CN108663377A - Bad inspection system and method - Google Patents
Bad inspection system and method Download PDFInfo
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- CN108663377A CN108663377A CN201810293780.1A CN201810293780A CN108663377A CN 108663377 A CN108663377 A CN 108663377A CN 201810293780 A CN201810293780 A CN 201810293780A CN 108663377 A CN108663377 A CN 108663377A
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- substrate
- bad
- turntable
- bad inspection
- inspection system
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Abstract
The present invention discloses a kind of supporting structure body, which is characterized in that including：Image acquiring device；Holder supports described image acquisition device；And combination member, the holder is fixed to support element by it, wherein, first substrate is moved from first direction to second direction, second substrate is moved from the second direction to the first direction, the first substrate moves simultaneously with the second substrate, described image acquisition device checked when the first substrate and the second substrate move the first substrate it is bad to.The expense of bad inspection system can be greatly reduced in the present invention.
Description
The application is application No. is 201410352778.9, and the applying date is on 07 23rd, 2014, entitled " bad
The divisional application of the patent application of inspection system and method ".
Technical field
The present invention relates to a kind of bad inspection system and method.
Background technology
It is very important by checking that substrate is bad to detect the undesirable substrate of appearance in advance.Usually as illustrated in fig. 1
Carry out the bad inspection in edge of substrate.
Fig. 1 is the schematic diagram for showing the common bad inspection of substrate edges.
As shown in Figure 1, the transverse direction of substrate is provided with camera 102, camera 102 checks that the edge of substrate is bad.
Four edges of substrate are required to check at this time, it is therefore desirable to multiple cameras.
In particular, the camera price for bad inspection is high, therefore the expense of bad inspection system is quite high.
Existing technical literature
Patent document：1251852 (authorization date of Korean Patent Publication No.：On April 1st, 2013).
Invention content
Technical problem
The purpose of the present invention is to provide a kind of bad inspection system and method that can reduce expense.
Technical solution
To reach above-mentioned purpose, the bad inspection method of substrate according to an embodiment of the invention includes：First bad inspection
Step is looked into, a part for the first substrate is checked while transferring first substrate to first direction；And second is bad
Checking step checks the other parts of the first substrate while transferring the first substrate to second direction.Wherein
The first direction is different from the second direction.
The bad inspection system of substrate according to another embodiment of the present invention includes：Supporting structure (Profile
Structure) comprising support element (Profile)；First image acquiring device is set to the one of the supporting structure
Part；And second image acquiring device, it is set to the other parts of the supporting structure.Wherein described first image obtains
Device is taken to check a part for the first substrate, second image acquiring device when first substrate is transferred to first direction
The other parts of the first substrate are checked when the first substrate is transferred to the second direction different from the first direction.
The bad inspection system of substrate according to an embodiment of the invention include as manipulator mobile space transfer it is logical
Road portion, turntable and cleaning machine.Wherein, it is transferred from the cleaning machine to the turntable in the first substrate cleaned by the cleaning machine
Period receives bad inspection for the first time, receives the during the second substrate is transplanted on the transfer passage portion from the turntable
Secondary bad inspection.
Supporting structure according to an embodiment of the invention includes：Support element is formed with slot；Holder, support are used
In the undesirable image acquiring device of inspection；Nut is inserted into the slot of the support element；And combination member, penetrate through institute
It states holder and is attached to the nut, described image acquisition device is fixed on the support element.
Technique effect
The present invention bad inspection system and method transferred to first direction using two camera inspections first
A part in the edge of substrate, and other edges for the first substrate transferred to second direction using two camera inspections.
That is, the bad inspection system can check the bad of all edges on substrate, the camera number of setting with four cameras
Amount is fewer than existing bad inspection system.Therefore the expense of above-mentioned bad inspection system can be greatly reduced.
Description of the drawings
Fig. 1 is the schematic diagram for the bad inspection in edge for showing general substrate；
Fig. 2 is the schematic diagram for the bad inspection system for showing first embodiment of the invention；
Fig. 3 is the schematic diagram for the bad inspection system for showing second embodiment of the invention；
Fig. 4 is the block diagram for the treatment process for showing one embodiment of the invention；
Fig. 5 is the stereogram for the second bad inspection operation for showing one embodiment of the invention；
Fig. 6 and Fig. 7 is the schematic diagram for the first bad inspection operation for showing one embodiment of the invention；
Fig. 8 to Figure 15 is the schematic diagram for the bad inspection method for showing one embodiment of the invention；
Figure 16 is the schematic diagram for the camera setting structure for showing one embodiment of the invention.
Reference sign
200：Substrate 202：Image acquiring device (camera)
300：Packaging cartridge (Cassette) 302：Transfer passage portion (Index)
304：Turntable (Turn table) 306：Cleaning machine
308：Chamber 310：Transfer chamber
312：Engineering chamber 500：First substrate
502：Second substrate 504：Supporting structure (Profile structure)
510：Support element 600：Light source
800：Lift component 802：Transferring members
810：Supporting structure 1000：First arm of manipulator
1002：Second arm 1600 of manipulator：Camera bracket
1610：Support element (Profile) 1612：Nut
1614：Combination member
Specific implementation mode
Illustrate the embodiment of the present invention referring to the drawings.
The present invention relates to the bad inspection systems of a kind of bad inspection system more particularly to edge, it may include checks substrate
Second bad inspection operation of the first bad inspection operation of the part in edge and other edges of inspection substrate.
For example, the bad inspection system may include the substrate after cleaning being transplanted on turntable (Turn from cleaning machine
Table the first bad inspection operation carried out during), and in the mistake for being transplanted on transfer passage portion (Index) from turntable
The the second bad inspection operation carried out in journey.
In general, to check the bad of four edges of substrate, it is necessary to multiple cameras be arranged to the direction of crosscutting substrate.But
It is that bad inspection system of the invention is divided into the first bad inspection operation and the second bad inspection operation checks the edge of substrate not
It is good, therefore only need four following cameras that can check all edges of substrate.That is, compared with prior art, can reduce
For checking the undesirable camera quantity in the edge of substrate, so as to reduce the expense of bad inspection system.
Also, it is executed after different from the treatment process (for example, cleaning process and deposition procedures) of a substrate another
The existing method of the treatment process of substrate, using manipulator two arms simultaneously exchange cleaning after first substrate with it is to be cleaned
The mode of second substrate multiple substrates are handled simultaneously, therefore the treatment process time of substrate can be shortened.
The various embodiments for the bad inspection system that the present invention will be described in detail referring to the drawings.
Fig. 2 is the schematic diagram for the bad inspection system for showing first embodiment of the invention.
As shown in Fig. 2, the bad inspection system of the present embodiment may include the first bad inspection operation and the second bad inspection
Process.
For example, can be a part of in during first direction transfer to edge A, B, C and D of substrate 200 in substrate 200,
The first bad inspection especially is carried out to the edge A and B positioned at transfer direction, in substrate 200 to perpendicular to the second of first direction
To the remaining edge of substrate 200 during the transfer of direction, the second bad inspection especially is carried out to the edge C positioned at transfer direction, D.
At this point, in the image acquiring device that will be used for bad inspection, such as the transfer direction in substrate 200 is arranged in camera
In the state of, it is checked while transferring substrate 200, therefore two cameras are only needed in the first bad inspection operation
202a, 202b can check that edge A, B's of substrate 200 is bad, and two cameras are only needed in the second bad inspection operation
202c and 202d can check the edge C of substrate 200, D it is bad.Such as shown in Fig. 2, when camera 202c is arranged corresponding
When substrate 200 being transferred to left side from right side in the state of edge C, camera 202c can take the entire of substrate 200
Edge C.That is, the bad inspection system only need a camera 202c can check substrate 200 entire edge C it is bad.
To sum up, bad inspection system of the invention by multiple bad inspection operations check substrates 200 edge A, B, C and
D, therefore the undesirable prior art in edge different from only checking substrate by primary bad inspection operation, only need four cameras
202a, 202b, 202c and 202d can check that entire edge A, B, C and D's of substrate 200 is bad.
Fig. 3 is the schematic diagram for the bad inspection system for showing second embodiment of the invention, and Fig. 4 is a display reality of the invention
Apply the block diagram of the treatment process of example.Fig. 5 is the stereogram for the second bad inspection operation for showing one embodiment of the invention, Fig. 6
And the schematic diagram that Fig. 7 is the first bad inspection operation for showing one embodiment of the invention.
As shown in figure 3, the bad inspection system of the present embodiment may include packaging cartridge (Cassette) 300, transfer passage portion
(Index) 302, turntable (Turn table) 304, cleaning machine 306 and chamber 308.
Packaging cartridge 300 is mounted with substrate, and substrate is moved in by manipulator.Specifically, manipulator can be moved from packaging cartridge 300
Go out substrate to be cleaned, or deposition can be inputted to packaging cartridge 300 substrate of certain layer.
Transfer passage portion 302 is the mobile space of manipulator.
Turntable 304 is the place that substrate to be cleaned intersects with the substrate after cleaning.
The effect of cleaning machine 306 is cleaning base plate.
Chamber 308 is the device for deposit etc. process, may include the transfer chamber (Transfer for transferring substrate
Chamber, TC) 310 and the engineering chamber (Process chamber, PC) 312 for depositing predetermined substance etc. on substrate.
The process of bad inspection system processing substrate of the explanation with this structure below.
As shown in Figures 4 to 7, manipulator send first substrate 500 to transfer passage portion 302 from packaging cartridge 300, later will
First substrate 500 is transplanted on turntable 304.
First substrate 500 is transplanted on cleaning machine 306 from turntable 304 later, and first substrate 500 is cleaned later.
Then, the first substrate 500 after cleaning is transplanted on turntable 304 from cleaning machine 306, wherein can be during transfer
First bad inspection is carried out to first substrate 500.
According to one embodiment, first substrate 500 can be as illustrated in fig. 6 in a manner of shuttle (shuttle) from cleaning machine
306 are transplanted on turntable 304, are carried out not to first substrate 500 using camera 202a, 202b and light source 600a, 600b at this time
Good inspection.
According to another embodiment, first substrate 500 can utilize conveyer (Conveyor) from cleaning machine as illustrated in fig. 7
306 are transplanted on turntable 304, are carried out not to first substrate 500 using camera 202a, 202b and light source 600a, 600b at this time
Good inspection.
Then, the first substrate 500 after cleaning is transplanted on transfer passage portion 302 by manipulator from turntable 304.At this point, machine
Second substrate 502 before cleaning can be transplanted on turntable 304 by tool hand from transfer passage portion 302.That is, manipulator can utilize
During first substrate 500 after cleaning is transplanted on transfer passage portion 302 by one arm from turntable 304, using the second arm to be cleaned
Second substrate 502 be transplanted on turntable 304 from transfer passage portion 302.The transfer process of this substrate 500,502 can simultaneously into
Row.
According to one embodiment, as shown in the dotted line frame of Fig. 4, can manipulator by the first substrate 500 after cleaning from
During turntable 304 is transplanted on transfer passage portion 302, the second bad inspection is carried out to first substrate 500.Such as it as shown in figure 5, takes the photograph
As head 202c, 202d can first substrate 500 be located at second substrate 502 top and first substrate 500 from turntable 304 transfer
When to transfer passage portion 302, check that the edge of first substrate 500 is bad.In addition, camera 202c or 202d may be provided at by propping up
On the supporting structure 504 that support member 510 is constituted.
Then, the first substrate 500 after cleaning is transplanted on chamber 308 by robot from transfer passage portion 302.At this point, the
Two substrates 502 can be transplanted on cleaning machine 306 from turntable 304.
Later, particular procedure process, such as deposition procedures can be carried out to first substrate 500 in chamber 308.
Deposition is had the first substrate of predetermined substance to be transplanted on transfer passage from chamber 308 by manipulator at the end of deposition procedures
Portion 302 will be loaded by the first substrate 500 of deposition in packaging cartridge 300 later.
To sum up, the bad inspection system of the present embodiment can carry out multiple bad inspections while the substrate after transfer is cleaned
It looks into.In particular, manipulator by cleaning after first substrate 500 be introduced into transfer passage portion 302 while to be cleaned second
Substrate 502 is transplanted on turntable 304, therefore can shorten the treatment process time.
Bad inspection method is described in detail referring to the drawings.
Fig. 8 to Figure 15 is the schematic diagram for the bad inspection method for showing one embodiment of the invention.For ease of visual observation,
Fig. 8 to Figure 15 show from the view turntable 304 in transfer passage portion 302 when turntable 304 structure.Also, Fig. 8 to Figure 15
Illustrate only the component for the second bad inspection operation in bad inspection operation.
It is made of support element as shown in figure 8, being provided between the inside or turntable 304 and transfer passage portion 302 of turntable 304
Supporting structure 810, camera 202c, 202d and light source 600c, 600d can be set on particular support part.
Light source 600c and 600d, which are separately positioned on, the position of light is provided to camera 202c and 202d, such as can be
Light emitting diode (LED).Camera 202c, 202d are located at the top of light source 600c, 600d in attached drawing, but can also be arranged in light
The lower part of source 600c, 600d.
In addition there may also be lift component 800 (for example, mandril (Lift pin)) and transferring members 802 in turntable 304
(such as transmission shaft (conveyor shaft)).
The effect of lift component 800 is that first substrate 500 or second substrate 502 is made to increase, and transferring members 802 can play
Transfer the effect of first substrate 500 or second substrate 502.
The bad checking process of bad inspection system of the explanation with 304 structure of this turntable below.
As shown in figure 8, the first substrate 500 through over cleaning and by bad inspection for the first time is transplanted on from cleaning machine 306
Turntable 304.First substrate 500 is located at the lower part of light source 600c and 600d at this time.
Then, control unit (not shown) makes lift component 800 rise, and the results are shown in Figure 9, and first substrate 500 passes through
Lift component 800 rises.At this point, first substrate leaves transferring members 802.
Then, as shown in Figure 10, the second substrate to be cleaned in transfer passage portion 302 is placed on by manipulator
In the state of on two arms 1002, in order to place the first substrate 500 after cleaning, the first arm 1000 is stretched over turntable 304.That is,
Manipulator includes the first arm 1000 for transferring first substrate 500 and the second arm 1002 for transferring second substrate 502.
Under the premise of ensuring that manipulator transfers substrate 500,502 using multiple arms 1000,1002, manipulator can arbitrarily become
Shape is implemented.
Later, it is placed on the first arm 1000 in first substrate 500, second substrate 502 is placed on the shape of the second arm 1002
Under state, arm 1000,1002 rises as illustrated in fig. 11.At this time first substrate 500 be located at camera 202c, 202d light source 600c,
Between 600d.
Then, the first arm 1000 for being placed with first substrate 500 is moved to transfer passage from turntable 304 as illustrated in fig. 12
Portion 302, the second arm 1002 for being provided with second substrate 502 are moved to turntable 304 from transfer passage portion 302.That is, first substrate
500 and second substrate 502 location swap, the exchange can be carried out at the same time.
According to one embodiment, during first substrate 500 is transplanted on transfer passage portion 302, camera 202c, 202d
Shoot the edge of first substrate 500.The described image taken is sent to control unit, and the control unit can be taken by analysis
Described image check that the edge of first substrate 500 is bad.That is, second bad inspection operation in first substrate 500 from turning
Platform 304 carries out when being transplanted on transfer passage portion 302.
Later as shown in figure 13, the arm 1000,1002 of manipulator declines.At this point, first substrate 500 is located at transfer passage portion
302 inside, second substrate 502 can be located at the inside of turntable 304.
Later as shown in figure 14, second substrate 502 is transplanted on cleaning machine 306 to clean, the second arm of manipulator
1002 are transplanted on transfer passage portion 302.
Later as shown in figure 15, lift component 800 declines.
Later although not shown, but first substrate 500 is transplanted in chamber 308, and envelope is transplanted on after carrying out certain working procedure
Mounted box 300, second substrate 502 are cleaned.
To sum up, bad inspection system of the invention can be right in cleaning machine 306 or between cleaning machine 306 and turntable 304
The bad progress first time inspection of first substrate 500, to second in turntable 304 or between turntable 304 and transfer passage portion 302
The bad of substrate 502 is cooked second of inspection.
Also, the first substrate 500 after cleaning and second substrate 502 to be cleaned can transfer passage portion 302 with turn
Place-exchange is carried out between platform 304.That is, due to carrying out treatment process to two substrates simultaneously, can examine in a short time
Look into the bad of mass substrate.
Figure 16 is the schematic diagram for the camera setting structure for showing one embodiment of the invention.
As shown in figure 16, waist is formed on support element 1610, is inserted into waist and is formed with slot or the nut 1612 in hole 1620.
The camera bracket 1600 of support camera 200 is supported in the state of the support of part 1610, combination member 1614,
Such as screw rod penetrates through the hole of camera bracket 1600 and is inserted into the slot or hole 1620 of nut 1612.To which camera 200 is solid
Surely support element 1610 is arrived.
In particular, primary nut 1612 can be optionally located in the slot of support element, therefore it is not only convenient for setting camera
200, additionally it is possible to arbitrarily determine the installation position of camera 200, that is, user camera 200 can be arranged using support element 1610
In required position.
Industrial applicability
The above embodiments are only used to illustrate the technical solution of the present invention., it will be understood by those of ordinary skill in the art that：
It still can be with technical scheme described in the above embodiments is modified, and these modifications or replacements do not make phase
The essence of technical solution is answered to be detached from the range of claims of the present invention.
Claims (4)
1. a kind of supporting structure body, which is characterized in that including：
Image acquiring device；
Holder supports described image acquisition device；And
The holder is fixed to support element by combination member,
Wherein, first substrate is moved from first direction to second direction, and second substrate is from the second direction to the first party
To movement, the first substrate moves simultaneously with the second substrate,
Described image acquisition device checks the bad of the first substrate when the first substrate and the second substrate move.
2. a kind of supporting structure body, which is characterized in that including：
Image acquiring device checks the bad of the first substrate, wherein the transfer passage in transfer passage portion or turntable
Portion is the mobile space of manipulator, and the turntable is the first substrate of executed certain working procedure and the pending certain working procedure
The crossing spatial of second substrate；And
Holder supports described image acquisition device.
3. a kind of supporting structure body, which is characterized in that including：
Image acquiring device is executing first substrate the cleaning machine of cleaning process or is accommodating the institute moved from the cleaning machine
The turntable for stating first substrate checks the bad of the first substrate；And
Holder supports described image acquisition device.
4. a kind of supporting structure body, which is characterized in that including：
One of substrate is bad in image acquiring device, inspection while the first substrate and second substrate that intersect；And
Holder supports described image acquisition device,
Wherein, the first substrate is the substrate of executed certain working procedure, and the second substrate is the pending certain working procedure
Substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810293780.1A CN108663377A (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410352778.9A CN105319219B (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
| CN201810293780.1A CN108663377A (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410352778.9A Division CN105319219B (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108663377A true CN108663377A (en) | 2018-10-16 |
Family
ID=55247080
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810293780.1A Pending CN108663377A (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
| CN201410352778.9A Expired - Fee Related CN105319219B (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410352778.9A Expired - Fee Related CN105319219B (en) | 2014-07-23 | 2014-07-23 | Bad inspection system and method |
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| Country | Link |
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| CN (2) | CN108663377A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112401796B (en) * | 2016-05-24 | 2023-08-25 | 李亚锐 | Intelligent dish washing machine and dish washing method thereof |
| CN106442560A (en) * | 2016-08-23 | 2017-02-22 | 汕头大学 | Positioning measurement and defect detection method of display screen |
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| CN203069517U (en) * | 2012-12-14 | 2013-07-17 | 江南大学 | Detection device |
| KR101990555B1 (en) * | 2012-12-24 | 2019-06-19 | 삼성디스플레이 주식회사 | Thin film encapsulation manufacturing device and manufacturing method of thin film encapsulation |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105319219A (en) | 2016-02-10 |
| CN105319219B (en) | 2019-05-14 |
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Application publication date: 20181016 |