CN108596164A - Fingerprint module and electronic equipment - Google Patents
Fingerprint module and electronic equipment Download PDFInfo
- Publication number
- CN108596164A CN108596164A CN201810793505.6A CN201810793505A CN108596164A CN 108596164 A CN108596164 A CN 108596164A CN 201810793505 A CN201810793505 A CN 201810793505A CN 108596164 A CN108596164 A CN 108596164A
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- fingerprint module
- joint face
- recognition chip
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- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Software Systems (AREA)
- Image Input (AREA)
Abstract
The present invention provides a kind of fingerprint module and electronic equipments, are related to fingerprint module technical field.Fingerprint module includes fingerprint recognition chip and modular circuit substrate, fingerprint recognition chip includes the first plane and the second plane to form step structure, first plane is protruded with respect to the second plane, fingerprint recognition chip includes joint face and installing port, joint face is formed in the second plane, installing port is formed in the region close to joint face in the second plane, modular circuit substrate includes interconnecting piece, interconnecting piece is electrically connected across installing port with joint face, compared to traditional fingerprint modular structure, fingerprint module provided by the invention is by being arranged in the region of fingerprint recognition chip and modular circuit substrate connection in the hierarchic structure of fingerprint recognition chip, save the thickness of modular circuit substrate and conductive material, the thickness of fingerprint module is reduced simultaneously, it is advantageously implemented the lightening design of electronic equipment.
Description
Technical field
The present invention relates to fingerprint module technical fields, in particular to a kind of fingerprint module and electronic equipment.
Background technology
Along with the rapid development of mobile internet era, the information exchange between mobile terminal user also increases in formula at double
Long, at the same time all kinds of telecommunication frauds and identity information are stolen event and repeated, the identification technology of the identity id information of user
The topic that safety problem is held in both hands at the heat to attract the attention of millions of people, in mobile Internet interaction, biological identification technology is led the epoch
Become a kind of emerging interaction technique down and is gradually approved that fingerprint identification technology has become one in mobile phone configuration by public
Kind standard configuration.
Traditional fingerprint modular structure includes cover board, becket, fingerprint chip, modular circuit substrate, wherein fingerprint chip
It is fixed on substrate by conductive material, becket is fixed on by glue-line on modular circuit substrate, and cover board is covered by glue-line
In fingerprint chip surface.Cell Phone Design is generally pursued thinner so that consumer experience is more preferable at present, fingerprint module traditional at present
The connecting material that overall thickness includes cover board+between fingerprint chip+modular circuit substrate and each layer is stacked, overall thickness is thicker, accounts for
With more interior of mobile phone space, constrains thickness and designed toward thinner direction.
Invention content
In view of this, the embodiment of the present invention is designed to provide a kind of fingerprint module and electronic equipment, it is existing to improve
The thicker problem of fingerprint module thickness.
The technical solution adopted by the present invention is as follows：
An embodiment of the present invention provides a kind of fingerprint module, the fingerprint module includes fingerprint recognition chip and modular circuit
Substrate, the fingerprint recognition chip include the first plane and the second plane, the relatively described second plane protrusion of first plane
Step structure is formed, the fingerprint recognition chip includes joint face and installing port, and it is flat that the joint face is formed in described second
Face, the installing port are formed in the region close to the joint face in second plane, and the modular circuit substrate includes connecting
Socket part, the interconnecting piece are electrically connected across the installing port with the joint face.
Further, the fingerprint module includes protection ring, and the protection ring is installed on second plane, the protection
Ring set is set to the outside of the step structure, and the protection ring includes ontology and supporting part, the supporting part and the ontology
The step structure of connection, the supporting part and the fingerprint recognition chip coordinates, and the supporting part is opposite with the joint face.
Further, the supporting part includes to house the accommodating space of the interconnecting piece, and the accommodating space is formed
In the supporting part in the opposite side of the joint face.
Further, the protection ring includes bonding plane, and bonding plane is the ontology table opposite with second plane
The bonding plane in face, protection ring passes through glue-line and the second plane adhesion.
Further, the fingerprint module includes cover board, and it is first flat to be adhered to the fingerprint recognition chip for the cover board
On face and the supporting part, the cover board is set to the inside of the ontology.
Further, the joint face includes signal conduction region, and the interconnecting piece passes through conductive material and the signal
Conducting region is fixedly connected.
Further, the fingerprint recognition chip includes chip substrate, wafer and signal conduction region, the wafer and institute
State the side surface that signal conduction region is set to the chip substrate.
Further, the protection ring is becket.
Further, the cover board is at least one of glass cover-plate, sapphire cover board, ceramic cover plate, paint cover board.
The embodiment of the present invention additionally provides a kind of electronic equipment, and the electronic equipment includes apparatus body and fingerprint mould
Group, the fingerprint module include fingerprint recognition chip and modular circuit substrate, the fingerprint recognition chip include the first plane and
Second plane, relatively described second plane of first plane are protruded to form step structure, and the fingerprint recognition chip includes
Joint face and installing port, the joint face are formed in second plane, and the installing port is formed in second plane and leans on
The region of the nearly joint face, the modular circuit substrate includes interconnecting piece, the interconnecting piece pass through the installing port with it is described
Joint face is electrically connected, and the fingerprint module is set to the apparatus body.
Compared with the prior art, the invention has the advantages that：
The present invention provides a kind of fingerprint module and electronic equipment, the fingerprint module includes fingerprint recognition chip and module
Circuit board, the fingerprint recognition chip include the first plane and the second plane, relatively described second plane of first plane
Protrusion forms step structure, and the fingerprint recognition chip includes joint face and installing port, and the joint face is formed in described the
Two planes, the installing port are formed in the region close to the joint face, the modular circuit substrate packet in second plane
Include interconnecting piece, the interconnecting piece is electrically connected across the installing port with the joint face, compared to traditional fingerprint modular structure,
Fingerprint module provided by the invention with the region of modular circuit substrate connection by will be arranged ladder knot in fingerprint recognition chip
On structure, the thickness of modular circuit substrate and conductive material is saved, while also reducing the thickness of fingerprint module, is conducive to reality
The lightening design of existing electronic equipment.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate
Appended attached drawing, is described in detail below.
Description of the drawings
It, below will be to required use in embodiment in order to illustrate more clearly of the technical solution of embodiment of the present invention
Attached drawing be briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not to be seen as
It is the restriction to range, it for those of ordinary skill in the art, without creative efforts, can be with root
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 shows the schematic diagram of existing fingerprint modular structure.
Fig. 2 shows the schematic diagrames of fingerprint module provided by the invention.
Fig. 3 shows the explosive view of fingerprint module provided in this embodiment.
Fig. 4 shows the structural schematic diagram of fingerprint recognition chip.
Fig. 5 shows the first multi-angled view of fingerprint recognition chip.
Fig. 6 shows the internal structure schematic diagram of fingerprint recognition chip.
Fig. 7 shows the schematic diagram of modular circuit substrate provided in this embodiment.
Fig. 8 shows the schematic diagram of protection ring.
Fig. 9 shows the cross section view of fingerprint module provided in this embodiment.
Figure 10 shows the schematic diagram of electronic equipment provided by the invention.
Icon：10- fingerprint modular structures；101- modular circuit substrates；102- fingerprint chips；103- beckets；104- is covered
Plate；200- fingerprint modules；210- fingerprint recognition chips；211- step structures；The first planes of 2111-；The second planes of 2112-；
2113- signal conductions region；2114- joint faces；2115- installing ports；212- plastic packagings；213- wafers；214- gold threads；215- chips
Substrate；230- protection rings；231- ontologies；2311- bonding planes；233- supporting parts；2331- accommodating spaces；250- cover boards；270- moulds
Group circuit board；271- interconnecting pieces；273- conductive materials；30- electronic equipments；300- apparatus bodies.
Specific implementation mode
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit claimed invention below
Range, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, those skilled in the art are not doing
The every other embodiment obtained under the premise of going out creative work, shall fall within the protection scope of the present invention.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
In the description of the present invention, it should be noted that the instructions such as term "upper", "lower", "left", "right", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when usually put
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, do not indicate or imply the indicated device
Or element must have a particular orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, can also be electrical connection；It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.
In the description of the present invention, it is also necessary to explanation, herein, such as first and second or the like relationship art
Language is only used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying this
There are any actual relationship or orders between a little entities or operation.The terms such as term "horizontal", "vertical", " pendency "
It is not offered as requiring component abswolute level or pendency, but can be slightly tilted.If "horizontal" refers to only that its direction is opposite " perpendicular
It is more horizontal for directly ", it is not to indicate that the structure is had to fully horizontally, but can be slightly tilted.Term " comprising ",
"comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process including a series of elements,
Method, article or equipment include not only those elements, but also include other elements that are not explicitly listed, or are also wrapped
It includes as elements inherent to such a process, method, article, or device.In the absence of more restrictions, by sentence " including
One ... " limit element, it is not excluded that there is also another in the process, method, article or apparatus that includes the element
Outer identical element.For the ordinary skill in the art, it can understand above-mentioned term in the present invention with concrete condition
Concrete meaning.
Below in conjunction with the accompanying drawings, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
Referring to Fig. 1, Fig. 1 shows the schematic diagram of existing fingerprint modular structure 10 comprising cover board 104, becket
103, fingerprint chip 102 and modular circuit substrate 101, wherein fingerprint chip 102 is fixed on modular circuit base by conductive material
On plate 101, becket 103 is fixed on by glue-line on modular circuit substrate 101, and cover board 104 is covered in fingerprint core by glue-line
The surface of piece 102.
Electronic device design is generally pursued thinner so that consumer experience is more preferable at present, fingerprint modular structure traditional at present
10 stacked structure overall thickness include the thickness of cover board 104, the thickness of fingerprint chip 102, modular circuit substrate 101 thickness with
And the connecting material between each layer, overall thickness is thicker, occupies the inner space of more electronic equipment, constrains electronic equipment
Thickness is designed toward thinner direction.
First embodiment
A kind of fingerprint module 200 is present embodiments provided, more, thickness is stacked to improve existing 200 thickness of fingerprint module
The problem of degree can not reduce.Fig. 2 and Fig. 3 are please referred to, Fig. 2 shows the stacked structures of fingerprint module 200 provided in this embodiment
Schematic diagram.
Fig. 3 shows the explosive view of fingerprint module 200 provided in this embodiment.Fingerprint module 200 includes modular circuit
Substrate 270, fingerprint recognition chip 210, protection ring 230 and cover board 250.Modular circuit substrate 270 and the fingerprint recognition chip
210 electrical connections, protection ring 230 are bonded on fingerprint recognition chip 210, and cover board 250 is bonded in the protection ring 230 and fingerprint is known
On other chip 210.
Fig. 4 and Fig. 5 are please referred to, fingerprint recognition chip 210 includes the first plane 2111 and the second plane 2112, the first plane
2111 and second plane 2112 form step structure 211, opposite second plane 2112 of the first plane 2111 is protruded.Fingerprint recognition
Chip 210 includes signal conduction region 2113, and the signal conduction region 2113 is for connecting modular circuit substrate 270 by fingerprint
The fingerprint signal that identification chip 210 identifies is transmitted by modular circuit substrate 270, and signal conduction region 2113 is formed in institute
State the second plane 2112.Signal conduction region 2113 is set to the second plane 2112 of fingerprint recognition chip 210, is conducive to subtract
Small additional bondline thickness reduces the integral thickness of fingerprint module 200.
Referring to Fig. 6, preferably, fingerprint module 200 includes plastic packaging 212, wafer 213, gold thread 214 and chip substrate
215.Wherein the inverter circuit region of 215 the inside circuit region comprising center and periphery of chip substrate, wafer 213 are set to chip
On the circuit region of substrate 215, the circuit region includes the signal conduction region to be electrically connected with modular circuit substrate 270
2113, the circuit region further includes the electric coupling area to be electrically connected with wafer 213.The wafer 213 passes through gold thread 214
It is electrically connected with the electric coupling area.The plastic packaging 212 coats wafer 213 and gold thread 214, and forms scheduled shape.Example
Such as, in this present embodiment, step structure 211 is formed.Step structure 211 includes the first plane 2111 and the second plane
2112, the second plane 2112 is formed on chip substrate 215, and the first plane 2111 is formed in the surface of plastic packaging 212.First plane
2111 opposite second planes 2112 are protruded.
Fig. 4 and Fig. 5 are please referred to, fingerprint recognition chip 210 includes joint face 2114 and installing port 2115,2114 shape of joint face
At in the second plane 2112.For installing connection modular circuit substrate 270, the signal conduction region 2113 is set joint face 2114
It is placed on joint face 2114.For example, the fingerprint recognition chip 210 includes multiple welderings for connecting modular circuit substrate 270
Contact, multiple pads, which are arranged on joint face 2114, forms signal conduction region 2113.
For installing port 2115 for introducing modular circuit substrate 270, installing port 2115 is formed in the of fingerprint recognition chip 210
Close to the position of the joint face 2114 in two planes 2112.The modular circuit substrate 270 can pass through the installing port
2115, it is connect with joint face 2114.In this present embodiment, the position that installing port 2115 opens up is in the chip substrate 215
Inverter circuit region.
Referring to Fig. 7, modular circuit substrate 270 includes interconnecting piece 271, interconnecting piece 271 is set to modular circuit substrate 270
One end.Interconnecting piece 271 is electrically connected across the installing port 2115 with the joint face 2114, for example, passing through conductive material 273
Electrical connection.For example, conductive material 273 can be tin cream or ACF glued membranes (Anisotropic Conductive Film,
ACF), but not limited to this, it can also be other materials with same or similar function.By tin cream or ACF glued membranes by mould
The joint face 2114 of interconnecting piece 271 and the fingerprint recognition chip 210 of group circuit board 270 is fixed, make fingerprint recognition chip 210 with
Modular circuit substrate 270 is stably connected with, while also achieving being electrically connected for fingerprint recognition chip 210 and modular circuit substrate 270,
So as to the finger print information identified by 270 transmission fingerprint identification chip 210 of modular circuit substrate.
In this present embodiment, the modular circuit substrate 270 can be printed circuit board (Printed Circuit
Board, PCB) or flexible PCB (Flexible Printed Circuit, FPC), the present embodiment is not construed as limiting this.
Fig. 3 and Fig. 8 are please referred to, Fig. 8 shows the schematic diagram of protection ring 230.Protection ring 230 is installed on fingerprint recognition
Second plane 2112 of chip 210, the protection ring 230 are set in the outside of the step structure 211, and protection ring 230 is used
In internal structures such as the wafers 213 of protection fingerprint recognition chip 210.
The protection ring 230 includes cricoid ontology and supporting part 233.Cricoid ontology and the fingerprint recognition chip
210 the second plane 2112 bonding, cricoid ontology are set in the outside of the step structure 211 of fingerprint recognition chip 210, institute
It states supporting part 233 to connect with the ontology, supporting part 233 is set to the inside of annular body, the supporting part 233 and the finger
The joint face 2114 of line identification chip 210 is opposite.
Protection ring 230 includes bonding plane 2311, and the bonding plane 2311 is the cricoid ontology and second plane
2112 opposite surfaces.The bonding plane 2311 of protection ring 230 is Nian Jie with the second plane 2112 by glue-line.
Referring to Fig. 9, Fig. 9 shows the cross section view of fingerprint module 200 provided in this embodiment.The supporting part 233
Coordinate with the step structure 211 of the fingerprint recognition chip 210, the supporting part 233 is opposite with the joint face 2114
Side is recessed to form accommodating space 2331, and the shapes and sizes of the accommodating space 2331 and the shape of the interconnecting piece 271 are big
Small matching, the accommodating space 2331 is used to house the interconnecting piece 271 of the modular circuit substrate 270, when the modular circuit
When the interconnecting piece 271 of substrate 270 is connect with the joint face 2114 of fingerprint recognition chip 210, the interconnecting piece 271 is placed in described
In accommodating space 2331.
In this present embodiment, the accommodating space 2331 can be formed by the portion concave of the supporting part 233, can be with
A part by cutting the supporting part 233 is formed, and the shape size of the accommodating space 2331 is according to the modular circuit
The interconnecting piece 271 of substrate 270 is arranged.
Protection ring 230 can be becket, can also be made of his material, the present embodiment does not limit this.
Cover board 250 is adhered in the first plane 2111 and the supporting part 233 of the fingerprint recognition chip 210, Yu Ben
In embodiment, the first plane 2111 of fingerprint recognition chip 210 and the supporting part 233 of the protection ring 230 work in coordination to be formed
Circle, the cover board 250 are set to the inside of the ontology 231, are bonded in the first plane 2111 worked in coordination and the guarantor
On the supporting part 233 of retaining ring 230.In other embodiments of the present invention, the carrying of first plane 2111 and protection ring 230
Portion 233 can also be combined into other shapes, such as rectangle, round rectangle etc..
Cover board 250 is protecting fingerprint recognition chip 210, cover board 250 can be by materials such as glass, sapphire, ceramics, paint
Material is made, but not limited to this.The cover board 250 can be also used for printing logo etc..
Fingerprint module 200 provided in this embodiment, compared to traditional fingerprint modular structure 10, by by fingerprint recognition core
The region of piece 210 being electrically connected with modular circuit substrate 270 is arranged in the hierarchic structure of fingerprint recognition chip 210, avoids
Additional glue-line is arranged in other planes of fingerprint recognition chip 210, and the overall thickness of 200 stacked structure of fingerprint module includes only cover board
250 and fingerprint recognition chip 210 thickness and bondline thickness between the two, effectively save modular circuit substrate 270 with
And the thickness of conductive material 273, while the integral thickness of fingerprint module 200 is also significantly reduced, it is advantageously implemented electronics and sets
Standby lightening design.
Second embodiment
The present embodiment provides a kind of electronic equipment 30, referring to Fig. 10, electronic equipment 30 includes apparatus body 300 and the
The fingerprint module 200 that one embodiment provides, fingerprint module 200 are connect with apparatus body 300.The electronic equipment 30 includes but not
It is limited to mobile phone, tablet computer, laptop etc..For example, the fingerprint module 200 can be set to the electronic equipment 30
Any plane or curved surface.Fingerprint module 200 includes modular circuit substrate 270, and modular circuit substrate 270 is for realizing fingerprint recognition
Chip 210 is electrically connected with apparatus body 300, and the information such as the fingerprint of identification are transmitted to apparatus body 300.
In conclusion the present invention provides a kind of fingerprint module and electronic equipment, fingerprint module includes fingerprint recognition chip
And modular circuit substrate, fingerprint recognition chip include the first plane and the second plane to form step structure, the first plane phase
Second plane is protruded, fingerprint recognition chip includes joint face and installing port, and joint face is formed in the second plane, and installing port is formed
In the region close to joint face in the second plane, modular circuit substrate includes interconnecting piece, and interconnecting piece passes through installing port and joint face
Electrical connection, compared to traditional fingerprint modular structure, by by the area of fingerprint recognition chip being electrically connected with modular circuit substrate
Domain is arranged in the hierarchic structure of fingerprint recognition chip, avoids other planes in fingerprint recognition chip that additional glue-line is arranged,
The overall thickness of fingerprint module stacked structure only include cover board+fingerprint recognition chip thickness and bondline thickness between the two,
The thickness for effectively saving modular circuit substrate and conductive material, significantly reduces the integral thickness of fingerprint module, favorably
In the lightening design for realizing electronic equipment.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of fingerprint module, which is characterized in that the fingerprint module includes fingerprint recognition chip and modular circuit substrate, described
Fingerprint recognition chip include the first plane and the second plane, relatively described second plane of first plane protrude to be formed it is ladder-like
Structure, the fingerprint recognition chip include joint face and installing port, and the joint face is formed in second plane, the installation
Mouth is formed in the region close to the joint face in second plane, and the modular circuit substrate includes interconnecting piece, the company
Socket part is electrically connected across the installing port with the joint face.
2. fingerprint module as described in claim 1, which is characterized in that the fingerprint module includes protection ring, the protection ring
Be installed on second plane, the protection ring is sheathed on the outside of the step structure, the protection ring include ontology and
Supporting part, the supporting part are connect with the ontology, and the step structure of the supporting part and the fingerprint recognition chip coordinates,
The supporting part is opposite with the joint face.
3. fingerprint module as claimed in claim 2, which is characterized in that the supporting part includes to house the interconnecting piece
Accommodating space, the accommodating space are formed in the supporting part in the opposite side of the joint face.
4. fingerprint module as claimed in claim 2, which is characterized in that the protection ring includes bonding plane, and bonding plane is described
The ontology surface opposite with second plane, the bonding plane of protection ring pass through glue-line and the second plane adhesion.
5. fingerprint module as claimed in claim 2, which is characterized in that the fingerprint module includes cover board, the cover board bonding
In in the first plane and the supporting part of the fingerprint recognition chip, the cover board is set to the inside of the ontology.
6. fingerprint module as described in claim 1, which is characterized in that the joint face includes signal conduction region, the company
Socket part is fixedly connected by conductive material with the signal conduction region.
7. fingerprint module as described in claim 1, which is characterized in that the fingerprint recognition chip includes chip substrate, wafer
And signal conduction region, the wafer and the signal conduction region are set to a side surface of the chip substrate.
8. fingerprint module as claimed in claim 2, which is characterized in that the protection ring is becket.
9. fingerprint module as claimed in claim 5, which is characterized in that the cover board is glass cover-plate, sapphire cover board, ceramics
At least one of cover board, paint cover board.
10. a kind of electronic equipment, which is characterized in that the electronic equipment includes that apparatus body and such as claim 1~9 are any
Fingerprint module described in, the fingerprint module are set to the apparatus body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810793505.6A CN108596164B (en) | 2018-07-18 | 2018-07-18 | Fingerprint module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810793505.6A CN108596164B (en) | 2018-07-18 | 2018-07-18 | Fingerprint module and electronic equipment |
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| CN108596164A true CN108596164A (en) | 2018-09-28 |
| CN108596164B CN108596164B (en) | 2024-06-04 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109299710A (en) * | 2018-12-06 | 2019-02-01 | 上海摩软通讯技术有限公司 | Fingerprint mould group and terminal device |
| CN109496315A (en) * | 2018-10-26 | 2019-03-19 | 深圳市汇顶科技股份有限公司 | Fingerprint detection stamp device, fingerprint detection system and electronic equipment |
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
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| CN104779223A (en) * | 2015-04-10 | 2015-07-15 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification chip packaging structure provided with unilateral groove and manufacturing method |
| CN105825165A (en) * | 2015-11-20 | 2016-08-03 | 维沃移动通信有限公司 | Fingerprint identification module, terminal device and assembling method |
| WO2017173739A1 (en) * | 2016-04-05 | 2017-10-12 | 意力(广州)电子科技有限公司 | Capacitive fingerprint recognition touch panel |
| US20180068148A1 (en) * | 2016-09-05 | 2018-03-08 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic fingerprint sensor package, ultrasonic fingerprint identification device and electronic device |
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| CN109496315B (en) * | 2018-10-26 | 2022-05-03 | 深圳市汇顶科技股份有限公司 | Fingerprint detection coding device, fingerprint detection system and electronic equipment |
| CN109299710A (en) * | 2018-12-06 | 2019-02-01 | 上海摩软通讯技术有限公司 | Fingerprint mould group and terminal device |
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
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