CN108662992A - surface measuring method and surface measuring system - Google Patents
surface measuring method and surface measuring system Download PDFInfo
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- CN108662992A CN108662992A CN201710206887.3A CN201710206887A CN108662992A CN 108662992 A CN108662992 A CN 108662992A CN 201710206887 A CN201710206887 A CN 201710206887A CN 108662992 A CN108662992 A CN 108662992A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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Abstract
A kind of surface measuring method and surface measuring system.Surface measuring method comprises the steps of to measure the surface of wafer to be measured：Surface scan is carried out to wafer to be measured using surface measuring device, to obtain the surface measuring information of wafer to be measured；Using mobile device according to one of surface measuring information altitude information, white light interferometer is made to be moved to initial scan position.White light interferometer includes the micro- actuating unit that can control interference objective movement；Make white light interferometer in initial scan position, is moved using micro- actuating unit control interference objective, to carry out image capturing operation.Wherein, the unit moving step pitch of mobile device is more than the unit moving step pitch of micro- actuating unit, and the movement speed of mobile device is more than the movement speed of micro- actuating unit.Entire amount degree of testing the speed can be substantially improved through the above steps.
Description
Technical field
It is especially a kind of measuring crystal column surface the present invention relates to a kind of surface measuring method and surface measuring system
Surface measuring method and surface measuring system.
Background technology
Silicon wafer warpage is one of problem important during manufacture of semiconductor, causes many because being known as of silicon wafer warpage, this
Silicon wafer warpage caused by a little factors can make component failures, film stripping or wafer on wafer generate slight crack, if serious
Wafer can be even set to generate rupture, therefore the monitoring of silicon wafer warpage is extremely important to manufacture of semiconductor.Existing major surfaces amount
Examining system is mostly to utilize white light interferometer, is directly measured to the specific position of wafer.However, due to wafer surface defects
Scale and white light interferometer precision be all it is very small, therefore, using white light interferometer carry out surface measuring when, need to consume
Take a large amount of time progress capture operation, so that the whole measurement time is tediously long, and it is low to measure efficiency.
Invention content
The main purpose of the present invention is to provide a kind of surface measuring method and surface measuring systems, to solve existing skill
In art, crystal column surface measurement is carried out merely with white light interferometer, there are measure the low problem of efficiency.
To achieve the goals above, the present invention provides a kind of surface measuring method, to measure the table of a wafer to be measured
Face, method for measurement comprise the steps of：One surface information obtaining step：Using a surface measuring device, wafer to be measured is carried out
Surface scan, to obtain a surface measuring information of wafer to be measured, surface measuring packet contains multiple altitude informations；One movement
To initial scan position step：According to one of altitude information, a white light interferometer is set to be located at using a mobile device opposite
The initial scan position answered；Wherein, white light interferometer includes an interference objective and a micro- actuating unit, micro- actuating unit energy
Control interference objective is moved in a longitudinal direction；One image capturing step：Make white light interferometer in initial scan position, utilization is micro-
Actuating unit controls interference objective and is moved in longitudinal direction, to carry out image capturing operation；Wherein, the unit movement of mobile device
Step pitch is more than the unit moving step pitch of micro- actuating unit, and the movement speed of mobile device is more than the mobile speed of micro- actuating unit
Degree.
Preferably, in being moved in the step of initial scan position, mobile device is control white light interferometer in longitudinal direction
It is mobile, and interference objective is made to be located at initial scan position；Wherein, surface measuring device measures a position of wafer to be measured
To obtain the speed of the corresponding height value in position, it is faster than and position is measured merely with white light interferometer to obtain position correspondence
Height value speed；In being moved in the step of initial scan position, in addition to according to one of altitude information, also foundation one is pre-
Determine offset, and so that white light interferometer is located at initial scan position using mobile device.
Preferably, surface information obtaining step and to be moved between the step of initial scan position also include a wafer carrying
Step：Control carries a bogey of wafer to be measured, so that wafer to be measured is moved to by the position of neighbouring surface measuring equipment
It is adjacent to a precalculated position of white light interferometer；Wherein, bogey can make wafer to be measured in a planar movement, and longitudinal direction is
The normal direction of plane.
Preferably, after image capturing step also include a position moving step：Bogey is controlled, so that crystalline substance to be measured
Circle is moved to another precalculated position by precalculated position；Wherein, initial scan position step, image capturing step and position are moved to
Moving step will repeat a pre-determined number.
To achieve the goals above, the present invention provides a kind of surface measuring system again, to be carried out to a wafer to be measured
Surface measuring, the surface measuring system include：One bogey, a surface measuring device, a white light interferometer and a movement
Device.For bogey to carry a wafer to be measured, bogey can make wafer to be measured in a planar movement.Surface measuring device
It is set to the side of bogey, surface measuring device can carry out surface measuring to wafer to be measured, and a dose,surface is generated with corresponding
Measurement information, surface measuring packet contain multiple altitude informations.White light interferometer includes a micro- actuating unit and an interferences
Mirror, micro- actuating unit can control interference objective and be moved in a longitudinal direction, to carry out image capturing operation to wafer to be measured；Its
In, longitudinal direction is the normal direction of plane.Mobile device can control white light interferometer along the longitudinal direction according to each altitude information
It is mobile, so that white light interferometer is moved to corresponding initial scan position；Wherein, the unit moving step pitch of mobile device is big
In the unit moving step pitch of micro- actuating unit, and the movement speed of mobile device is more than the movement speed of micro- actuating unit.Wherein,
When white light interferometer is moved to initial scan position, white light interferometer can be cooperated by micro- actuating unit and interference objective,
To carry out image capturing to wafer to be measured.
Preferably, surface measuring system also includes a processing unit, and processing unit is electrically connected surface measuring device, holds
Carry set, mobile device and white light interferometer, processing unit can be according to the multiple high number of degrees that surface measuring information is included
According to and corresponding plane coordinates data, control bogey and mobile device, and enable white light interferometer in wafer phase to be measured
Corresponding position carries out image capturing.
Preferably, surface measuring system also includes a means for correcting, to correction surface measuring equipment, carrying dress
It sets, the relative position of white light interferometer and mobile device to each other.
Preferably, surface measuring device is to carry out surface measuring to wafer to be measured using streak reflex method；Mobile device energy
According to each altitude information and a predetermined offset, corresponding control white light interferometer moves along the longitudinal direction.
Preferably, surface measuring system also includes an input unit, electrically connected processing device, input unit to
User is provided and inputs a measurement information, measurement information includes multiple wafer adjustment location data；Processing unit can be according to institute
Multiple wafer adjustment location data are stated, bogey and mobile device are controlled, so that white light interferometer is corresponding in wafer to be measured
Position carry out image capturing operation.
Preferably, surface measuring system also includes a mechanical arm device, electrically connected processing device, and handles dress
Energy control machinery arm is set, the wafer to be measured being set on bogey is picked and placeed.
Beneficial effects of the present invention can be：It, can be fast by the mutual cooperation of surface measuring device and mobile device
So that white light interferometer is moved to initial scan position fastly, and makes white light interferometer that can save a large amount of time and look for the initial
In this way, will the measurement speed of white light interferometer can be substantially improved, and the efficiency integrally measured is substantially improved in scan position.
Description of the drawings
Fig. 1 is the side view of the surface measuring system of the present invention.
Fig. 2 is the vertical view of the surface measuring system of the present invention.
Fig. 3 is the block schematic diagram of the surface measuring system of the present invention.
Fig. 4 is the flow diagram of the first embodiment of the surface measuring method of the present invention.
Fig. 5 is the flow diagram of the second embodiment of the surface measuring method of the present invention.
Fig. 6 is the surface measuring method of the present invention and the schematic diagram of surface measuring system measurements crystal column surface.
Fig. 7 to Figure 10 is the operation chart of the second embodiment of the surface measuring method of the present invention.
Specific implementation mode
Also referring to Fig. 1 to Fig. 3, for the schematic diagram of the surface measuring system of the present invention.The surface measuring of the present invention
System 1 is to measure the surface of a wafer W to be measured.As shown, surface measuring system 1 includes a processing unit 10, one
Surface measuring device 20, a bogey 30, a mobile device 40 and a white light interferometer 50.Surface measuring device 20, carrying
Device 30, mobile device 40 and white light interferometer 50 can be disposed in a fixed seat 60, be not limited certainly, each device
Specific position can be fixed on according to demand.Processing unit 10 is electrically connected surface measuring device 20, bogey 30, mobile dress
Set 40 and white light interferometer 50, and processing unit 10 can sequentially control surface measuring equipment 20, bogey 30, mobile device 40
And white light interferometer 50, to carry out surface measuring operation to wafer W to be measured.In practical applications, the processing unit 10 is for example
It can be computer, single-chip processor etc., not limited in this.
Furthermore, it is understood that surface measuring device 20 and white light interferometer 50 can be respectively arranged at the bogey 30
Both ends, bogey 30 can carry a wafer W to be measured.Surface measuring device 20 can measure the surface of wafer W to be measured, be produced with corresponding
A raw surface measuring information 201, and surface measuring information 201 can be transferred to processing unit 10 by surface measuring device 20.Specifically
For, surface measuring information 201 can be include multiple altitude informations 2011 and multiple corresponding plane coordinates data
2012；That is, each altitude information 2011 is Z axis coordinate value, and each plane coordinates data 2012 are X, Y axis coordinate
Value.
Bogey 30 can be include a plummer 31 and a planar movement unit 32.Plummer 31 and planar movement
Unit 32 is connected.Planar movement unit 32 can be subject to processing the control of device 10, and the plummer 31 is made arbitrarily to be moved in a plane
Dynamic, so that plummer 31 moves between surface measuring device 20 and white light interferometer 50, and planar movement unit 32 can make to wait for
It surveys wafer W and is moved to specific position corresponding to white light interferometer 50, to allow white light interferometer 50 to the certain bits of wafer W to be measured
It sets and carries out image capturing operation；Wherein, the plane is X-Y plane shown in figure.
Mobile device 40 is connected with each other with white light interferometer 50, and mobile device 40 can be subject to processing the control of device 10, so that
White light interferometer 50 is mobile along a longitudinal direction (non-label, Z-direction as shown in figure), and the longitudinal direction is institute
The normal direction of plane (aforesaid plane mobile unit 32 can control the plane of the movement of plummer 31) is stated, the longitudinal direction is
Z-direction shown in figure.Processing unit 10 is then each altitude information 2011 in foundation surface measuring information 201, and is corresponded to
Mobile device 40 is controlled, so that an interference objective 51 of white light interferometer 50 is located at (being moved to) corresponding initial scan position
It sets.In practical applications, mobile device 40 can directly control the movement of entire white light interferometer 50, so that interference objective 51 is right
It can also be that only control interference objective 51 moves, and makes its shifting that the initial scan position or mobile device 40, which should be moved to,
It moves to initial scan position；Certainly, mobile device 40 is not limited to above two mode, as long as interference objective 51 can be made to be located at
Corresponding initial scan position comes under the range of the invention to be protected.
The white light interferometer 50 also includes a micro- actuating unit 52 (being, for example, piezoelectric actuator PZT).White light interference
When instrument 50 carries out image capturing to wafer W to be measured, micro- actuating unit 52 is moved interference objective 51 is controlled along the longitudinal direction,
And coordinate image capturing unit (not shown) to carry out image capturing operation.It is noted that the unit of mobile device 40 is moved
Dynamic step pitch is greater than the unit moving step pitch (can be specifically poor 1000 times) of micro- actuating unit 52, and the movement of mobile device 40
Speed is more than the movement speed of micro- actuating unit 52.
In addition, surface measuring device 20 measures a position of wafer W to be measured, to obtain the corresponding height in the position
The speed of value is to be faster than to measure the position merely with white light interferometer 50, to obtain the corresponding height value in the position
Speed；In other words, the measurement speed of surface measuring device 20 is faster than white light interferometer 50.Specifically, surface measuring device 20
Can utilize streak reflex method, surface measuring operation is carried out to wafer W to be measured, so can quickly and disposably be obtained
The surface measuring information 201.
In other words, by measuring speed by the relatively rough surface measuring device 20 of accuracy in measurement, first rapidly
The scanning of the overall surface height of wafer W to be measured is carried out, each altitude information 2011 for then recycling scanning acquired makes white light
Interferometer 50 can rapidly reach corresponding initial scan position, and then make white light interferometer 50 that can rapidly proceed by
Image capturing operation, in this way, by whole measurement speed can be substantially improved, so as to which the efficiency of measurement is substantially improved.
Compared to the prior art for carrying out crystal column surface measurement to be measured merely with white light interferometer, due to the table of wafer to be measured
Face may be because warpage or a variety of causes, and be rendered as rough state, therefore, in the prior art, white light interference
Instrument needs very more time, goes to above-mentioned initial scan position, then can just carry out image capturing operation, so will the amount of causing
It is low to survey efficiency.In addition, as the component scale on wafer W to be measured is more and more finer, it is existing to be carried out using streak reflex method
The device of surface measuring, since precision is bad, merely with the device for carrying out surface measuring with streak reflex method, will be unable to
Fine image capturing operation is effectively carried out to the component on wafer W to be measured.
In special application, surface measuring device 20 and white light interferometer 50 can be disposed on the same side, not office
It is limited to position shown in figure；Even in better application, the surface measuring that surface measuring is carried out using streak reflex method is filled
20 are set, partial component can be shared with the component inside white light interferometer 50, and be not limited to two above-mentioned independent dresses
It sets.
It illustrates, in practical applications, surface measuring system 1 can also include a mechanical arm device 70
The wafer W to be measured not being measured is placed on bogey 30 by (as shown in Figure 2) to transfer wafer W to be measured, or
Person is wafer W to be measured by completion has been measured by being unloaded on bogey 30；And mechanical arm device 70 can be electrically connected
Processing unit 10, and processing unit 10 can be after wafer W to be measured completes to measure, 70 transfer bogey of control machinery arm apparatus
Wafer W to be measured on 30, to achieve the effect that automatic measurement.Certainly, the mechanical arm device 70 and bogey 30
Quantity, can be according to increase in demand, in this way, bogey 30 carries out wafer W to be measured with mechanical arm device 70 wherein
Removal operation when, another bogey 30 and mechanical arm device 70 can be carried out at the same time the installation of another wafer W to be measured, very
Can there is another wafer W to be measured carrying out metrology operation extremely in the same time.
It is noted that surface measuring system 1 also includes a means for correcting (not shown), can be selectively
It is set on bogey 30.When means for correcting is set on bogey 30, processing unit 10 can be measured with control surface
Device 20 carries out surface measuring to it, then and controls bogey 30 and is delivered to white light interferometer 50, so that mobile fill
It sets 40 cooperation white light interferometers 50 and surface measuring is carried out to means for correcting.Thereby, processing unit 10 or related personnel, Ke Yiyi
According to surface measuring device 10 and white light interferometer 50 to means for correcting measured as a result, corresponding correction surface measuring equipment 20,
Bogey 30, the relative position of white light interferometer 50 and mobile device 40 to each other so that bogey 30 can correctly by
Wafer W to be measured is moved to the precalculated position of neighbouring white light interferometer 50 by the position of neighbouring surface measuring equipment 20, and passes through school
Equipment can enable white light interferometer 50 and mobile device 40 carry out coherent video accurately according to surface measuring information 201 and obtain
It is taken as industry.In addition, as shown in Fig. 2, means for correcting 80 can be then to correct white light interferometer 50 measuring value of itself.
In specific implement, surface measuring system 1 can also include an input unit 90, electrically connected processing dress
10 are set, input unit 90 inputs a measurement information (not shown) to provide user, which includes multiple wafer amounts
Survey position data (not shown).Thereby, processing unit 10 can control bogey 30 according to these wafer adjustment location data
And mobile device 40, so that white light interferometer 50 carries out image capturing in the corresponding positions wafer W to be measured.More specifically,
The practical positions for being easy to happen warpage wafer W to be measured can be that these wafers measure by the input of input unit 90 by user
Position data, and so that white light interferometer 50 is directed to the position for being easy to happen warpage inputted and carry out surface measuring.
Also referring to Fig. 4 and Fig. 5, for the present invention measuring the surface measuring method of the surface morphology of wafer
The schematic diagram of two embodiments；In following explanation, each device and the specific installation position of component, continuous action relation can consider in light of actual conditions
Previous embodiment will not be described in great detail below；But the method and step that following embodiment is defined is not limited to utilize previous embodiment
These devices and component, any device that may achieve identical effect and purpose and component are all the change application model of the present embodiment
It encloses.
As shown in figure 4, it is the first embodiment of surface measuring method, it includes have following steps：
One surface information obtaining step S11：Using surface measuring device 20, surface scan is carried out to wafer W to be measured, to take
Obtain the surface measuring information 201 of the wafer W to be measured；Wherein, surface measuring information 201 includes multiple altitude informations 2011.
One is moved to initial scan position step S12：According to one of altitude information 2011 (i.e. Z axis coordinate value), profit
White light interferometer 50 is set to move with mobile device 40, so that the interference objective 51 of white light interferometer 50 is located at a corresponding initial
Scan position (it is, interference objective 51 is made to correspond to positioned at the position of the Z axis coordinate value)；Wherein, inside white light interferometer 50
With a micro- actuating unit 52, to when white light interferometer 50 is measured, control interference objective 51 is along a longitudinal direction
It is moved, and the mobile device 40 is not when white light interferometer 50 carries out image capturing operation, to control interferences
Mirror 51 carries out mobile component；Wherein, the altitude information 2011 described in this step can be include user setting (or
Set by relevant processing unit) a predetermined offset D (as shown in Figure 6)；In actual implementation, mobile device 40 can be with
It is to control white light interferometer 40 along Z axis (longitudinal direction) movement, and wafer W to be measured is controlled in X- by bogey 30
Y plane moves or mobile device 40 can be that control white light interferometer 50 is moved in X, Y, Z axis.
One image capturing step S13：Make white light interferometer 50 in initial scan position, is controlled using micro- actuating unit 52 dry
It relates to object lens 51 to move in longitudinal direction, to carry out image capturing operation.
In specific implement, surface measuring device 20, mobile device 40 and white light interferometer 50 can be electrical each other
Connection, and can carry out the surface measuring information 201 and associated control signal by wired or wireless mode to each other
It transmits.Certainly, it can also be surface measuring device 20, mobile device 40 and white light interferometer 50, be all connected to processing unit 10,
And the transmission of relevant information and signal is carried out by processing unit 10.It illustrates, it is above-mentioned to be moved to initial scan position
Step S12 and image capturing step S13 is to carry out surface state measurement for single a position on wafer W to be measured, in reality
It is above-mentioned to be moved to initial scan position step S12 and image capturing step S13 in, can be according to user's demand, weight
It is multiple to execute for several times；For example, user can be the predetermined surface state for measuring N number of position on wafer W to be measured, and above-mentioned
It is moved to initial scan position step S12 and image capturing step S13 and correspondence is repeated into n times.
It is the second embodiment of surface measuring method, it includes have following steps as shown in Fig. 5 to Figure 10：
One surface information obtaining step S21：Using surface measuring device 20, surface scan is carried out to wafer W to be measured, to take
The surface measuring information 201 of wafer to be measured is obtained, surface measuring information 201 includes multiple altitude informations 2011；Specifically, such as
Shown in Fig. 6, by these altitude informations 2011 (Z axis coordinate value) and a predetermined offset D acquired by surface measuring device 20, warp
Initial scan line ISL depicted in figure can be obtained by crossing calculation；Wherein, predetermined offset D can be user according to be measured
The height of component P1, P2, P3, P4 on wafer W are set, or can be processing units 10 according to surface measuring information 201
It determines；It sets that is, predetermined offset D can be artificial setting or computer, is not limited in this automatically.Especially
Illustrate, the initial scan line ISL is pattern and predetermined offset D based on wafer W surface to be measured, coordinates white light interference
The scanning direction of instrument 50 and scanning distance determined, therefore, when white light interferometer 50 scans downwards, initial scan line ISL bases
It is positioned at the top of wafer W to be measured in sheet.
One wafer carrying step S22：Control carries the bogey 30 of wafer W to be measured, so that wafer W to be measured is by neighbouring table
The position of face measuring equipment 20 is moved to precalculated position；Wherein, the precalculated position is white light interferometer 50 to wafer W to be measured
Carry out the position of surface measuring；Specifically, as shown in fig. 6, when surface detecting system 1 is intended to the component P1 on wafer W to be measured
When carrying out image capturing operation, processing unit 10 will (can be user according to the plane coordinates data 2012 of component P1
It is selected), control bogey 30 moves, and component P1 is made to be located substantially at lower section (the i.e. white light interferometer of white light interferometer 50
50 can carry out the position of image capturing).
One is moved to initial scan position step S23：According to (corresponding to the plane coordinates data 2012 in step 23)
One of altitude information 2011 makes white light interference using mobile device 40 (white light interferometer 50 is driven to move along the longitudinal direction)
Instrument 50 (interference objective 51) is located at corresponding initial scan position；Wherein, 50 inside of white light interferometer has a micro- cause
Moving cell 52, to when white light interferometer 50 carries out image capturing operation, control interference objective 51 is moved, and described
Mobile device 40 in white light interferometer 50 not being scanned and when image capturing, control interference objective 51 carries out mobile
Component.Specifically, also referring to Fig. 6 to Fig. 8, when processing unit 10 (as shown in Figure 3), control bogey 30 is in X-Y
Planar movement, when lower section to be moved to white light interferometer 50, processing unit 10 will be according to one of altitude information 2011
(Z axis coordinate value) and a predetermined offset D control white light interferometers 50 are moved to the initial scan position corresponding to component P1
ISP1；That is, processing unit 10 will (can be that processing unit 10 is voluntarily determined according to the plane coordinates data 2012
X that fixed or user selectes, Y axis coordinate value), it searches in surface measurement information 201,2011 (Z of corresponding altitude information
Axial coordinate value), and the scanning direction according to white light interferometer 50 and scanning distance, and selectively superposition (or subtracting) is predetermined
Offset D is thereby moved to the correspondence of white light interferometer 50 to obtain the Z axis coordinate value of the initial scan position ISP1
The initial scan position ISP1.In practical applications, each altitude information 2011 that surface measuring device 20 is exported can be with
It directly includes the predetermined offset D to be；Alternatively, each altitude information 2011 can also be not include to have the predetermined migration
D is measured, and foundation user is self-defined again or processing unit 10 voluntarily calculates gained for 10 mobile device 40 of after-treatment device
Predetermined offset D, each altitude information 2011 is calculated, to obtain the initial scan position ISP1.
One image capturing step S24：Make white light interferometer 50 in initial scan position, is controlled using micro- actuating unit 52 dry
It relates to object lens 51 to move in longitudinal direction, to carry out image capturing operation.Specifically, also referring to Fig. 6 to Fig. 9, processing dress
10 control mobile devices 40 (as shown in Figure 3) are set, and after so that white light interferometer 50 is moved to initial scan position ISP1, processing dress
Setting 10 will be such that micro- actuating unit 52 of white light interferometer 50 operates, and interference objective 51 is driven to vertically move, so that the white light is dry
Interferometer 50 carries out image capturing operation；Wherein, dotted line frame R depicted in Fig. 6 corresponds to the control interference of micro- actuating unit 52
Object lens 51 operate, so that white light interferometer 50 carries out wafer W to be measured the longitudinal scanning range of image capturing.
One position moving step S25：Control bogey 30 so that wafer W to be measured be moved to by precalculated position it is another pre-
Positioning is set；Specifically, bogey 30 according to different plane coordinates data 2012, will carry the wafer W movements to be measured, and
Make the different location of wafer W to be measured, the corresponding position for being located at white light interferometer 50 and capable of carrying out image capturing operation.Wherein, mobile
A pre-determined number will be repeated to initial scan position step, image capturing step and position moving step, pre-determined number is small
In the quantity of these altitude informations.Specifically, as shown in Fig. 6, Fig. 9 and Figure 10, surface detecting system 1 is such as intended to wafer to be measured
The position of four components P1, P2, P3, P4 on W are scanned and image capturing operation, then processing unit 10 is in white light interferometer
50 in initial scan position ISP1, after completing image capturing step S24, it will execution position moving step S25, with according to component
Wafer W to be measured is moved to the lower section of white light interferometer 50 by the plane coordinate value corresponding to P2, control bogey 30, then again
Secondary execution is moved to initial scan position step S23, so that white light interferometer 50 is moved to initial scan position ISP2, with again
Carry out image capturing step S24.Similarly, above-mentioned identical step is followed in the measurement of component P3, P4.
Wherein, wafer carrying step S22 for example can be by aforementioned bogey 30, so that wafer to be measured can be in surface
It is moved between measuring equipment 20 and white light interferometer 50.Position moving step equally can also be that will be waited for by bogey 30
The position that wafer W is moved to next predetermined measurement is surveyed, so that white light interferometer is measured.It is described to hold in practical application
It can be the linear shifter of X-Y axis, mechanical arm etc. to carry and set 30, do not limited in this.
In summary, referring to Fig. 6, the surface measuring system and surface measuring method of the present invention, are to first pass through dose,surface
It surveys device 20 and obtains multiple initial scan position ISP1, ISP2, ISP3, ISP4 depicted in figure, then pass through bogey
30 and mobile device 40 cooperation, make white light interferometer 50 reach initial scan position (ISP1, ISP2, ISP3, ISP4) after, then
It drives interference objective 51 to vertically move using micro- actuating unit 52, white light interferometer 50 is made to carry out image capturing operation.Due to this
A little initial scan positions (ISP1, ISP2, ISP3, ISP4) are the surface shapes that the wafer W to be measured is measured by surface measuring device 20
After looks, calculated that (selectively superposition or subtract predetermined offset D) is acquired, and therefore, white light interferometer 50 reaches initial
After scan position (ISP1, ISP2, ISP3, ISP4), you can drive interference objective 51 to vertically move using micro- actuating unit 52, make
White light interferometer 50 carries out relevant image capturing operation to the wafer W to be measured of the position.
The existing direct crystal column surface measurement system that image scan is carried out using white light interferometer, is existed compared to the present invention
There is problems with：Image capturing operation is being carried out to the specific position of wafer to be measured in control white light interferometer due to the use of person
Before, user is not aware that the surface topography of wafer to be measured, and therefore, in existing technology, associated user must be according to mistake
Toward experience, setting white light interferometer starts to carry out image capturing operation to different positions in an identical predetermined Z axis height.
In this way, white light interferometer will expend many times (the unit moving step pitch of micro- actuating unit is very small), this hair is just reached
The bright initial scan position, to can just carry out image scan and obtain operation (optical characteristics based on white light interferometer,
After white light interferometer must first be moved to correct scan position, it can just effectively utilize micro- actuating unit and carry out image capturing).
In extreme situations, the Z axis height set by the user, when can not match the warp value of wafer different location point to be measured,
After white light interferometer consuming many times will be caused to be scanned, initial scan position can not be still found, and user is required
Initial Z axis height is adjusted again, so that white light interferometer is scanned from newly again.
Claims (10)
1. a kind of surface measuring method, which is characterized in that the surface measuring method, should to measure the surface of a wafer to be measured
Surface measuring method comprises the steps of：
One surface information obtaining step：Using a surface measuring device, surface scan is carried out to the wafer to be measured, is waited for obtaining this
A surface measuring information of wafer is surveyed, which contains multiple altitude informations；
One is moved to initial scan position step：According to one of altitude information, make a white light interference using a mobile device
Instrument is located at an initial scan position；Wherein, which includes an interference objective and a micro- actuating unit, micro- actuating
Unit can control the interference objective and be moved in a longitudinal direction；And
One image capturing step：Make the white light interferometer in the initial scan position, the interference is controlled using micro- actuating unit
Object lens are moved in the longitudinal direction, so that the white light interferometer carries out image capturing operation to the wafer to be measured；
Wherein, the unit moving step pitch of the mobile device is more than the unit moving step pitch of micro- actuating unit, and the mobile device
Movement speed be more than micro- actuating unit movement speed.
2. surface measuring method according to claim 1, which is characterized in that be moved to initial scan position step in this
In, which is to control the white light interferometer to move in the longitudinal direction, and the interference objective is made to be located at the initial scan
Position；Wherein, which measures a position of the wafer to be measured to obtain the corresponding height value in the position
Speed, be faster than and the position measured merely with the white light interferometer to obtain the speed of the corresponding height value in the position；
It is moved in the step of initial scan position in this, in addition to according to one of them altitude information, going back according to a predetermined offset, and
The white light interferometer is set to be located at the initial scan position using the mobile device.
3. surface measuring method according to claim 1, which is characterized in that the surface information obtaining step is moved to this
It also include a wafer carrying step between the step of initial scan position：Control carries a bogey of the wafer to be measured, with
The wafer to be measured is set to be moved to the precalculated position for being adjacent to the white light interferometer by the position of the neighbouring surface measuring device；Its
In, which can make the wafer to be measured in a planar movement, which is the normal direction of the plane.
4. surface measuring method according to claim 3, which is characterized in that after the image capturing step also include one
Position moving step：The bogey is controlled, so that the wafer to be measured is moved to another precalculated position by the precalculated position；Its
In, this is moved to initial scan position step, the image capturing step and the position moving step and will repeat one predetermined time
Number.
5. a kind of surface measuring system, which is characterized in that the surface measuring system is to a wafer progress dose,surface to be measured
It surveys, the surface measuring system includes：
One bogey, to carry a wafer to be measured, which can make the wafer to be measured in a planar movement；
One surface measuring device, is set to the side of the bogey, which can carry out the wafer to be measured
Surface measuring generates a surface measuring information with corresponding, which contains multiple altitude informations；
One white light interferometer is set to the other side of the bogey, the white light interferometer include a micro- actuating unit and
One interference objective, micro- actuating unit can control the interference objective and be moved in a longitudinal direction, to carry out shadow to the wafer to be measured
As obtaining operation；Wherein, which is the normal direction of the plane；And
One mobile device can control the white light interferometer according to the respectively altitude information and be moved along the longitudinal direction, so that this is white
Optical interferometer is located at corresponding initial scan position；Wherein, the unit moving step pitch of the mobile device is more than micro- actuating
The unit moving step pitch of unit, and the movement speed of the mobile device is more than the movement speed of micro- actuating unit；
Wherein, when which is located at the initial scan position, the white light interferometer can by micro- actuating unit and should
Interference objective cooperates, to carry out image capturing to the wafer to be measured.
6. surface measuring system according to claim 5, which is characterized in that the surface measuring system also includes a processing
Device, the processing unit are electrically connected the surface measuring device, the bogey, the mobile device and the white light interferometer, should
Processing unit can be according to the altitude information and corresponding plane coordinates data that the surface measuring information is included, and controlling should
Bogey and the mobile device, and the white light interferometer is enable to carry out image capturing in the corresponding position of wafer to be measured.
7. surface measuring system according to claim 5, which is characterized in that the surface measuring system also includes a correction
Device, to correct the surface measuring device, the bogey, the white light interferometer and the mobile device to each other opposite
Position.
8. surface measuring system according to claim 5, which is characterized in that the surface measuring device is to utilize streak reflex
Method carries out surface measuring to the wafer to be measured；The mobile device can be according to the respectively altitude information and a predetermined offset, corresponding control
The white light interferometer is made to move along the longitudinal direction.
9. surface measuring system according to claim 5, which is characterized in that the surface measuring system also includes an input
Device, is electrically connected a processing unit, which inputs a measurement information, the measurement information packet to provide user
Contain multiple wafer adjustment location data；The processing unit can control the bogey according to the wafer adjustment location data
And the mobile device, so that the white light interferometer carries out image capturing operation in the corresponding position of wafer to be measured.
10. surface measuring system according to claim 5, which is characterized in that the surface measuring system also includes a machine
Tool arm apparatus is electrically connected a processing unit, and the processing unit can control the mechanical arm, pick and place and be set to the carrying
Wafer to be measured on device.
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