发明的半导体装置进行说明。
图1是本发明的第一实施方式的半导体装置的立体图。
本发明的第一实施方式的半导体装置1由使用树脂包覆半导体芯片(未图示)后的圆柱形状的树脂密封体10、以及从作为树脂密封体10的底面的一个主面4沿垂直方向伸长的多个引线2a、2b、3构成。在树脂密封体10内,多个引线2a、2b、3与半导体芯片上的电极电连接。多个引线由1个直线状引线3和与直线状引线3分离并呈螺旋状地围绕其的多个螺旋状引线2a、2b构成,1个直线状引线3从一个主面4的大致中心向树脂密封体10的轴向直线伸长,螺旋状引线2a、2b从一个主面4的径向的外周附近沿轴向螺旋伸长,形成了多级螺旋(multiple spiral)构造。此时的螺旋的方向为向右卷绕、向左卷绕哪一个都可以,但是,多个螺旋状引线的卷方向相同。从一个主面4中的直线状引线3的中心到螺旋状引线的距离即半径r在螺旋状引线2a和螺旋状引线2b为等距离,即使螺旋状引线2a、2b反复旋转该半径r也不改变总是固定。此外,螺旋状引线2a的螺旋间距21总是固定,在螺旋状引线2b中也具有相同的螺旋间距21。如后述那样,在安装基板上安装半导体装置时的高度精度根据该螺旋间距21的大小而改变。
在上述中将半导体芯片的密封体说明为树脂密封体,但是,在本发明中并不限定于树脂密封体,也可以为利用了通过金属CAN覆盖半导体芯片后的密封体的半导体装置。此外,将螺旋状引线为多个的多级螺旋构造说明为例子,但是,螺旋状引线也可以为1个。
图2是本发明的第一实施方式的半导体装置的底视图。
左图为半导体装置1的树脂密封体为圆柱形的例子,右图为半导体装置1的树脂密封体为长方体的例子。在树脂密封体的一个主面4上设置有多个引线延伸部7,在一个主面4的中心部设置有1处引线延伸部7,在周边部设置有2处引线延伸部7,从周边部的引线延伸部7的1处延伸螺旋状引线2a,从另1处延伸螺旋状引线2b,而且,从中心部的引线延伸部7延伸直线状引线3。图示的虚线示出了将一个主面4的中心部作为中心的圆,沿着该圆的圆周形成螺旋状引线2a、2b,从一个主面4中的直线状引线3的中心到螺旋状引线的距离即半径r在螺旋状引线2a和螺旋状引线2b为等距离。进而,与螺旋状引线2a和2b对应的引线延伸部7被设置在将与直线状引线3对应的引线延伸部7作为中心而对称的位置。如果,所装载的半导体芯片为4个端子,则设置在周边部的引线延伸部7为3处,3个引线延伸部7位于以中心角120°均等地分割后的圆周上。在像这样增加端子数的情况下,只要根据该数在圆周上均等地配置引线延伸部7即可。
图3是将本发明的第一实施方式的半导体装置安装于安装基板后的电子装置的侧面图。
使从半导体装置1的树脂密封体10延伸的螺旋状引线2a和2b、直线状引线3一边如螺钉那样旋转一边塞入到预先设置于安装基板13的多个贯通孔中,在成为规定的装配高度5和规定的方向的时间点停止,经由焊锡9将安装基板13和引线接合。然后,将从安装基板13的下表面冒出的不需要的引线切断而电子装置的制造完成。螺旋状引线2a、2b的螺旋间距21被任意决定,但是,当使螺旋间距21变大时,由1次旋转造成的塞入量变大,相反当使螺旋间距21变小时,由1次旋转造成的塞入量变小。在想要严格地管理半导体装置1的高度精度的情况下,使旋转间距21变小更有利。
图4是安装本发明的第一实施方式的半导体装置的安装基板的贯通孔部放大图。(a)为剖面图,(b)为平面图。
如图4(a)所示那样,在安装基板13中设置有3处从其上表面到达下表面的贯通孔22,中央的贯通孔22为直线状引线用的孔,两端的贯通孔22为螺旋状引线用的孔。在该侧面图中难以理解,但是,左端的贯通孔按照从上表面向下表面去而从纸面的跟前向里方向稍微靠右倾斜,右端的贯通孔按照从上表面向下表面去而从纸面的里头向跟前方向稍微靠左倾斜。中央的贯通孔22为与安装基板13的基板平面垂直的贯通孔。
接着,使用图4(b)的平面图来对各个贯通孔22的倾斜的情况进行说明。3处贯通孔的贯通孔入口22a沿横一条直线排列,但是,在两端的贯通孔中,贯通孔出口22b与贯通孔入口22a不完全重叠而错开。在左端的贯通孔中,贯通孔出口22b相对于贯通孔入口22a向图的上方稍微靠右错开。这表示贯通孔22按照从上表面向下表面去而从跟前向里方向稍微靠右倾斜。此外,在右端的贯通孔22中,贯通孔出口22b相对于贯通孔入口22a向图的下方稍微靠左错开。这表示贯通孔按照从上表面向下表面去而从里头向跟前方向稍微靠左倾斜。再有,在平面视上沿着螺旋状引线描绘的圆周设置两端的贯通孔22的贯通孔入口22a和贯通孔出口22b。此外,该贯通孔的倾斜的程度与螺旋状引线的倾斜一致,由螺旋状引线的螺旋间距或半径决定。它们的倾斜的程度是已知的,因此,在向安装基板装配半导体装置时,只要知晓装配时的转速,则能够高精度地安装到规定的高度。
如果,上述那样的形状的贯通孔22的形成困难,则使两端的贯通孔22为与安装基板13的基板平面垂直的形状的贯通孔也可,但是,此时需要以能够贯通的方式宽度宽地设置螺旋状引线2a、2b。
图5是将本发明的第一实施方式的半导体装置安装于安装基板时的顶视图。
通过在安装基板13的贯通孔中穿过螺旋状引线来使半导体装置旋转从而高精度地改变其装配高度的情况如上述那样,但是,在本发明的第一实施方式的半导体装置中也能够与高度同时任意决定装配方向。例如,在半导体装置1为指向性高的传感器的情况下,容易针对想要感测的被检测对象(例如,光或声音)沿检测灵敏度良好的方向(感测方向)6安装半导体装置1。在图5中的左侧的图中,发光体(灯泡型)与半导体装置1的感测方向6不一致,但是,只要使半导体装置1向左旋转90°,就能够检测灵敏度好地检测被检测对象。这是因为:相对于半导体装置1的一个主面4以沿着圆的圆周的方式设置螺旋状引线2a、2b。此外,通过改变半导体装置1的感测方向6也改变其装配高度5,但是,只要使螺旋状引线2a、2b的螺旋间距21充分小,则根据感测方向6的调整而改变的高度的变化量小而能够为容许范围内。
图6是本发明的第二实施方式的半导体装置的立体图。
在图1中,关于螺旋状引线2a、2b,在作为圆柱形状的树脂密封体10的底面的一个主面4设置有引线延伸部,但是,在本发明的第二实施方式的半导体装置中,引线延伸部为不被设置在一个主面4而被设置在圆柱的侧面的结构。通过做成这样的结构,从而能够使螺旋状引线2a、2b的半径r比圆柱形状的树脂密封体10的半径大,能够做成耐振性高的半导体装置1。在螺旋状引线2a、2b为将2个弹簧组合后的形状并与安装基板接合的情况下,来自外界的振动经由安装基板传递到半导体装置1的螺旋状引线2a、2b,存在螺旋状引线2a、2b进行疲劳破坏而产生安装不良的情况。螺旋状引线2a、2b作为弹簧发挥作用来缓和振动的应力来防止引线的疲劳破坏。在第二实施方式中,即使由于螺旋状引线2a、2b的半径更大而受到振动,半导体装置1的姿势恢复性也高,能够更稳定地进行感测。
图7是本发明的第三实施方式的半导体装置的立体图。
第三实施方式为将第一实施方式和第二实施方式组合后的实施方式,一个螺旋状引线20在一个主面4的外周附近设置引线延伸部,引线从此螺旋伸长。此外,另一个螺旋状引线19在圆柱形状的树脂密封体10的侧面设置引线延伸部,引线从此螺旋伸长。形成多级螺旋构造的2个螺旋状引线的螺旋间距21相同,但是,半径不同,从圆柱的侧面伸长的螺旋状引线19的半径被形成为比从圆柱的底面伸长的螺旋状引线20的半径大。通过做成这样的结构,从而能够做成对振动频率不同的振动也具有耐振性的半导体装置1。
在此之前,说明了本发明的半导体装置能够在安装基板装配为任意的高度、能够向安装基板装配为任意的方向、以及具有耐振性,但是,本发明的半导体装置的引线为与线圈类似的形状而也能够用作天线。像这样,在本发明的半导体装置的情况下,除了将引线的部分作为电信号的传递的功能以外,也能够活用作天线功能。
附图标记的说明
1 半导体装置
2a 螺旋状引线
2b 螺旋状引线
3 直线状引线
4 一个主面
5 装配高度
6 感测方向
7 引线延伸部
9 焊锡
10 树脂密封体
11 半导体装置
12 引线
13 安装基板
14 装配高度
15 距离
19 螺旋状引线
20 螺旋状引线
21 螺旋间距
22 贯通孔
22a 贯通孔入口
22b 贯通孔出口
r 半径。
Claims (6)
1.一种半导体装置,包含从覆盖半导体芯片的密封体引出的多个引线,其中,所述半导体装置具备:
所述引线从所述密封体的一个主面引出而沿与所述一个主面垂直方向延伸的直线状引线;以及
与所述直线状引线分离且呈螺旋状地围绕所述直线状引线的螺旋状引线。
2.根据权利要求1所述的半导体装置,其特征在于,所述螺旋状引线的引线延伸部被设置在所述一个主面。
3.根据权利要求1所述的半导体装置,其特征在于,所述螺旋状引线的引线延伸部被设置在与所述一个主面不同的面。
4.根据权利要求3所述的半导体装置,其特征在于,与所述一个主面不同的面为所述密封体的侧面。
5.根据权利要求1至4的任一项所述的半导体装置,其特征在于,所述螺旋状引线的螺旋间距为固定。
6.一种电子装置,将根据权利要求1至权利要求4的任一项所述的半导体装置安装于安装基板,其特征在于,
在接合有所述螺旋状引线的所述安装基板设置有所述螺旋状引线贯通的贯通孔,
所述贯通孔为按照所述螺旋状引线的形状。
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US6320268B1 (en) * | 1999-01-27 | 2001-11-20 | Abb (Schweiz) Ag | Power semiconductor module |
JP2002151223A (ja) * | 2000-11-13 | 2002-05-24 | Sony Corp | 電気部品用ソケット |
JP2008034698A (ja) * | 2006-07-31 | 2008-02-14 | Denso Corp | 軟質材封止型パワー半導体装置 |
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