CN108588797A - A kind of preparation method of diamond dust card grinding - Google Patents
A kind of preparation method of diamond dust card grinding Download PDFInfo
- Publication number
- CN108588797A CN108588797A CN201810347630.4A CN201810347630A CN108588797A CN 108588797 A CN108588797 A CN 108588797A CN 201810347630 A CN201810347630 A CN 201810347630A CN 108588797 A CN108588797 A CN 108588797A
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- China
- Prior art keywords
- card grinding
- power supply
- diamond dust
- pure water
- grinding
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention discloses a kind of preparation methods of diamond dust card grinding,The preparation method of the diamond dust card grinding includes ultrasonic cleaning,Once flushing,Once electrolytic oil removing,Secondary flushing,Hydrochloride derusting,One of pure water embathes,It is sulfuric acid activated,Two pure water embathe,Drying,Nickel preplating,Clamping,Tubulature,Upper sand,It thickeies,Unloading clip,Bright nickel plating,Closing amounts to 17 processing steps,Pass through ultrasonic cleaning,The oily waste degradation that card grinding can be infected with by hydrochloride derusting in mechanical processing,Pass through one layer of nickel of preplating on the card grinding after sulfuric acid activated,So that combining for diamond dust and card grinding is even closer,It is handled by thickening,So that the diamond dust outer layer being adsorbed on card grinding adheres to one layer of nickel again,Greatly improve bond strength,Simultaneously,Upper sand is carried out using by card grinding insertion diamond dust,Card grinding contacts full and uniform with diamond dust,Improve electroplating quality.
Description
Technical field
The present invention relates to a kind of mechanical device more particularly to a kind of preparation methods of diamond dust card grinding.
Background technology
Nowadays with the rapid development of science and technology, single metal material is insufficient for certain specific demands, and answers
The rise of condensation material can meet many special performances and function, play an important role in modern science and technology.It is multiple
Close plating be exactly it is one or more it is insoluble it is evengranular be suspended in plating solution, be electroplated or chemical plating method, make
Particle is co-deposited with matrix metal, to form the composite deposite with various different performances.Using nickel as matrix metal, with Buddha's warrior attendant
Stone particle is dispersed phase, has high hardness and good wearability by the composite deposite that electro-deposition obtains, is widely used in
Cutter, in grinding tool.Existing diamond dust card grinding is often electroplated after direct oil removing in plating, the knot between diamond dust and card grinding
It is relatively low with joint efforts, and directly closing vanning after the completion of diamond dust plating, equally also easily there is diamond dust and falls off since binding force is low
The problems such as.In view of disadvantages described above, it is really necessary to design a kind of preparation method of diamond dust card grinding.
Invention content
Technical problem to be solved by the present invention lies in：A kind of preparation method of diamond dust card grinding is provided, to solve Buddha's warrior attendant
The sand problem low with card grinding binding force.
In order to solve the above technical problems, the technical scheme is that：A kind of preparation method of diamond dust card grinding, the Buddha's warrior attendant
The preparation method that needle is sanded includes the following steps：
1) ultrasonic cleaning：Cradle bottom is first laid with nylon wire, then card grinding is positioned over to nylon wire upper end in order, most
The Hanging Basket is positioned over oil removing 30-35min in degreasing fluid afterwards；
2) once flushing:Card grinding after step 1) ultrasonic cleaning is positioned in gutter channel and uses pure water rinsing 5-
8min；
3) once electrolytic oil removing：Card grinding after step 2) once flushing is completely immersed in the electrolytic cell for filling with degreasing fluid
Carry out electrolytic degreasing 10-15min；
4) secondary flushing：Card grinding after step 3) electrolytic degreasing is positioned in gutter channel and uses pure water rinsing 15min；
5) hydrochloride derusting：Card grinding after the secondary flushing of step 4) is completely immersed in the plastic channel for filling with dilute hydrochloric acid and is carried out
Derust 1-2min；
6) one of pure water embathes：Card grinding after step 5) hydrochloride derusting is first completely immersed in leaching in the sink for filling with pure water
Bubble 10-12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
4-6min carries out secondary embathe；
7) sulfuric acid activated：First the card grinding after step 6) pure water embathes is completely immersed in fill in the plastic channel of dilute sulfuric acid into
Row activation 4-5S；
8) two pure water embathe：Card grinding after step 7) is sulfuric acid activated is first completely immersed in leaching in the sink for filling with pure water
Bubble 10-12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
4-6min carries out secondary embathe；
9) it dries：The hair-dryer of the card grinding after two pure water of step 8) embathes first is dried up into water droplet, then card grinding is poured into
Pallet is put into oven and is dried, and the drying temperature is 120 °, and the drying time is 10min；
12) nickel preplating：First step 11) row's needle obtained is inserted into the shielding box being positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 10-15min can be prepared by it is pre-
Plating piece, the electroplating temperature are 37 DEG C -50 DEG C；
10) clamping：First the card grinding after step 9) drying is cooled to room temperature, then the tip of the card grinding is placed upwards
It is fixed in fixture；
11) tubulature：First heat-shrinkable T bush is sleeved on from top to bottom on the outside of the card grinding being fixed in fixture, reuses heat gun
Heat heat-shrinkable T bush so that heat-shrinkable T bush tightly card grinding is coated to the row's of being made needle, the tip of the card grinding exposes heat-shrinkable T bush
5-6mm；
13) sand on：First pre- plating piece made from step 12) is inserted into the sand box for filling with diamond dust, then by the cathode of power supply
It being connected on the outside of pre- plating piece, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 60-75min and can be prepared by semi-finished product,
The electroplating temperature is 45 DEG C -55 DEG C；
14) it thickeies：First semi-finished product made from step 13) are inserted into the shielding box that is positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 60-75min can be prepared by plus
Thick member, the electroplating temperature are 45 DEG C -55 DEG C；
15) unloading clip：Thickening piece made from step 14) is removed from fixture first, plate knife is reused and rows dry brokenly heat-shrink tube simultaneously
It tears heat-shrink tube off, finally the thickening piece is sequentially positioned in a concentration of 10% aqueous slkali and is stored；
16) bright nickel plating：First the thickening piece stored in aqueous slkali is taken out and is positioned in rolling basket, then by the rolling basket
It is positioned in electroplating bath, then the cathode of power supply is connected on the outside of the rolling basket, the anode of power supply is connected on the outside of nickel plate, starts electricity
Source carries out plating 2-3min and can be prepared by semi-finished product, and the electroplating temperature is 37 DEG C -50 DEG C；
17) it closes：First the semi-finished product after step 16) bright nickel plating are put into after standing 10S in confining liquid and are taken out, then made
The confining liquid on thick semi-finished product is dried up with wind turbine, finally semi-finished product are sequentially positioned over after pallet push-in baking oven drying at
Product.
The present invention is further improved as follows：
Further, in the step 5) dilute hydrochloric acid a concentration of 5%.
Further, in the step 7) dilute sulfuric acid a concentration of 5%.
Further, the temperature activated in the step 7) is 35-38 DEG C.
Further, semi-finished product are rotated clockwise to 180 ° in the horizontal direction every 15min in the step 14).
Further, the drying temperature described in the step 17) is 120 DEG C -125 DEG C, and the drying time is 10-
15min。
Advantageous effect of the present invention：The greasy dirt that card grinding can be infected in mechanical processing by ultrasonic cleaning, hydrochloride derusting
Removal, passes through one layer of nickel of preplating on the card grinding after sulfuric acid activated so that combining for diamond dust and card grinding is even closer, passes through
Thickening is handled so that and the diamond dust outer layer being adsorbed on card grinding adheres to one layer of nickel again, greatly improves bond strength, meanwhile, it adopts
Upper sand is carried out with by card grinding insertion diamond dust, card grinding contacts full and uniform, raising electroplating quality with diamond dust.
Description of the drawings
Fig. 1 shows front view of the present invention
Specific implementation mode
Embodiment 1
As shown in Figure 1, a kind of preparation method of diamond dust card grinding, the preparation method of the diamond dust card grinding includes following step
Suddenly：
1) ultrasonic cleaning：Cradle bottom is first laid with nylon wire, then card grinding is positioned over to nylon wire upper end in order, most
The Hanging Basket is positioned over oil removing 30min in degreasing fluid afterwards；
2) once flushing:Card grinding after step 1) ultrasonic cleaning is positioned in gutter channel and uses pure water rinsing
5min；
3) once electrolytic oil removing：Card grinding after step 2) once flushing is completely immersed in the electrolytic cell for filling with degreasing fluid
Carry out electrolytic degreasing 10min；
4) secondary flushing：Card grinding after step 3) electrolytic degreasing is positioned in gutter channel and uses pure water rinsing 15min；
5) hydrochloride derusting：Card grinding after the secondary flushing of step 4) is completely immersed in the plastic channel for filling with dilute hydrochloric acid and is carried out
Derust 1min；
6) one of pure water embathes：Card grinding after step 5) hydrochloride derusting is first completely immersed in leaching in the sink for filling with pure water
Bubble 10min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
4min carries out secondary embathe；
7) sulfuric acid activated：First the card grinding after step 6) pure water embathes is completely immersed in fill in the plastic channel of dilute sulfuric acid into
Row activation 4S；
8) two pure water embathe：Card grinding after step 7) is sulfuric acid activated is first completely immersed in leaching in the sink for filling with pure water
Bubble 10min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
4min carries out secondary embathe；
9) it dries：The hair-dryer of the card grinding after two pure water of step 8) embathes first is dried up into water droplet, then card grinding is poured into
Pallet is put into oven and is dried, and the drying temperature is 120 °, and the drying time is 10min；
12) nickel preplating：First step 11) row's needle obtained is inserted into the shielding box being positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 10-15min can be prepared by it is pre-
Plating piece, the electroplating temperature are 37 DEG C；
10) clamping：First the card grinding after step 9) drying is cooled to room temperature, then the tip of the card grinding is placed upwards
It is fixed in fixture；
11) tubulature：First heat-shrinkable T bush is sleeved on from top to bottom on the outside of the card grinding being fixed in fixture, reuses heat gun
Heat heat-shrinkable T bush so that heat-shrinkable T bush tightly card grinding is coated to the row's of being made needle, the tip of the card grinding exposes heat-shrinkable T bush
5mm；
13) sand on：First pre- plating piece made from step 12) is inserted into the sand box for filling with diamond dust, then by the cathode of power supply
It is connected on the outside of pre- plating piece, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 60min and can be prepared by semi-finished product, institute
The electroplating temperature stated is 45 DEG C；
14) it thickeies：First semi-finished product made from step 13) are inserted into the shielding box that is positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 60-75min can be prepared by plus
Thick member, the electroplating temperature are 45 DEG C；
15) unloading clip：Thickening piece made from step 14) is removed from fixture first, plate knife is reused and rows dry brokenly heat-shrink tube simultaneously
It tears heat-shrink tube off, finally the thickening piece is sequentially positioned in a concentration of 10% aqueous slkali and is stored；
16) bright nickel plating：First the thickening piece stored in aqueous slkali is taken out and is positioned in rolling basket, then by the rolling basket
It is positioned in electroplating bath, then the cathode of power supply is connected on the outside of the rolling basket, the anode of power supply is connected on the outside of nickel plate, starts electricity
Source carries out plating 2min and can be prepared by semi-finished product, and the electroplating temperature is 37 DEG C；
17) it closes：First the semi-finished product after step 16) bright nickel plating are put into after standing 10S in confining liquid and are taken out, then made
The confining liquid on thick semi-finished product is dried up with wind turbine, finally semi-finished product are sequentially positioned over after pallet push-in baking oven drying at
Product.
A concentration of the 5% of dilute hydrochloric acid in step 5) of the present invention, a concentration of the 5% of dilute sulfuric acid, institute in the step 7)
It is 35 DEG C to state the temperature activated in step 7), rotates clockwise semi-finished product in the horizontal direction every 15min in the step 14)
180 °, the drying temperature described in the step 17) is 120 DEG C, and the drying time is 10min.
Embodiment 2
As shown in Figure 1, a kind of preparation method of diamond dust card grinding, the preparation method of the diamond dust card grinding includes following step
Suddenly：
1) ultrasonic cleaning：Cradle bottom is first laid with nylon wire, then card grinding is positioned over to nylon wire upper end in order, most
The Hanging Basket is positioned over oil removing 33min in degreasing fluid afterwards；
2) once flushing:Card grinding after step 1) ultrasonic cleaning is positioned in gutter channel and uses pure water rinsing
6min；
3) once electrolytic oil removing：Card grinding after step 2) once flushing is completely immersed in the electrolytic cell for filling with degreasing fluid
Carry out electrolytic degreasing 13min；
4) secondary flushing：Card grinding after step 3) electrolytic degreasing is positioned in gutter channel and uses pure water rinsing 15min；
5) hydrochloride derusting：Card grinding after the secondary flushing of step 4) is completely immersed in the plastic channel for filling with dilute hydrochloric acid and is carried out
Derust 1min；
6) one of pure water embathes：Card grinding after step 5) hydrochloride derusting is first completely immersed in leaching in the sink for filling with pure water
Bubble 11min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
5min carries out secondary embathe；
7) sulfuric acid activated：First the card grinding after step 6) pure water embathes is completely immersed in fill in the plastic channel of dilute sulfuric acid into
Row activation 4S；
8) two pure water embathe：Card grinding after step 7) is sulfuric acid activated is first completely immersed in leaching in the sink for filling with pure water
Bubble 11min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
5min carries out secondary embathe；
9) it dries：The hair-dryer of the card grinding after two pure water of step 8) embathes first is dried up into water droplet, then card grinding is poured into
Pallet is put into oven and is dried, and the drying temperature is 120 °, and the drying time is 10min；
12) nickel preplating：First step 11) row's needle obtained is inserted into the shielding box being positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 10-15min can be prepared by it is pre-
Plating piece, the electroplating temperature are 38 DEG C；
10) clamping：First the card grinding after step 9) drying is cooled to room temperature, then the tip of the card grinding is placed upwards
It is fixed in fixture；
11) tubulature：First heat-shrinkable T bush is sleeved on from top to bottom on the outside of the card grinding being fixed in fixture, reuses heat gun
Heat heat-shrinkable T bush so that heat-shrinkable T bush tightly card grinding is coated to the row's of being made needle, the tip of the card grinding exposes heat-shrinkable T bush
5mm；
13) sand on：First pre- plating piece made from step 12) is inserted into the sand box for filling with diamond dust, then by the cathode of power supply
It is connected on the outside of pre- plating piece, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 72min and can be prepared by semi-finished product, institute
The electroplating temperature stated is 50 DEG C；
14) it thickeies：First semi-finished product made from step 13) are inserted into the shielding box that is positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 60-75min can be prepared by plus
Thick member, the electroplating temperature are 50 DEG C；
15) unloading clip：Thickening piece made from step 14) is removed from fixture first, plate knife is reused and rows dry brokenly heat-shrink tube simultaneously
It tears heat-shrink tube off, finally the thickening piece is sequentially positioned in a concentration of 10% aqueous slkali and is stored；
16) bright nickel plating：First the thickening piece stored in aqueous slkali is taken out and is positioned in rolling basket, then by the rolling basket
It is positioned in electroplating bath, then the cathode of power supply is connected on the outside of the rolling basket, the anode of power supply is connected on the outside of nickel plate, starts electricity
Source carries out plating 2min and can be prepared by semi-finished product, and the electroplating temperature is 38 DEG C；
17) it closes：First the semi-finished product after step 16) bright nickel plating are put into after standing 10S in confining liquid and are taken out, then made
The confining liquid on thick semi-finished product is dried up with wind turbine, finally semi-finished product are sequentially positioned over after pallet push-in baking oven drying at
Product.
A concentration of the 5% of dilute hydrochloric acid in step 5) of the present invention, a concentration of the 5% of dilute sulfuric acid, institute in the step 7)
It is 36 DEG C to state the temperature activated in step 7), rotates clockwise semi-finished product in the horizontal direction every 15min in the step 14)
180 °, the drying temperature described in the step 17) is 123 DEG C, and the drying time is 13min.
Embodiment 3
As shown in Figure 1, a kind of preparation method of diamond dust card grinding, the preparation method of the diamond dust card grinding includes following step
Suddenly：
1) ultrasonic cleaning：Cradle bottom is first laid with nylon wire, then card grinding is positioned over to nylon wire upper end in order, most
The Hanging Basket is positioned over oil removing 35min in degreasing fluid afterwards；
2) once flushing:Card grinding after step 1) ultrasonic cleaning is positioned in gutter channel and uses pure water rinsing
8min；
3) once electrolytic oil removing：Card grinding after step 2) once flushing is completely immersed in the electrolytic cell for filling with degreasing fluid
Carry out electrolytic degreasing 15min；
4) secondary flushing：Card grinding after step 3) electrolytic degreasing is positioned in gutter channel and uses pure water rinsing 15min；
5) hydrochloride derusting：Card grinding after the secondary flushing of step 4) is completely immersed in the plastic channel for filling with dilute hydrochloric acid and is carried out
Derust 2min；
6) one of pure water embathes：Card grinding after step 5) hydrochloride derusting is first completely immersed in leaching in the sink for filling with pure water
Bubble 12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
6min carries out secondary embathe；
7) sulfuric acid activated：First the card grinding after step 6) pure water embathes is completely immersed in fill in the plastic channel of dilute sulfuric acid into
Row activation 5S；
8) two pure water embathe：Card grinding after step 7) is sulfuric acid activated is first completely immersed in leaching in the sink for filling with pure water
Bubble 12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and is impregnated
6min carries out secondary embathe；
9) it dries：The hair-dryer of the card grinding after two pure water of step 8) embathes first is dried up into water droplet, then card grinding is poured into
Pallet is put into oven and is dried, and the drying temperature is 120 °, and the drying time is 10min；
12) nickel preplating：First step 11) row's needle obtained is inserted into the shielding box being positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, startup power supply carry out plating 10-15min can be prepared by it is pre-
Plating piece, the electroplating temperature are 50 DEG C；
10) clamping：First the card grinding after step 9) drying is cooled to room temperature, then the tip of the card grinding is placed upwards
It is fixed in fixture；
11) tubulature：First heat-shrinkable T bush is sleeved on from top to bottom on the outside of the card grinding being fixed in fixture, reuses heat gun
Heat heat-shrinkable T bush so that heat-shrinkable T bush tightly card grinding is coated to the row's of being made needle, the tip of the card grinding exposes heat-shrinkable T bush
6mm；
13) sand on：First pre- plating piece made from step 12) is inserted into the sand box for filling with diamond dust, then by the cathode of power supply
It is connected on the outside of pre- plating piece, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 75min and can be prepared by semi-finished product, institute
The electroplating temperature stated is 55 DEG C；
14) it thickeies：First semi-finished product made from step 13) are inserted into the shielding box that is positioned in electroplating bath, then by power supply
Cathode be connected on the outside of fixture, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 75min and can be prepared by thickening
Part, the electroplating temperature are 55 DEG C；
15) unloading clip：Thickening piece made from step 14) is removed from fixture first, plate knife is reused and rows dry brokenly heat-shrink tube simultaneously
It tears heat-shrink tube off, finally the thickening piece is sequentially positioned in a concentration of 10% aqueous slkali and is stored；
16) bright nickel plating：First the thickening piece stored in aqueous slkali is taken out and is positioned in rolling basket, then by the rolling basket
It is positioned in electroplating bath, then the cathode of power supply is connected on the outside of the rolling basket, the anode of power supply is connected on the outside of nickel plate, starts electricity
Source carries out plating 3min and can be prepared by semi-finished product, and the electroplating temperature is 50 DEG C；
17) it closes：First the semi-finished product after step 16) bright nickel plating are put into after standing 10S in confining liquid and are taken out, then made
The confining liquid on thick semi-finished product is dried up with wind turbine, finally semi-finished product are sequentially positioned over after pallet push-in baking oven drying at
Product.
A concentration of the 5% of dilute hydrochloric acid in step 5) of the present invention, a concentration of the 5% of dilute sulfuric acid, institute in the step 7)
It is 38 DEG C to state the temperature activated in step 7), rotates clockwise semi-finished product in the horizontal direction every 15min in the step 14)
180 °, the drying temperature described in the step 17) is 125 DEG C, and the drying time is 15min.
The present invention is not limited to above-mentioned specific embodiment, those skilled in the art from above-mentioned design,
Without performing creative labour, the various transformation made are within the scope of the present invention.
Claims (6)
1. a kind of preparation method of diamond dust card grinding, it is characterised in that the preparation method of the diamond dust card grinding includes the following steps：
1) ultrasonic cleaning：Cradle bottom is first laid with nylon wire, then card grinding is positioned over to nylon wire upper end in order, finally will
The Hanging Basket is positioned over oil removing 30-35min in degreasing fluid；
2) once flushing:Card grinding after step 1) ultrasonic cleaning is positioned in gutter channel and uses pure water rinsing 5-8min；
3) once electrolytic oil removing：Card grinding after step 2) once flushing is completely immersed in the electrolytic cell for filling with degreasing fluid and is carried out
Electrolytic degreasing 10-15min；
4) secondary flushing：Card grinding after step 3) electrolytic degreasing is positioned in gutter channel and uses pure water rinsing 15min；
5) hydrochloride derusting：Card grinding after the secondary flushing of step 4) is completely immersed in the plastic channel for fill with dilute hydrochloric acid and is derusted
1-2min；
6) one of pure water embathes：First the card grinding after step 5) hydrochloride derusting is completely immersed in the sink for filling with pure water and is impregnated
10-12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and impregnates 4-
6min carries out secondary embathe；
7) sulfuric acid activated：First the card grinding after step 6) pure water embathes is completely immersed in the plastic channel for fill with dilute sulfuric acid and is lived
Change 4-5S；
8) two pure water embathe：First the card grinding after step 7) is sulfuric acid activated is completely immersed in the sink for filling with pure water and is impregnated
10-12min is once embathed, then the card grinding after once embathing is completely immersed in other one sink for filling with pure water and impregnates 4-
6min carries out secondary embathe；
9) it dries：The hair-dryer of the card grinding after two pure water of step 8) embathes first is dried up into water droplet, then card grinding is poured into pallet
It is put into oven to be dried, the drying temperature is 120 °, and the drying time is 10min；
12) nickel preplating：First step 11) row's needle obtained is inserted into the shielding box being positioned in electroplating bath, then bearing power supply
Pole is connected on the outside of fixture, and the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 10-15min and can be prepared by pre- plating piece,
The electroplating temperature is 37 DEG C -50 DEG C；
10) clamping：First the card grinding after step 9) drying is cooled to room temperature, then the tip of the card grinding is positioned over folder upwards
It is fixed in tool；
11) tubulature：First heat-shrinkable T bush is sleeved on from top to bottom on the outside of the card grinding being fixed in fixture, reuses heat gun heating
Heat-shrinkable T bush so that heat-shrinkable T bush tightly card grinding is coated to the row's of being made needle, the tip of the card grinding exposes heat-shrinkable T bush 5-
6mm；
13) sand on：First pre- plating piece made from step 12) is inserted into the sand box for filling with diamond dust, then the cathode of power supply is connected on
On the outside of pre- plating piece, the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 60-75min and can be prepared by semi-finished product, described
Electroplating temperature be 45 DEG C -55 DEG C；
14) it thickeies：First semi-finished product made from step 13) are inserted into the shielding box being positioned in electroplating bath, then bearing power supply
Pole is connected on the outside of fixture, and the anode of power supply is connected on the outside of nickel plate, and startup power supply carries out plating 60-75min and can be prepared by thickening piece,
The electroplating temperature is 45 DEG C -55 DEG C；
15) unloading clip：Thickening piece made from step 14) is removed from fixture first, plate knife is reused and rows dry brokenly and heat-shrink tube and tear off
The thickening piece is finally sequentially positioned in a concentration of 10% aqueous slkali and stores by heat-shrink tube；
16) bright nickel plating：First the thickening piece stored in aqueous slkali is taken out and is positioned in rolling basket, then the rolling basket is placed
Be connected on the outside of the rolling basket in electroplating bath, then by the cathode of power supply, the anode of power supply is connected on the outside of nickel plate, startup power supply into
Row plating 2-3min can be prepared by semi-finished product, and the electroplating temperature is 37 DEG C -50 DEG C；
17) it closes：First the semi-finished product after step 16) bright nickel plating are put into after standing 10S in confining liquid and are taken out, reuses wind
Machine dries up the confining liquid on thick semi-finished product, and baking oven drying finished product is pushed into after semi-finished product to be finally sequentially positioned over to pallet.
2. the preparation method of diamond dust card grinding as described in claim 1, it is characterised in that dilute hydrochloric acid is dense in the step 5)
Degree is 5%.
3. the preparation method of diamond dust card grinding as described in claim 1, it is characterised in that dilute sulfuric acid is dense in the step 7)
Degree is 5%.
4. the preparation method of diamond dust card grinding as described in claim 1, it is characterised in that the temperature activated in the step 7)
It is 35-38 DEG C.
5. the preparation method of diamond dust card grinding as described in claim 1, it is characterised in that every 15min in the step 14)
Semi-finished product are rotated clockwise to 180 ° in the horizontal direction.
6. the preparation method of diamond dust card grinding as described in claim 1, it is characterised in that the drying described in the step 17)
Temperature is 120 DEG C -125 DEG C, and the drying time is 10-15min.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109402683A (en) * | 2018-12-12 | 2019-03-01 | 常州大学 | A kind of initialization layer and the ultrasonic raising coating binding force method combined |
| CN109652844A (en) * | 2019-01-09 | 2019-04-19 | 深圳市常兴技术股份有限公司 | Plating plating sand technique |
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| CN109652844A (en) * | 2019-01-09 | 2019-04-19 | 深圳市常兴技术股份有限公司 | Plating plating sand technique |
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