CN108570651A - A kind of horizontal magnetron sputtering film production line of multi-chamber and its film plating process - Google Patents
A kind of horizontal magnetron sputtering film production line of multi-chamber and its film plating process Download PDFInfo
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- CN108570651A CN108570651A CN201810606746.5A CN201810606746A CN108570651A CN 108570651 A CN108570651 A CN 108570651A CN 201810606746 A CN201810606746 A CN 201810606746A CN 108570651 A CN108570651 A CN 108570651A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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Abstract
The invention belongs to filming equipment technical fields, a kind of horizontal magnetron sputtering film production line of multi-chamber is specifically disclosed, its direction advanced along substrate includes feeding platform successively, into piece room, heating room, preceding surge chamber, at least two mutually independent magnetic control sputtering vacuum coating rooms, rear surge chamber, cooling chamber and blanking bench, further includes the transmission mechanism for being used for transmission substrate.The film-formation result of the magnetron sputtering film production line magnetron sputtering is good, meets the continuous coating demand of multilayer functional film, while its production efficiency is high, and the utilization rate of target is high, reduces the use cost of target.
Description
Technical field
The invention belongs to plated film production technical field, more particularly to the horizontal magnetron sputtering film production line of a kind of multi-chamber and
Its film plating process.
Background technology
In microelectronic industry and photovoltaic industry technology growing today, vacuum coating technology is in above-mentioned industry development
Indispensable role is played, while the complication and the diversified requirement of film layer of device are also to the structure of vacuum coating equipment
More stringent requirements are proposed with function, is meeting except the requirement of technological process, it is also desirable to can realize the industrialization of serialization
Production.
Currently, using it is more be the more target plated film modes of single vacuum chamber, although the system of different membrane systems can be realized
It is standby, but its intermittent mode of production limits its continuous production, and different vacuum sputtering membrane interlayers can have pollution
The phenomenon that, the boundary between different film layers is also not bery apparent, the serious performance for affecting plating membrane module；In addition, existing continuous
Routinely using the form of plane sputtering target material in metaplasia producing line, it is relatively low that there are target utilizations, and production efficiency is not high to be lacked
Point.
Therefore, research and develop a kind of production efficiency that can improve plated film, the plated film requirement for meeting multilayer functional film multi-cavity
The horizontal magnetron sputtering film production line in room is extremely urgent.
Invention content
The purpose of the present invention is overcome the deficiencies in the prior art, disclose a kind of horizontal magnetron sputtering plating production of multi-chamber
The film-formation result of line, the magnetron sputtering film production line magnetron sputtering is good, meets the continuous coating demand of multilayer functional film,
Its production efficiency is high simultaneously, and the utilization rate of target is high, reduces the use cost of target.
In order to reach above-mentioned technical purpose, the present invention is realized by following technical scheme：
The horizontal magnetron sputtering film production line of a kind of multi-chamber of the present invention, the direction advanced along substrate are wrapped successively
Include feeding platform, into piece room, heating room, preceding surge chamber, at least two mutually independent magnetic control sputtering vacuum coating rooms, rear buffering
Room, cooling chamber and blanking bench further include the transmission mechanism for being used for transmission substrate.
As being further improved for above-mentioned technology, cylindric magnetron sputtering is equipped in the magnetic control sputtering vacuum coating room
Target.
In the present invention, the quantity of the magnetic control sputtering vacuum coating room is three, can also be according to the need of practical film layer
It is set as more.
In the present invention, the transmission mechanism is variable-frequency motor speed reducer drive mechanism.
The invention also discloses the film plating process of the horizontal magnetron sputtering film production line of the multi-chamber, specific steps
It is：
(1) forvacuum and ionic discharge clean pretreatment process, and substrate is transmitted to from feeding platform into after piece room, into
Carry out forvacuum process in piece interior is cleaned using ionic discharge and is pre-processed；
(2) heating treatment step：Substrate is heated in heating interior；
(3) buffered process before：The substrate of heating is subjected to buffering transition in preceding surge chamber；
(4) multiple tracks continuous magnetron sputtering vacuum coating treatment process：By substrate successively into excessively mutually independent magnetron sputtering
Vacuum film coating chamber carries out coating film treatment；
(5) buffered process afterwards：The substrate for having carried out the processing of multiple tracks magnetic control sputtering vacuum coating is subjected to buffering transition
To atmospheric pressure；
(6) cooling treatment process：The substrate of plated film progress cooling treatment is restored to room temperature in cooling chamber；
(7) discharge process：The coated product for the normal temperature and pressure that cooling chamber comes out is delivered to blanking bench.
In above-mentioned steps (1) forvacuum and ionic discharge cleaning pretreatment process, using radio frequency high tension discharge power supply pair
Substrate surface carries out argon gas discharging cleaning, and processing air pressure is 5-100Pa, discharge power 100-500W, and the Discharge Cleaning time is
10-20 minutes.
The heating treatment step of above-mentioned steps (2) is specifically substrate to be sent to heating room, in 200-250 degrees Celsius of temperature
Substrate is toasted 15-20 minutes under degree.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) coating film production line of the present invention, due to being provided with multiple mutually independent magnetic control sputtering vacuum coatings
Room can carry out the processing of multiple tracks continuity filming process successively, can sputter unlike material target according to technological requirement, realize respectively
Prepared by different metal layer or the magnetron sputtering of nonmetallic materials, mutually isolated magnetron sputtering plating chamber can be effectively
The pollution between different sputtered layers is prevented, ensures the apparent boundary between different film layers, meets the plating of multilayer functional film
Film requirement.
(2) coating film production line of the present invention, ionic discharge cleaning pretreatment assist in removing the impurity of substrate surface
With greasy dirt and improve its surface-active, be conducive to improve the adhesive force between film layer and substrate when follow-up plated film；And heating can
The aqueous vapor for removing adsorption is likewise advantageous to improve the adhesive force of magnetron sputtering film layer and substrate, be splashed to improve magnetic control
The film-formation result penetrated；
(3) coating film production line of the present invention, due to using variable-frequency motor speed reducer drive mechanism, ensure each room and
The adjustable structure design of transmission speed of outside recycling frame and transition bench can be realized within the unit interval according to technological requirement
Substrate stablizes transmission between different chamber, meets the needs of industrialized production plated film, while the speed change of substrate drive speed
The adjustable mode of spacing of adjustable and corresponding sputtering chamber sputtering target material, while coating can be also improved in substrate surface in coating process
Uniformity；
(4) magnetic control spattering target is using cylindrical target and the high-power DC power supply of configuration, realize to metal targets and
The magnetron sputtering of nonmetallic target, cylindrical target rotates simultaneously after starter enables the utilization rate to target greatly improve, high-power electricity
Source can improve the sputter rate of film, can more further increase the production efficiency of plated film.
Description of the drawings
The present invention is described in detail in the following with reference to the drawings and specific embodiments：
Fig. 1 is the horizontal magnetron sputtering plating production-line arrangement schematic diagram of multi-chamber of the present invention.
Specific implementation mode
The horizontal magnetron sputtering film production line of a kind of multi-chamber of the present invention, the direction advanced along substrate are wrapped successively
Include feeding platform 1, into piece room 2, heating room 3,4, three mutually independent magnetic control sputtering vacuum coating rooms 5,6,7 of preceding surge chamber, after
Surge chamber 8, cooling chamber 9 and blanking bench 10 further include the transmission mechanism (not shown) for being used for transmission substrate.
In the present invention, it is equipped with cylindric magnetron sputtering in three mutually independent magnetic control sputtering vacuum coating rooms 5,6,7
Target.
In the present invention, the transmission mechanism is variable-frequency motor speed reducer drive mechanism.
The invention also discloses the film plating process of the horizontal magnetron sputtering film production line of the multi-chamber, specific steps
It is：
(1) forvacuum and ionic discharge clean pretreatment process, and substrate is transmitted to from feeding platform 1 into after piece room 2,
Forvacuum process is carried out in into piece room 2, is cleaned and is pre-processed using ionic discharge, specifically：It is discharged using radio frequency high tension electric
Source carries out argon gas discharging cleaning to substrate surface, and processing air pressure is 5-100Pa, discharge power 100-500W, when Discharge Cleaning
Between be 10-20 minutes.
(2) heating treatment step：Substrate is heated in heating room 3, specifically in 200-250 degrees Celsius of temperature
Substrate is toasted 15-20 minutes under degree.
(3) buffered process before：The substrate of heating is subjected to buffering transition in preceding surge chamber 4；
(4) multiple tracks continuous magnetron sputtering vacuum coating treatment process：By substrate successively into excessively mutually independent magnetron sputtering
Vacuum film coating chamber 5,6,7 carries out coating film treatment；
(5) buffered process afterwards：The substrate of multiple tracks magnetic control sputtering vacuum coating processing will have been carried out in rear surge chamber 8
It carries out buffering and transits to atmospheric pressure；
(6) cooling treatment process：The substrate of plated film cooling treatment is carried out in cooling chamber 9 to restore to room temperature；
(7) plated film completion and discharge process：The coated product for the normal temperature and pressure that cooling chamber comes out is delivered to blanking bench 10.
It is explained its plating steps below by way of a specific application example：
(1) glass substrate for choosing certain size specification is sent after cleaning preparation before plated film by transport mechanism
To into piece room, after forvacuum, then radio frequency high tension discharge power supply is used to carry out argon gas discharging cleaning to glass surface, handle air pressure
For 5Pa, discharge power 100W, the Discharge Cleaning time is 10 minutes；
(2) after the completion of electric discharge pretreatment, glass substrate is sent to heating room 3, to glass base under 200 degree celsius temperatures
Piece toasts 15 minutes；
(3) after completing heat treatment, it is being sent to first independent magnetron sputtering plating room 5 by preceding surge chamber 4,
In the coating chamber, tin indium oxide target material is sputtered using d.c. sputtering mode, depositing 1 micron thick transparent in glass substrate surface leads
Electroxidation indium tin thin film；
(4) continue to be sent to second independent magnetron sputtering plating room 6, sputtered and aoxidized using high pressure mid frequency sputtering technique
Silicon target, the silicon oxide film of redeposited 500nm thickness；
(5) finally, it is resent to the independent magnetron sputtering plating room 7 of third, gold is sputtered by the way of d.c. sputtering
Belong to copper, prepared by the sputtering that 1 micron thick copper metal film is completed on surface.
(6) after completing magnetron sputtering membrane process, surge chamber 8 and cooling chamber 9 after the sheet glass warp after plated film, then restore
It is taken out from blanking bench 10 after atmospheric pressure, completes entire serialization coating process.
The invention is not limited in the above embodiment, every various changes or modifications to the present invention do not depart from the present invention
Spirit and scope, if these modification and variations belong within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to also imply that comprising these modification and variations.
Claims (7)
1. a kind of horizontal magnetron sputtering film production line of multi-chamber, it is characterised in that：The direction advanced along substrate includes successively
Feeding platform, into piece room, heating room, preceding surge chamber, at least two mutually independent magnetic control sputtering vacuum coating rooms, rear surge chamber,
Cooling chamber and blanking bench further include the transmission mechanism for being used for transmission substrate.
2. the horizontal magnetron sputtering film production line of multi-chamber according to claim 1, it is characterised in that：The magnetron sputtering
Cylindric magnetic controlled sputtering target is equipped in vacuum coating room.
3. the horizontal magnetron sputtering film production line of multi-chamber according to claim 1, it is characterised in that：The magnetron sputtering
The quantity of vacuum film coating chamber is three.
4. the horizontal magnetron sputtering film production line of multi-chamber according to claim 1, it is characterised in that：The transmission mechanism
For variable-frequency motor speed reducer drive mechanism.
5. the film plating process of the horizontal magnetron sputtering film production line of multi-chamber according to any one of claims 1 to 4, tool
Body step is：
(1) forvacuum and ionic discharge clean pretreatment process, and substrate is transmitted to from feeding platform into after piece room, into piece room
Interior progress forvacuum process is cleaned using ionic discharge and is pre-processed；
(2) heating treatment step：Substrate is heated in heating interior；
(3) buffered process before：The substrate of heating is subjected to buffering transition in preceding surge chamber；
(4) multiple tracks continuous magnetron sputtering vacuum coating treatment process：By substrate successively into excessively mutually independent magnetron sputtered vacuum
Coating chamber carries out coating film treatment；
(5) buffered process afterwards：The substrate for having carried out the processing of multiple tracks magnetic control sputtering vacuum coating is carried out buffering to transit to greatly
Air pressure；
(6) cooling treatment process：The substrate of plated film progress cooling treatment is restored to room temperature in cooling chamber；
(7) discharge process：The coated product for the normal temperature and pressure that cooling chamber comes out is delivered to blanking bench.
6. the film plating process of the horizontal magnetron sputtering film production line of multi-chamber according to claim 5, it is characterised in that：
In above-mentioned steps (1) forvacuum and ionic discharge cleaning pretreatment process, using radio frequency high tension discharge power supply to substrate
Surface carries out argon gas discharging cleaning, and processing air pressure is 5-100Pa, and discharge power 100-500W, the Discharge Cleaning time is 10-20
Minute.
7. the film plating process of the horizontal magnetron sputtering film production line of multi-chamber according to claim 5, it is characterised in that：On
The heating treatment step for stating step (2) is specifically substrate to be sent to heating room, to substrate under 200-250 degree celsius temperatures
Baking 15-20 minutes.
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| CN201810606746.5A CN108570651A (en) | 2018-06-13 | 2018-06-13 | A kind of horizontal magnetron sputtering film production line of multi-chamber and its film plating process |
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| CN201810606746.5A CN108570651A (en) | 2018-06-13 | 2018-06-13 | A kind of horizontal magnetron sputtering film production line of multi-chamber and its film plating process |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207954A (en) * | 2018-10-19 | 2019-01-15 | 布勒莱宝光学设备（北京）有限公司 | Polychrome film glass and its production method and equipment |
| CN109576660A (en) * | 2019-01-16 | 2019-04-05 | 北京奥普科星技术有限公司 | Steel pipe continuous sputtering coating machine |
| CN110318029A (en) * | 2019-06-28 | 2019-10-11 | 常州长江功能玻璃股份有限公司 | Vertical vacuum coating film on glass line |
| CN110629186A (en) * | 2019-09-25 | 2019-12-31 | 李湘裔 | Continuous deposition device for electrochromic functional thin film device |
| CN111676452A (en) * | 2020-06-29 | 2020-09-18 | 哈尔滨奥瑞德光电技术有限公司 | Method for efficiently plating superhard film |
| WO2021052497A1 (en) * | 2019-09-20 | 2021-03-25 | 深圳市晶相技术有限公司 | Semiconductor device |
| CN113445018A (en) * | 2021-06-29 | 2021-09-28 | 山东三齐能源有限公司 | Magnetron sputtering-based shielding conductive film layer preparation equipment and method |
| CN113774341A (en) * | 2021-09-17 | 2021-12-10 | 嘉兴浩宇等离子体科技有限公司 | Vacuum coating production line for buttons |
| CN114875376A (en) * | 2022-04-16 | 2022-08-09 | 黄石全洋光电科技有限公司 | Continuous vacuum coating production line and coating process |
| CN115627449A (en) * | 2022-11-02 | 2023-01-20 | 佛山市晶玻科技有限公司 | Curved glass coating process |
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| CN201648512U (en) * | 2010-03-24 | 2010-11-24 | 深圳森丰真空镀膜有限公司 | Continuous vacuum coating device |
| CN103849845A (en) * | 2014-03-07 | 2014-06-11 | 东莞鑫泰玻璃科技有限公司 | Magnetron sputtering coating production line |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201648512U (en) * | 2010-03-24 | 2010-11-24 | 深圳森丰真空镀膜有限公司 | Continuous vacuum coating device |
| CN103849845A (en) * | 2014-03-07 | 2014-06-11 | 东莞鑫泰玻璃科技有限公司 | Magnetron sputtering coating production line |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207954A (en) * | 2018-10-19 | 2019-01-15 | 布勒莱宝光学设备（北京）有限公司 | Polychrome film glass and its production method and equipment |
| CN109207954B (en) * | 2018-10-19 | 2021-04-20 | 布勒莱宝光学设备（北京）有限公司 | Multi-colour film glass and its production method and equipment |
| CN109576660A (en) * | 2019-01-16 | 2019-04-05 | 北京奥普科星技术有限公司 | Steel pipe continuous sputtering coating machine |
| CN110318029A (en) * | 2019-06-28 | 2019-10-11 | 常州长江功能玻璃股份有限公司 | Vertical vacuum coating film on glass line |
| CN110318029B (en) * | 2019-06-28 | 2021-07-13 | 常州长江功能玻璃股份有限公司 | Vertical vacuum glass coating line |
| WO2021052497A1 (en) * | 2019-09-20 | 2021-03-25 | 深圳市晶相技术有限公司 | Semiconductor device |
| CN110629186A (en) * | 2019-09-25 | 2019-12-31 | 李湘裔 | Continuous deposition device for electrochromic functional thin film device |
| CN111676452A (en) * | 2020-06-29 | 2020-09-18 | 哈尔滨奥瑞德光电技术有限公司 | Method for efficiently plating superhard film |
| CN113445018A (en) * | 2021-06-29 | 2021-09-28 | 山东三齐能源有限公司 | Magnetron sputtering-based shielding conductive film layer preparation equipment and method |
| CN113774341A (en) * | 2021-09-17 | 2021-12-10 | 嘉兴浩宇等离子体科技有限公司 | Vacuum coating production line for buttons |
| CN114875376A (en) * | 2022-04-16 | 2022-08-09 | 黄石全洋光电科技有限公司 | Continuous vacuum coating production line and coating process |
| CN115627449A (en) * | 2022-11-02 | 2023-01-20 | 佛山市晶玻科技有限公司 | Curved glass coating process |
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Application publication date: 20180925 |