CN108664669A - A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet - Google Patents
A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet Download PDFInfo
- Publication number
- CN108664669A CN108664669A CN201710186899.4A CN201710186899A CN108664669A CN 108664669 A CN108664669 A CN 108664669A CN 201710186899 A CN201710186899 A CN 201710186899A CN 108664669 A CN108664669 A CN 108664669A
- Authority
- CN
- China
- Prior art keywords
- bga solder
- test
- solder joints
- value
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of BGA solder joints thermal life prediction technique, test platform and test cabinets, belong to BGA technical fields, BGA solder joint models are simulated in finite simulation element analysis software in cycling environments, obtain ess-strain amount, substitute into the average life span value that calculation formula obtains the thermal fatigue failure of BGA solder joint models, actual experiment is carried out again, and it is compareed with emulation data, find out rule therein and bias factor, simulating analysis is corrected, and is summarized as a set of thermal reliability design criteria and carries out industry popularization.
Description
Technical field
The present invention relates to thermal life prediction technique technical fields, particularly, are related to a kind of BGA solder joints thermal life prediction side
Method, test platform and test cabinet.
Background technology
As electronic product operating ambient temperature constantly changes, the continuous start and stop of chip lead to the temperature of electronic product itself
Degree is constantly in the state of variation.Due to printed board base material itself and the factors such as IC package base material coefficient of thermal expansion is inconsistent,
Electronic product operational process China, different materials expanding with heat and contract with cold difference cause intermediate solder joint to be acted on by internal shearing stress,
Cause to crack to be subjected to displacement, finally causes the failure of product.
The current analysis for the BGA solder joint thermal lifves both at home and abroad lays particular emphasis on principle analysis and the technique reason of butt welding point cracking
By in promotion, in the welding process since the difference of technique causes the practical sexual deviation of solder joint lifetimes, concrete technology realization side
Formula and welding material select the research in butt welding point service life under different conditions less, and the predictor method for life of product is also to stop
Theory analysis and emulation level are stayed in, is proved without a large amount of experimental data.
Invention content
Present invention aims at a kind of BGA solder joints thermal life prediction technique of offer, test platform and test cabinets, to solve
Carry out less for working in the differentiation of simulation nicety in the prior art, predominantly stays in the skill of theoretical research stage level
Art problem.
To achieve the above object, technical solution provided by the invention is as follows：A kind of BGA solder joints thermal life prediction technique, first
In finite simulation element analysis software after implementation steps a-d, then implementation steps e, f, g successively,
A, simulation model is established, simulation model includes the several BGA solder joints models printed on Slab and printing Slab,
And the material of printing Slab and BGA solder joint models is set respectively；
B, mesh generation is carried out to simulation model；
C, simulation model is made to be in the external hot circulation that two kinds of temperature constantly alternately change；
D, show that each BGA solder joints model passes through the ess-strain amount that external hot circulation generates by step C；
E, Tiredness model calculates：Utilize Manson-Coffin formula：
In formula, Nf--- the average life span of thermal fatigue failure；Δ γ --- equivalent range of shear strain,Δ
ε --- equivalent overall strain range；εf--- fatigue ductility coefficient；C --- fatigue toughness index；
The average life span of the thermal fatigue failure of each BGA solder joints model is calculated, and thus obtains one group of BGA solder joint model
The average life span value of thermal fatigue failure；
F, actual experiment：The test board for the entity being consistent with the simulation model is set, by test board be placed in in step C
In the practical thermal environment that external hot circulation is consistent, and the experimental lifetime value of each BGA solder joints in test board is obtained, and then obtains one
Group experimental lifetime value；
G, it is compareed with emulation data：By the average life span value of the thermal fatigue failure of one group of BGA solder joint model
It is compareed with one group of experimental lifetime value group, if the consistency of this two groups of numerical value is less than 90%, in Finite Element Simulation Analysis
The size of modification simulation model and/or material and/or grid, repeat step a-f in software, until the one of this two groups of numerical value
Until cause property is more than or equal to 90%.
In step f, actual experiment is carried out to multiple test boards, break-make of the BGA solder joints under thermal environment is monitored in real time, obtains
To the first-hand actual life value of each BGA solder joints, of all BGA solder joints on all test boards on co-located point
Proficiency actual life value constitutes the first-hand actual life value group of location point BGA solder joints, then executes actual life value and calculates
Step：A1 averages to first-hand actual life value group, and the first-hand actual life value more than average value 20% is eliminated
First-hand actual life value group obtains new first-hand actual life value group, and a2 repeats a1, until obtaining the interior data of group not
Until first-hand actual life value group more than corresponding average value 20%, a3 will finally obtain first-hand actual life value group and ask
Average value is the experimental lifetime value of BGA solder joints on the location point.
One kind being used for BGA solder joint thermal life test platforms, including temperature cycling test case and test cabinet, the temperature are followed
It is provided with test board in ring test case, monitoring board, the input terminal of the monitoring board and the survey are provided in the test cabinet
Test plate (panel) is electrically connected, the output end of the monitoring board and upper mechatronics.
A kind of test cabinet of BGA solder joints thermal life test platform, including set gradually from top to bottom in babinet it is several right
Guide rail sliding chute, pairs of guide rail sliding chute are installed in the both sides in babinet, several monitoring boards are additionally provided in babinet respectively, monitoring board
Both ends are inserted into respectively in two pairs of guide rail sliding chutes.
The babinet is fixedly connected with the guide rail sliding chute.
The monitoring board is at least arranged one.
The invention has the advantages that：A kind of BGA solder joints thermal life prediction technique, test platform and the survey of the present invention
Test-run a machine case obtains different welding conditions under different operating environment by analyzing welding spot reliability under different welding conditions
Under each solder joint effective access times, while simulation analysis model can be directed to build the test platform of profession and carry out practical survey
Examination, carries out deviation factors that are corresponding and correcting simulation analysis with theoretical analysis result by test result, obtains more accurate and reliable
Analysis method.Can analog equipment actual motion environment, and can in real time detect in product operational process and respectively detect solder joint
The test data of experiment acquisition and emulation data are compared and analyzed, are looked for by real-time break-make situation under the conditions of corresponding temperature
Go out rule therein and bias factor, correct simulating analysis, is summarized as a set of solder joint thermal reliability design and welding procedure
It sets criterion and carries out industry popularization.
Description of the drawings
Below with reference to figure, the present invention is described in further detail.The attached drawing constituted part of this application is used for
A further understanding of the present invention is provided, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, does not constitute
Inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is a kind of flow diagram of BGA solder joints thermal life prediction technique；
Fig. 2 is BGA solder joint thermal life test platform architecture schematic diagrames；
Fig. 3 is the test casing structure schematic diagram of BGA solder joint thermal life test platforms；
Fig. 4 is the hardware elementary diagram block diagram of the test board of the present invention；
Fig. 5 is the hardware elementary diagram block diagram of the monitoring board of the present invention；
Reference sign：1, temperature cycling test case；2, test board；3, cabinet is tested；4, monitoring board；5, host computer；
6, babinet；7, guide rail sliding chute.
Specific implementation mode
The embodiment of the present invention is described in detail below in conjunction with attached drawing.
Embodiment 1：
Referring to Fig. 1, a kind of BGA solder joints thermal life prediction technique, the first implementation steps in finite simulation element analysis software
After a-d, then implementation steps e, f, g finite simulation element analysis softwares preferentially select ansys successively；BGA solder joints are the core of BGA package
The solder joint of piece.
A, simulation model is established, simulation model includes the several BGA solder joints models printed on Slab and printing Slab,
And the material of the material and BGA solder joint models of printing Slab is set respectively, which (includes printing Slab
With all BGA solder joints models) have dimension information, shape information, material information and the structural information of printed board, structural information
Including forming the collocation and arrangement of each section of the printed board；
B, mesh generation is carried out to simulation model (including printing Slab and all BGA solder joints models), ensures emulation essence
Degree and speed；
C, load is defined：So that simulation model is in the external hot circulation that two kinds of temperature constantly alternately change, makes emulation mould
Type can carry out calorifics simulation analysis under conditions outside；
D, the calorifics simulation analysis generated in step C is obtained as a result, analyzing and obtaining each BGA solder joints model by external
The ess-strain amount that thermal cycle generates, stress refer to the internal stress that each BGA solder joints model is subject to, and strain refers to each BGA welderings
The strain that point model generates；
E, Tiredness model calculates：Electronic Packaging SnPb solder joint failures are low cycle facigue failures, solder joint thermal cycle failure
Life pattern mainly based on the Coffin-Manson equations in low period (abbreviation C-M equations), utilizes Manson-Coffin
Formula：In formula, Nf--- the average life span (cycle) of thermal fatigue failure；Δ γ --- equivalent shear strain
Range,Δ ε --- equivalent overall strain range；εf--- fatigue ductility coefficient (=0.325)；C --- fatigue is tough
Sex index；
C is related with the temperature of thermal cycle and frequency herein.
C=-0.442-6 × 10-4Tm+1.74×10-2ln(1+f)
Wherein, the mean temperature (DEG C) of Tm --- thermal cycle；
Tmax--- cycle maximum temperature values (DEG C)；
Tmin--- cycle minimum temperature value (DEG C)；
F --- cycle frequency；
Calculate the average life span N of the thermal fatigue failure of each BGA solder joints modelf, and thus obtain one group of BGA solder joint model
Thermal fatigue failure average life span value Nf, the average life span value of the thermal fatigue failure of this group of BGA solder joint model is by printing template die
In type on all location points the thermal fatigue failure of all BGA solder joints models average life span value NfIt constitutes；
F, actual experiment：The test board for the entity being consistent with the simulation model is set, by test board be placed in in step C
In the practical thermal environment that external hot circulation is consistent, each BGA solder joints are under external thermal cycle conditions on real-time monitoring and test plate
Break-make, and the experimental lifetime value of each BGA solder joints on test board is obtained, and then one group of experimental lifetime value is obtained, which tests the longevity
Life value is made of the experimental lifetime value of all BGA solder joints on test board, and test board includes the number being arranged in printed board and printed board
A BGA solder joints, shape, size, the structure of printed board are consistent simultaneously unanimously with shape, size, the structure of printing Slab, several
BGA solder joints are consistent simultaneously unanimously with the location point of the quantity of several BGA solder joints models, shape, size, structure, distribution, that is, test
Plate has all information of simulation model：Have dimension information, shape information, material information and the structural information of printed board；This
In step, test board is only arranged one piece, and experimental lifetime value is for BGA solder joints to the actual life value of fracture, reality since experiment
Thermal environment is that constantly alternately the thermal environment of variation, practical thermal environment constantly replace the outer of variation with described two temperature to two kinds of temperature
Portion's thermal cycle is consistent simultaneously consistent.
G, it is compareed with emulation data：By the average life span value of the thermal fatigue failure of one group of BGA solder joint model
It is compareed with one group of experimental lifetime value, corrects simulation model：If the consistency of this two groups of numerical value is less than 90%, limited
The size of modification simulation model and/or material and/or grid, mesh generation are to printed board model net in first simulation analysis software
Lattice are divided and/or are divided to BGA solder joint model meshes, can be by the thinner (division of grid and how by grid of mesh generation
Divide more carefully can be found in published ANSYS study courses), repeat step a-f, until this two groups of numerical value consistency be more than or
Until person is equal to 90%.
Embodiment 2：
A kind of BGA solder joints thermal life prediction technique as shown in Figure 1, difference from example 1 is that：In step f
In, actual experiment is carried out to multiple test boards, monitors break-make of the BGA solder joints under practical thermal environment in real time, to experimental data into
Row screening：First obtain the first-hand actual life value of each BGA solder joints, it is all on co-located point on all test boards
The first-hand actual life value of BGA solder joints constitutes the first-hand actual life value group of location point BGA solder joints, then executes reality
Life value calculates step：A1 averages to first-hand actual life value group, will be more than the first-hand practical longevity of average value 20%
Life value eliminates first-hand actual life value group, obtains new first-hand actual life value group, and a2 repeats a1, until obtaining group
Until interior data are no more than the first-hand actual life value group of corresponding average value 20%, i.e., the finally obtained first-hand practical longevity
All first-hand actual life values in life value group are no more than the average value of finally obtained first-hand actual life value group
20%, a3 will finally obtain first-hand actual life value group and average as the experimental lifetime of BGA solder joints on the location point
Value.Thus the experimental lifetime value of all BGA solder joints on all location points on test board can be acquired, and then is obtained described in embodiment 1
One group of experimental lifetime value.
Embodiment 3：
Fig. 3 and Fig. 4 are please referred to, the preferred embodiment of the present invention provides a kind of BGA solder joints thermal life test platform, with
A kind of BGA solder joints thermal life prediction technique described in embodiment 1, embodiment 2 matches, including：Temperature cycling test case 1 and test
Cabinet 3, test board 2 is provided in the temperature cycling test case 1, and temperature cycling test case 1 is used to provide the external heat
Cycling condition or environment, test board 2 are equipped with several BGA solder joints, and chip bga is welded in by BGA solder joints on test board 2, institute
It states in test cabinet 3 and is provided with monitoring board 4, the input terminal of the monitoring board 4 is electrically connected with the test board 2, the monitoring board 4
Output end be electrically connected with host computer 5.The testing fatigue of process -55~125 DEG C in temperature cycling test case 1 of test board 2 will
Test out bad point data and bad point fracture when temperature feedback arrive test cabinet 3 in monitoring board 4, monitoring board 4 with it is upper
Bad point information is fed back on host computer 5 by data line between machine 5, host computer 5 provides report.Enough it is directed to simulation analysis model
The test platform for building profession carries out actual test, carries out corresponding with theoretical analysis result by test result and corrects simulation analysis
Deviation factors, obtain more accurately and reliably analysis method.
Test board 2 is equipped with BGA solder joints dot matrix 9 and digital signal output interface 10, and BGA solder joints dot matrix 9 includes several BGA
Solder joint, each BGA solder joint in BGA solder joints dot matrix 9 pass through conducting wire and connect digital signal output interface 10；
Monitoring board 4 is equipped with microcontroller 12, digital signal input interface 11 and 485 modules 13, digital signal input interface
11 and 485 modules 13 are electrically connected microcontroller 12；
It is connected by data/address bus between digital signal output interface 10 and digital signal input interface 11, the data are total
Line is made of several conducting wires, and monitoring board 4 is communicated by 485 modules 13 with host computer 5.
Test board 2 after the power is turned on, by making all pins of bga chip export high level (ground wire the programming of bga chip
Except pin), digital signal input interface 11 exports the electric signal of each BGA solder joint in BGA solder joints dot matrix 9, monitoring board 4
On the electric signal that is sent of number of single-chip detection word signal input interface 11, and judge each BGA solder joint one by one
Whether electric signal is high level signal：It is then to prove that the BGA solder joints are normal；It is no, then prove the BGA solder joint normal ruptures.
Testing result is sent to host computer by monitoring board 4 by 485 modules.
The microcontroller is ARM7 processors, the model MAX485 of 485 module.
A kind of BGA solder joints thermal life test platform is the experiment porch for step f, by the platform to BGA solder joints into
Row experiment.
Embodiment 4：
Referring to Fig. 5, the preferred embodiment of the present invention provides a kind of test machine of BGA solder joints thermal life test platform
Case matches with a kind of BGA solder joints thermal life prediction technique of embodiment 1,2, and application described one kind in embodiment 3
BGA solder joint thermal life test platforms, including：What is set gradually from top to bottom in babinet 6 and babinet 6 is several to guide rail sliding chute 7, in pairs
Guide rail sliding chute 7 be installed in the both sides in babinet 6 respectively, and pairs of guide rail sliding chute 7 is installed in the both sides in babinet 6 respectively
Monitoring board 4 is additionally provided on wall, in babinet, the both ends of monitoring board 4 are inserted into respectively in two pairs of guide rail sliding chutes 7.
Preferably, the babinet 6 is fixedly connected with the guide rail sliding chute 7, increases stability.
The monitoring board 4 is at least arranged one, it is preferable that several, disposably measurable several surveys are arranged in the monitoring board 4
Test plate (panel), several test boards are electrically connected with several monitoring boards 4 respectively, improve conventional efficient, and several monitoring boards 4 distinguish insert number pair
Guide rail sliding chute 7.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect：By to not
It is analyzed with welding spot reliability under welding condition, obtains under different operating environment effectively making for each solder joint under different welding conditions
With number, while it simulation analysis model can be directed to build the test platform of profession and carry out actual test, by test result and reason
The deviation factors that simulation analysis is corresponded to and corrected by analysis result obtain more accurately and reliably analysis method.It being capable of mould
Quasi- product actual motion environment, and can detect in real time and respectively detect solder joint in product operational process under the conditions of corresponding temperature
The test data of experiment acquisition and emulation data are compared and analyzed, find out rule and deviation therein by real-time break-make situation
Factor corrects simulating analysis, that is, providing one kind makes finite element analysis software obtain BGA solder joint lifetimes prediction result and reality
The consistent method of border experimental lifetime result, and be summarized as a set of thermal reliability design criteria and carry out industry popularization.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention；For the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of BGA solder joints thermal life prediction technique, which is characterized in that the first implementation steps a- in finite simulation element analysis software
After d, then implementation steps e, f, g successively,
A, simulation model is established, simulation model includes printing Slab and printing several BGA solder joints models on Slab, and divide
The other material to printing Slab and BGA solder joint models is set；
B, mesh generation is carried out to simulation model；
C, simulation model is made to be in the external hot circulation that two kinds of temperature constantly alternately change；
D, show that each BGA solder joints model passes through the ess-strain amount that external hot circulation generates by step c；
E, Tiredness model calculates：Utilize Manson-Coffin formula：
In formula, Nf--- the average life span of thermal fatigue failure；Δ γ --- equivalent range of shear strain,Δ
ε --- equivalent overall strain range；εf--- fatigue ductility coefficient；C --- fatigue toughness index；
The average life span of the thermal fatigue failure of each BGA solder joints model is calculated, and the heat for thus obtaining one group of BGA solder joint model is tired
The average life span value of labor failure；
F, actual experiment：The test board for the entity being consistent with the simulation model is set, test board is placed in and outside in step C
In the practical thermal environment that thermal cycle is consistent, and the experimental lifetime value of each BGA solder joints on test board is obtained, and then obtains one group of reality
Test life value；
G, it is compareed with emulation data：By the average life span value and one of the thermal fatigue failure of one group of BGA solder joint model
Group experimental lifetime value is compareed, if the consistency of this two groups of numerical value is less than 90%, in finite simulation element analysis software
The size and/or material and/or grid of modification simulation model, repeat step a-f, until the consistency of this two groups of numerical value is big
In or equal to until 90%.
2. a kind of BGA solder joints thermal life prediction technique according to claim 1, it is characterised in that：In step f, to more
A test board carries out actual experiment, monitors break-make of the BGA solder joints under thermal environment in real time, is screened to experimental data：First
To the first-hand actual life value of each BGA solder joints, of all BGA solder joints on all test boards on co-located point
Proficiency actual life value constitutes the first-hand actual life value group of location point BGA solder joints, then executes actual life value and calculates
Step：A1 averages to first-hand actual life value group, and the first-hand actual life value more than average value 20% is eliminated
First-hand actual life value group obtains new first-hand actual life value group, and a2 repeats a1, until obtaining the interior data of group not
Until first-hand actual life value group more than corresponding average value 20%, a3 is asked finally obtaining first-hand actual life value group
Average value is the experimental lifetime value of BGA solder joints on the location point.
3. a kind of BGA solder joints thermal life test platform, which is characterized in that including temperature cycling test case (1) and test cabinet
(3), it is provided with test board (2) in the temperature cycling test case (1), monitoring board (4) is provided in the test cabinet (3),
The input terminal of the monitoring board (4) is electrically connected with the test board (2), output end and host computer (5) electricity of the monitoring board (4)
Connection.
4. a kind of test cabinet of BGA solder joints thermal life test platform, which is characterized in that including：In babinet (6) from top to bottom according to
Secondary setting it is several to guide rail sliding chute (7), pairs of two guide rail sliding chutes (7) are respectively provided at the both sides in babinet (6), are also set in babinet
There are monitoring board (4), the both ends of monitoring board (4) to be inserted into respectively in pairs of two guide rail sliding chutes (7).
5. a kind of test cabinet of BGA solder joints thermal life test platform according to claim 4, it is characterised in that：It is described
Babinet (6) is fixedly connected with the guide rail sliding chute (7).
6. a kind of test cabinet of BGA solder joints thermal life test platform according to claim 4, it is characterised in that：It is described
Monitoring board (4) is at least arranged one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710186899.4A CN108664669A (en) | 2017-03-27 | 2017-03-27 | A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710186899.4A CN108664669A (en) | 2017-03-27 | 2017-03-27 | A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108664669A true CN108664669A (en) | 2018-10-16 |
Family
ID=63785379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710186899.4A Pending CN108664669A (en) | 2017-03-27 | 2017-03-27 | A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108664669A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109918823A (en) * | 2019-03-15 | 2019-06-21 | 成都航空职业技术学院 | A kind of minute yardstick BGA welding spot structure parameter optimization method reducing distorting stress |
| CN111898307A (en) * | 2020-08-20 | 2020-11-06 | 哈尔滨工业大学 | Grading simplification method of fatigue simulation model of welding spot containing multi-strand wire |
| CN113945826A (en) * | 2021-10-13 | 2022-01-18 | 浪潮商用机器有限公司 | Electronic board card testing method and device and medium |
| WO2022252743A1 (en) * | 2021-06-03 | 2022-12-08 | 深圳市中兴微电子技术有限公司 | Test apparatus and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103745028A (en) * | 2013-12-02 | 2014-04-23 | 温州大学 | Simulation test method for heat fatigue performance of material interface of micro-nanometer device |
| JP2015094717A (en) * | 2013-11-13 | 2015-05-18 | パナソニックＩｐマネジメント株式会社 | Thermal fatigue life prediction device, thermal fatigue life prediction method, and program |
| CN104820781A (en) * | 2015-05-06 | 2015-08-05 | 北京航空航天大学 | Prediction method of thermal fatigue life of BGA (Ball Grid Array) welding spot considering influence of sequential temperature cycling load loading |
-
2017
- 2017-03-27 CN CN201710186899.4A patent/CN108664669A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015094717A (en) * | 2013-11-13 | 2015-05-18 | パナソニックＩｐマネジメント株式会社 | Thermal fatigue life prediction device, thermal fatigue life prediction method, and program |
| CN103745028A (en) * | 2013-12-02 | 2014-04-23 | 温州大学 | Simulation test method for heat fatigue performance of material interface of micro-nanometer device |
| CN104820781A (en) * | 2015-05-06 | 2015-08-05 | 北京航空航天大学 | Prediction method of thermal fatigue life of BGA (Ball Grid Array) welding spot considering influence of sequential temperature cycling load loading |
Non-Patent Citations (2)
| Title |
|---|
| 任占勇: "《数字化研制环境下的可靠性工程技术——基于产品数字样机的可靠性设计与分析》", 30 June 2015 * |
| 佟川等: ""塑封球栅阵列焊点热疲劳寿命预测有限元方法"", 《焊接学报》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109918823A (en) * | 2019-03-15 | 2019-06-21 | 成都航空职业技术学院 | A kind of minute yardstick BGA welding spot structure parameter optimization method reducing distorting stress |
| CN111898307A (en) * | 2020-08-20 | 2020-11-06 | 哈尔滨工业大学 | Grading simplification method of fatigue simulation model of welding spot containing multi-strand wire |
| CN111898307B (en) * | 2020-08-20 | 2022-08-02 | 哈尔滨工业大学 | Grading simplification method of fatigue simulation model of welding spot containing multi-strand wire |
| WO2022252743A1 (en) * | 2021-06-03 | 2022-12-08 | 深圳市中兴微电子技术有限公司 | Test apparatus and method |
| CN113945826A (en) * | 2021-10-13 | 2022-01-18 | 浪潮商用机器有限公司 | Electronic board card testing method and device and medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108664669A (en) | A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet | |
| CN106655159B (en) | New energy power station primary frequency modulation capability test system and test method thereof | |
| US20220326314A1 (en) | Method for monitoring online state of bonding wire of igbt module | |
| CN109211500B (en) | Reliability analysis method for PBGA (printed circuit board array) packaging interconnection welding spot under random vibration load | |
| CN104899372B (en) | In conjunction with emulation and fail-safe analysis highly accelerated stress screeningtest profile construction method | |
| CN103487781B (en) | A kind of reliability estimation method of the electronic mutual inductor based on accelerated deterioration | |
| CN109061338A (en) | Energy storage PCS is to dragging test platform and method | |
| CN109115383A (en) | The Prediction method for fatigue life of cold extrusion Strengthening Hole | |
| CN111859723A (en) | Simulation analysis method for stress damage of through hole plugging process of electronic component | |
| CN110264053A (en) | A kind of distribution network reliability evaluation method for considering Strategies of Maintenance and failure rate being influenced | |
| CN108228979B (en) | Low-cycle fatigue life analysis method for generator structure | |
| CN111105072A (en) | Method for predicting health degree of photovoltaic power station based on entropy weight fuzzy synthesis method | |
| CN201788254U (en) | PCB withstand voltage testing device | |
| CN102708233B (en) | Reliability implementing capability assessment method applicable to surface mounting process | |
| CN109388830A (en) | A kind of circuit board life-span prediction method | |
| CN115291074A (en) | Online monitoring method for faults of solder layer of IGBT chip | |
| CN204925371U (en) | Many analog output's of standard source electric energy quality on -line monitoring device's test system | |
| CN111523262B (en) | Method for calculating acceleration factor of circuit board interconnection part under multi-stress coupling effect | |
| CN100501424C (en) | Device and method for testing clock or signal driving load capacity | |
| Shao et al. | The Principle and application of physics-of-failure based reliability technology | |
| Gleichauf et al. | Test screening of solder joints under combined cyclic thermal and bending load for automotive applications | |
| CN109359328A (en) | Prediction technique, device, computer equipment and the storage medium of solder joint lifetimes | |
| CN108091949A (en) | Voltage sampling circuit, battery protecting plate and battery pack | |
| CN1525332A (en) | A method for realizing reliability test of temperature | |
| CN204649843U (en) | A kind of circuit board carbon ink device for testing resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181016 |
|
| RJ01 | Rejection of invention patent application after publication |