CN108601198A - A kind of printed wiring board and preparation method thereof - Google Patents
A kind of printed wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN108601198A CN108601198A CN201810262206.XA CN201810262206A CN108601198A CN 108601198 A CN108601198 A CN 108601198A CN 201810262206 A CN201810262206 A CN 201810262206A CN 108601198 A CN108601198 A CN 108601198A
- Authority
- CN
- China
- Prior art keywords
- flexible
- layer
- plate module
- notch
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of printed wiring board and preparation method thereof, which includes：Flexible circuitry plate module, flexible shielding layer and the rigid circuit plate module positioned at the flexible circuit board both sides, the flexible circuitry plate module include flexible conductive layer and the flexible insulating layer positioned at the flexible conductive layer both sides, wherein：The corresponding position of the rigid circuit plate module of flexible circuitry plate module both sides includes at least one opening；The position that the flexible insulating layer of the flexible circuitry plate module at least side corresponds to the opening opens up a notch；The flexible shielding layer is set to the opening, and is covered in the flexible insulating layer and is connect with the flexible conductive layer by the notch.Since the flexible circuitry plate module of the printed wiring board is only constituted by three layers, compared with prior art, thickness is effectively reduced, the lightening application of electronic product is more conducive to, to solve the problems of the prior art.
Description
Technical field
The present invention relates to wiring board technology fields more particularly to a kind of printed wiring board and preparation method thereof.
Background technology
The support element of electronic component in printed wiring board (Printed Circuit board, PCB) series electron product is used
Electric connection between various electronic components are provided.Current printed wiring board includes mainly：Rigid printed wiring board is (also known as hard
Property wiring board), flexible printed circuit board (also known as flexible circuit board) and (the also known as soft or hard combination of soft or hard combination printed wiring board
Plate).Wherein, Rigid Flex is since the durability for having had both rigid wiring board is preferable and the softness of flexible printed circuit board
Property preferably equal advantage, it is of increased attention.
It is as shown in Figure 1 the cross-sectional view of current common Rigid Flex, includes soft in the Rigid Flex
Property the circuit plate module 11 and rigid circuit plate module 12 positioned at flexible circuitry plate module two sides, and rigid circuit plate module
There is opening 13 on 12, is used to form at least one of Rigid Flex flex region.Flexible circuitry plate module 11 is multilayered structure,
It is followed successively by the first flexible insulating layer 111, flexible conductive layer 112, the second flexible insulating layer 113, flexible shielding layer 114 and third
Flexible insulating layer 115, flexible shielding layer 115 therein use latticed copper or other metals, for signal shielding and
Ground connection.However the thickness of flexible circuitry plate module 11 is larger in this Rigid Flex, is unfavorable for the lightening of electronic product, because
This thickness for how reducing flexible circuitry plate module is the technical problems to be solved by the invention.
Invention content
A kind of printed wiring board of offer of the embodiment of the present invention and preparation method thereof, to solve in prior art Rigid Flex
The larger problem of the thickness of flexible circuitry plate module.
In order to solve the above-mentioned technical problem, the invention is realized in this way：
In a first aspect, a kind of printed wiring board is provided, including：Flexible circuitry plate module, flexible shielding layer and it is located at
The rigid circuit plate module of the flexible circuit board both sides, the flexible circuitry plate module include flexible conductive layer and be located at institute
The flexible insulating layer of flexible conductive layer both sides is stated, wherein：
The corresponding position of the rigid circuit plate module of flexible circuitry plate module both sides includes at least one opening；
The position that the flexible insulating layer of the flexible circuitry plate module at least side corresponds to the opening opens up a notch；
The flexible shielding layer is set to the opening, and be covered in the flexible insulating layer and by the notch with
The flexible conductive layer connection.
Second aspect, provides a kind of production method of printed wiring board, and this method includes：
There is provided a flexible circuitry plate module, the flexible circuitry plate module includes flexible conductive layer and is located at the flexibility
The flexible insulating layer of conductive layer both sides, and wherein have at least one notch on the flexible insulating layer of side；
Rigid circuit plate module is prepared respectively in the both sides of the flexible circuitry plate module, wherein both sides hardness wiring board
Module includes opening in the corresponding position of the notch；
Flexible shielding layer is made in the opening comprising the notch side, and the flexible shielding layer is lacked by described
Mouth is connect with the flexible conductive layer.
In the printed wiring board that the embodiment of the present invention is provided, since flexible circuitry plate module only includes flexible conductive layer
And this three layers of the flexible insulating layer positioned at the flexible conductive layer both sides, wherein：The hard rays of flexible circuitry plate module both sides
The corresponding position of road plate module includes at least one opening；Described in the flexible insulating layer of flexible circuitry plate module at least side corresponds to
The position of opening opens up a notch；Flexible shielding layer is set to the opening, and is covered in the flexible insulating layer and passes through
The notch is connect with the flexible conductive layer.Since the flexible circuitry plate module of the printed wiring board is only constituted by three layers, and
It is shielded by the flexible shielding layer being arranged in aperture position, compared with prior art, can effectively reduce printed wiring board
Thickness, the lightening application of electronic product is more conducive to, to solve the problems of the prior art.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the cross-sectional view of printed wiring board in the prior art；
Fig. 2 is a kind of cross-sectional view of printed wiring board provided in an embodiment of the present invention；
Fig. 3 is the cross-sectional view of another printed wiring board provided in an embodiment of the present invention；
Fig. 4 is the cross-sectional view of another printed wiring board provided in an embodiment of the present invention；
Fig. 5 is the flow diagram of printed wiring board manufacturing method provided in an embodiment of the present invention；
Fig. 6 is printed wiring board manufacturing method preparation technology flow chart provided in an embodiment of the present invention；
Fig. 7 is the cross-sectional view of flexible circuitry plate module provided in an embodiment of the present invention；
Fig. 8 is the preparation technology flow chart of flexible circuitry plate module provided in an embodiment of the present invention；
Fig. 9 is the preparation technology flow chart of rigid circuit plate module provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
As described above, the flexible circuitry plate module in existing Rigid Flex is multilayered structure, as shown in Figure 1, including
Compliant conductive, flexible shielding layer and three flexible insulating layers.Since the thickness of flexible circuitry plate module is larger so that soft or hard knot
The thickness of plywood entirety is also larger, is unfavorable for the lightening of electronic product.
Based on this, the present invention provides a kind of printed wiring board, can be used in solving the problems of the prior art.Such as Fig. 2
Shown, which includes：Flexible circuitry plate module 21, flexible shielding layer 22 and be located at the flexible circuit board two
The rigid circuit plate module 23 of side, the flexible circuitry plate module 21 include flexible conductive layer 211 and are led positioned at the flexibility
The flexible insulating layer 212 of electric layer both sides, wherein：
The corresponding position of the rigid circuit plate module 23 of 21 both sides of flexible circuitry plate module includes at least one opens
Mouth 24, to form flex region in the position of the opening 24, while the other positions except opening 24 form rigid area；This
Kind corresponding position can refer to, on a certain position of flexible circuitry plate module 21, the hardness of 21 both sides of flexible circuitry plate module
Circuit plate module 23 is both provided with opening, and the openings of sizes of both sides can also be identical.
The position of 212 corresponding opening 24 of flexible insulating layer of at least side of flexible circuitry plate module 21 opens up (in flex region)
One notch 25；
The flexible shielding layer 22 is set to the opening 24, and is covered in the flexible insulating layer 212 and passes through institute
Notch 25 is stated to connect with the flexible conductive layer 211.
The printed wiring board 20 provided using the embodiment of the present invention, flexible circuitry plate module 21 is by flexible conductive layer
211 and two flexible insulating layers 212 constitute, and pass through and notch 25 be set on a flexible insulating layer 212 wherein so that is soft
Property shielded layer 22 can be attached with flexible conductive layer 211 by notch 25, to have the function that ground connection and shielding.Due to
The flexible circuitry plate module 21 of the printed wiring board 20 is only constituted by three layers, compared with the existing technology in five layers of multilayered structure,
Thickness is effectively reduced, the lightening application of electronic product is more conducive to, to solve the problems of the prior art.
In practical applications, the flexible conductive layer 211 of the flexible circuitry plate module 21 can be that conductive metallic material makes
Metal conducting layer, such as by conductive metal be fabricated to thickness less than some threshold value when, the flexible conductive layer 211 can be used as；
Flexible conductive layer 211 can also be the conductive layer etc. that other conductive materials make, for example prepared by conductive carbon material, and specific make should
Material used in flexible conductive layer can be selected according to requirements such as cost, electric conductivities.It should be noted that due to
Copper, silver etc. have good conductive property, and cost of manufacture is relatively low, and it is soft as this is made that copper or silver usually may be used
The material of property conductive layer 211.By taking copper as an example, sheet copper (increasing when thickness is smaller flexible) can be made by modes such as etchings
At conducting wire, to be used as the flexible conductive layer 211.
Two flexible insulating layers 212 of flexible circuitry plate module 21 may be used identical material and make, and can also use
Different materials makes, and the mode of making can also be identical or different.It for convenience of description, here can be by flexible shielding layer 22
The flexible insulating layer 212 of covering is referred to as the first flexible insulating layer, and the flexible insulating layer 212 of the other side is referred to as the second flexibility absolutely
Edge layer can usually make second flexible insulating layer with the organic flexible material of insulation, and the selection of specific material can basis
The demand of insulation performance determines, for example may be used the Kapton (Polyimide Film, PI) of high insulating property
As the material for making the second flexible insulating layer, the second made flexible insulating layer is Kapton PI insulation at this time
Layer；Certainly, the organic flexible material of insulation can also be used to make the first flexible insulating layer, common material also may be used
Using Kapton (Polyimide Film, PI), can also be needed using other insulation according to insulation performance
Organic flexible material.
Since the organic flexible material flexibility of insulation is higher, and the problems such as repeatedly bend also and be easy to be broken,
Therefore the first flexible insulating layer and the second flexible insulating layer are prepared using insulation organic flexible material, can be improved whole
Bending performance.In particular, Kapton PI can be used in the first flexible insulating layer and the second flexible insulating layer, due to polyamides
Imines film PI has excellent insulation performance, is more applicable under certain scenes more demanding to insulation performance.
In the application process of printed wiring board 20, flexible shielding layer 22 can shield external interference signals, can also pass through
The flexible shielding layer 22 is grounded.The flexible shielding layer 22 can be multilayered structure, for example can be double-layer structure, include
Machine insulating layer and metal layer, metal layer therein are connect by notch 25 with flexible conductive layer 211, and organic insulator is covered in
On metal layer；Certainly in practical applications, in order to enhance shield effectiveness, flexible shielding layer 22 can also be in above-mentioned double-layer structure
Except increase other layers, for example other metal layer etc. is further added by organic insulator.
In addition, flexible conductive layer 211 is in 25 part of notch, can also to the flexible conductive layer 211 of 25 part of notch into
Row surface treatment generates superficial layer by injection or gold-plated mode, lives for the flexible conductive layer 211 to the part
Change.Wherein injection or gold-plated material can be metal fine particles, and specifically metal can be the electric conductivities such as Ni, Au, Ag
Excellent metal, to improve the effect of activation.
In practical applications, when flexible shielding layer 22 is the double-layer structure that organic insulator and metal layer form, gold
It can be specially the preferable metal of the electric conductivities such as Ni, copper, Ag to belong to specific metal used by layer；It is covered on metal layer
Organic insulator can also use the good insulation flexible materials of insulation performances such as Kapton PI, certainly due to flexibility
Shielded layer 22 is located at flex region, may frequently bend in practical applications, therefore the organic insulator can also select it
The good organic insulating material of his bending performance.
Generally for convenient for preparing flexible shielding layer 22, can flexible shielding film be subjected to entirety in rigid area and flex region
Covering, then integrally generates flexible shielding layer 22, such as Fig. 3 institutes of flexible shielding layer 22 at this time by the way of gluing or pressing
Show, while covering rigid area and flex region.It is this in such a way that screened film integrally generates flexible shielding layer 22, cost of manufacture
It is relatively low, manufacture craft is relatively simple, usually relatively thin additionally, due to screened film, even if whole in rigid area and flex region using screened film
Body generates flexible shielding layer 22, the thickness of the printed wiring board 20 compared with the existing technology in printed wiring board it is also relatively thin,
It can solve the problems of the prior art.
It should be noted that the area of notch 25 can be less than or equal to the area of corresponding opening 24.It is a kind of optional
Mode is, the area of notch 25 is less than the area of corresponding opening 24, at this point, in flex region flexible circuit board 21 flexible insulation
On layer 22, subregion forms notch 25.
For the rigid circuit plate module 23 in printed wiring board 20, or multilayered structure, for example can be hardness
The double-layer structure that insulating layer 231 and rigid conductive layer 232 are formed, as shown in figure 4, rigid insulation layer 231 and homonymy is soft
Property insulating layer 212 connect；Certainly hardness circuit plate module 23 can also increase other layers on the basis of above-mentioned double-layer structure, than
Such as increase protective layer on rigid conductive layer 232, for protecting rigid conductive layer 232.
In addition, insulation effect in order to further increase, further can be divided into multilayered structure by rigid insulation layer 231,
For example it can be divided into double-layer structure, respectively the first rigid insulation layer 2311 and the second rigid insulation layer 2312 are rigid at this time
Circuit plate module 23 is made of rigid conductive layer 232, the first rigid insulation layer 2311 and the second rigid insulation layer 2312, and second is hard
Property insulating layer 2312 is connect with flexible insulating layer 212.First rigid insulation layer 2311 and the second rigid insulation layer 2312 can be adopted
It is made of different rigid insulation materials, for example polypropylene board PP may be used and make the second rigid insulation layer 2312, using ring
Oxygen glass mat FR4 makes the first rigid insulation layer 2311.
The present invention also provides a kind of production method of printed wiring board, can be used in making above-mentioned printed wiring board
20, therefore the problems of the prior art can be also solved, this is repeated no more here, wherein in this method embodiment, if
Have and does not know that place can refer to 20 embodiment part of printed wiring board provided herein.With reference to the method stream of Fig. 5
The step of preparation technology flow chart of journey figure and Fig. 6 are specifically described, this method include：
Step S301：One flexible circuitry plate module is provided.
Flexible circuitry plate module provided here can be and 21 knot having the same of above-mentioned flexible circuitry plate module
Structure, as shown in fig. 7, the flexible circuitry plate module 21 is including flexible conductive layer 211 and is located at 211 both sides of the flexible conductive layer
Flexible insulating layer 212, and wherein have at least one notch 25 on the flexible insulating layer of side.Here it is at least one usually
Can be multiple, that is to say, that can be multiple notches 25 on the flexible insulating layer of 21 side of flexible circuitry plate module.In addition this
In described 21 side of flexible circuitry plate module, can be the arbitrary side in 21 both sides of flexible circuitry plate module, can also
It is specified certain side, is defined here not to this.
It is identical as above-mentioned provided printed wiring board 20, the flexible insulating layer 212 of 211 both sides of flexible conductive layer here
Identical or different flexible insulating material may be used to prepare, just repeated no more for preparing material here.
It should be noted that for the flexible circuitry plate module 21 provided, its preparation method can also be carried out here
It specifically describes.It can be with as shown in figure 8, including the following steps in the preparation process of the flexible circuitry plate module 21 provided：
The first step can provide a flexible insulating film 212 ＇.
Second step makes notch 25 by mold punching on 212 ＇ of the flexible insulating film, to produce band notch
25 flexible insulating films (namely flexible insulating layer 212 jaggy).
During specific make with 25 flexible insulating film of notch, Prepreg or Bonding sheet molds may be used
Stamp aligns Prepreg or Bonding sheet and punching mould, by the way of mold punching, will fit in open
Prepreg the or Bonding sheet of cover area are punched out.
Third walks, and after producing band 25 flexible insulating film of notch, is covered to the flexible conductive layer 211 provided
Side, to be used as flexible insulating layer 212, wherein the other side of the flexible conductive layer 211 is again covered with flexible insulating layer
212, to produce the flexible circuitry plate module 21.
Certainly it will be covered to the mode of the side of flexible conductive layer 211 with 25 flexible insulating film of notch, can pass through glue
Viscous or pressing mode, naturally it is also possible to be other modes.
Flexible insulating layer 212 is covered with for the other side of flexible conductive layer 211, which can pass through
If under type makes, a metal layer is provided, the side of the metal layer is covered with flexible insulating layer, then leads to overetched mode and exists
Conducting wire is made on the other side of the metal layer, so as to form the flexible conductive layer 211, flexible insulating layer here can
It is attached to metal layer in a manner of by the way that gluing or pressing can also be used.
Step S302：Rigid circuit plate module is prepared respectively in the both sides of the flexible circuitry plate module provided, wherein two
Side hardness circuit plate module includes opening in the corresponding position of notch.
Here rigid 23 phase of circuit plate module that prepared rigid circuit plate module can be provided with above-described embodiment
Together.21 both sides hardness circuit plate module of flexible circuitry plate module includes opening 24 in the corresponding position of notch 25, so as to
The rigid area except flex region and flex region is formed in 24 positions that are open, the area of split shed 24 is greater than or equal to notch 25
Area, and in the range of the position range of notch 25 entirely falls in corresponding opening 24.
In practical application, rigid circuit plate module 23 is prepared respectively in the both sides of the flexible circuitry plate module 21 provided
Mode can there are many, for example rigid circuit plate module 23 can be pressed respectively in the both sides of flexible circuitry plate module 21 with line, so
Opening 24 is produced on the corresponding position of rigid circuit plate module 23 afterwards, wherein the mode for specifically producing opening 24 can be with
It is, by radium-shine or mold stamp, opening 24 to be produced on the corresponding position of rigid circuit plate module.
In addition, since rigid circuit plate module 23 is generally also multilayered structure, can also be adopted according to the difference of concrete structure
Rigid circuit plate module 23 is prepared respectively in the both sides of the flexible circuitry plate module 21 provided with different modes.
For example, the hardness circuit plate module 23 is specially to make 231 ＂ of the second rigid insulation layer using polypropylene board PP, and
And first rigid insulation layer 2311 made of epoxy glass fiber plate FR4.It should at this point, being prepared in flexible circuitry plate module 21
It, can be first by polypropylene board PP by producing opening 24 in a manner of mould punching etc., then will make when rigid circuit plate module
The polypropylene board PP for going out opening 24 is pressure bonded in flexible circuitry plate module 21, as the second rigid insulation layer 2312；Then by
It is laminated 232 ＇ of cyclization oxygen glass mat FR4 and rigid conductive plate, in pressing epoxy glass fiber plate FR4 and hardness conduction
After plate, using modes such as radium-shine or mold stamps, opening is produced on epoxy glass fiber plate FR4 and rigid conductive plate
24, respectively as the first rigid insulation layer 2311 and rigid conductive layer 232.The flow for being illustrated in figure 9 the preparation process is shown
It is intended to, hardness 232 ＇ of conductive plate therein can be specially copper coin, and what the first rigid insulation layer 2311 used prepares material as ring
Oxygen glass mat FR4, what the second rigid insulation layer 2312 used prepares material as polypropylene board PP.
Step S303：Flexible shielding layer is made in the opening comprising notch side, and by flexible shielding layer described in
Notch is connect with the flexible conductive layer.
In practical application, according to the difference of 22 structure of flexible shielding layer can there are many preparation methods, for example work as flexible screen
It is that when being covered in the opening 24 of 25 side of notch, may be used and flexible shielding layer material is fabricated in opening 24 to cover layer 22
Then the fritter to match is covered fritter by way of pressing to the opening 24 comprising notch 25.This mode is made
The printed wiring board made is not due to including flexible shielding layer 22, thinner thickness, but manufacturing process is more multiple in rigid area
It is miscellaneous, it can be used under lightening more demanding scene.Other modes can certainly be used to make flexible shielding layer
In the flex region of 25 side of notch, it is defined here not to this.
It, can be by 25 side of notch when flexible shielding layer is covered in the flex region of 25 side of notch and rigid area
Upper direct gluing or pressing flexible shielding film, make flexible shielding layer 22.Printed wiring board prepared by this mode, relatively
In flexible shielding layer 22 only be covered in the rigid area of 25 side of notch when it is thicker, due to flexible shielding film integral thickness compared with
It is thin, integral thickness, and this preparation integrally pressed by flexible shielding film can be also reduced for existing number
Mode, simple for process, cost of manufacture is relatively low.Therefore in practical applications, can be selected according to demands such as cost of manufacture, thickness
Specifically production method.
It should be noted that before the making flexible shielding layer of step S303, this method can also include, to notch 25
The flexible conductive layer of position is surface-treated, and can be specifically, by injection or gold-plated mode in 25 position of notch
Superficial layer is generated on flexible conductive layer, to be activated to the flexible conductive layer of the part.Wherein injection or gold-plated material
Can be metal fine particle, specifically metal can be the excellent metal of the electric conductivities such as Ni, Au, Ag, to further carry
The effect of overactivity.
Using the production method for the printed wiring board that the embodiment of the present application is provided, produced printed wiring board it is soft
Property circuit plate module only includes, flexible conductive layer and the flexible insulating layer positioned at flexible conductive layer both sides, and flexible shielding layer
It is set to flex region and is connect with flexible conductive layer by the notch 25 in flex region.Since the flexible circuitry plate module only has
3 layers, thus it is relatively thin compared with the existing technology, and the printed wiring board finally produced is also relatively thin, can adapt in electronic product
Lightening application, solves the problems of the prior art.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that process, method, article or device including a series of elements include not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including this
There is also other identical elements in the process of element, method, article or device.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical scheme of the present invention substantially in other words does the prior art
Going out the part of contribution can be expressed in the form of software products, which is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal (can be mobile phone, computer, service
Device, air conditioner or network equipment etc.) execute method described in each embodiment of the present invention.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within the protection of the present invention.
Claims (10)
1. a kind of printed wiring board, which is characterized in that including：Flexible circuitry plate module, flexible shielding layer and positioned at described soft
Property wiring board both sides rigid circuit plate module, the flexible circuitry plate module include flexible conductive layer and be located at the flexibility
The flexible insulating layer of conductive layer both sides, wherein：
The corresponding position of the rigid circuit plate module of flexible circuitry plate module both sides includes at least one opening；
The position that the flexible insulating layer of the flexible circuitry plate module at least side corresponds to the opening opens up a notch；
The flexible shielding layer is set to the opening, and be covered in the flexible insulating layer and by the notch with it is described
Flexible conductive layer connects.
2. printed wiring board as described in claim 1, which is characterized in that the flexible shielding layer specifically includes：Organic insulation
Layer and metal layer, the metal layer are connect by the notch with the flexible conductive layer.
3. printed wiring board as described in claim 1, which is characterized in that the flexible shielding layer is also covered in the hardness of homonymy
Circuit plate module.
4. printed wiring board as described in claim 1, which is characterized in that the area of the opening is more than the face of the notch
Product.
5. printed wiring board as described in claim 1, which is characterized in that
The flexible insulating layer is specially：Kapton PI insulating layers；
The flexible conductive layer is specially：Copper flexible conductive layer；
It is described hardness circuit plate module include：Rigid insulation layer and rigid conductive layer, wherein the rigid insulation layer and homonymy
The flexible insulating layer connection.
6. a kind of production method of printed wiring board, which is characterized in that including：
There is provided a flexible circuitry plate module, the flexible circuitry plate module includes flexible conductive layer and is located at the compliant conductive
The flexible insulating layer of layer both sides, and wherein have at least one notch on the flexible insulating layer of side；
Rigid circuit plate module is prepared respectively in the both sides of the flexible circuitry plate module, wherein both sides hardness circuit plate module
Include opening in the corresponding position of the notch；
Make flexible shielding layer in the opening comprising the notch side, and by the flexible shielding layer by the notch with
The flexible conductive layer connection.
7. method as claimed in claim 6, which is characterized in that make flexible shielding in the opening comprising the notch side
Layer, specifically includes：
By gluing over said opening or pressing flexible shielding film, the flexible shielding layer is made.
8. method as claimed in claim 6, which is characterized in that the flexible circuitry plate module provided is made by the following method
Make：
One flexible insulating film is provided；
At least one notch is produced on the flexible insulating film by mold punching；
The flexible insulating film after notch will be produced to cover to the side of the flexible conductive layer provided, wherein the flexibility is led
The other side of electric layer is covered with flexible insulating layer.
9. method as claimed in claim 8, which is characterized in that the flexible conductive layer provided makes by the following method：
A metal layer is provided, the side of the metal layer is covered with flexible insulating layer；
Conducting wire is made by being etched on the metal layer.
10. method as claimed in claim 6, which is characterized in that make flexible screen in the opening comprising the notch side
Before covering layer, the method further includes：The flexible conductive layer of the gap position is surface-treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810262206.XA CN108601198A (en) | 2018-03-28 | 2018-03-28 | A kind of printed wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810262206.XA CN108601198A (en) | 2018-03-28 | 2018-03-28 | A kind of printed wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108601198A true CN108601198A (en) | 2018-09-28 |
Family
ID=63624788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810262206.XA Pending CN108601198A (en) | 2018-03-28 | 2018-03-28 | A kind of printed wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601198A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890132A (en) * | 2019-04-09 | 2019-06-14 | 盐城维信电子有限公司 | A kind of multi-layer flexible circuit board and preparation method thereof of shielded signal line |
| CN113973420A (en) * | 2020-07-22 | 2022-01-25 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex board and manufacturing method thereof |
| CN113973420B (en) * | 2020-07-22 | 2024-05-31 | 庆鼎精密电子（淮安）有限公司 | Soft and hard combined plate and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6918179B2 (en) * | 2002-04-10 | 2005-07-19 | International Business Machines Corporation | Method of deforming flexible cable sections extending between rigid printed circuit boards |
| CN102159021A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN106034373A (en) * | 2015-03-10 | 2016-10-19 | 上海量子绘景电子股份有限公司 | High-density multilayer copper circuit board and preparation method thereof |
-
2018
- 2018-03-28 CN CN201810262206.XA patent/CN108601198A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6918179B2 (en) * | 2002-04-10 | 2005-07-19 | International Business Machines Corporation | Method of deforming flexible cable sections extending between rigid printed circuit boards |
| CN102159021A (en) * | 2010-02-12 | 2011-08-17 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN106034373A (en) * | 2015-03-10 | 2016-10-19 | 上海量子绘景电子股份有限公司 | High-density multilayer copper circuit board and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890132A (en) * | 2019-04-09 | 2019-06-14 | 盐城维信电子有限公司 | A kind of multi-layer flexible circuit board and preparation method thereof of shielded signal line |
| CN113973420A (en) * | 2020-07-22 | 2022-01-25 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex board and manufacturing method thereof |
| CN113973420B (en) * | 2020-07-22 | 2024-05-31 | 庆鼎精密电子（淮安）有限公司 | Soft and hard combined plate and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102298791B1 (en) | Electromagnetic shielding film, circuit board and manufacturing method of electromagnetic shielding film | |
| US20220394859A1 (en) | Method of manufacturing circuit board | |
| CN102316664B (en) | Flexible circuit board and manufacture method thereof | |
| CN107452691A (en) | Electronic circuit package | |
| JPH09107190A (en) | Shield for flat constituent element group | |
| JP2004095566A (en) | Shield film, shielded flexible printed wiring board, and their manufacturing methods | |
| JP2011159879A (en) | Flexible printed wiring board with shield, method for manufacturing the same, and electronic apparatus | |
| CN105210462A (en) | Method for manufacturing component-embedded substrate, and component-embedded substrate | |
| CN108601198A (en) | A kind of printed wiring board and preparation method thereof | |
| CN1913752B (en) | Method for manufacturing blended multi-layer circuit substrate | |
| CN208095043U (en) | Electromagnetic shielding film and wiring board | |
| CN109496063A (en) | Electromagnetic shielding film and its manufacturing method, flexible circuit board and its manufacturing method | |
| US20220046788A1 (en) | Shielded Printed Wiring Board, Method For Manufacturing Shielded Printed Wiring Board, And Connecting Member | |
| CN102858092A (en) | Circuit board and manufacturing method thereof | |
| JP3501268B2 (en) | Flexible printed wiring board | |
| CN101340775B (en) | Flexible circuit board and manufacturing method thereof | |
| CN110461086A (en) | A kind of circuit board, circuit board manufacturing method and terminal | |
| CN109890132A (en) | A kind of multi-layer flexible circuit board and preparation method thereof of shielded signal line | |
| CN105845468B (en) | A kind of touch switch and its manufacturing method | |
| CN210405759U (en) | Grounding film and shielding film grounding structure | |
| US11563265B2 (en) | Antenna module and method for manufacturing the same | |
| JP5904354B2 (en) | Flexible printed wiring board with shield, manufacturing method thereof, and electronic device | |
| US10636549B2 (en) | Electronic component | |
| CN110191574A (en) | Ground film and screened film ground structure | |
| JP4330868B2 (en) | Printed wiring board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180928 |
|
| RJ01 | Rejection of invention patent application after publication |