CN108621312A - A method of it solving silicon carbide cutting cutting fluid and blocks - Google Patents

A method of it solving silicon carbide cutting cutting fluid and blocks Download PDF

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Publication number
CN108621312A
CN108621312A CN201810466512.5A CN201810466512A CN108621312A CN 108621312 A CN108621312 A CN 108621312A CN 201810466512 A CN201810466512 A CN 201810466512A CN 108621312 A CN108621312 A CN 108621312A
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CN
China
Prior art keywords
cutting fluid
cutting
settling zone
silicon carbide
overflow port
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Pending
Application number
CN201810466512.5A
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Chinese (zh)
Inventor
苏双图
张洁
赖柏帆
林武庆
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Nortel New Mstar Technology Ltd Fujian
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Nortel New Mstar Technology Ltd Fujian
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Priority to CN201810466512.5A priority Critical patent/CN108621312A/en
Publication of CN108621312A publication Critical patent/CN108621312A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums

Abstract

The invention discloses a kind of methods that solution silicon carbide cutting cutting fluid blocks, including:Cutting fluid on board is connected to cutting fluid bucket pipeline by board pipeline, cutting fluid bucket pipeline is inserted into the first settling zone, and the cutting fluid on board is made to be precipitated in the first settling zone;When the liquid level of liquid to be cut exceeds the overflow port of the first settling zone, overflow port of the cutting fluid through the first settling zone overflows to the second settling zone;When extension trapezoidal overflow port of the liquid level of liquid to be cut beyond the second settling zone, the cutting fluid precipitated by the second settling zone overflows to third filtering area by the trapezoidal overflow port of extension;The cutting fluid for overflowing to third filtering area is filtered by filter pad, and filtered cutting fluid flows directly into feed trough, and the cutting fluid of filtering is extracted into the system that a cycle is formed on line cutting machine platform by suction pump.The present invention solves silicon carbide in cutting process since cutting fluid blocks, and flow becomes smaller, causes from nozzles spray to the non-uniform problem of silicon carbide crystal bar cutting fluid.

Description

A method of it solving silicon carbide cutting cutting fluid and blocks
Technical field
The present invention relates to the technical fields of separation, and in particular to a method of it solving silicon carbide cutting cutting fluid and blocks.
Background technology
Silicon carbide is the important third generation half to grow up after first generation semiconductor Si, second generation semiconductor GaAs Conductor material.The application of third generation semiconductor technology will expedite the emergence of upper trillion yuan and dive in energy-saving and emission-reduction, information technology, three big field of national defence In market, illumination is penetrated into rapidly in recent years, electrical device, each corner in the fields such as microwave radio, market scale quickly carries It rises, has a wide range of applications market, become in fields such as new-energy automobile, lamps for vehicle, general illumination, electric vehicle, 5G applications One of the direction of Future New Energy Source development.
Silicon carbide has the characteristics that broad stopband, high heat conductance, high breakdown field strength, high carrier saturation migration rate etc..So And silicon carbide Morse hardness 9.2, be only second to diamond, cause carborundum crystals cutting difficulty it is quite big, in cutting process due to The exception of diamond line, cutting fluid sprinkling etc., is easy to cause that be cut into silicon carbide wafer, angularity, curvature, surface topography equal Even property is very poor, especially because cutting fluid sandblasting is uneven, diamond line is caused to be dry grinded with silicon carbide crystal bar, is easy to cause brill Stone line breaks, and surface scratch is deepened, and angularity, curvature etc. increase extremely.
The cutting fluid barrel structure of existing cutting machine is mainly:Recycling bin and supply bucket, centre add filter core.Due to cutting In the process, diamond line and silicon carbide crystal bar mutually rub, it may appear that the diamond to fall off on many glue carborundum powders and diamond line Particle, coating stick together, and form gelatinous dope, when leading to that gelatinous dope is through filtration core in cutting fluid, filter core To blocking, to make filter core lose filtration or cut the problems such as flow quantity becomes smaller.
Chinese patent CN201310005314.6 discloses a kind of wire cutting device for filtering cutting fluid, including water tank, notch, Suction pump, bottom surface filter screen, movable pressing board, side filter screen, braced frame;The device is cut for existing Wire EDM Cutting liquid filter device, there are susceptible to plugging defects, carry out structure improvement, to reduce the blocked occurrence probability of filter device, have Simple in structure, easy to operate, at low cost, filter device is not easy blocked feature.But the cutting apparatus hardness of the patent compared with It is low, the problem of not still being avoided that cutting apparatus and silicon carbide fall off dust for silicon carbide cutting, block filter core.
Therefore, in view of the above-mentioned problems, needing to find a new process solution solution silicon carbide in cutting process due to cutting Liquid blocking is cut, flow becomes smaller, causes from nozzles spray to the non-uniform problem of silicon carbide crystal bar cutting fluid.
Invention content
The present invention is in view of the above-mentioned problems, provide a kind of method for solving silicon carbide cutting cutting fluid and blocking.
Technical solution is used by the present invention solves the above problems:A kind of side for solving silicon carbide cutting cutting fluid and blocking Method solves silicon carbide cutting cutting fluid using Novel cutting liquid bucket and blocks;Novel cutting liquid bucket includes:Board pipeline 1, cutting fluid Bucket pipeline 2, third filtering area 3, the trapezoidal overflow port 4 of extension, filter pad 5, suction pump 6, the first settling zone 7, the second settling zone 8, Feed trough 9, bottom switch 10, temperature-controlling system 11;The method that silicon carbide cutting cutting fluid blocks is solved, is included the following steps:
Cutting fluid on board is connected to cutting fluid bucket pipeline 2 by step S1 by board pipeline 1, and cutting fluid bucket pipeline 2 is inserted into In first settling zone 7, the cutting fluid on board is made to be precipitated in the first settling zone 7;
Step S2, when the liquid level of liquid to be cut exceeds the overflow port of the first settling zone 7, cutting fluid is through the first settling zone 7 Overflow port overflows to the second settling zone 8;
Step S3, when the trapezoidal overflow port 4 of the extension of the liquid level of liquid to be cut beyond the second settling zone 8, by the second precipitation The cutting fluid that area 8 is precipitated overflows to third filtering area 3 by the trapezoidal overflow port of extension 4;
Step S4, the cutting fluid for overflowing to third filtering area 3 are filtered by filter pad 5, and filtered cutting fluid is straight It connects and flows into feed trough 9, the cutting fluid of filtering is extracted by the system for forming a cycle on line cutting machine platform by suction pump 6.
Further, temperature-controlling system 11 is housed, to adjust the temperature of cutting fluid in feed trough 9.
Further, bottom switch 10 is replacing cutting fluid.
Further, bottom switch 10 is specially to replace cutting fluid:When replacing cutting fluid, cutting fluid is passed through into handle It pulls and replaces area, opened by bottom switch 10, cutting fluid cylinder internal washing is clean.
Further, in step S1, board pipeline 1 is connected with liquid bucket pipeline 2 is cut by connection ring, cuts liquid bucket pipeline 2 Tube bottom be less than the first settling zone 7 overflow port.
Further, in step S3, the height of the height of the trapezoidal overflow port of extension 4 higher than the overflow port of the first settling zone 7.
It is easy blocked problem based on cutting fluid during cutting silicon carbide, solves to cut in cutting process to improve The problem of liquid blocks, the Novel cutting liquid bucket of the application design, can significantly solve in silicon carbide crystal bar cutting process, generate Gelatinous dope blocks cutting fluid pipeline or nozzle, and cutting flow quantity in cutting process is caused to become smaller, spray uneven etc. ask Topic.
In addition, using improved cutting fluid bucket carry out silicon carbide crystal bar cutting, find to line cutting machine platform pipeline not by Situation is blocked, the cutting fluid pipeline cleaning frequency on board is effectively improved, improves production efficiency, the cutting fluid The improvement of bucket not only increases silicon carbide crystal bar cutting quality, while also improving production efficiency.
It is an advantage of the invention that:
1. the application solves to cut using filtration method after the method that silicon carbide cutting cutting fluid blocks first uses sedimentation The filtering for cutting liquid is controlling cutting fluid temperature, to make the quality of cutting fluid reach the demand of production by temperature-controlling system;
2. the Novel cutting liquid bucket of the application design, can significantly solve in silicon carbide crystal bar cutting process, glue is generated The dope of shape blocks cutting fluid pipeline or nozzle, lead to problems such as in cutting process cut flow quantity become smaller, spray it is uneven;
3. the Novel cutting liquid bucket that the present invention designs is the method for being staticly settled and being reserved using cutting fluid, first by cutting fluid In gelatinous dope precipitated by twice, then filtered together using last, by the remaining impurity whole mistake of cutting process It filters, to solve the problems, such as to occur in cutting process gelatinous dope by pipeline and spray nozzle clogging;
4. the Novel cutting liquid bucket of invention design has the cutting fluid pipeline cleaning frequency on board The improvement of effect, improves production efficiency, and the improvement of the cutting fluid bucket not only increases silicon carbide crystal bar cutting quality, while also carrying High production efficiency.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the Novel cutting liquid bucket of the present invention.
Reference sign:Board pipeline 1, cutting fluid bucket pipeline 2, third filtering area 3, the trapezoidal overflow port 4 of extension, filtering Pad 5, suction pump 6, the first settling zone 7, the second settling zone 8, feed trough 9, bottom switch 10, temperature-controlling system 11.
Specific implementation mode
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims Implement with the multitude of different ways of covering.
The application is described further below with reference to Fig. 1, a kind of solution silicon carbide as shown in Figure 1 cutting cutting fluid is stifled The Novel cutting liquid bucket of plug, including:Board pipeline 1, cutting fluid bucket pipeline 2, third filtering area 3, the trapezoidal overflow port 4 of extension, mistake Filter bed 5, suction pump 6, the first settling zone 7, the second settling zone 8, feed trough 9, bottom switch 10, temperature-controlling system 11;In feed trough 9 Equipped with temperature-controlling system 11, to adjust the temperature of cutting fluid;Bottom switch 10 is replacing cutting fluid;Specially:Replace cutting When liquid, cutting fluid is moved to by handle and replaces area, is opened by bottom switch 10, cutting fluid cylinder internal washing is clean;
The method that silicon carbide cutting cutting fluid blocks is solved, is included the following steps:
Step S1, board pipeline 1 are connected with liquid bucket pipeline 2 is cut by connection ring, cut the tube bottom of liquid bucket pipeline 2 less than the The overflow port of one settling zone 7;Cutting fluid on board is connected to cutting fluid bucket pipeline 2, cutting fluid bucket pipeline 2 by board pipeline 1 It is inserted into the first settling zone 7, the cutting fluid on board is made to be precipitated in the first settling zone 7;
Step S2, when the liquid level of liquid to be cut exceeds the overflow port of the first settling zone 7, cutting fluid is through the first settling zone 7 Overflow port overflows to the second settling zone 8;
Step S3, when the trapezoidal overflow port 4 of the extension of the liquid level of liquid to be cut beyond the second settling zone 8, by the second precipitation The cutting fluid that area 8 is precipitated overflows to third filtering area 3 by the trapezoidal overflow port of extension 4;The height of the trapezoidal overflow port of extension 4 is higher than The height of the overflow port of first settling zone 7;
Step S4, the cutting fluid for overflowing to third filtering area 3 are filtered by filter pad 5, and filtered cutting fluid is straight It connects and flows into feed trough 9, the cutting fluid of filtering is extracted by the system for forming a cycle on line cutting machine platform by suction pump 6;By Processed cutting fluid is extracted into the use carried out in board repeatedly by suction pump again;When replacing cutting fluid, can facilitate will cut It cuts liquid and replacement area is moved to by handle, the switch 10 by cutting fluid cylinder bottom is opened, and cutting fluid cylinder internal washing is clean.
From actual production, the application solves the Novel cutting liquid bucket that silicon carbide cutting cutting fluid blocks, to practical raw Production brings huge productivity effect, and table 1 gives the data comparison of Novel cutting liquid bucket and traditional cutting fluid bucket.
The data comparison of table 1 Novel cutting liquid bucket and traditional cutting fluid bucket
As can be seen from the above table, it provides cutting fluid using the application Novel cutting liquid bucket to cut for silicon carbide crystal bar, solve Since gelatinous dope directly blocks filter screen in cutting process, cause the flow that cutting fluid flows to nozzle to become smaller, sprays Uneven etc. problem is spilt, effective control is obtained for from Warp, Bow, dry grinding ratio from the point of view of the quality for being cut into chip;From From the point of view of the service life of cutting fluid, the service life increases 1~3run than traditional cutting fluid bucket, from statistics 50run numbers in cutting process From the point of view of, clogging rate reduces 30%, and the number of cleaning machine pipeline is also effectively reduced, and the frequency of cleaning reduces 6%, board mobility is improved.
It these are only the preferred embodiment of the present invention, be not intended to restrict the invention, for those skilled in the art For member, the invention may be variously modified and varied.Any modification made by all within the spirits and principles of the present invention, Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.

Claims (6)

1. a kind of method for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that solve carbonization using Novel cutting liquid bucket Silicon cuts cutting fluid and blocks;The Novel cutting liquid bucket includes:Board pipeline (1), cutting fluid bucket pipeline (2), third filtering area (3), the trapezoidal overflow port of extension (4), filter pad (5), suction pump (6), the first settling zone (7), the second settling zone (8), feed trough (9), bottom switch (10), temperature-controlling system (11);The method for solving silicon carbide cutting cutting fluid and blocking, including following step Suddenly:
Cutting fluid on board is connected to cutting fluid bucket pipeline (2) by step S1 by board pipeline (1), and cutting fluid bucket pipeline (2) is inserted Enter in the first settling zone (7), the cutting fluid on board is made to be precipitated in the first settling zone (7);
Step S2, when the liquid level of liquid to be cut exceeds the overflow port of the first settling zone (7), cutting fluid is through the first settling zone (7) Overflow port overflows to the second settling zone (8);
Step S3, when the liquid level of liquid to be cut exceeds the trapezoidal overflow port of extension (4) of the second settling zone (8), by the second precipitation The cutting fluid of area (8) precipitation overflows to third filtering area (3) by the trapezoidal overflow port of extension (4);
Step S4, the cutting fluid for overflowing to third filtering area (3) are filtered by filter pad (5), and filtered cutting fluid is straight It connects and flows into feed trough (9), the cutting fluid of filtering is extracted by the system for forming a cycle on line cutting machine platform by suction pump (6).
2. the method according to claim 1 for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that the feed trough (9) temperature-controlling system (11) is housed, to adjust the temperature of cutting fluid in.
3. the method according to claim 1 for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that open the bottom (10) are closed to replace cutting fluid.
4. the method according to claim 3 for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that open the bottom Close (10) is specially to replace cutting fluid:When replacing cutting fluid, cutting fluid is moved to by handle and replaces area, is opened by bottom (10) are closed to open, cutting fluid cylinder internal washing is clean.
5. the method according to claim 1 for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that in step S1, The board pipeline (1) is connected with liquid bucket pipeline (2) is cut by connection ring, and the tube bottom for cutting liquid bucket pipeline (2) is heavy less than first The overflow port in shallow lake area (7).
6. the method according to claim 1 for solving silicon carbide cutting cutting fluid and blocking, which is characterized in that in step S3, Height of the height of the trapezoidal overflow port of extension (4) higher than the overflow port of the first settling zone (7).
CN201810466512.5A 2018-05-16 2018-05-16 A method of it solving silicon carbide cutting cutting fluid and blocks Pending CN108621312A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810466512.5A CN108621312A (en) 2018-05-16 2018-05-16 A method of it solving silicon carbide cutting cutting fluid and blocks

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Application Number Priority Date Filing Date Title
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101327622A (en) * 2007-06-21 2008-12-24 正申科技(北京)有限责任公司 Mortar recovery technique for cutting single-crystal and polycrystalline silicon wire
US20100061911A1 (en) * 2008-08-04 2010-03-11 Hariharan Alleppey V METHOD TO CONVERT SILICON POWDER TO HIGH PURITY POLYSILICON THROUGH INTERMEDIATE SiF4
CN102730696A (en) * 2012-02-17 2012-10-17 山东清泽能源有限公司 Physical method for recovering cutting liquid, crystal silicon micro-powder and silicon carbide micro-powder from silicon wafer cutting waste mortar
CN204767811U (en) * 2015-06-15 2015-11-18 天津栋天新能源科技有限公司 Clean system is handled in circulation of glass processing cutting fluid
CN206103510U (en) * 2016-09-28 2017-04-19 深圳市创世纪机械有限公司 Water filter tank structure is crossed to glass machine cutting fluid

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101327622A (en) * 2007-06-21 2008-12-24 正申科技(北京)有限责任公司 Mortar recovery technique for cutting single-crystal and polycrystalline silicon wire
US20100061911A1 (en) * 2008-08-04 2010-03-11 Hariharan Alleppey V METHOD TO CONVERT SILICON POWDER TO HIGH PURITY POLYSILICON THROUGH INTERMEDIATE SiF4
CN102730696A (en) * 2012-02-17 2012-10-17 山东清泽能源有限公司 Physical method for recovering cutting liquid, crystal silicon micro-powder and silicon carbide micro-powder from silicon wafer cutting waste mortar
CN204767811U (en) * 2015-06-15 2015-11-18 天津栋天新能源科技有限公司 Clean system is handled in circulation of glass processing cutting fluid
CN206103510U (en) * 2016-09-28 2017-04-19 深圳市创世纪机械有限公司 Water filter tank structure is crossed to glass machine cutting fluid

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Application publication date: 20181009

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