CN108621422A - A kind of 3D printer levelling mechanism - Google Patents

A kind of 3D printer levelling mechanism Download PDF

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Publication number
CN108621422A
CN108621422A CN201810325724.1A CN201810325724A CN108621422A CN 108621422 A CN108621422 A CN 108621422A CN 201810325724 A CN201810325724 A CN 201810325724A CN 108621422 A CN108621422 A CN 108621422A
Authority
CN
China
Prior art keywords
contact
wafer
electric telescopic
rod
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810325724.1A
Other languages
Chinese (zh)
Other versions
CN108621422B (en
Inventor
丰洪微
范哲超
陈磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inner Mongolia Technical College of Mechanics and Electrics
Original Assignee
Inner Mongolia Technical College of Mechanics and Electrics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inner Mongolia Technical College of Mechanics and Electrics filed Critical Inner Mongolia Technical College of Mechanics and Electrics
Priority to CN201810325724.1A priority Critical patent/CN108621422B/en
Publication of CN108621422A publication Critical patent/CN108621422A/en
Application granted granted Critical
Publication of CN108621422B publication Critical patent/CN108621422B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245Platforms or substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)

Abstract

The present invention provides a kind of 3D printer levelling mechanism, which includes with levelling mechanism:The support plate and adjustment plate of stacking further include four electric telescopic rods for being arranged between the support plate and the adjustment plate and being used to adjust the adjustment plate, wherein four electric telescopic rods are separately positioned on four angles of the support plate;The contact pilotage controlled using the buoyancy of liquid is provided in adjustment plate, when the contact pilotage and any first contact or the second wafer contact, the accumulator is electrically connected with corresponding electric telescopic rod.The beneficial effects of the invention are as follows:It can be very good to realize by the levelling device of setting and leveling carried out to 3D printer, facilitate and leveling is carried out to 3D printer.

Description

A kind of 3D printer levelling mechanism
Technical field
The present invention relates to 3D printing technique field more particularly to a kind of 3D printer levelling mechanisms.
Background technology
3D printing is one kind of rapid shaping technique, it be one kind based on digital model file, with powdered gold Belong to or the adhesive materials such as plastics, constructs the technology of object by layer-by-layer printing.Often in mold manufacturing, industrial design Equal fields are used for modeling, after be gradually available for the direct manufactures of some products.
The levelling mechanism major part for photosensitive resin 3D printer on the market is all 3 points or 4 leveling at present.Its In, adjustable plate is setting up and down with platform, is connected by axially disposed screw between adjustable plate and platform, and screw, which is located at, to be adjusted Spring is arranged on part between plate and platform, one end that screw is pierced by adjustable plate is connected with wing nut as leveling nut. It tightens or unscrews four dish shape nut energy leveling platform quadrangles, the platform made is parallel with charging tray.
But the effect of above-mentioned traditional levelling mechanism leveling is not especially good.
Invention content
The purpose of the invention is to overcome the deficiencies of the prior art and provide a kind of 3D printer levelling mechanism.
The present invention is achieved through the following technical solutions:
The present invention provides a kind of 3D printer levelling mechanism, which includes with levelling mechanism:The branch of stacking Fagging and adjustment plate further include being arranged between the support plate and the adjustment plate and for adjusting the four of the adjustment plate A electric telescopic rod, wherein four electric telescopic rods are separately positioned on four angles of the support plate;
Further include the accommodating chamber being arranged in the adjustment plate, liquid is provided in the accommodating chamber, the accommodating chamber Cylinder is provided on bottom wall;Supporting rod is provided in the cylinder, the supporting rod is connected with contact pilotage by universal joint, described to touch Float is provided on needle;
Four the first contacts and the second wafer, and first contact and institute are surrounded on the madial wall of the cylinder The second wafer is stated to be arranged alternately;Wherein, first contact is electrically connected with a corresponding electric telescopic rod, the second wafer with Corresponding two adjacent electric telescopic rod electrical connections;The contact pilotage is connected with accumulator;In the contact pilotage and any described the When one contact or the second wafer contact, the accumulator is electrically connected with corresponding electric telescopic rod.
Preferably, further include the locking device being arranged in each electric telescopic rod;
The electric telescopic rod include the first metallic rod and be nested in first metallic rod and with first gold medal Belong to the second metallic rod that bar is slidably connected, further includes the driving device of driving the second metallic rod sliding;
The locking device includes:Electromagnet in first metallic rod is set, and when the electromagnet obtains electric, Adsorb second metallic rod;The clamping screw being connect with the first metallic rod spiral, and when the clamping screw is locked, The clamping screw is pressed in second metallic rod;
The top plate of the cylinder is provided with the third wafer, and when the contact pilotage and the third wafer contact, the electricity Magnet is electrically connected with the accumulator.
Preferably, the cylinder is truncated cone-shaped cylinder, and the supporting rod is retractable support lever, and the third wafer passes through Adjusting screw rod is connect with the top of the truncated cone-shaped cylinder.
Preferably, first contact and the second wafer extend on the top plate of the cylinder, and described first touches The bending part of piece and institute's the second wafer is the bending of arc.
Preferably, further include that the supporting rack for deviating from the adjustment plate side in the support plate is set.
Preferably, the portion envelops that the contact pilotage is located in the liquid have insulating layer.
The beneficial effects of the invention are as follows:It can be very good to realize by the levelling device of setting and 3D printer adjusted It is flat, it facilitates and leveling is carried out to 3D printer.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of 3D printer levelling mechanism provided in an embodiment of the present invention.
Specific implementation mode
Hereinafter, certain exemplary embodiments are simply just described.As one skilled in the art will recognize that Like that, without departing from the spirit or scope of the present invention, described embodiment can be changed by various different modes. Therefore, attached drawing and description are considered essentially illustrative rather than restrictive.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on ... shown in the drawings or Position relationship is merely for convenience of description of the present invention and simplification of the description, and does not indicate or imply the indicated device or element must There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more, Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc. Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;Can be that machinery connects It connects, can also be electrical connection, can also be communication;It can be directly connected, can also indirectly connected through an intermediary, it can be with It is the interaction relationship of the connection or two elements inside two elements.For the ordinary skill in the art, may be used To understand the concrete meaning of above-mentioned term in the present invention as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower" It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " side " and " above " include fisrt feature Right over second feature and oblique upper, or it is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature is Two features " under ", " lower section " and " following " include fisrt feature right over second feature and oblique upper, or be merely representative of One characteristic level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, Fig. 1 is a kind of structural schematic diagram of 3D printer levelling mechanism provided by the invention.
The present invention provides a kind of 3D printer levelling mechanism, which includes with levelling mechanism:The branch of stacking Fagging and adjustment plate 5 further include being arranged between the support plate and the adjustment plate 5 and for adjusting the adjustment plate 5 Four electric telescopic rods, wherein four electric telescopic rods are separately positioned on four angles of the support plate;
Further include the accommodating chamber 7 being arranged in the adjustment plate 5, liquid, the accommodating chamber are provided in the accommodating chamber 7 Cylinder 12 is provided on 7 bottom wall;Supporting rod 13 is provided in the cylinder 12, the supporting rod 13 is connected with by universal joint Contact pilotage 9 is provided with float 14 on the contact pilotage 9;
Four the first contacts 8 and the second wafer 11 are surrounded on the madial wall of the cylinder 12, and described first touches Piece 8 is arranged alternately with the second wafer 11;Wherein, first contact 8 is electrically connected with a corresponding electric telescopic rod, described The second wafer 11 is electrically connected with corresponding two adjacent electric telescopic rods;The contact pilotage 9 is connected with accumulator;In the contact pilotage 9 with any first contact 8 or the second wafer 11 when contacting, and the accumulator is electrically connected with corresponding electric telescopic rod.
Preferably, further include the locking device being arranged in each electric telescopic rod;
The electric telescopic rod include the first metallic rod and be nested in first metallic rod and with first gold medal Belong to the second metallic rod 4 that bar is slidably connected, further includes the driving device that driving second metallic rod 4 is slided;
The locking device includes:Electromagnet 6 in first metallic rod is set, and the electromagnet 6 it is electric When, adsorb second metallic rod 4;The clamping screw 3 being connect with the first metallic rod spiral, and in the clamping screw 3 When locking, the clamping screw 3 is pressed in second metallic rod 4;
The top plate of the cylinder 12 is provided with the third wafer 10, and when the contact pilotage 9 and the third wafer 10 contact, The electromagnet 6 is electrically connected with the accumulator.
Preferably, the cylinder 12 is truncated cone-shaped cylinder 12, and the supporting rod 13 is retractable support lever 13, the third Contact 10 is connect by adjusting screw rod with the top of the truncated cone-shaped cylinder 12.
Preferably, first contact 8 and the second wafer 11 extend on the top plate of the cylinder 12, and described The bending part of one contact 8 and institute's the second wafer 11 is the bending of arc.
Preferably, further include that the supporting rack for deviating from 5 side of the adjustment plate in the support plate is set.
Preferably, the portion envelops that the contact pilotage 9 is located in the liquid have insulating layer.
In the above-mentioned technical solutions, it can be very good to realize by the levelling device of setting and leveling carried out to 3D printer, It facilitates and leveling is carried out to 3D printer.
To facilitate understanding of the present embodiment of the invention a kind of 3D printer levelling mechanism provided, with reference to specific reality Example is applied it is described in detail.
It continues to refer to figure 1, the present invention provides a kind of 3D printer levelling mechanism, 3D printer levelling mechanism packets It includes:The support plate and adjustment plate 5 and four electric telescopic rods, the electric telescopic rod of stacking are located at the four of support plate It a angle, and the both ends of each electric telescopic rod are connect with support plate and adjustment plate 5 respectively electronic is stretched by four in leveling Leveling of the flexible realization of contracting bar to adjustment plate 5.
In specific setting, electric telescopic rod include the first metallic rod and be nested in first metallic rod and with institute The second metallic rod 4 that the first metallic rod is slidably connected is stated, further includes the driving device that driving second metallic rod 4 is slided;It should Driving device can be motor-driven gear & rack structure, or use linear motor, and the stator and rotor of linear motor It is fixedly connected respectively with the first metallic rod and the second metallic rod 4.
In specific leveling, by giving four electric telescopic rod power supplies to be adjusted to it to realize.Specifically, the leveling Structure include the accommodating chamber 7 being arranged in the adjustment plate 5, be provided with liquid in the accommodating chamber 7;And the accommodating chamber 7 is one The accommodating chamber 7 of a sealing.In addition, being provided with cylinder 12 on the bottom wall of the accommodating chamber 7;It is provided with supporting rod in the cylinder 12 13, supporting rod 13 is connected with contact pilotage 9 by universal joint, and the portion envelops that contact pilotage 9 is located in the liquid have insulating layer.Contact pilotage Float 14 is provided on 9, which swims in the surface of liquid;In addition, being surrounded on the madial wall of the cylinder 12 Four the first contacts 8 and the second wafer 11, and first contact 8 is arranged alternately with the second wafer 11;Wherein, described One contact 8 is electrically connected with a corresponding electric telescopic rod, the second wafer 11 and corresponding two adjacent electric telescopic rods Electrical connection;The contact pilotage 9 is connected with accumulator;It is contacted with any first contact 8 or the second wafer 11 in the contact pilotage 9 When, the accumulator is electrically connected with corresponding electric telescopic rod.
It is stretched for example, four electric telescopic rods are respectively the first electric telescopic rod, the second electric telescopic rod, third is electronic Contracting bar and the 4th electric telescopic rod, then corresponding four the first contacts are;First contact a, the first contact b, the first contact c and First contact d, wherein the first contact a is connect with the first electric telescopic rod, the first contact b is connect with the second electric telescopic rod, the One contact c is connect with third electric telescopic rod, and the first contact d is connect with the 4th electric telescopic rod.In addition, four the second wafers point Than for the second wafer e, the second wafer f, the second wafer g and the second wafer h, wherein the second wafer e respectively with the first electric expansion Bar and the connection of the second electric telescopic rod;, the second wafer f connect with the second electric telescopic rod and third electric telescopic rod respectively;, the Two contact g are connect with third electric telescopic rod and the 4th electric telescopic rod respectively;, the second wafer f respectively with the 4th electric expansion Bar and the connection of the first electric telescopic rod.
When in use, when adjustment plate 5 tilts, liquid level also tilts, and corresponding float 14 also tilts, band moving contact pin 9 It tilts, so that contact pilotage 9 touches one in the first above-mentioned contact 8 and the second wafer 11, then corresponding accumulator Electric telescopic rod conducting corresponding with the contact, to drive electric telescopic rod to stretch out, to realize adjustment.If with the second wafer 11 contacts, then 11 corresponding two electric telescopic rods stretchings of corresponding driving the second wafer, to carry out leveling to adjustment plate 5.
After the completion of leveling, need to lock adjustment plate 5.Therefore levelling mechanism provided by the present application further includes setting Locking device in each electric telescopic rod;Wherein, which includes:It is arranged in first metallic rod Electromagnet 6, and when the electromagnet 6 obtains electric, adsorb second metallic rod 4;It is connect with the first metallic rod spiral Clamping screw 3, and when the clamping screw 3 is locked, the clamping screw 3 is pressed in second metallic rod 4;
The top plate of the cylinder 12 is provided with the third wafer 10, and when the contact pilotage 9 and the third wafer 10 contact, The electromagnet 6 is electrically connected with the accumulator.After the completion of leveling, contact pilotage 9 is detached from and the first contact 8 and the second wafer 11 Contact, and contacted with the third wafer 10 at the top of staving, at this point, electromagnet 6 is connected with accumulator, the absorption of electromagnet 6 second Metallic rod 4, to lock the position of the second metallic rod 4.
In order to facilitate the precision of adjustment whole device, which is truncated cone-shaped cylinder 12, and the supporting rod 13 is that can stretch Contracting supporting rod 13, the third wafer 10 are connect by adjusting screw rod with the top of the truncated cone-shaped cylinder 12.And it is being arranged When, first contact 8 and the second wafer 11 extend on the top plate of the cylinder 12, and first contact 8 and institute The bending part of the second wafer 11 is the bending of arc.In setting, contact pilotage 9 can be adjusted by adjusting the length of supporting rod 13 Highly, and since staving uses truncated cone-shaped, contact pilotage 9 is higher, smaller with the spacing of cylinder madial wall, the essence of adjustment Degree is higher.In addition, the third wafer 10 adjusts height using by adjusting bolt, therefore, it is corresponding adjust contact pilotage 9 when, can be with Corresponding adjustment the third wafer 10, to guarantee to lock electric telescopic rod.
In addition, the levelling device further includes that the supporting rack for deviating from 5 side of the adjustment plate in the support plate is arranged.
3D printer is adjusted it can be seen from the above description that can be very good to realize by the levelling device of setting It is flat, it facilitates and leveling is carried out to 3D printer.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and All any modification, equivalent and improvement made by within principle etc., should all be included in the protection scope of the present invention.

Claims (6)

1. a kind of 3D printer levelling mechanism, which is characterized in that including:The support plate and adjustment plate of stacking, further include setting Set four electric telescopic rods between the support plate and the adjustment plate and for adjusting the adjustment plate, wherein described Four electric telescopic rods are separately positioned on four angles of the support plate;
Further include the accommodating chamber being arranged in the adjustment plate, liquid, the bottom wall of the accommodating chamber are provided in the accommodating chamber On be provided with cylinder;It is provided with supporting rod in the cylinder, the supporting rod is connected with contact pilotage by universal joint, on the contact pilotage It is provided with float;
It is surrounded with four the first contacts and the second wafer on the madial wall of the cylinder, and first contact and described the Two contacts are arranged alternately;Wherein, first contact is electrically connected with a corresponding electric telescopic rod, the second wafer with it is corresponding Two adjacent electric telescopic rods electrical connection;The contact pilotage is connected with accumulator;It is touched in the contact pilotage and any described first When piece or the second wafer contact, the accumulator is electrically connected with corresponding electric telescopic rod.
2. 3D printer levelling mechanism according to claim 1, which is characterized in that further include being arranged in each electricity Locking device on dynamic telescopic rod;
The electric telescopic rod include the first metallic rod and be nested in first metallic rod and with first metallic rod The second metallic rod being slidably connected further includes the driving device of driving the second metallic rod sliding;
The locking device includes:Electromagnet in first metallic rod is set, and when the electromagnet obtains electric, is adsorbed Second metallic rod;The clamping screw being connect with the first metallic rod spiral, and when the clamping screw is locked, it is described Clamping screw is pressed in second metallic rod;
The top plate of the cylinder is provided with the third wafer, and when the contact pilotage and the third wafer contact, the electromagnet It is electrically connected with the accumulator.
3. 3D printer levelling mechanism according to claim 1, which is characterized in that the cylinder is truncated cone-shaped cylinder, The supporting rod is retractable support lever, and the third wafer is connect by adjusting screw rod with the top of the truncated cone-shaped cylinder.
4. 3D printer levelling mechanism according to claim 2, which is characterized in that first contact and described second Contact extends on the top plate of the cylinder, and the bending that the bending part of first contact and institute's the second wafer is arc.
5. 3D printer levelling mechanism according to claim 1, which is characterized in that further include being arranged in the support plate Supporting rack away from the adjustment plate side.
6. 3D printer levelling mechanism according to claim 1, which is characterized in that the contact pilotage is located in the liquid Portion envelops have insulating layer.
CN201810325724.1A 2018-04-04 2018-04-04 Leveling mechanism for 3D printer Expired - Fee Related CN108621422B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810325724.1A CN108621422B (en) 2018-04-04 2018-04-04 Leveling mechanism for 3D printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810325724.1A CN108621422B (en) 2018-04-04 2018-04-04 Leveling mechanism for 3D printer

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CN108621422A true CN108621422A (en) 2018-10-09
CN108621422B CN108621422B (en) 2020-07-28

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110682398A (en) * 2019-10-10 2020-01-14 佛山市艾温特智能科技有限公司 Conveniently adjust balanced clay sculpture printer of print table
CN114506078A (en) * 2022-04-20 2022-05-17 徐州瑞缔新材料科技有限公司 Photocuring 3D printer
CN115138872A (en) * 2022-06-30 2022-10-04 安徽省春谷3D打印智能装备产业技术研究院有限公司 Laser 3D prints and uses platform stabilising arrangement
CN115430845A (en) * 2022-08-01 2022-12-06 汕头大学 Leveling device of 3D printer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1732172A1 (en) * 1988-04-18 1992-05-07 Центральный Научно-Исследовательский И Проектно-Конструкторский Институт Механизации И Энергетики Лесной Промышленности Liquid level indicator in hydraulic system vessel with spent liquid
CN1439773A (en) * 2002-02-19 2003-09-03 南文辉 Transversal wave control system of level-control road materials spreader
CN105172138A (en) * 2015-08-19 2015-12-23 珠海天威飞马打印耗材有限公司 Platform assembly, digital light processing (DLP) 3D printer and demoulding method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1732172A1 (en) * 1988-04-18 1992-05-07 Центральный Научно-Исследовательский И Проектно-Конструкторский Институт Механизации И Энергетики Лесной Промышленности Liquid level indicator in hydraulic system vessel with spent liquid
CN1439773A (en) * 2002-02-19 2003-09-03 南文辉 Transversal wave control system of level-control road materials spreader
CN105172138A (en) * 2015-08-19 2015-12-23 珠海天威飞马打印耗材有限公司 Platform assembly, digital light processing (DLP) 3D printer and demoulding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110682398A (en) * 2019-10-10 2020-01-14 佛山市艾温特智能科技有限公司 Conveniently adjust balanced clay sculpture printer of print table
CN114506078A (en) * 2022-04-20 2022-05-17 徐州瑞缔新材料科技有限公司 Photocuring 3D printer
CN114506078B (en) * 2022-04-20 2022-07-01 徐州瑞缔新材料科技有限公司 Photocuring 3D printer
CN115138872A (en) * 2022-06-30 2022-10-04 安徽省春谷3D打印智能装备产业技术研究院有限公司 Laser 3D prints and uses platform stabilising arrangement
CN115138872B (en) * 2022-06-30 2024-01-26 安徽省春谷3D打印智能装备产业技术研究院有限公司 Laser 3D prints and uses platform stabilising arrangement
CN115430845A (en) * 2022-08-01 2022-12-06 汕头大学 Leveling device of 3D printer
CN115430845B (en) * 2022-08-01 2023-06-06 汕头大学 Leveling device of 3D printer

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