CN108625502A - A kind of heat insulating board and preparation method thereof - Google Patents

A kind of heat insulating board and preparation method thereof Download PDF

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Publication number
CN108625502A
CN108625502A CN201710161679.6A CN201710161679A CN108625502A CN 108625502 A CN108625502 A CN 108625502A CN 201710161679 A CN201710161679 A CN 201710161679A CN 108625502 A CN108625502 A CN 108625502A
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China
Prior art keywords
aeroge
resin
heat insulating
insulating board
preparation
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CN201710161679.6A
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Chinese (zh)
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CN108625502B (en
Inventor
卢梦言
卢军
卢孟磊
张丁日
卢斌
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Changsha Xingna Aerogel Co Ltd
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Changsha Xingna Aerogel Co Ltd
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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E04B1/78—Heat insulating elements
    • E04B1/80—Heat insulating elements slab-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/24—Structural elements or technologies for improving thermal insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
    • Y02B80/10—Insulation, e.g. vacuum or aerogel insulation

Abstract

A kind of heat insulating board, which is characterized in that be made of core and surface layer, the core is the aeroge/resin composite body being mutually made of the resin of aeroge and the bonding aeroge, and the surface layer is resin phase.Preparation method mainly includes the following steps that：（1）Piece is closed, after evenly mixing with toner by aeroge, lays on a piece of transparent resin plate, another transparent resin plate is covered on mixture, assembly is obtained；（2）It is hot-forming, under certain temperature and pressure, assembly is carried out hot-forming.The heat insulating board of the present invention has preferable heat preservation and insulation and translucency and good security performance, sound insulation and noise reducing performance, is suitable for the fields such as green building and door and window, cladding glass and the lighting roof of super low energy consumption building and nearly zero energy consumption building.

Description

A kind of heat insulating board and preparation method thereof
Technical field
The present invention relates to energy-saving material technical field more particularly to a kind of heat insulating board comprising aeroge and its preparations Method.
Background technology
Aeroge be it is a kind of mutually assembled with nanometer scale ultramicro powder constituted nanoporous network structure, and in network hole The lightweight nano solid material of gaseous state decentralized medium is full of in gap.Its porosity is up to 99.8%, and the typical sizes of hole are 1~ 40nm, specific surface area are 400~1200m2/ g, and density can be down to 3kg/m3, room temperature thermal coefficient can be down to 0.010W/（m•K） Hereinafter, showing excellent lightweight, light transmission, heat-insulated, heat preservation, sound insulation, fire prevention, shock resistance and excellent chemical stabilization Property and noninflammability.Silica aerogel material is set to be visited in calorifics, acoustics, optics, microelectronics, particle just because of these features Survey etc. has very wide application potential.
However, since conventional sol-gel process process is complicated, and produce the comprehensive of the complete transparency aerogel plank of large scale It is high to close technical threshold, numerous skills such as is not only related to material technology, and further relates to technology and equipment Technology Art field, accordingly, it is difficult to prepare large-sized complete aeroge.Further, since aeroge is fragile material, flexural strength compared with Difference cannot be used alone, and can only be used as the laminboard layer of hollow glass, and it is transparent in building to limit aeroge to a certain extent The application range in building enclosure field, and since glass is from great, undoubtedly increases the load of building, building is made to exist Some potential safety problems.It would therefore be highly desirable to develop a kind of transparent, with excellent thermal insulation heat-insulating property large scale, high intensity and light The building energy conservation plate of matter.
Invention content
In order to obtain the building energy conservation plate of a kind of large scale with excellent thermal insulation heat-insulating property, high intensity and lightweight, this Inventing the solution proposed is：Using the aeroge surface with inner hydrophobic, surface hydrophilic structure feature with a large amount of Si- OH can have compatible and bonding action with the active function groups of resin surface, and heating degree is further increased under pressure field outside Resin increases the interface bond strength of aeroge and resin, is on the one hand conducive to carry in the wetting coating function on aeroge surface On the other hand high aeroge being uniformly distributed inside resin gives full play to the performances such as the heat-insulation and heat-preservation of aeroge and resin High-strength and high ductility performance.
A kind of preparation method of heat insulating board proposed by the present invention, mainly includes the following steps that：
（1）Piece is closed, after evenly mixing by aeroge and toner, is laid on a piece of transparent resin plate, it is transparent by another Resin plate is covered on mixture, obtains assembly；
（2）It is hot-forming, under certain temperature and pressure, assembly is carried out hot-forming.
In this way, by closing piece and hot-forming step, can be obtained a kind of upper layer be resin phase, core be aeroge with The heat insulating board for aeroge/resin composite body that the resin of the bonding aeroge is mutually constituted.The present invention by using with Inner hydrophobic, surface hydrophilic structure feature aeroge surface have a large amount of Si-OH can have with the active function groups of resin surface There is compatible and bonding action, heating degree coats work with wetting of the resin on aeroge surface under pressure field, is further increased outside With, increase the interface bond strength of aeroge and resin, be on the one hand conducive to improve aeroge being uniformly distributed inside resin, On the other hand the performances such as the heat-insulation and heat-preservation of aeroge and the high-strength and high ductility performance of resin are given full play to.Therefore, using above-mentioned side Heat insulating board made from method not only has other than large scale and the higher-strength of resin itself, but also with good heat-insulated Heat-insulating property, sound insulation and noise reducing performance, security performance and the characteristics such as light-weight, it is low not to solve simple aeroge flexural strength The problem of capable of directly being used separately as architectural exterior-protecting construction.
Another technical solution of the present invention is on above-mentioned basis, temperature in the hot-forming step is 80 ~ 320 DEG C, pressure is 0.1 ~ 20MPa.In this way, resin reaches softening state to liquid, then 0.1 within the temperature range of 50 ~ 320 DEG C The impressed pressure of ~ 20MPa off field, optimally forms good interface bond strength between aeroge surface.
Another technical solution of the present invention is that on above-mentioned basis, the volume ratio of the aeroge and toner is （0.1-9）:1.In this way, aeroge accounting can be equivalent to ordinary resin at this time with very little, aeroge accounting can be very big, at this time It is equivalent to aerogel material, therefore according to performance needs, the volume ratio range of aeroge and toner can be 0.1：1 to 9： 1。
Another technical solution of the present invention is that on above-mentioned basis, the aeroge has inner hydrophobic, surface parent Water feature.In this way, by using the aeroge surface with inner hydrophobic, surface hydrophilic structure feature with a large amount of Si-OH energy There is compatible and bonding action with the active function groups of resin surface, further increase wetting of the resin on aeroge surface and coat Effect increases the interface bond strength of aeroge and resin, is on the one hand conducive to improve uniform point of aeroge inside resin On the other hand cloth gives full play to the performances such as the heat-insulation and heat-preservation of aeroge and the high-strength and high ductility performance of resin.
Another technical solution of the present invention is on above-mentioned basis, the shape of the aeroge can be it is blocky, Granular, powder, according to performance it needs to be determined that.
Another technical solution of the present invention is that on above-mentioned basis, the transparent resin plate can be polyethylene, gather One kind in propylene, polyvinyl chloride, polystyrene, polyformaldehyde, makrolon, polyamide, acrylic resin, according to performance need It determines.
The present invention another technical solution be it is above-mentioned basis on, the toner be thermosetting powders or Thermoplastic resin powder.
The present invention another technical solution be it is above-mentioned basis on, the step（2）In, it is described it is hot-forming be It is carried out in vacuum environment.In this way, under certain temperature and pressure condition, softening or liquefaction occur for resin, have morphotropism or stream Dynamic property further excludes the bubble between resin and aeroge, heat insulating board is obtained after cooling at this time in vacuum environment. In this way, further increasing the heat preservation and insulation of heat insulating board.
The present invention another technical solution, which is characterized in that be made of core and surface layer, the core be by aeroge with Aeroge/resin composite body that the resin of the aeroge is mutually constituted is bonded, the surface layer is resin phase.In this way, due to heat-insulated The upper layer of thermal insulation board is resin phase, and core is aeroge/resin composite body, therefore and resiniferous excellent mechanical performances With the heat preservation of aeroge distinctive excellent thermal insulation, sound insulation and noise reducing performance and high transparency etc., solves simple aeroge flexural strength Low the problem of cannot directly being used separately as architectural exterior-protecting construction.
Description of the drawings
Fig. 1 is the cross-sectional view of the structure of the heat insulating board of the present invention.
Wherein：1-resin phase；2-aeroges.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
A kind of one embodiment of the present of invention, manufacturing method of heat insulating board, includes the following steps：
（1）After evenly mixing by aeroge and toner, it lays on a piece of transparent resin plate, then by another transparent resin Plate is parallelly covered on the mixture of aeroge and toner, obtains assembly；
（2）Under certain temperature and pressure, assembly is carried out hot-forming.
In this way, by closing piece and hot-forming step, it can be obtained that a kind of upper layer is resin phase 1, core is aeroge 2 And bond the heat insulating board of aeroge/resin composite body of the composition of resin phase 1 of the aeroge 2.The present invention by using Aeroge surface with inner hydrophobic, surface hydrophilic structure feature can be with the active function of resin surface with a large amount of Si-OH Group has compatible and bonding action, further increases resin in the wetting coating function on aeroge surface, increases aeroge and tree On the one hand the interface bond strength of fat is conducive to improve aeroge being uniformly distributed inside resin, on the other hand give full play to The high-strength and high ductility performance of the performances such as the heat-insulation and heat-preservation of aeroge and resin.Therefore, using heat-insulation and heat-preservation made from the above method Plate not only has other than large scale and the higher-strength of resin itself, but also with good heat preservation and insulation, sound insulation drop It makes an uproar performance, security performance and the characteristics such as light-weight, solving that simple aeroge flexural strength is low cannot be separately as building The problem of building enclosure directly uses.
On the basis of the above embodiments, in another embodiment of the present invention, temperature in the hot-forming step is 80 ~ 320 DEG C, pressure is 0.1 ~ 20MPa.In this way, resin reaches softening state to liquid, then 0.1 within the temperature range of 50 ~ 320 DEG C The impressed pressure of ~ 20MPa off field, optimally forms good interface bond strength between aeroge surface.
On the basis of the above embodiments, in another embodiment of the present invention, the volume ratio of the aeroge and toner For（0.1-9）:1.In this way, aeroge accounting can be equivalent to ordinary resin at this time with very little, aeroge accounting can be very big, this When be equivalent to aerogel material, therefore according to performance needs, the volume ratio range of aeroge and toner can be 0.1：1 arrives 9：1.
On the basis of the above embodiments, in another embodiment of the present invention, the aeroge 2 has inner hydrophobic, surface Hydrophilic profile.In this way, by using the aeroge surface with inner hydrophobic, surface hydrophilic structure feature with a large amount of Si-OH Can with the active function groups of resin surface have compatible and bonding action, further increase resin aeroge surface wetting packet Effect is covered, the interface bond strength of aeroge and resin is increased, it is uniform inside resin to be on the one hand conducive to raising aeroge Distribution, on the other hand gives full play to the performances such as the heat-insulation and heat-preservation of aeroge and the high-strength and high ductility performance of resin.
On the basis of the above embodiments, in another embodiment of the present invention, the shape of the aeroge 2 can be it is blocky, Graininess, powder, according to performance it needs to be determined that.
On the basis of the above embodiments, in another embodiment of the present invention, the transparent resin plate can be polyethylene, gather One kind in propylene, polyvinyl chloride, polystyrene, polyformaldehyde, makrolon, polyamide, acrylic resin, according to performance need It determines.
On the basis of the above embodiments, in another embodiment of the present invention, the toner is thermosetting powders Or thermoplastic resin powder.
On the basis of the above embodiments, in another embodiment of the present invention, the step（2）In, it is described hot-forming to be It is carried out in vacuum environment.In this way, under certain temperature and pressure condition, softening or liquefaction occur for resin, have morphotropism or Mobility further excludes the bubble between resin and aeroge, heat-insulation and heat-preservation is obtained after cooling at this time in vacuum environment Plate.In this way, further increasing the heat preservation and insulation of heat insulating board.
Another embodiment of the present invention, a kind of heat insulating board, which is characterized in that be made of core and surface layer, the core For the aeroge/resin composite body being mutually made of with the resin for bonding the aeroge aeroge, the surface layer is resin phase.Such as This, since the upper layer of heat insulating board is resin phase, core is aeroge/resin composite body, therefore and resiniferous The excellent mechanical performances and distinctive excellent thermal insulation heat preservation of aeroge, sound insulation and noise reducing performance and high transparency etc., solve simple gas Gel flexural strength low the problem of cannot directly being used separately as architectural exterior-protecting construction.
On the basis of the above embodiments, in another embodiment of the present invention, a kind of manufacturing method of heat insulating board, including Following steps：
（1）It is 0.1 by the volume ratio of aeroge and toner:1, the transparent cake aeroge and thermosetting resin powder of ratio will be determined End after evenly mixing, is uniformly laid on a piece of transparent polyvinyl chloride plate, then another transparent polyvinyl chloride plate is parallelly covered It is placed on the mixture of aeroge and toner, obtains assembly；
（2）Under certain temperature and pressure, assembly is carried out hot-forming, forming temperature is 80 DEG C, and briquetting pressure is 10MPa keeps 30min with this condition, obtains heat insulating board.
The heat insulating board obtained through the above steps is as shown in Figure 1, wherein aeroge 2 and the bonding aeroge The thickness for aeroge/resin composite body that resin phase 1 is constituted is 10mm, and upper and lower surface tree lipid phase thickness is 4mm, test knot Fruit shows, visible light transmittance 90%, heat transfer coefficient 2.90W/（m2·K）.
On the basis of the above embodiments, in another embodiment of the present invention, a kind of manufacturing method of heat insulating board, including Following steps：
（1）It is 5 by the volume ratio of aeroge and toner:1, the transparent grain shape aeroge and thermosetting resin powder of ratio will be determined End after evenly mixing, is uniformly laid on a piece of transparent polypropylene plate, then another transparent polypropylene plate is parallelly covered in On the mixture of aeroge and toner, assembly is obtained；
（2）Under certain temperature and pressure, assembly is carried out hot-forming, forming temperature is 150 DEG C, and briquetting pressure is 20MPa keeps 20min with this condition, obtains heat insulating board.
The heat insulating board obtained through the above steps is as shown in Figure 1, wherein aeroge 2 and the bonding aeroge The thickness for aeroge/resin composite body that resin phase 1 is constituted is 10mm, and upper and lower surface tree lipid phase thickness is 4mm, test knot Fruit shows, visible light transmittance 85%, heat transfer coefficient 1.57W/（m2·K）.
On the basis of the above embodiments, in another embodiment of the present invention, a kind of manufacturing method of heat insulating board, including Following steps：
（1）It is 2 by the volume ratio of aeroge and toner:1, the transparent powdered aeroge and thermoplastic resin cosmetics of ratio will be determined End after evenly mixing, is uniformly laid on a piece of transparent polystyrene plate, then another transparent polystyrene plate is parallelly covered It is placed on the mixture of aeroge and toner, obtains assembly；
（2）Under certain temperature and pressure, assembly is carried out hot-forming, forming temperature is 250 DEG C, and briquetting pressure is 0.1MPa keeps 25min with this condition, obtains heat insulating board.
The heat insulating board obtained through the above steps is as shown in Figure 1, wherein aeroge 2 and the bonding aeroge The thickness for aeroge/resin composite body that resin phase 1 is constituted is 10mm, and upper and lower surface tree lipid phase thickness is 4mm, test knot Fruit shows, visible light transmittance 80%, heat transfer coefficient 1.82W/（m2•K）.
On the basis of the above embodiments, in another embodiment of the present invention, a kind of manufacturing method of heat insulating board, including Following steps：
（1）It is 9 by the volume ratio of aeroge and toner:1, the transparent grain shape aeroge and thermoplastic resin cosmetics of ratio will be determined End after evenly mixing, is uniformly laid on a piece of clear polycarbonate plate, then another clear polycarbonate plate is parallelly covered It is placed on the mixture of aeroge and toner, obtains assembly；
（2）Under certain temperature and pressure, assembly is carried out hot-forming, forming temperature is 320 DEG C, and briquetting pressure is 1MPa keeps 20min with this condition, obtains heat insulating board.
The heat insulating board obtained through the above steps is as shown in Figure 1, wherein aeroge 2 and the bonding aeroge The thickness for aeroge/resin composite body that resin phase 1 is constituted is 10mm, and upper and lower surface tree lipid phase thickness is 4mm, test knot Fruit shows, visible light transmittance 77%, heat transfer coefficient 1.22W/（m2•K）.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment Limitation, it is other it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications, Equivalent substitute mode is should be, is included within the scope of the present invention.

Claims (8)

1. a kind of preparation method of heat insulating board, which is characterized in that mainly include the following steps that：
（1）Piece is closed, after evenly mixing by aeroge and toner, is laid on a piece of transparent resin plate, it is transparent by another Resin plate is covered on mixture, obtains assembly；
（2）It is hot-forming, under certain temperature and pressure, assembly is carried out hot-forming.
2. a kind of preparation method of heat insulating board according to claim 1, which is characterized in that the aeroge and resin The volume ratio of powder is 0.1-9:1.
3. a kind of preparation method of heat insulating board according to claim 1, which is characterized in that the aeroge has interior Portion is hydrophobic, surface hydrophilic feature.
4. a kind of preparation method of heat insulating board according to claim 1, which is characterized in that the shape of the aeroge For one kind in bulk, graininess, powder.
5. a kind of preparation method of heat insulating board according to claim 1, which is characterized in that the transparent resin plate is Polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyformaldehyde, makrolon, one kind in polyamide, acrylic resin.
6. a kind of preparation method of aerogel composite according to claim 1, which is characterized in that the toner For thermosetting powders or thermoplastic resin powder.
7. a kind of preparation method of heat insulating board according to claim 1, which is characterized in that the hot-forming step Further include being carried out in vacuum environment.
8. a kind of heat insulating board obtained according to preparation method described in aforementioned any claim, which is characterized in that by core It being constituted with surface layer, the core is the aeroge/resin composite body being mutually made of the resin of aeroge and the bonding aeroge, The surface layer is resin phase.
CN201710161679.6A 2017-03-17 2017-03-17 Heat insulation board and preparation method thereof Active CN108625502B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202509640U (en) * 2012-03-15 2012-10-31 三利防水保温工程有限公司 Polyisocyanurate foam (PIR) composite thermal insulation plate
CN104452987A (en) * 2013-09-13 2015-03-25 天津市艾迪聚氨酯工业有限公司 Composite polyurethane heat-insulating board
CN205272695U (en) * 2015-11-02 2016-06-01 卓达新材料科技集团有限公司 Aerogel composite insulation board
CN105839801A (en) * 2016-05-20 2016-08-10 广西大学 Insulation board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202509640U (en) * 2012-03-15 2012-10-31 三利防水保温工程有限公司 Polyisocyanurate foam (PIR) composite thermal insulation plate
CN104452987A (en) * 2013-09-13 2015-03-25 天津市艾迪聚氨酯工业有限公司 Composite polyurethane heat-insulating board
CN205272695U (en) * 2015-11-02 2016-06-01 卓达新材料科技集团有限公司 Aerogel composite insulation board
CN105839801A (en) * 2016-05-20 2016-08-10 广西大学 Insulation board

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CN108625502B (en) 2019-12-24

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