CN108615679A - A kind of automation process production line towards novel standard optical assembly - Google Patents
A kind of automation process production line towards novel standard optical assembly Download PDFInfo
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- CN108615679A CN108615679A CN201810260148.7A CN201810260148A CN108615679A CN 108615679 A CN108615679 A CN 108615679A CN 201810260148 A CN201810260148 A CN 201810260148A CN 108615679 A CN108615679 A CN 108615679A
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 230000008569 process Effects 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 230000003287 optical effect Effects 0.000 title claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 40
- 239000007921 spray Substances 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims abstract description 13
- 238000004064 recycling Methods 0.000 claims abstract description 11
- 210000000707 wrist Anatomy 0.000 claims description 40
- 238000005452 bending Methods 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000010992 reflux Methods 0.000 claims 2
- 238000005457 optimization Methods 0.000 abstract description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 40
- 239000011787 zinc oxide Substances 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of automation process production lines towards novel standard optical assembly, include for rail mounted etching machine equipment：ABB robots, PLC machine tool hand control system, conveying device and the fluctuating plate station set gradually along the conveying direction of the conveying device, reaction station, washing station, air-dry station, backflow station and tool disk recycling station at etching paste spray station；After ZnO pieces are placed on the tool disk of fluctuating plate station by the ABB robots, pass through the etching paste spray station successively by pipeline, the reaction station, the washing station, the air-dried station, the backflow station, the tool disk recycles station, it is finally transmitted to fluctuating plate station, the epitaxial wafer that robot crawl growth is completed is placed on empty magazine, manually takes the magazine filled into next process away successively.The present invention can effectively improve factory's efficiency of operation using automation process production line, ensure that safe operation, optimization production reduce labor cost.
Description
Technical field
The present invention relates to automation process, vision-based detection automation and manipulator control system fields, more particularly to one
Automation process production line of the kind towards novel standard optical assembly.
Background technology
Before the appearance of Automation of Manufacturing Process technology, plant operator must personal monitoring's equipment performance index and product
Quality, to determine that production equipment is in optimal operational condition and it is necessary to it could implement various maintenances when shutting down, it reduce
Factory's efficiency of operation, and can not ensure safe operation.Automation of Manufacturing Process system is in addition to that can acquire and handle information, moreover it is possible to
Automatically adjust various equipment, optimization production.If necessary, plant operator can stop automated system, be operated manually.
Vision-based detection is exactly to replace human eye with machine to measure and judge.Vision-based detection refers to passing through machine vision product
(i.e. image-pickup device is divided to CMOS (complementary metal oxide semiconductor) and CCD (ccd image sensor) two
Kind) target will be ingested be converted into picture signal, dedicated image processing system is sent to, according to pixel distribution and brightness, face
The information such as color, are transformed into digitized signal；Picture system carries out various operations to extract clarification of objective, in turn to these signals
The device action at scene is controlled according to the result of differentiation.It is the valuable mechanism for producing, assembling or pack.It is being examined
The function aspect surveyed defect and faulty goods is prevented to be dispensed into consumer has immeasurable value.
Manipulator is a kind of new device to grow up during automated production, be widely used in industrial production and
Other field.Programmable controller (PLC) is widely used in industrial processes.Manipulator control system carries
PLC program.This machinery has applied to stepper motor, direct current generator driving and Pneumatic Transmission, and manipulator can be made to meet control and wanted
It asks, realizes the sequence of movement arrangement of manipulator.Each solenoid valve is controlled by the software program of PLC, cylinder movement is driven, provides one
Fixed pulsed drive stepper motor, to the action of control machinery hand.The material carrying machine hand of exploitation can be in space pick-and-place object
Body, flexible movements are various, can replace manually carrying out operation, and variation that can be according to workpiece and fortune in high temperature and dangerous operation area
Relevant parameter is changed in the requirement of dynamic flow at any time.
Therefore, need that the prior art is further improved, exploitation is a kind of towards the automatic of novel standard optical assembly
Chemical industry skill apparatus for production line, reduces labor cost, and optimization production improves factory's efficiency of operation, ensures safe operation.
Invention content
The object of the present invention is to provide a kind of automation process production lines towards novel standard optical assembly, utilize robot
Simple functions carry out object of transport.By the appropriate end (for example, handgrip) for robotic asssembly arm tool, robot can be with
Product is efficiently and accurately moved to another position from a position, epitaxial wafer is from magazine to the loading and unloading of etching machine charging tray
Process is all completed by robot by complicated action.
To realize that the purpose of foregoing invention, the technical solution adopted by the present invention are realized as follows：One kind is towards novel standard light
The automation process production line of component, including：Rail mounted etches machine equipment；It is equipped with conveying dress in the rail mounted etching machine equipment
It sets, the conveying device includes No. 1 pipeline and No. 2 pipelines；No. 1 pipeline is connected with No. 2 pipelines；Institute
The fluctuating plate station for being equipped on the left of rail mounted etching machine equipment on No. 1 pipeline and being used for loading and unloading is stated, along described defeated
The conveying direction of device is sent to be equipped with the etching paste spray station for etching, reaction station successively in the top of the conveying device
With air-dried station；The lower section of No. 2 pipelines direction corresponding with the air-dried station is equipped with washing station, the track
Formula etches machine equipment and is equipped with backflow station close to the side of washing station；The lower section of the conveying device and the fluctuating plate work
The corresponding position in position is equipped with tool disk and recycles station；The backflow station is connected with tool disk recycling station；It is close
The rail mounted etching machine equipment left direction is equipped with the robot for loading and unloading, is set on the rail mounted etching machine equipment
It is useful for controlling PLC (programmable controller) manipulator control system of the robot motion.
Preferably, the fluctuating plate station includes the special loading and unloading workbench of epitaxial wafer magazine and tool disk；The tooling
Several ZnO (zinc oxide) piece groove is provided in disk, for placing ZnO pieces.
Preferably, the reaction station includes sensor and timer, and the sensor is for detecting the tool disk
No smoothly to reach the reaction station, the timer is used to record when the tool disk reaches that the reaction station stops
Between.
Preferably, the washing station includes jacking system, cylinder and spray system；The jacking system is for adjusting institute
State the height of spray system；The cylinder is used to adjust the height of the tool disk；The spray system is equipped with spray hood, described
Spray system cleans epitaxial wafer by the spray hood cleaning showers liquid.
Preferably, the air-dried station includes high pressure positive blower, air outlet, air-dries cover and exhaust outlet, the high pressure positive blower
For providing wind regime and adjusting blowing temperature and blow-time, the air outlet is used for adjusting air outlet angle, the air-dried cover
In preventing the outlet air of the air outlet from disorderly blowing, the exhaust outlet is for the wind discharge in the air-dried station.
Preferably, the backflow station includes that tool disk moves down component, the tool disk move down component for accept from institute
It states the tool disk that air-dried station conveying comes and locks its position, to take out the ZnO pieces for completing etch process.
Preferably, the tool disk recycling station includes tool disk conveying assembly and moves up rotating device, the tool disk
Conveying assembly moves down component with the tool disk respectively, the rotating device that moves up is connect；The tool disk conveying assembly is used for
The tool disk is delivered to the lower section of the fluctuating plate station below the backflow station, it is described to move up rotating device use
In the tool disk is delivered to the fluctuating plate station below the fluctuating plate station.
Preferably, the robot includes pedestal, moving portion and control unit；The moving portion is connect with control unit, described
Moving portion by make robot in three dimensions flexible motion in a manner of be located on pedestal, the control unit with control robot completion
The mode of compound action is connect with moving portion during loading and unloading.
Preferably, the moving portion includes that arm rotates, before and after arm and above and below arm, the arm rotation and pedestal rotation company
It connecing, the arm is front and back to be connect with the arm rotary motion, and the arm is located at upper one end far from arm rotation before and after the arm up and down,
And be rotatablely connected before and after the arm；The control unit includes that wrist rotation, wrist bending and wrist torsion, the wrist rotate one end and institute
It states arm to be vertically connected with, the other end and wrist bending connection, the wrist torsion are located at upper one rotated far from wrist of wrist bending
End.
Preferably, the angle that rotates freely of the arm rotation is ± 180 °；Above and below the arm rotate freely angle be+
150 ° Dao -163 °；The angle that rotates freely of the wrist rotation is ± 270 °；Wrist bending rotate freely angle be ±
145°；The angle that rotates freely of the wrist torsion is ± 360 °.
Advantageous effect
Compared with prior art, the advantageous effect that the present invention obtains is：The present invention makes machine by automated control technology
Impossible Complex Assembly process before people can complete, using the simple functions of robot come object of transport, by for machine
Device people assembles the appropriate end (for example, handgrip) of arm tool, and robot can efficiently and accurately move product from a position
Move another position.Manpower can be reduced by using ABB robots, reduce labor cost.ABB robots can eliminate
To the demand of dangerous, dull or tired labour in industrial environment.
Description of the drawings
Fig. 1 is the device structure schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram of the ABB robots of the present invention；
Fig. 3 is the left view of the ABB robots of the present invention；
Fig. 4 is the pedestal vertical view of the ABB robots of the present invention；
Fig. 5 is the wrist windup-degree view of the ABB robots of the present invention；
Fig. 6 is the vertical view of the ABB robots of the present invention；
Fig. 7 is the backflow station structural schematic diagram that the present invention etches machine equipment for rail mounted；
Fig. 8 is the tool disk recycling station structure schematic diagram a that the present invention etches machine equipment for rail mounted；
Fig. 9 is the tool disk recycling station structure schematic diagram b that the present invention etches machine equipment for rail mounted；
Figure 10 is the tool disk that the present invention etches machine equipment for rail mounted；
Figure 11 is the vertical view for the tool disk that the present invention etches machine equipment for rail mounted；
Figure 12 is the magazine that the present invention etches machine equipment for rail mounted；
Specific implementation mode
To facilitate the understanding of the present invention, the present invention is further described in more detail below with reference to relevant drawings.Attached drawing
In give preferred embodiments of the present invention.But the present invention can embody in the form of other are different, it is not limited to this
Literary described embodiment.Opposite, the purpose for providing this embodiment is to make the disclosure understand more
Add thorough.Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the present invention
The normally understood meaning of technical staff in domain is identical.Used term is intended merely to retouch in the description of the invention herein
State the purpose of specific embodiment, it is not intended that in the limitation present invention.
Embodiment
The problem of in order to cope with the demand of dull or tired labour, reduce manpower, reduce labor cost, the present invention provide
It is a kind of to be used for automation process production line towards novel standard optical assembly.In the technical scheme, by using robot
Simple functions carry out object of transport.By the appropriate end (for example, handgrip) for robotic asssembly arm tool, robot can be with
Product is efficiently and accurately moved to another position from a position, epitaxial wafer is from magazine to the loading and unloading of etching machine charging tray
Process is all completed by robot by complicated action.
As shown in Figure 1, a kind of automation process production line towards novel standard optical assembly, including：Rail mounted etching machine
Equipment；Conveying device is equipped in the rail mounted etching machine equipment, the conveying device includes No. 1 pipeline 18 and No. 2 conveyings
Line 19 is used for transportation tooling disk 21；No. 1 pipeline 18 is connected with No. 2 pipelines 19；No. 1 pipeline 18
The upper fluctuating plate station 11 being equipped on the left of rail mounted etching machine equipment for loading and unloading, along the defeated of the conveying device
Direction is sent to be equipped with the etching paste spray station 12 for etching, reaction station 13 successively in the top of the conveying device and air-dry
Station 15；The lower section of No. 2 pipelines direction corresponding with the air-dried station is equipped with washing station 14, the rail mounted
It etches machine equipment and is equipped with backflow station 16 close to the side of washing station；The lower section of the conveying device and the fluctuating plate work
11 corresponding positions of position are equipped with tool disk and recycle station 17；The backflow station 16 is connected with tool disk recycling station 17
It connects；It is equipped with the robot 34 for loading and unloading, the rail mounted etching close to rail mounted etching machine equipment left direction
Machine equipment is equipped with the PLC machine tool hand control system for controlling the robot motion.
The fluctuating plate station 11 includes the special loading and unloading workbench of epitaxial wafer magazine and the ZnO pieces containing placement ZnO pieces
The tool disk 21 of groove；The ABB robots 34 complete epitaxial wafer from magazine to the upper of etching machine charging tray in fluctuating plate station 11
Blanking process；
The etching paste spray station 12 includes the etching paste nozzle 25 of spraying etching paste, for being carried out to the epitaxial wafer
Etching；
The reaction station 13 includes sensor and timer, and whether the sensor is suitable for detecting the tool disk 21
Profit reaches the reaction station 13, the timer be used to record the tool disk 21 reach reaction station 13 stop when
Between；
The washing station 14 is for cleaning the epitaxial wafer after etching；The washing station includes that lifting is
System, cylinder 20 and spray system 26；The jacking system 26 is used to adjust the height of the spray system 26；The cylinder 20 is used
In the height for adjusting the tool disk 21；The spray system 26 is equipped with spray hood, and the spray system 26 passes through the spray
Cover cleaning showers liquid cleans epitaxial wafer.
The air-dried station 15 includes that high pressure positive blower, air outlet 27, air-dried cover and exhaust outlet, the high pressure positive blower are used for
Wind regime is provided and adjusts blowing temperature and blow-time, the air outlet 27 is used for for adjusting air outlet angle, the air-dried cover
Prevent the outlet air of the air outlet 27 from disorderly blowing, the exhaust outlet is for the wind discharge in the air-dried station 15；
The backflow station 16 moves down component 23 including tool disk, the tool disk move down component 23 for accept from described
It air-dries station 15 to convey the tool disk 21 to come and lock its position, to take out the ZnO pieces for completing etch process；
The tool disk recycling station 17 includes tool disk conveying assembly 22 and moves up rotating device 24, and the tool disk is defeated
Sending component 22 is used to the tool disk 21 being delivered to the lower section of the fluctuating plate station 11 from the lower section of the backflow station 16,
The rotating device 24 that moves up from the lower section of the fluctuating plate station 11 by the tool disk 21 for being delivered to the fluctuating plate
Station 11.The tool disk conveying assembly 22 moves down component 23 with the tool disk respectively, the rotating device 24 that moves up is connect；
The artificial ABB robots of machine.
As shown in Figure 2 to Figure 3, the ABB robots 34 include pedestal 35, moving portion and control unit；The moving portion with
Control unit connect, the moving portion by make robot in three dimensions flexible motion in a manner of be located on pedestal 35, the control
It completes to connect with moving portion in a manner of compound action during loading and unloading to control robot in portion.
The moving portion includes arm rotation 33,32 and arm up and down 31 before and after arm, and the arm rotation 33 is rotated with the pedestal
Connection, before and after the arm 32 with 33 rotation connection of arm rotation, the arm 31 is located on 32 before and after the arm far from arm up and down
One end of rotation 33, and be rotatablely connected with before and after the arm 32.
The control unit includes wrist rotation 30, wrist bending 29 and wrist torsion 28, and the wrist rotates on 28 one end and the arm
Lower 31 connection, the other end are connect with wrist bending 29, and the wrist torsion 28 is located in the wrist bending 29 rotates 28 far from wrist
One end.
As shown in figure 4, the arm rotation 33 in controlled level orientation is located on the pedestal of ABB robots 34.Arm rotation 33
It is ± 180 ° to rotate freely angle.
As shown in figure 5, the fine activity of 28 control ABB robots 34 of wrist torsion, i.e., complexity during completion loading and unloading
Action.The angle that rotates freely of the wrist torsion 28 is ± 360 °, crawl epitaxial wafer facility, and loading and unloading are flexible.
As shown in fig. 6, the vertical view in the ABB robots 34 can be clearly observable on the arm in the vertical orientation of control
Lower 31, wrist rotation 30, wrist bending 29, the arm 31 rotate freely+150 ° to -163 ° of angle up and down, and the wrist rotates 30
It is ± 270 ° to rotate freely angle, and rotating freely for the wrist bending 29 is ± 145 °.It is assisted mutually, common to complete complicated behaviour
Make.
As shown in fig. 7, backflow station 16 moves down component 23 including tool disk.Concrete technology is：Tool disk 21 is delivered to back
After flowing station 16, tool disk moves down 23 position of component and moves down, and moves up component 24 by return flow line and tool disk and be delivered to
Discharge station 11.
As shown in Fig. 8, Fig. 9 and Figure 10, when tool disk 21 is delivered to backflow station 11, workbench pneuma-lock magazine, machine
Device people captures the epitaxial wafer that growth is completed and is placed into successively on empty magazine, and empty magazine is moved down in tool disk under 23 position of component
It moves, manually takes the magazine filled into next process away in tool disk recycling station 17.
As shown in figure 11, fluctuating plate station 11 has the tool disk 21 containing the ZnO piece grooves for placing ZnO pieces, tool disk 21
It is preferred that stainless steel.
As shown in figure 12, the ZnO piece grooves that suitable shape is provided in tool disk 21 are used for placing ZnO pieces.The present embodiment
In, 5 rows 7 row totally 35 circle ZnO piece grooves are provided in tool disk 21.Concrete technology is：After tool disk 21 is in place, ABB machines
Device people 34 is positioned with vision, ZnO pieces is put into the ZnO piece grooves in tool disk 21, pointing device starts after the completion of load
Button waits for No. 1 pipeline 18 that tool disk 21 is delivered to etching paste spray station 12.
As described above, the shape and quantity of the grooves of ZnO pieces shown in Figure 12 are only to describe in more detail the present invention, do not limit to
In the present embodiment, shape, quantity, the size of ZnO piece grooves etc. can also be embodied with other different forms；
The concrete technology of the present invention is described in detail below：
The PLC machine tool hand control system external prolongs piece and carries out vision-based detection, and the ABB robots 34 are to being randomly placed in
Epitaxial wafer in magazine is positioned with vision, and the ABB robots 34 carry out epitaxial wafer feeding at fluctuating plate station 11, will
ZnO pieces are put into the ZnO piece grooves in tool disk 21, pointing device start button after the completion of load, wait for No. 1 pipeline 18 will
Tool disk is delivered to the etching paste spray station 12, and etching machine is etched technique, and the etching paste nozzle 25 is by etching paste
It is sprayed on the ZnO on pieces to be etched, the reaction station 13 is transported to by No. 1 pipeline 18 after the completion of etching,
The sensor detects that the tool disk smoothly reaches the reaction station 13, and the timer stops to the tool disk 21
The time is stayed to be recorded, then tool disk 21 is transported to the washing station 14 by extra etching paste by No. 1 pipeline 18
It washes, after the completion of cleaning, tool disk is transported to the air-dried station 15 by No. 2 pipelines 19 and carried out by the tool disk 21
It air-dries, the tool disk 21 is transported to the backflow station 16 by No. 2 pipelines and carries out epitaxial wafer magazine time after the completion of air-drying
Stream, the tool disk move down component 23 and accept the tool disk 21 to come from the air-dried station 15 conveying and lockup period position
It sets, to take out the ZnO pieces for completing etching；The tool disk moves down 23 position of component and moves down, defeated by return flow line and tool disk
Magazine is transported to the tool disk and recycles station 17 by sending component 22, the magazine that will manually be filled at tool disk recycling station 17
Take away, by it is described move up rotating device 24 and move up the tool disk 21 be delivered to the fluctuating plate station 11.
In one embodiment of this invention, the automation loading and unloading described in the automation process production line development and application
The ABB robots 34 all controlled by PLC control system complete.The PLC machine tool hand control system uses off-line programing, to machine institute
It states ABB robots and carries out fast debugging, carry out information collection and instruction and send and control before and after arm rotation 3, arm on 32, arm
Lower 31, wrist rotation 30, wrist bending 29, wrist torsion 28, help the ABB robots 34 to complete complicated operation；
According to the disclosure and teachings of the above specification, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and is changed.Therefore, the invention is not limited in specific implementation modes disclosed and described above, to the one of invention
A little modifications and changes should also be as falling into the scope of the claims of the present invention.In addition, although being used in this specification
Some specific terms, these terms are merely for convenience of description, does not limit the present invention in any way.
Claims (10)
1. a kind of automation process production line towards novel standard optical assembly, which is characterized in that including：Rail mounted etching machine is set
It is standby；Conveying device is equipped in the rail mounted etching machine equipment, the conveying device includes No. 1 pipeline and No. 2 pipelines；Institute
No. 1 pipeline is stated with No. 2 pipelines to be connected；On No. 1 pipeline on the left of rail mounted etching machine equipment
Equipped with the fluctuating plate station for loading and unloading, the conveying direction along the conveying device is set successively in the top of the conveying device
It is useful for etching paste spray station, reaction station and the air-dried station of etching；The lower section of No. 2 pipelines and the air-dried work
The corresponding direction in position is equipped with washing station, and the rail mounted etching machine equipment is equipped with reflux work close to the side of washing station
Position；The lower section of conveying device position corresponding with the fluctuating plate station is equipped with tool disk and recycles station；The reflux
Station is connected with tool disk recycling station；It is equipped with for up and down close to rail mounted etching machine equipment left direction
The robot of material, the rail mounted etching machine equipment are equipped with the PLC machine tool hand for controlling the robot motion and control system
System.
2. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The fluctuating plate station includes the special loading and unloading workbench of epitaxial wafer magazine and tool disk；It is provided in the tool disk several
ZnO piece grooves, the ZnO pieces groove is for placing ZnO pieces.
3. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The reaction station includes sensor and timer, the sensor for detect the tool disk whether smoothly reach it is described anti-
Station, the timer is answered to reach the reaction station residence time for recording the tool disk.
4. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The washing station includes jacking system, cylinder and spray system；The jacking system is used to adjust the height of the spray system
Degree；The cylinder is used to adjust the height of the tool disk；The spray system is equipped with spray hood, and the spray system passes through institute
Spray hood cleaning showers liquid is stated to clean epitaxial wafer.
5. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The air-dried station includes high pressure positive blower, air outlet, air-dries cover and exhaust outlet, and the high pressure positive blower is for providing wind regime and adjusting
Section blowing temperature and blow-time, the air outlet is for adjusting air outlet angle, and the air-dried cover is for preventing the air outlet
Outlet air disorderly blow, the exhaust outlet be used for by the air-dried station wind be discharged.
6. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The backflow station includes that tool disk moves down component, the tool disk move down component for accept conveyed from the air-dried station
Come the tool disk and lock its position, with take out complete etch process ZnO pieces.
7. a kind of automation process production line towards novel standard optical assembly according to claim 1, it is characterised in that：
Tool disk recycling station includes tool disk conveying assembly and moves up rotating device, the tool disk conveying assembly respectively with institute
State tool disk move down component, it is described move up rotating device connection；The tool disk conveying assembly is used for the tool disk from institute
State the lower section that the fluctuating plate station is delivered to below backflow station, it is described move up rotating device for by the tool disk from
The fluctuating plate station is delivered to below the fluctuating plate station.
8. a kind of automation process production line towards novel standard optical assembly according to claim 1, which is characterized in that
The robot includes pedestal, moving portion and control unit；The moving portion is connect with control unit, and the moving portion is so that robot
It is located on pedestal in the mode of three dimensions flexible motion, the control unit completes loading and unloading complexity in the process to control robot
The mode of action is connect with moving portion.
9. a kind of automation process production line towards novel standard optical assembly according to claim 8, it is characterised in that：
The moving portion include that arm rotation, arm be front and back and arm above and below, the arm rotation is rotatablely connected with the pedestal, the arm it is front and back with
Arm rotary motion connection, the arm are located at upper one end far from arm rotation before and after the arm up and down, and with before and after the arm
Rotation connection；The control unit includes that wrist rotation, wrist bending and wrist torsion, the wrist rotate one end and be vertically connected with the arm,
The other end is connected with wrist bending, and the wrist torsion is located at described upper one end far from wrist rotation of wrist bending.
10. a kind of automation process production line towards novel standard optical assembly according to claim 8, feature exist
In the angle that rotates freely of the arm rotation is ± 180 °；The angle that rotates freely above and below the arm is+150 ° to -163 °；Institute
The angle that rotates freely for stating wrist rotation is ± 270 °；The angle that rotates freely of the wrist bending is ± 145 °；The wrist torsion
It is ± 360 ° to rotate freely angle.
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| CN112582501A (en) * | 2020-12-14 | 2021-03-30 | 张家港博佑光电科技有限公司 | Silicon solar cell RENA polycrystalline texturing processing method |
| CN112678460A (en) * | 2020-12-30 | 2021-04-20 | 广东智联自动化技术有限公司 | Two-station full-automatic plasma feeding and discharging device |
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Application publication date: 20181002 |