CN108617076A - The setting method of position is fused on a kind of wiring board - Google Patents
The setting method of position is fused on a kind of wiring board Download PDFInfo
- Publication number
- CN108617076A CN108617076A CN201810377936.4A CN201810377936A CN108617076A CN 108617076 A CN108617076 A CN 108617076A CN 201810377936 A CN201810377936 A CN 201810377936A CN 108617076 A CN108617076 A CN 108617076A
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- CN
- China
- Prior art keywords
- fusion
- making
- fusion position
- face
- wiring board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to wiring board production technical field, the setting method of position is fused on specially a kind of wiring board.The present invention by will fuse position be arranged to it is latticed, increase the surface area of faying face when fusion position is combined with prepreg, so as to increase binding force between the two, simultaneously because fusion position is in latticed, the volume of copper substantially reduces in fusion position, the rate of temperature rise can be improved, ensure electromagnetic heating effect, improve efficiency.It according to the different fusion position of the copper thickness in the face of making setting trellis-type and determines whether one side opposite on adjacent lines plank makes fusion position, the fluctuation of electromagnetic induction during electromagnetic heating can be reduced, be conducive to the control to electromagnetic heating parameter in alloying process.
Description
Technical field
The present invention relates to the setting methods that position is fused in wiring board production technical field more particularly to a kind of wiring board.
Background technology
In PCB during manufacturing, being needed after the making and detection of completion internal layer circuit on assist side material will be each
Circuit plank and prepreg, which are superimposed together (pre- stack structure) by the sequence of design and are press-fitted together as one to form multilayer, produces plate,
In bonding processes, it is necessary to which there are one the pressure of high intensity to be compressed on (generally in 300-450psi) on pre- stack structure, is pressing
It will appear each laminate material due to there is mobility etc. prepreg in the process to deviate, can cause after offset different on plate
The circuit property of network is connected, so as to cause interior short.Therefore, fixation must first be positioned before pre- stack structure pressing.Industry positioning side
Formula mainly have fusion, riveted and PIN-LAM these three.Current fusion positioning method is usually the edges of boards setting of assist side material
Independent strip copper billet is as fusion position, as shown in Figure 1, then making the copper billet of fusion position using Joule's law using Heat sealing machine
Electromagnetic induction occurs, generates heat, and then the prepreg at fusion position is made to melt and be fused with the copper billet of fusion position, it is solid after cooling
Change, to make each sandwich circuit plank Primary Location be fixed together.Fusion positioning method has the following defects now：It is tied after fusion
Resultant force is insufficient, and when pressing is still susceptible to the problem of plank shifts；The copper billet area of fusion position is larger, copper billet heating
Speed is slow, and efficiency is low, fusion parameter not easy to control when fusion.
Invention content
The present invention is slow there are heating rate when binding force deficiency, fusion for existing fusion positioning method and parameter is not easily-controllable
The problem of processed, heating rate is fast when providing a kind of binding force that each circuit plank can be improved and fusion, alloying process is easily controllable
Fusion position setting method.
To achieve the above object, the present invention uses following technical scheme.
The setting method of position is fused on a kind of wiring board, the edges of boards setting fusion position of assist side material, the fusion position is
Grid is constituted by copper wire.
The specific design method of the fusion position is divided into three kinds, is referred to as A classes fusion position, B classes fusion position and the fusion of C classes
Position.
The fusion position of A classes is：The A classes fusion position is the rectangular of 9mm in a length of 24mm and width；A classes fuse position be by 5 ×
The grid that 3 grid is constituted, and the line width for constituting the copper wire of grid is 0.8mm.
The one side that A classes fusion position is made on circuit plank is known as making face, makes the circuit plank of A classes fusion position
Its copper layer thickness of making face is 1 OZ or H OZ；When fusion the copper layer thickness of the circuit plank adjacent with the making face be H OZ or
1 OZ and the one side opposite with the making face also make A classes in corresponding position and fuse position.
The fusion position of B classes is：The B classes fusion position is the rectangular of 9mm in a length of 24mm and width；B classes fuse position be by 3 ×
The grid that 3 grid is constituted, and the line width for constituting the copper wire of grid is 0.8mm.
The one side that B classes fusion position is made on circuit plank is known as making face, makes the circuit plank of B classes fusion position
Its copper layer thickness of making face is 2 OZ；When fusion the copper layer thickness of the circuit plank adjacent with the making face be H OZ or 1 OZ or
2 OZ and the one side opposite with the making face also make B classes in corresponding position and fuse position.
The one side that B classes fusion position is made on circuit plank is known as making face, makes the circuit plank of B classes fusion position
Its copper layer thickness of making face is 3 OZ；When fusion the copper layer thickness of the circuit plank adjacent with the making face be H OZ or 1 OZ or
2 OZ or 3 OZ and the one side opposite with the making face do not make fusion position.
The fusion position of C classes is：The C classes fusion position is the rectangular of 9mm in a length of 24mm and width；C classes fuse position be by 2 ×
The grid that 2 grid is constituted, and the line width for constituting the copper wire of grid is 1mm.
The one side that C classes fusion position is made on circuit plank is known as making face, makes the circuit plank of C classes fusion position
Its copper layer thickness of making face is 4 OZ；When fusion the copper layer thickness of the circuit plank adjacent with the making face be H OZ or 1 OZ or
2 OZ or 3 OZ and the one side opposite with the making face do not make fusion position.
Above-described fusion position, the edges of boards of assist side material make molten while internal layer circuit is made on assist side material
Close position.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is arranged to latticed, increase by that will fuse position
The surface area of faying face when fusion position is combined with prepreg, so as to increasing binding force between the two, simultaneously because melting
It is in latticed to close position, and the volume for fusing copper in position substantially reduces, and the rate of temperature rise can be improved, and ensures electromagnetic heating effect,
Improve efficiency.According to the different fusion position of the copper thickness in the face of making setting trellis-type and determine opposite one on adjacent lines plank
Whether face makes fusion position, can reduce the fluctuation of electromagnetic induction during electromagnetic heating, is conducive in alloying process to electromagnetic heating
The control of parameter.
Description of the drawings
Fig. 1 is the schematic diagram of the fusion position of the edges of boards setting of assist side material in the prior art；
Fig. 2 is the schematic diagram for being provided with A classes in embodiment and fusing the circuit plank of position；
Fig. 3 is the schematic diagram for being provided with B classes in embodiment and fusing the circuit plank of position；
Fig. 4 is the schematic diagram for being provided with C classes in embodiment and fusing the circuit plank of position.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment
Present embodiments provide the setting method that position is fused on a kind of wiring board, the edges of boards setting fusion of assist side material
Position, the fusion position is by copper wire constitutes grid, and as in Figure 2-4, be provided in respectively on circuit plank three kinds different
Position is fused, respectively referred to as A classes fusion position 10, B classes fusion position 20 and C classes fuse position 30.
The fusion position 10 of A classes is：It is the rectangular of 9mm in a length of 24mm and width；It is by 5 × 3 grid structure that A classes, which fuse position 10,
At grid, and constitute grid copper wire line width be 0.8mm.
The one side that A classes fusion position is made on circuit plank is known as making face, makes the circuit plank of A classes fusion position
Its copper layer thickness of making face is 1 OZ or H OZ；When fusion the copper layer thickness of the circuit plank adjacent with the making face be H OZ or
1 OZ and the one side opposite with the making face also make A classes in corresponding position and fuse position.
The fusion position 20 of B classes is：The B classes fusion position 20 is the rectangular of 9mm in a length of 24mm and width；B classes fusion position is
The grid being made of 3 × 3 grid, and the line width for constituting the copper wire of grid is 0.8mm.
The one side that B classes fusion position 20 is made on circuit plank is known as making face, makes the wiring board of B classes fusion position 20
Its copper layer thickness of the making face of material is 2 OZ；The copper layer thickness of the circuit plank adjacent with the making face is H OZ or 1 when fusion
OZ or 2 OZ and the one side opposite with the making face also make B classes in corresponding position and fuse position 20.
The one side that B classes fusion position 20 is made on circuit plank is known as making face, makes the wiring board of B classes fusion position 20
Its copper layer thickness of the making face of material is 3 OZ；The copper layer thickness of the circuit plank adjacent with the making face is H OZ or 1 when fusion
OZ or 2 OZ or 3 OZ and the one side opposite with the making face do not make fusion position.
The fusion position of C classes is：It is the rectangular of 9mm that the C classes, which fuse 30 in a length of 24mm and width,；C classes fusion position 30 is
The grid being made of 2 × 2 grid, and the line width for constituting the copper wire of grid is 1mm.
The one side that C classes fusion position 30 is made on circuit plank is known as making face, makes the wiring board of C classes fusion position 30
Its copper layer thickness of the making face of material is 4 OZ；The copper layer thickness of the circuit plank adjacent with the making face is H OZ or 1 when fusion
OZ or 2 OZ or 3 OZ and the one side opposite with the making face do not make fusion position.
It is opposite on above-mentioned the fusion position and decision adjacent lines plank different according to the copper thickness setting trellis-type in the face of making
One side whether make fusion position, indicate as follows with table：
In following table, " single side " indicates, in pre- stack structure, in a circuit plank, (first trip is the circuit board making face
Copper layer thickness) making face make fusion position, it is on opposite another circuit plank and opposite with the making face with the making face
(first is the copper layer thickness in the face) does not make fusion position on one side；It is " two-sided " to indicate, in pre- stack structure, in a circuit plank
Making face makes fusion position, with the making face on opposite another circuit plank and the one side opposite with the making face also makes phase
The fusion position of same type；" A " indicates that the making face of assist side material makes A classes and fuses position；" B " indicates the making of assist side material
Face makes B classes and fuses position；" C " indicates that the making face of assist side material makes C classes and fuses position.
Above-described fusion position, the edges of boards of assist side material make molten while internal layer circuit is made on assist side material
Close position.
The present embodiment is arranged to latticed by that will fuse position, increases fusion position faying face when being combined with prepreg
Surface area, so as to increase binding force between the two, simultaneously because fusion position is in latticed, the volume for fusing copper in position is notable
It reduces, the rate of temperature rise can be improved, ensure electromagnetic heating effect, improve efficiency.According to the copper thickness in the face of making, grid is set
Whether opposite one side makes fusion position on different types of fusion position and decision adjacent lines plank, can reduce electromagnetic heating mistake
The fluctuation of electromagnetic induction in journey is conducive to the control to electromagnetic heating parameter in alloying process
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. fusing the setting method of position on a kind of wiring board, the edges of boards setting fusion position of assist side material, which is characterized in that described
Fusion position is to constitute grid by copper wire.
2. fusing the setting method of position on a kind of wiring board according to claim 1, it is characterised in that：The fusion position is in
A length of 24mm and width are the rectangular of 9mm；It is the grid being made of 5 × 3 grid to fuse position, and constitutes the line width of the copper wire of grid
For 0.8mm.
3. fusing the setting method of position on a kind of wiring board according to claim 2, it is characterised in that：It is made on circuit plank
The one side for making fusion position is known as making face, its copper layer thickness of the making face of circuit plank for making the fusion position is 1OZ or H
OZ；The copper layer thickness of the circuit plank adjacent with the making face is H OZ or 1OZ and opposite with the making face one when fusion
Face also makes fusion position in corresponding position.
4. fusing the setting method of position on a kind of wiring board according to claim 1, it is characterised in that：The fusion position is in
A length of 24mm and width are the rectangular of 9mm；It is the grid being made of 3 × 3 grid to fuse position, and constitutes the line width of the copper wire of grid
For 0.8mm.
5. fusing the setting method of position on a kind of wiring board according to claim 4, it is characterised in that：It is made on circuit plank
The one side for making fusion position is known as making face, its copper layer thickness of the making face of circuit plank for making the fusion position is 2OZ；Fusion
When the circuit plank adjacent with the making face copper layer thickness be H OZ or 1OZ or 2OZ and the one side opposite with the making face
Fusion position is also made in corresponding position.
6. fusing the setting method of position on a kind of wiring board according to claim 4, it is characterised in that：It is made on circuit plank
The one side for making fusion position is known as making face, its copper layer thickness of the making face of circuit plank for making the fusion position is 3OZ；Fusion
When the circuit plank adjacent with the making face copper layer thickness be H OZ or 1OZ or 2OZ or 3OZ and opposite with the making face
Fusion position is not made on one side.
7. fusing the setting method of position on a kind of wiring board according to claim 1, it is characterised in that：The fusion position is in
A length of 24mm and width are the rectangular of 9mm；It is the grid being made of 2 × 2 grid to fuse position, and constitutes the line width of the copper wire of grid
For 1mm.
8. fusing the setting method of position on a kind of wiring board according to claim 7, it is characterised in that：It is made on circuit plank
The one side for making fusion position is known as making face, its copper layer thickness of the making face of circuit plank for making the fusion position is 4OZ；Fusion
When the circuit plank adjacent with the making face copper layer thickness be H OZ or 1OZ or 2OZ or 3OZ and opposite with the making face
Fusion position is not made on one side.
9. according to the setting method for fusing position on a kind of wiring board of claim 1-8 any one of them, it is characterised in that：Online
The edges of boards of assist side material make fusion position while making internal layer circuit on the plank of road.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377936.4A CN108617076A (en) | 2018-04-25 | 2018-04-25 | The setting method of position is fused on a kind of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377936.4A CN108617076A (en) | 2018-04-25 | 2018-04-25 | The setting method of position is fused on a kind of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617076A true CN108617076A (en) | 2018-10-02 |
Family
ID=63660694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810377936.4A Pending CN108617076A (en) | 2018-04-25 | 2018-04-25 | The setting method of position is fused on a kind of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617076A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012055733A1 (en) * | 2010-10-26 | 2012-05-03 | Sagem Defense Securite | An electronics card, an electronic device including such a card, and a method of protecting an electronics card |
| CN202406395U (en) * | 2011-12-28 | 2012-08-29 | 胜宏科技（惠州）股份有限公司 | Auxiliary joint for fixing multilayer PCB inner core board |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
-
2018
- 2018-04-25 CN CN201810377936.4A patent/CN108617076A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012055733A1 (en) * | 2010-10-26 | 2012-05-03 | Sagem Defense Securite | An electronics card, an electronic device including such a card, and a method of protecting an electronics card |
| CN202406395U (en) * | 2011-12-28 | 2012-08-29 | 胜宏科技（惠州）股份有限公司 | Auxiliary joint for fixing multilayer PCB inner core board |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181002 |
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| RJ01 | Rejection of invention patent application after publication |