CN108693945A - A kind of self power generation high-availability computer radiator and from temperature difference control method - Google Patents
A kind of self power generation high-availability computer radiator and from temperature difference control method Download PDFInfo
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- CN108693945A CN108693945A CN201810779553.XA CN201810779553A CN108693945A CN 108693945 A CN108693945 A CN 108693945A CN 201810779553 A CN201810779553 A CN 201810779553A CN 108693945 A CN108693945 A CN 108693945A
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- 238000010248 power generation Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 24
- 241000883990 Flabellum Species 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of self power generation high-availability computer radiator and from temperature difference control method, it is related to field of computer technology;Two pieces of thermo-electric generation chips are installed on the radiator, it is independent to radiate by separating radiator and thermo-electric generation chip cold end radiator, generate the temperature difference.To provide electric energy for radiator fan motor, heat spreader structures are simple, efficient.
Description
Technical field
The invention discloses a kind of self power generation high-availability computer radiator and from temperature difference control method, it is related to computer technology
Field.
Background technology
With society be constantly progressive, scientific and technological continuous development, computer in the routine work and life of people
As an indispensable part.Computer function it is powerful, it can be achieved that numerical computations, information and date processing, Computer Aided Design with
The functions such as manufacture, process control, artificial intelligence, network application, application field have penetrated into all trades and professions of society, have just changed
Become the traditional work of people, studying and living mode.
Processor is the core of computer system, and reliability is that entire computer system is reliably basic.Processor
Reliability is very sensitive to temperature, studies have shown that 55% processor failure is caused by overheating.How efficient cooling treatment
Device has become important and urgent problem.Traditional computer processor(Including central processing unit, graphics processor)Heat dissipation is big
Air cooling method is mostly used, i.e., metal fin is installed on a processor, and small fan is installed on a heat sink, allows Air Forced Convection
The heat generated when processor work is taken away, i.e. electricity consumption can drive fan rotation to achieve the purpose that heat dissipation.But existing air cooling method
It needs additionally to consume electric energy for fan running, and the thermal energy that processor generates could not be also utilized, but is directly discharged into air.
This not only causes the waste of the energy, can also influence environment.
Invention content
The purpose of the present invention is to provide a kind of self power generation high-availability computer radiator and from temperature difference control method, thus gram
Take the deficiencies in the prior art.
The principle of the present invention is that thermo-electric generation is the Seebeck effect using thermoelectric material, and thermal energy is directly changed into
The Green power generation technology of electric energy;Make full use of processor itself generate heat, by one kind from thermo-electric generation control program come
Thermo-electric generation is carried out, the electric energy sent out is supplied directly to the operation of processor radiator, and radiator constantly distributes radiating end
Heat, reduce the temperature of radiating end, to increase the temperature difference between processor and radiating end, and then improve processor itself hair
Electrical efficiency, with this, to achieve the purpose that processor self-heating, oneself dissipates.Pacify between processor radiating block and thermo-electric generation chip cooling block
Equipped with thermo-electric generation chip, the both sides of thermo-electric generation chip are independently radiated, and generate the temperature difference.To be provided for radiator fan motor
Electric energy.
The invention is realized by the following technical scheme, including processor, further include radiator fan, processor radiating block,
Thermo-electric generation chip cooling block, thermo-electric generation chip,
The bottom surface of wherein processor radiating block is contacted with processor, and the top surface of processor radiating block further includes that uniformly distributed hot junction connects
Piece, correspondingly, the bottom surface of thermo-electric generation chip cooling block further include uniformly distributed cold end connection sheet, and hot junction connection sheet is connect with cold end
Piece is engaged with each other;Thermo-electric generation chip is arranged between hot junction connection sheet and cold end connection sheet, and both sides connect with hot junction respectively
Contact pin is bonded with cold end connection sheet;
The left and right side of the hot junction connection sheet is fixedly connected with processor cooling fin;
The top surface of the cold end connection sheet is fixedly connected with thermo-electric generation chip cooling piece.
Hot junction connection sheet is also fixed by one piece of ABS plastic piece by six screw connections with cold end link plate.
The present invention includes below from temperature difference control method:
When processor load increases, temperature of processor rises, and the temperature difference between hot junction connection sheet and cold end connection sheet is caused to add
Greatly, therefore the generating efficiency of thermo-electric generation chip is promoted, and improves the rotating speed of radiator fan, power also rises therewith;Similarly,
When processor load reduces, temperature of processor declines, and the temperature difference between hot junction connection sheet and cold end connection sheet is caused to reduce, because
The decrease of power generation of this thermo-electric generation chip, the rotating speed of radiator fan, power also decline therewith;To be formed from temperature difference object
Reason control, excludes the control of electronic component, achievees the purpose that increase device performance stability.
The radiator fan is connect with hot junction connection sheet;Hot junction connection sheet further includes the buckle on setting in front,
Shell is fixed on by the connecting rod of bottom in buckle.
The radiator fan includes mainly shell, motor and flabellum;Flabellum axle is set to motor front end, and motor is fixed on outer
The axle center of shell.
The motor is DC brushless motor.
The radiator flabellum is turbine type blade.
The processor cooling fin is all made of fin type with thermo-electric generation chip cooling piece, and fin direction is outside, most
The wind of limits generated using radiator fan is radiated.
Contact surface between the thermo-electric generation chip and hot junction connection sheet and cold end connection sheet is more than using thermal conductivity
The heat-conducting silicone grease of 10W/m-k is filled.
It is an advantage of the current invention that the radiator of 1, traditional computer is by powered operation, electricity is caused in this way
Can secondary waste, the temperature difference that is formed carries out between high temperature and the low temperature of radiating end that this utilization of works processor itself generates
Thermo-electric generation, the electric energy sent out are supplied directly to radiator operation.2, the present invention is excluded using from temperature difference physical control scheme
The control of electronic component increases the stability of device.3, the present invention DC brushless motor device small using voltage is started
Part, DC brushless motor volume is small, and rotating speed is high, and construction for heat radiating device can be made compact, improves radiating efficiency.The present invention is suitable for
Any computer, thermal conductivity is good, efficient, and heat spreader structures are simple, performance is stablized, and not only realize effective profit of energy
With, saved electric energy, more reduce influence of the heat to environment, preferably realize effects of energy saving and emission reduction.
Description of the drawings
Fig. 1 is structure of the invention schematic diagram.
Fig. 2 is control principle drawing of the present invention.
Fig. 3 is structure of the invention figure one.
Fig. 4 is structure of the invention figure two.
Fig. 5 is structure of the invention figure three.
Fig. 6 is load resistance power effect curve graph.
Fig. 7 is load resistance voltage effects curve graph.
Fig. 8 is best connection plan line map.
Specific implementation mode
1 to 8 pair of the preferred embodiment of the present invention below in conjunction with the accompanying drawings further illustrates the present invention the problems with overcome:
1, thermoelectric generation film generating efficiency is improved as far as possible;2, the same of thermo-electric generation is carried out in the heat generated using computer processor
When, ensure the working environment that computer processor low temperature requires;3, the wind generated to greatest extent using fan is radiated;
4, make whole device performance stable, durable;And realize being controlled from the temperature difference for computer processor, form benign cycle.
The invention is realized by the following technical scheme, including processor 10, further includes radiator fan 1, processor heat dissipation
Block 2, thermo-electric generation chip cooling block 3, thermo-electric generation chip 4, i.e., by 4 aware processor radiating block 2 of thermo-electric generation chip and temperature
The temperature difference between poor power-generating chip radiating block 3, to produce electricl energy, driving motor 12 rotates flabellum 13, to reach heat dissipation
Purpose.
Thermo-electric generation chip 4 is fabricated using thin film technique, has following features:(1)In 1mm2In region
Difference variation can generate the voltage of 0.5-5v, it can be achieved that self continued power;(2)Small, the response time is short;(3)Long lifespan,
It can work long hours.
Wherein the bottom surface of processor radiating block 2 is contacted with processor 10, and the top surface of processor radiating block 2 further includes uniformly distributed
Hot junction connection sheet 21, correspondingly, the bottom surface of thermo-electric generation chip cooling block 3 further include uniformly distributed cold end connection sheet 31, and hot junction connects
Contact pin 21 is engaged with each other with cold end connection sheet 31;The setting of thermo-electric generation chip 4 hot junction connection sheet 21 and cold end connection sheet 31 it
Between, and both sides are bonded with hot junction connection sheet 21 with cold end connection sheet 31 respectively;
Wherein fixing means is that hot junction connection sheet 21 is connect with cold end link plate 31 and one piece of ABS plastic piece 5 by six screws 51
It is fixed.
Processor radiating block 2 is preferably processed by aluminium block with thermo-electric generation chip cooling block 3, is mainly used at realization
Manage the efficient transmission of heat between device 10 and thermo-electric generation chip 4.The thermal conductivity of aluminium is 237W/m.K, is better than other common materials
Heat transfer efficiency, select aluminum products may be implemented low cost and efficient heat transfer purpose.The structure of heat conduction portion mainly depends on
In the quantity and size of thermo-electric generation chip 4.The startup voltage of DC brushless motor is 0.15v, although the thermo-electric generation of monolithic
The voltage maximum that chip 4 generates is up to 2v, and output power is up to 0.22w, but since the internal resistance of thermo-electric generation chip 4 is higher,
Often the thermo-electric generation chip 4 of monolithic cannot drive DC brushless motor to rotate.But then, if thermo-electric generation chip 4
Excessively, then it can lead to each 4 non-uniform temperature of thermo-electric generation chip, influence generating efficiency.Therefore, the present invention is sent out using four temperature difference
Electrical chip 4 is used as preferred embodiment, as shown in Figure 6.
The left and right side of the hot junction connection sheet 21 is fixedly connected with processor cooling fin 22;
The top surface of the cold end connection sheet 31 is fixedly connected with thermo-electric generation chip cooling piece 32.
The present invention includes below from temperature difference control method:
When 10 load of processor increases, 10 temperature rise of processor causes between hot junction connection sheet 21 and cold end connection sheet 31
The temperature difference increase, therefore the generating efficiency of thermo-electric generation chip 4 is promoted, and improves the rotating speed of radiator fan 1, and power is also therewith
Rise;Similarly, when 10 load of processor reduces, 10 temperature of processor declines, and leads to hot junction connection sheet 21 and cold end connection sheet
The temperature difference between 31 reduces, therefore the decrease of power generation of thermo-electric generation chip 4, the rotating speed of radiator fan 1, and power is also therewith
Decline;To be formed from temperature difference physical control, the control of electronic component is excluded, achievees the purpose that increase device performance stability.
The circulation that air is pushed by radiator fan 1, constantly takes away the heat in metal heat-dissipation block.Air is radiating
Under the action of block, first flow through with thermo-electric generation chip cooling block 3, reduce thermo-electric generation chip 4 and be located at the temperature of this side, then pass through
It crosses the main radiating block of processor 2 and takes away heat, not only improve generating efficiency, but also the effective heat for having taken away the generation of processor 10 in this way
Amount, realizes the secondary use of the energy, to realize the purpose of energy-saving and emission-reduction.
The radiator fan 1 is connect with hot junction connection sheet 21;Hot junction connection sheet 21 further includes on setting in front
Buckle 211, shell 11 are fixed on by the connecting rod 111 of bottom in buckle 211.
The radiator fan 1 includes mainly shell 11, motor 12 and flabellum 13;Flabellum 13 is located in 12 front end of motor,
Motor 12 is fixed on the axle center of shell 11.
The motor 12 is DC brushless motor, and the voltage generated due to thermo-electric generation chip 4 and the internal resistance of itself are larger,
And DC Brushless Motor has the advantage of high conversion efficiency, therefore this items selection DC brushless motor is as power source.Directly
The main feature for flowing brushless motor is as follows:(1)Have the advantages that Traditional DC motor, while eliminating carbon brush, slip ring knot again
Structure(2)It can save speed reducer with the high-power operation of low speed and directly drive big load(3)Torque characteristics is excellent, in, low speed
Torque performance is good, and detent torque is big, and starting current is small(4)Stepless speed regulation, speed adjustable range is wide, and overload capacity is strong, and reliability is high, surely
It is qualitative good, it is adaptable(5)Resistance to vibrations of jolting, low noise shake small, smooth movement, long lifespan
The radiator flabellum 13 is turbine type blade.
The processor cooling fin 22 and thermo-electric generation chip cooling piece 32 are all made of fin type, and fin direction to
Outside, the wind generated to greatest extent using radiator fan 1 is radiated.Radiator fan 1 is driven using DC brushless motor
Rotation moves thermal energy by air stream turn, and when air is compressed, static pressure transmits air fluid, using throughout
On heating surface, to take away heat.
Contact surface between the thermo-electric generation chip 4 and hot junction connection sheet 21 and cold end connection sheet 31 is more than using thermal conductivity
The heat-conducting silicone grease of 10W/m-k is filled.Fig. 6 and Fig. 7 is the load resistance power effect curve graph and load resistance of processor
Voltage effects curve graph, processor can reach 40 °C of temperature difference up to 65 °C and room temperature when computer normal operation.By Fig. 6 with
Fig. 7 it is found that 40 °C of temperature difference curve smoothing, the maximum voltage that the thermo-electric generation chip 4 of monolithic generates is 1.8V, maximum work output
Rate is 0.3W.Since the temperature of processor 10 is steady rising, temperature difference also grows steadily therewith, and the power sent out also steadily increases
It is long, reach stable performance.
Present invention uses four plate thermo-electric generation chips 4 to generate electricity, due to by shadows such as resistance in thermo-electric generation chip 4
It rings, using the connection scheme of four 4, motors 12 of plate thermo-electric generation chip:Its mode of connection is as shown in Figure 8.
In this scenario, the thermo-electric generation chip 4 of monolithic can generate 1.8V voltages, internal resistance in 40 DEG C of the temperature differenceR It is interiorIt is 2
Ω, total voltage 3.6V, total internal resistance are 2 Ω, and motor equivalent resistance existsR MotorFor 10 Ω, then
Electric currentI=U Always/(R In total+R Motor)=0.3 A
VoltageU It is defeated=U Always*R Motor/(R In total+R Motor)=3 V
PowerP Output=U Output*I=0.9 W
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, and do not carrying on the back
In the case of spirit or essential attributes from the present invention, the present invention can be realized in other specific forms.Therefore, no matter from which
From the point of view of a bit, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is wanted by appended right
Ask rather than above description limit, it is intended that by all changes that come within the meaning and range of equivalency of the claims
It is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (9)
1. a kind of self power generation high-availability computer radiator, including processor(10), it is characterized in that:It further include radiator fan(1),
Processor radiating block(2), thermo-electric generation chip cooling block(3), thermo-electric generation chip(4),
Wherein processor radiating block(2)Bottom surface and processor(10)Contact, processor radiating block(2)Top surface further include uniformly distributed
Hot junction connection sheet(21), correspondingly, thermo-electric generation chip cooling block(3)Bottom surface further include uniformly distributed cold end connection sheet
(31), hot junction connection sheet(21)With cold end connection sheet(31)It is engaged with each other;Thermo-electric generation chip(4)It is arranged in hot junction connection sheet
(21)With cold end connection sheet(31)Between, and both sides respectively with hot junction connection sheet(21)With cold end connection sheet(31)Fitting;
The hot junction connection sheet(21)Left and right side and processor cooling fin(22)It is fixedly connected;
The cold end connection sheet(31)Top surface and thermo-electric generation chip cooling piece(32)It is fixedly connected.
2. a kind of self power generation high-availability computer radiator according to claim 1, it is characterized in that:Hot junction connection sheet(21)With
Cold end link plate(31)Also pass through one piece of ABS plastic piece(5)By six screws(51)It is connected and fixed.
3. a kind of self power generation high-availability computer radiator according to claim 1, it is characterized in that:
The radiator fan(1)With hot junction connection sheet(21)Connection;Hot junction connection sheet(21)Further include on setting in front
Buckle(211), shell(11)Pass through the connecting rod of bottom(111)It is fixed on buckle(211)In.
4. a kind of self power generation high-availability computer radiator according to claim 1, it is characterized in that:The radiator fan
(1)It include mainly shell(11), motor(12)With flabellum(13);Flabellum(13)It is located in motor(12)Front end, motor(12)Gu
It is scheduled on shell(11)Axle center.
5. a kind of self power generation high-availability computer radiator according to claim 4, it is characterized in that:The motor(12)It is straight
Flow brushless motor.
6. a kind of self power generation high-availability computer radiator according to claim 4, it is characterized in that:The radiator flabellum
(13)For turbine type blade.
7. a kind of self power generation high-availability computer radiator according to claim 1, it is characterized in that:The processor cooling fin
(22)With thermo-electric generation chip cooling piece(32)It is all made of fin type, and fin direction is consistent, to which wind direction is consistent, utilizes heat dissipation
Device fan(1)The wind of generation radiates.
8. a kind of self power generation high-availability computer radiator according to claim 1, it is characterized in that:The thermo-electric generation chip
(4)With hot junction connection sheet(21)With cold end connection sheet(31)Between contact surface using thermal conductivity be more than 10W/m-k thermal conductive silicon
Fat is filled.
9. according to a kind of self power generation high-availability computer radiator of claim 1 to 8 any one of them, it is characterized in that including following
From temperature difference control method:
Work as processor(10)When load increases, processor(10)Temperature rise leads to hot junction connection sheet(21)With cold end connection sheet
(31)Between the temperature difference increase, therefore thermo-electric generation chip(4)Generating efficiency promoted, improve radiator fan(1)Turn
Speed, power also rise therewith;Similarly, work as processor(10)When load reduces, processor(10)Temperature declines, and hot junction is caused to connect
Piece(21)With cold end connection sheet(31)Between the temperature difference reduce, therefore thermo-electric generation chip(4)Decrease of power generation, radiator
Fan(1)Rotating speed, power also declines therewith;To be formed from temperature difference physical control, the control of electronic component is excluded, reaches and adds
The purpose of big device performance stability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810779553.XA CN108693945A (en) | 2018-07-16 | 2018-07-16 | A kind of self power generation high-availability computer radiator and from temperature difference control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810779553.XA CN108693945A (en) | 2018-07-16 | 2018-07-16 | A kind of self power generation high-availability computer radiator and from temperature difference control method |
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| Publication Number | Publication Date |
|---|---|
| CN108693945A true CN108693945A (en) | 2018-10-23 |
Family
ID=63851670
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810779553.XA Pending CN108693945A (en) | 2018-07-16 | 2018-07-16 | A kind of self power generation high-availability computer radiator and from temperature difference control method |
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| Country | Link |
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| CN (1) | CN108693945A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111432611A (en) * | 2020-04-29 | 2020-07-17 | 中国电子科技集团公司第七研究所 | VPX machine case with heat dissipation function |
| CN112987887A (en) * | 2021-03-12 | 2021-06-18 | 六盘水师范学院 | Artificial intelligence analytical equipment for data processing |
| CN114110545A (en) * | 2021-11-24 | 2022-03-01 | 青岛同辉照明科技有限公司 | Device for keeping temperature of LED lamp constant |
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