CN108587045A - A kind of computer connector matrix - Google Patents
A kind of computer connector matrix Download PDFInfo
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- CN108587045A CN108587045A CN201810465125.XA CN201810465125A CN108587045A CN 108587045 A CN108587045 A CN 108587045A CN 201810465125 A CN201810465125 A CN 201810465125A CN 108587045 A CN108587045 A CN 108587045A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/322—Ammonium phosphate
- C08K2003/323—Ammonium polyphosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of computer connector matrixes, are related to computer connector art field, including following raw material：ABS terpolymers, makrolon, polyurethane rubber, ZAO nanopowders, brucite fiber, clay grade mica, lead-zinc ore floating tailing, sepiolite, plasticizer, crosslinking agent, coupling agent, fire retardant.The connector matrix of the present invention all has in the feature of environmental protection and preparation efficiency scale, shielding, physics and chemistry etc. to be obviously improved, and is widely used, superior in durability.
Description
Technical field
The present invention relates to computer connector art fields, and in particular to a kind of computer connector matrix.
Background technology
The normal operation of computer works, and does not leave the application of connector, and connector is also connector, that is, connects two
The device of active device is used for transmission electric current or signal.Connector includes connector matrix and the connector end which is provided with
Son.But with the fast development of computer industry, connector matrix is also high towards intensity, big, the light-weighted direction of rigidity is developed,
Connector matrix on the market mostly uses made from plastic alloy at present, has good application and physical and chemical stability.But with
Social progress, the development of computer and the complication of application environment, for protection, ensure fragile electronic component,
The considerations of reinforcing the factors such as the reliability of overall architecture intensity and electric power signal conveying, existing computer on the market connects
The protective value of plug-in unit matrix seems less and less adequate, not comprehensive enough, especially on electromagnetic shielding and durable performance, certain journey
Its application is limited on degree, therefore, it is necessary to improve.
Invention content
For problems of the prior art, the present invention provides a kind of computer connector matrix, this kind of connectors
Matrix all has in the feature of environmental protection and preparation efficiency scale, shielding, physics and chemistry etc. and is obviously improved.
In order to achieve the above object, the present invention is achieved through the following technical solutions：
A kind of computer connector matrix, including following raw material by weight：
60-70 parts of ABS terpolymers；
20-30 parts of makrolon；
10-20 parts of polyurethane rubber；
4-6 parts of ZAO nanopowders；
1-2 parts of brucite fiber；
2-3 parts of clay grade mica；
4-6 parts of lead-zinc ore floating tailing；
3-5 parts of sepiolite；
1.5-2.5 parts of plasticizer；
1-2 parts of crosslinking agent；
1-2 parts of coupling agent；
1-1.5 parts of fire retardant.
Further, above computer connector matrix includes following raw material by weight：
65 parts of ABS terpolymers；
25 parts of makrolon；
15 parts of polyurethane rubber；
5 parts of ZAO nanopowders；
1.5 parts of brucite fiber；
2.5 parts of clay grade mica；
5 parts of lead-zinc ore floating tailing；
4 parts of sepiolite；
2 parts of plasticizer；
1.5 parts of crosslinking agent；
1.5 parts of coupling agent；
1.25 parts of fire retardant.
Further, above-mentioned ABS terpolymers include two kinds of ABS, and the content of A monomers is 24- in the first ABS
The content of 28%, S monomer is 61-65%；The content of A monomers is 31-33% in second of ABS, and the content of S monomers is 50-
52%；And the mass ratio of the first ABS and second of ABS are 2:1.
Preferably, above-mentioned plasticizer is using one in tributyl citrate, octyl epoxy stearate, trioctyl trimellitate (TOTM)
Kind or more than one.
Preferably, above-mentioned crosslinking agent is trimethylolpropane, m-xylene diamine, tetra-n-butyl titanate in mass ratio 3:1:1
It is blended.
Preferably, above-mentioned coupling agent uses aluminum-zirconium bimetallic coupling agent.
Preferably, above-mentioned fire retardant is ammonium polyphosphate, tert-butylation aryl phosphate ester in mass ratio 1:2 are blended.
Further, the preparation method of above computer connector matrix includes the following steps：
(1) raw material is weighed by the weight；
(2) raw material brucite fiber, clay grade mica, lead-zinc ore floating tailing, sepiolite are delivered to attrition grinding and set
It is ground in standby to fineness and is less than or equal to 20 microns；
(3) batch mixing：It is divided into following three phases
Ⅰ：ABS terpolymers, makrolon, polyurethane rubber are delivered in high temperature kneader, in temperature 175-185
Kneading mixing 10-12min under the conditions of DEG C obtains batch mixing A；
Ⅱ：Remaining other raw materials are added in high temperature kneader again and are mixed with batch mixing A, in 170-180 DEG C of condition of temperature
Lower kneading mixing 25-35min, obtains mixing material；
(4) the extruded granulation of material, injection molding will be kneaded；
The injection molding process conditions are：Barrel first stage temperature is 170-180 DEG C, and second stage temperature is 180-
190 DEG C, phase III temperature is 190-200 DEG C, and fourth stage temperature is 175-185 DEG C, and nozzle temperature is 190-200 DEG C.
The present invention has following advantageous effect：
(1) feature of environmental protection and preparation efficiency scale：Computer connector matrix zero-emission, the nothing in process of production of the present invention
Pollution does not generate any harmful, penetrating odor, environmentally protective, the recyclable recycling of waste product, and utilization rate is high；Production process
Compatibility performance is good between middle raw material, and production efficiency is high, prepares simple and convenient, and transport assembling is convenient, suitable scale of mass production；Pass through
To the ingenious selection of raw materials for production and its inventive improvements of preparation process, ABS terpolymers in raw material, ZAO nanopowders,
The synergistic effect of the ingredients such as brucite fiber, coupling agent makes basis material obtained reach following effect：
(2) shielding：The computer connector matrix of the present invention can have electromagnetic wave, sound wave and infrared ray good
Reflectivity is shielded, has ensured the normal work running of computer system and its interior electronic component；
(3) density is small：The computer connector matrix of the present invention can realize the frivolous mesh of basal body structure thickness, weight
, on the one hand, save the output of material cost, on the other hand, inside computer system heat of being more convenient for it is scattered but；
(4) physics and chemistry：The computer connector matrix physicochemical property of the present invention is stablized, and has excellent resistance to compression and surrender strong
Degree, impact resistance toughness, abrasion and corrosion resistance, weather-proof ageing resistance, waterproof frost resistance and heat-resistant fireproof etc., insulating properties
Good, antistatic, coefficient of thermal expansion is small, and structural integrity is securely unlikely to deform, and application scenario is extensive, and service life is long.
Specific implementation mode
The specific implementation mode of the present invention is further described with reference to embodiment, following embodiment is only used for more
Technical scheme of the present invention is clearly demonstrated, and not intended to limit the protection scope of the present invention.
Embodiment 1
A kind of computer connector matrix, including following raw material by weight：
60 parts of ABS terpolymers；
20 parts of makrolon；
10 parts of polyurethane rubber；
4 parts of ZAO nanopowders；
1 part of brucite fiber；
2 parts of clay grade mica；
4 parts of lead-zinc ore floating tailing；
3 parts of sepiolite；
1.5 parts of plasticizer；
1 part of crosslinking agent；
1 part of coupling agent；
1 part of fire retardant.
The selection of above-mentioned part material is as shown in table 1 below：
Table 1
In addition, the preparation method of above computer connector matrix follows the steps below：
(1) the above-mentioned brucite fiber weighed, clay grade mica, lead-zinc ore floating tailing, sepiolite are delivered to
It is ground in attrition grinding equipment to fineness and is less than or equal to 20 microns；
(2) batch mixing：It is divided into following three phases
Ⅰ：ABS terpolymers, makrolon, polyurethane rubber are delivered in high temperature kneader, in 175 DEG C of items of temperature
Kneading mixing 12min under part obtains batch mixing A；
Ⅱ：Remaining other raw materials are added in high temperature kneader again and are mixed with batch mixing A, are pinched under the conditions of 170 DEG C of temperature
It closes and is kneaded 35min, obtain mixing material；
(3) the extruded granulation of material, injection molding will be kneaded；
Wherein, injection molding process conditions are：Barrel first stage temperature is 170 DEG C, and second stage temperature is 180 DEG C,
Phase III temperature is 190 DEG C, and fourth stage temperature is 175 DEG C, and nozzle temperature is 190 DEG C.
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥162MPa；
2) impact toughness：≥26J/cm2；
3) electromagnet shield effect：≥120dB(10GHz).
Comparative example 1
A kind of computer connector matrix, raw materials for production and preparation method are same as Example 1, but which part raw material
Selection it is as shown in table 2 below：
Table 2
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥120MPa；
2) impact toughness：≥18J/cm2；
3) electromagnet shield effect：≥75dB(10GHz).
Embodiment 2
A kind of computer connector matrix, including following raw material by weight：
65 parts of ABS terpolymers；
25 parts of makrolon；
15 parts of polyurethane rubber；
5 parts of ZAO nanopowders；
1.5 parts of brucite fiber；
2.5 parts of clay grade mica；
5 parts of lead-zinc ore floating tailing；
4 parts of sepiolite；
2 parts of plasticizer；
1.5 parts of crosslinking agent；
1.5 parts of coupling agent；
1.25 parts of fire retardant.
The selection of above-mentioned part material is as shown in table 3 below：
Table 3
In addition, the preparation method of above computer connector matrix follows the steps below：
(1) the above-mentioned brucite fiber weighed, clay grade mica, lead-zinc ore floating tailing, sepiolite are delivered to
It is ground in attrition grinding equipment to fineness and is less than or equal to 20 microns；
(2) batch mixing：It is divided into following three phases
Ⅰ：ABS terpolymers, makrolon, polyurethane rubber are delivered in high temperature kneader, in 180 DEG C of items of temperature
Kneading mixing 11min under part obtains batch mixing A；
Ⅱ：Remaining other raw materials are added in high temperature kneader again and are mixed with batch mixing A, are pinched under the conditions of 175 DEG C of temperature
It closes and is kneaded 30min, obtain mixing material；
(3) the extruded granulation of material, injection molding will be kneaded；
Wherein, injection molding process conditions are：Barrel first stage temperature is 175 DEG C, and second stage temperature is 185 DEG C,
Phase III temperature is 195 DEG C, and fourth stage temperature is 180 DEG C, and nozzle temperature is 195 DEG C.
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥164MPa；
2) impact toughness：≥25J/cm2；
3) electromagnet shield effect：≥120dB(10GHz).
Comparative example 2
A kind of computer connector matrix, raw materials for production and preparation method are same as Example 2, but which part raw material
Selection it is as shown in table 4 below：
Table 4
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥120MPa；
2) impact toughness：≥20J/cm2；
3) electromagnet shield effect：≥75dB(10GHz).
Embodiment 3
A kind of computer connector matrix, including following raw material by weight：
70 parts of ABS terpolymers；
30 parts of makrolon；
20 parts of polyurethane rubber；
6 parts of ZAO nanopowders；
2 parts of brucite fiber；
3 parts of clay grade mica；
6 parts of lead-zinc ore floating tailing；
5 parts of sepiolite；
2.5 parts of plasticizer；
2 parts of crosslinking agent；
2 parts of coupling agent；
1.5 parts of fire retardant.
The selection of above-mentioned part material is as shown in table 5 below：
Table 5
In addition, the preparation method of above computer connector matrix follows the steps below：
(1) the above-mentioned brucite fiber weighed, clay grade mica, lead-zinc ore floating tailing, sepiolite are delivered to
It is ground in attrition grinding equipment to fineness and is less than or equal to 20 microns；
(2) batch mixing：It is divided into following three phases
Ⅰ：ABS terpolymers, makrolon, polyurethane rubber are delivered in high temperature kneader, in 185 DEG C of items of temperature
Kneading mixing 10min under part obtains batch mixing A；
Ⅱ：Remaining other raw materials are added in high temperature kneader again and are mixed with batch mixing A, are pinched under the conditions of 180 DEG C of temperature
It closes and is kneaded 25min, obtain mixing material；
(3) the extruded granulation of material, injection molding will be kneaded；
Wherein, injection molding process conditions are：Barrel first stage temperature is 180 DEG C, and second stage temperature is 190 DEG C,
Phase III temperature is 200 DEG C, and fourth stage temperature is 185 DEG C, and nozzle temperature is 200 DEG C.
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥165MPa；
2) impact toughness：≥24J/cm2；
3) electromagnet shield effect：≥120dB(10GHz).
Comparative example 3
A kind of computer connector matrix, raw materials for production and preparation method are same as Example 3, but which part raw material
Selection it is as shown in table 6 below：
Table 6
Connector substrate performance parameter obtained above is as follows：
1) yield strength：≥124MPa；
2) impact toughness：≥20J/cm2
3) electromagnet shield effect：≥76dB(10GHz).
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution recorded in example is modified or equivalent replacement of some of the technical features.All essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (8)
1. a kind of computer connector matrix, which is characterized in that including following raw material by weight：
60-70 parts of ABS terpolymers；
20-30 parts of makrolon；
10-20 parts of polyurethane rubber；
4-6 parts of ZAO nanopowders；
1-2 parts of brucite fiber；
2-3 parts of clay grade mica；
4-6 parts of lead-zinc ore floating tailing；
3-5 parts of sepiolite；
1.5-2.5 parts of plasticizer；
1-2 parts of crosslinking agent；
1-2 parts of coupling agent；
1-1.5 parts of fire retardant.
2. a kind of computer connector matrix according to claim 1, which is characterized in that including it is following by weight
Raw material：
65 parts of ABS terpolymers；
25 parts of makrolon；
15 parts of polyurethane rubber；
5 parts of ZAO nanopowders；
1.5 parts of brucite fiber；
2.5 parts of clay grade mica；
5 parts of lead-zinc ore floating tailing；
4 parts of sepiolite；
2 parts of plasticizer；
1.5 parts of crosslinking agent；
1.5 parts of coupling agent；
1.25 parts of fire retardant.
3. a kind of computer connector matrix according to claim 1, which is characterized in that the ABS terpolymers packet
Include two kinds of ABS, the content of A monomers is 24-28% in the first ABS, and the content of S monomers is 61-65%；A is mono- in second of ABS
The content of body is 31-33%, and the content of S monomers is 50-52%；And the mass ratio of the first ABS and second of ABS are 2:1.
4. a kind of computer connector matrix according to claim 1, which is characterized in that the plasticizer is citric acid three
It is one or more than one kinds of in butyl ester, octyl epoxy stearate, trioctyl trimellitate (TOTM).
5. a kind of computer connector matrix according to claim 1, which is characterized in that the crosslinking agent is trihydroxy methyl
Propane, m-xylene diamine, tetra-n-butyl titanate in mass ratio 3:1:1 is blended.
6. a kind of computer connector matrix according to claim 1, which is characterized in that the coupling agent is that aluminum-zirconium is double
Metal coupling agent.
7. a kind of computer connector matrix according to claim 1, which is characterized in that the fire retardant is polyphosphoric acid
Ammonium, tert-butylation aryl phosphate ester in mass ratio 1:2 are blended.
8. according to a kind of computer connector matrix of claim 1-7 any one of them, which is characterized in that the system of described matrix
Preparation Method includes the following steps：
(1) raw material is weighed by the weight；
(2) by raw material brucite fiber, clay grade mica, lead-zinc ore floating tailing, sepiolite grind to fineness be less than etc.
In 20 microns；
(3) batch mixing：It is divided into following three phases
Ⅰ：Kneading mixing 10- under the conditions of being 175-185 DEG C by ABS terpolymers, makrolon, polyurethane rubber temperature
12min obtains batch mixing A；
Ⅱ：Remaining other raw materials are mixed with batch mixing A again, kneading mixing 25-35min under the conditions of 170-180 DEG C of temperature is obtained mixed
Refine material；
(4) the extruded granulation of material, injection molding will be kneaded；
The injection molding process conditions are：Barrel first stage temperature is 170-180 DEG C, and second stage temperature is 180-190
DEG C, phase III temperature is 190-200 DEG C, and fourth stage temperature is 175-185 DEG C, and nozzle temperature is 190-200 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810465125.XA CN108587045A (en) | 2018-05-16 | 2018-05-16 | A kind of computer connector matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810465125.XA CN108587045A (en) | 2018-05-16 | 2018-05-16 | A kind of computer connector matrix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108587045A true CN108587045A (en) | 2018-09-28 |
Family
ID=63631244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810465125.XA Withdrawn CN108587045A (en) | 2018-05-16 | 2018-05-16 | A kind of computer connector matrix |
Country Status (1)
| Country | Link |
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| CN (1) | CN108587045A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110437575A (en) * | 2019-07-31 | 2019-11-12 | 天长市宏福电子有限公司 | A kind of relay1 case flame-resistant insulation composite material and preparation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104371257A (en) * | 2013-08-12 | 2015-02-25 | 青岛博研达工业技术研究所(普通合伙) | Multifunctional ABS composite material |
-
2018
- 2018-05-16 CN CN201810465125.XA patent/CN108587045A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104371257A (en) * | 2013-08-12 | 2015-02-25 | 青岛博研达工业技术研究所(普通合伙) | Multifunctional ABS composite material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110437575A (en) * | 2019-07-31 | 2019-11-12 | 天长市宏福电子有限公司 | A kind of relay1 case flame-resistant insulation composite material and preparation method |
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Application publication date: 20180928 |
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