CN108568915A - Cutting tool and mounting flange - Google Patents
Cutting tool and mounting flange Download PDFInfo
- Publication number
- CN108568915A CN108568915A CN201810178284.1A CN201810178284A CN108568915A CN 108568915 A CN108568915 A CN 108568915A CN 201810178284 A CN201810178284 A CN 201810178284A CN 108568915 A CN108568915 A CN 108568915A
- Authority
- CN
- China
- Prior art keywords
- cutting
- cutting tool
- mounting flange
- cutting fluid
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Milling Processes (AREA)
Abstract
Cutting tool and mounting flange are provided, the cleaning solution of cleaning can be saved, improve the efficiency of machining.The cutting tool is fixed on the front end of the main shaft of cutting apparatus, is cut machined object in the state of being provided of cutting fluid, which includes：It is formed with the round base station of wheel axle portion a surface side；And it is formed in the cutting blade of the peripheral part of the surface side opposite with a face of the circle base station, being circumferentially formed with cutting fluid on the circle base station keeps off go back to portion.In addition, the mounting flange will be fixed on the cutting tool that machined object is cut in the state of being provided of cutting fluid the front end of the main shaft of cutting apparatus, the mounting flange, which has, is clamped and fixed fixing nut the cutting tool together with the flange part of mounting flange main body, on the flange part, circumferentially it is formed with cutting fluid in the back side of the bearing surface and keeps off go back to portion.
Description
Technical field
The present invention relates to the cutting tool cut to machined object in the state of being provided with cutting fluid and will cut
Cutting knife tool is fixed on the mounting flange of the front end of main shaft.
Background technology
It has been known that there is the cutting tools using annular shape to semiconductor wafer or package substrate, ceramic substrate, glass substrate etc.
Machined object carries out the cutting apparatus of critically machining.In the cutting apparatus, which is energy by main shaft supporting
Enough rotations.Also, cutting tool is set to rotate by so that the main shaft is rotated, and it is processed so that the cutting tool of rotation is cut into
Object, to carry out machining to machined object.
On the front of the machined object, such as in the multiple regions point of the segmentation preset lines division by clathrate setting
It is not formed with the devices such as IC or LSI.Also, works as and machined object is cut along the segmentation preset lines and divides machined object
When cutting, multiple chips (hereinafter referred to as device chip) with device are formed.
It is right when making cutting tool be cut into machined object in cutting apparatus used in the processing of machined object
Cutting tool provides cutting fluid.Cutting tool carries out machining in the state of being provided of cutting fluid to machined object.
In the machining of machined object, the pollutants such as cutting swarf are will produce, when pollutant is attached to machined object,
It can cause various unfavorable conditions.Such as when pollutant is attached to the pad of machined object, cause failure welding sometimes.Added
In the case that work object is the imaging sensors such as cmos sensor or ccd sensor, when pollutant is attached to sensor, it can cause
Device is bad.
The pollutant of machined object is attached to when machined object is dried after machining, in machining
Cementation can occur, even if implementing cleaning later, it is also difficult to by pollutant removal.Therefore, it is proposed to being added in machining
Work object provides the cutting apparatus of cleaning solution.
Patent document 1：Japanese Unexamined Patent Publication 2006-231474 bulletins
Patent document 2：Japanese Unexamined Patent Publication 6-97278 bulletins
But in these cutting apparatus, the cutting fluid for not being merely provided for the machining of machined object is needed, is also carried
For the cleaning solution of the cleaning for machined object.Therefore, following new problems be will produce：It is provided to the amount of the liquid of machined object
Increase, processing cost increases.
Invention content
The present invention is completed in view of the problem, and its purpose is to provide cutting tool and mounting flange, inhibition is made
Water and the cementation for preventing pollutant.
According to one method of the present invention, cutting tool is provided, the front end of the main shaft of cutting apparatus is fixed on, is being carried
It has supplied in the state of cutting fluid to cut machined object, which is characterized in that the cutting tool includes：Round base station,
Center is formed with embedded hole, and is formed with wheel axle portion a surface side；And cutting blade, be formed in the circle base station with this
On the peripheral part of the opposite surface side in one face, on the circle base station, circumferentially it is formed with cutting fluid and keeps off go back to portion.
In addition, another mode according to the present invention, provides mounting flange, cutting tool is fixed on cutting apparatus
The front end of main shaft, the cutting tool cut machined object in the state of being provided of cutting fluid, which is characterized in that should
Mounting flange has mounting flange main body and fixing nut, wherein the mounting flange main body has hub portion and flange part, described
Hub portion, which runs through, is inserted into the embedded hole of cutting tool, and is formed with external screw thread in front end, and the flange part is from the hub portion court
It is radially projecting, and with the bearing surface supported to the cutting tool, the fixing nut is together with the flange part to the cutting
Cutter is clamped and is fixed, and the interior spiral shell with the external thread spiro fastening of the hub portion is formed in the inner circumferential of the fixing nut
Line is circumferentially formed with cutting fluid in the back side of the bearing surface and keeps off go back to portion on the flange part.
In addition, in another mode of the present invention, can also be that the cutting tool is disk-shaped, the mounting flange
Also there is front flange, the front flange to have the bearing surface supported to the cutting tool together with the mounting flange main body, it should
Fixing nut is clamped the cutting tool together with the flange part by the front flange by fixing the front flange,
On the front flange, circumferentially it is formed with cutting fluid in the back side of the bearing surface and keeps off go back to portion.
During implementing machining using cutting tool, cutting fluid, but the cutting provided are provided to the cutting tool
Liquid largely disperses via base station or mounting flange to outside from the cutting blade of cutting tool.
Therefore, for the cleaning that the cutting fluid that will be dispersed to outside is used for machined object, in one embodiment of the present invention
Cutting tool and mounting flange on be formed with cutting fluid and keep off go back to portion.The cutting fluid, which is kept off go back to portion and is formed in, is provided to cutting tool
The path transmitted to outside of cutting fluid on, the cutting fluid that portion is kept off go back to inhibit to reach the cutting fluid is transmitted outward.
It reaches the cutting fluid and keeps off back the cutting fluid in portion and lose the impetus and fallen to machined object.Fall on cutting on machined object
It cuts liquid to wash away the pollutant on machined object, therefore can save to clean and be provided to the cleaning solution of machined object.Energy
Enough cleanings for implementing machined object using the cutting fluid dispersed in conventional structure to outside, therefore the efficiency of machining is non-
It is often good.
Therefore, according to the present invention, cutting tool and mounting flange are provided, inhibit used water and prevents pollutant
Cementation.
Description of the drawings
Fig. 1 is the stereogram for schematically showing cutting apparatus.
Fig. 2 is the exploded perspective view for schematically showing cutting unit.
(A) of Fig. 3 is the side view for schematically showing cutting tool and mounting flange, and (B) of Fig. 3 is by the stream of cutting fluid
Dynamic situation amplification and the vertical view schematically shown.
Fig. 4 is the exploded perspective view for schematically showing cutting unit.
(A) of Fig. 5 is the side view for schematically showing cutting tool and mounting flange, and (B) of Fig. 5 is by the stream of cutting fluid
Dynamic situation amplification and the vertical view schematically shown.
Fig. 6 is the side view for schematically showing machining.
(A) of Fig. 7 is the side view for schematically showing cutting tool and mounting flange, and (B) of Fig. 7 is by the stream of cutting fluid
Dynamic situation amplification and the vertical view schematically shown.
Fig. 8 is the side view for schematically showing cutter hood.
Label declaration
1：Machined object；3：Frame；5：Band；2：Cutting apparatus；4：Base station；6：Keep workbench (holding unit)；6a：It protects
Hold face；8、8a：Cutting unit；10：X-axis mobile mechanism (mobile unit)；12：X-axis guide rail；14：X-axis moving table；16：X
Axis ball-screw；18：X-axis pulse motor；20：Supporting station；22：Fixture；24：Y-axis moving mechanism (index feed unit)；
26：Y-axis guide rail；28：Y-axis moving table；28a：Base portion；28b：Wall portion；30：Y-axis ball-screw；32：Y-axis pulse electric
Machine；34：Z axis mobile mechanism；36：Z axis guide rail；38：Z-axis moving table；40：Z axis pulse motor；42、42a、42b、
42c：Cutting tool；44：Cutter hood；44a：Cutting fluid provides nozzle；44b：Cutting fluid provides mouth；46：Filming apparatus；48a、
48b：Round base station；48c：Embedded hole；50：Cutting blade；52：Main shaft shell；54：Main shaft；56a、56b、56c：Mounting flange；58a、
58b、58c：Mounting flange main body；60：Fixing nut；62a、62c：Hub portion；64a、64b、64c：Flange part；66a、66b、
66c：Cutting fluid keeps off go back to portion；68：Cutting fluid；70a、70c：Spindle mounting hole；72：Bolt；74：Front flange；76：Protruding portion.
Specific implementation mode
First, using Fig. 1 to using the cutting tool of present embodiment and the cutting apparatus of mounting flange to illustrate.Figure
1 is the stereogram of an example for schematically showing cutting apparatus.Each structural element is propped up as shown in Figure 1, cutting apparatus 2 has
The base station 4 held.It is provided on the upper surface of base station 4 and keeps workbench (holding unit) 6, in the top of the holding workbench 6
It is provided with cutting unit 8.
It is provided with X-axis mobile mechanism (mobile unit) 10 keeping the lower section of workbench 6.X-axis mobile mechanism 10, which has, to be set
It sets in the upper surface of base station 4 and a pair of of the X-axis guide rail 12 parallel with X-direction.In X-axis guide rail 12 in a manner of it can slide
It is equipped with X-axis moving table 14.
The back side (lower face side) of X-axis moving table 14 is provided with nut portions (not shown), in the nut portions
It is screwed with the X-axis ball-screw 16 parallel with X-axis guide rail 12.It is linked with X-axis pulse electricity in an end of X-axis ball-screw 16
Motivation 18.When making X-axis ball-screw 16 rotate using X-axis pulse motor 18, X-axis moving table 14 is along X-axis guide rail
12 move in the X-axis direction.
The face side (upper surface side) of X-axis moving table 14 is provided with supporting station 20.Match in the center of supporting station 20
It is equipped with and keeps workbench 6.It is keeping being arranged around workbench 6 there are four fixture 22, they are from four in face of keeping machined object
Cricoid frame (not shown) gripped.
It keeps workbench 6 and the rotating mechanism connection (not shown) in the lower section of supporting station 20 is set, it can be around flat with Z axis
Capable rotary shaft rotation.It is equipped with porous part on the front for keeping workbench 6, which protects by being formed in
It holds the attraction road (not shown) of the inside of workbench 6 and is connect with source (not shown) is attracted.It is to protect to keep the upper surface of workbench
Hold face 6a, when from the attraction source for be placed on retaining surface 6a machined object negative pressure when, machined object is attracted
It is maintained at and keeps on workbench 6.
Machined object is, for example, the substrates such as the semiconductor wafers such as silicon, sapphire or glass, quartz.It is processed at this
On the front of object, for example, by clathrate setting segmentation preset lines division multiple regions be respectively formed with IC or LSI etc.
Device.Also, when dividing machined object when being cut machined object along the segmentation preset lines, device core is formed
Piece.
The Y for making cutting unit 8 be moved in index feed direction (Y direction) is disposed adjacently with X-axis mobile mechanism 10
Axis mobile mechanism (index feed unit) 24.Y-axis moving mechanism 24, which has, to be arranged in the upper surface of base station 4 and is put down with Y direction
Capable a pair of of Y-axis guide rail 26.
Y-axis moving table 28 is provided in a manner of it can slide in Y-axis guide rail 26.Y-axis moving table 28 has
Have：The base portion 28a contacted with Y-axis guide rail 26；And the wall portion 28b of setting is erect relative to base portion 28a.In Y-axis mobile working
The back side (lower face side) of the base portion 28a of platform 28 is provided with nut portions (not shown), is screwed in the nut portions and is led with Y-axis
The parallel Y-axis ball-screw 30 of rail 26.
It is linked with Y-axis pulse motor 32 in an end of Y-axis ball-screw 30.When utilization Y-axis pulse motor 32
When Y-axis ball-screw 30 being made to rotate, Y-axis moving table 28 moves in the Y-axis direction along Y-axis guide rail 26.
Being provided on the wall portion 28b of Y-axis moving table 28 makes knife unit 8 be moved up in vertical direction (Z-direction)
Dynamic Z axis mobile mechanism 34.Z axis mobile mechanism 34, which has, to be arranged on the side of wall portion 28b and a pair parallel with Z-direction
Z axis guide rail 36.
Z-axis moving table 38 is provided in a manner of it can slide in Z axis guide rail 36.In Z-axis moving table 38
Back side (sides wall portion 28b) be provided with nut portions (not shown), the Z parallel with Z axis guide rail 36 is screwed in the nut portions
Axis ball-screw (not shown).
It is linked with Z axis pulse motor 40 in an end of Z axis ball-screw.When making Z using Z axis pulse motor 40
When axis ball-screw rotates, Z-axis moving table 38 moves in the Z-axis direction along Z axis guide rail 36.In the Z axis mobile working
The cutting unit 8 cut machined object is supported on platform 38.
Cutting unit 8 has：It is supported to the main shaft that can be rotated；And the cutting tool rotated by the main shaft
42.The cutting blade of the cutting tool 42 is to mix the abrasive grains such as diamond in the bond materials such as metal or resin (bonding agent) and formed
's.When make the cutting tool 42 of rotation be cut into keep workbench 6 kept machined object when, can to the machined object into
Row machining.
Cutting unit 8 also has the cutter hood 44 of covering cutting tool 42.Using Fig. 6, cutter hood 44 is carried out specifically
It is bright.The side view of cutting unit 8 is shown in FIG. 6.
Cutter hood 44 has：Cutting fluid provides nozzle 44a, adjacent with two sides of cutting tool 42, and is formed
There is the ejiction opening towards cutting tool 42；And cutting fluid ejiction opening 44b, it is adjacent in the peripheral direction of cutting tool 42.
Cutting fluid provide nozzle 44a and cutting fluid ejiction opening 44b respectively by cutting fluid liquid pushing tube 44c, 44d and cutting fluid provide source
Connection (not shown).In the machining of machined object, provides the ejiction opening of nozzle 44a from cutting fluid and cutting fluid sprays
Mouth 44b provides cutting fluid to cutting tool 42.Cutting fluid is, for example, pure water.
In addition, being provided with the injection nozzle (not shown) towards machined object on the lower surface of cutter hood 44.Added
When the machining of work object, cleaning solution is sprayed from the injection nozzle to machined object.
As shown in Figure 1, in cutting unit 8, compare on the cutting direction of travel (processing direction of feed) that machining is advanced
The position of cutting tool 42 on the front has filming apparatus 46.Filming apparatus 46 can clap the front of machined object
It takes the photograph, the filming apparatus 46 is used when adjusting the position of cutting tool 42, so that cutting tool 42 is pre- to the cutting of machined object
Alignment is cut.
Then, cutting unit is described in detail.Fig. 2 is the exploded perspective of an example for schematically showing cutting unit 8a
Figure.In cutting unit 8a shown in Fig. 2, the cutting tool 42a of wheel type is installed.Cutting tool 42a includes round base station
48a and cutting blade 50.On round base station 48a, it is formed with embedded hole 48c in center, and wheel axle portion is formed with a surface side.
Cutting blade 50 is formed on the peripheral part of the surface side opposite with a face of circle base station 48a.
Cutting unit 8a has main shaft shell 52.It is accommodated with by air bearing bearing as can in the inside of main shaft shell 52
The main shaft 54 rotated around Y-axis.It is formed with threaded hole in the front end of main shaft 54, according to the rotation by the main shaft 54 in cutting
The direction for being rotated to tighten on direction is carved with screw thread.Mounting flange 56a is installed in the front end of main shaft 54.
Mounting flange 56a has：Mounting flange main body 58a；And fixing nut 60, with the mounting flange main body
Cutting tool 42a is clamped between 58a and is fixed.Mounting flange main body 58a has：Hub portion 62a runs through and is inserted into
The embedded hole 48c of cutting tool 42a；And flange part 64a, it is radially protruded from hub portion 62a, flange part 64a tools
There is the bearing surface supported to cutting tool 42a.It is formed with external screw thread in the front end of hub portion 62a.In fixing nut 60
On in inner circumferential be formed with the internal thread with the external thread spiro fastening of hub portion 62a.
Hub portion 62a and flange part 64a are configured in the way of respective center overlapping of axles.That is, by columned
The axis that the respective central link of two bottom surfaces of hub portion 62a is got up and two circles by disk-shaped flange part 64a
The overlapping of axles got up of respective central link in face be straight line.
Spindle mounting hole 70a is formed on the inside of mounting flange 56a.Spindle mounting hole 70a pacifies according to by main shaft 54
The above-mentioned central shaft mode consistent with the rotation center of main shaft 54 is formed as and the main shaft 54 when being filled to spindle mounting hole 70a
The corresponding shape in front end.Spindle mounting hole 70a has opening in the sides hub portion 62a, can make bolt by the opening
72 screw togather with the threaded hole of the front end for the main shaft 54 for being inserted into spindle mounting hole 70a.
The cutting tool 42a that mounting flange 56a will be used and be installed on main shaft 54 is shown in (A) of Fig. 3.(A) of Fig. 3 is to show
Meaning property shows the side view of cutting tool 42a and mounting flange 56a.In the mounting flange 56a of present embodiment, in the flange
On portion 64a, circumferentially it is formed with cutting fluid in the back side of the bearing surface supported to cutting tool 42a and keeps off go back to portion
66a.In addition, on the round base station 48a of the cutting tool 42a of present embodiment, circumferentially it is formed with cutting fluid and keeps off go back to portion
66b。
Using (B) of Fig. 3, the function that portion 66a, 66b are kept off back to cutting fluid illustrates.(B) of Fig. 3 is will be from cutter hood
The case where flowing for the cutting fluid that 44 cutting fluid ejiction opening 44b is provided to cutting tool 42a, amplifies and what is schematically shown bow
View.
As shown in (B) of Fig. 3, the part of the cutting fluid 68 provided the cutting blade 50 for being provided to cutting tool 42a it
Afterwards, the flange part 64a of mounting flange 56a is reached along cutting tool 42a.Here, it is formed with cutting fluid on flange part 64a
Keep off back portion 66a.Therefore, cutting fluid 68, which is cut liquid and keeps off back portion 66a, keeps off back, therefore is not easy side transmission further out, loses
The impetus and fall.
In addition, as shown in (B) of Fig. 3, a part for the cutting fluid 68 provided is in the cutting blade for being provided to cutting tool 42a
After 50, the round base station 48a of cutting tool 42a is reached.Here, it is formed with cutting fluid on circle base station 48a and keeps off go back to portion
66b.Therefore, cutting fluid 68, which is cut liquid and keeps off back portion 66a, keeps off back, therefore is not easy side transmission further out, to lose gesture
Head and fall.
The cutting fluid 68 for losing the impetus and falling reaches the machined object for keeping workbench 6 to be kept.Then, the cutting fluid
68 pairs of machined objects are cleaned and wash away pollutant.Therefore, it is possible to save the clear of machined object is provided to be cleaned
Washing lotion.The cutting fluid dispersed in the past can be used to implement the cleaning of machined object, therefore the efficiency of machining is very good.
For example, keeping off go back to portion when not forming cutting fluid on mounting flange, not formed and cut on the round base station of cutting tool
It cuts in the case that liquid keeps off go back to portion, cutting fluid will not lose the impetus but disperse to the outside of cutting unit.Using Fig. 7, to previous
Cutting tool and mounting flange illustrate.(A) of Fig. 7 is the side view for schematically showing cutting tool and mounting flange,
The case where (B) of Fig. 7 is the flowing by cutting fluid is amplified and the vertical view that schematically shows.
Cutting fluid gear is not formed on previous cutting tool 42b and previous mounting flange 56b shown in (A) of Fig. 7
The portion of returning.Therefore, as shown in (B) of Fig. 7, a part for the cutting fluid 68 of cutting tool 42b is provided to from cutting fluid ejiction opening 44b
After being provided to the cutting blade 50 of cutting tool 42b, fly to outside along cutting tool 42b, mounting flange 56b and main shaft 54
It dissipates.In addition, the other parts of cutting fluid 68 are dispersed along cutting tool 42b, circle base station 48b and fixing nut 60 to outside.
The cutting fluid dispersed to outside does not clean without washing away pollutant machined object.Therefore, use with
Toward cutting tool 42b and previous mounting flange 56b in the case of, in order to which the pollutant generated in machining is washed away,
A large amount of cleaning solution must be provided to machined object.On the other hand, in the cutting tool of present embodiment and present embodiment
It is formed with cutting fluid on mounting flange and keeps off go back to portion, the cutting fluid dispersed in the past can be used to clean machined object, therefore
Cleaning solution can be saved, the efficiency of machining is very good.
Using Fig. 4 and Fig. 5, the other structures example of cutting tool and mounting flange to present embodiment illustrates.Separately
Outside, explanation is omitted for works same as cutting unit 8a.It is equipped in Fig. 4 and cutting unit 8c shown in fig. 5
It is formed with the disk-shaped cutting tool 42c of embedded hole in center.Cutting tool 42c is, for example, cutting for grommet-type or Kimberley type
Cutting knife tool.The periphery of cutting tool 42c is as cutting blade.
In cutting unit 8c, mounting flange 56c is installed in the front end of main shaft 54.Mounting flange 56c has：It installs convex
Edge main body 58c；Front flange 74 has the bearing supported to cutting tool 42c between mounting flange main body 58c
Face；And fixing nut 60, front flange 74 is fixed.The fixing nut 60 fixes the front flange 74, thus by
The front flange 74 supports cutting tool 42c together with the flange part 64c of mounting flange main body 58c.
The cutting tool 42c that mounting flange 56c will be used and be installed on main shaft 54 is shown in (A) of Fig. 5.(A) of Fig. 5 is to show
Meaning property shows the side view of cutting tool 42c and mounting flange 56c.In the mounting flange 56c of present embodiment, in front flange
Cutting fluid is circumferentially formed in the back side of the bearing surface supported to cutting tool 42c keep off back portion 66c on 74.
Using (B) of Fig. 5, the function that portion 66c is kept off back to cutting fluid illustrates.(B) of Fig. 5 is will be from cutter hood 44
Cutting fluid ejiction opening 44b is provided to the amplification of the case where flowing of the cutting fluid 68 of cutting tool 42c and the vertical view that schematically shows
Figure.
As shown in (B) of Fig. 5, a part for the cutting fluid 68 provided reaches peace after being provided to cutting tool 42c
Fill the front flange 74 of flange 56c.Here, it is formed with cutting fluid on front flange 74 and keeps off back portion 66c.Therefore, cutting fluid 68 is cut
It cuts liquid and keeps off back portion 66c and keep off back, therefore be not easy side transmission further out, fallen to machined object to lose the impetus, it is right
Machined object is cleaned and removes pollutant.Therefore, it is possible to save the cleaning solution for being provided to machined object.
In addition, the cutting fluid formed in the cutting tool and mounting flange of present embodiment keep off back portion 66a, 66b,
66c is, for example, the circular slot that depth is 2mm, width is 2mm.But cutting fluid keeps off go back to portion that 66a, 66b, 66c are not limited to
This.
Then, to used be equipped with present embodiment cutting tool or mounting flange cutting unit machined object
Machining illustrate.The machining is implemented using cutting apparatus 2.The cutting process is illustrated using Fig. 6.Figure
6 be the partial sectional view for schematically illustrating the cutting process.
Machined object 1 is, for example, the disk-shaped semiconductor wafer being pasted onto on the band 5 being tensioned by frame 3.It first, will be by
Machining object 1 is placed in across the band 5 on the retaining surface 6a for keeping workbench 6, and frame 5 is fixed using fixture 22.Then,
So that the attraction source of the inside of holding workbench 6 is acted, by keep workbench 6 inside attraction road to machined object 1
Attracted, is kept on workbench 6 to which machined object 1 to be fixed on.
Then, ShiXZhou mobile mechanisms (mobile unit) 10 and Y-axis moving mechanism (index feed unit) 24 acted and
Cutting unit 8 is positioned at defined position, so as to cutting tool 42 is positioned at machined object 1 cutting preset lines one end
Outside above.Then, so that the rotation of cutting tool 42 is started, and cutting fluid is provided to cutting tool 42.It is provided from cutting fluid
Nozzle 44a and cutting fluid ejiction opening 44b provided to the cutting fluid of cutting tool 42.
Then, cutting unit 8 is made to decline and cutting tool 42 is positioned at defined height and position.Then, cutting is made to fill
2 X-axis mobile mechanism is set to be acted and be processed feeding to machined object 1.Then, when the cutting tool of rotation 42 and quilt
When machining object 1 contacts, start machining.
At this point, being provided to the cutting fluid of cutting tool 42 in cutting tool 42 and mounting flange from cutting fluid ejiction opening 44b
Upper transmission, but reach the cutting fluid that is formed on the round base station and mounting flange of the cutting tool and keep off back the cutting fluid in portion and kept off
It returns and loses the impetus.Then, which falls towards machined object 1, washes away cutting of being generated in the machining of machined object 1
The pollutants such as swarf.Therefore, it is possible to save machined object 1 cleaning cleaning solution, the efficiency of machining can be improved.
Then, when the machining of cutting tool 42 is advanced and divides machined object 1 along all segmentation preset lines
When, such as form each device chip.
In addition, in the cutting apparatus using the cutting tool of present embodiment and mounting flange, it can be with cutter hood 44
Cutting fluid provide mouth 44b be disposed adjacently protruding portion.The protruding portion is disposed in be cut than what is sprayed from cutting fluid ejiction opening 44b
Nearby locate by the direction of rotation of the cutting tool 42 at the position for cutting liquid arrival cutting tool 42.That is, the protruding portion is sprayed in cutting fluid
It exports adjacent on the negative direction of the direction of rotation of the cutting tool 42 of 44b.
During implementing machining using cutting tool 42, provided from cutting fluid ejiction opening 44b to the cutting tool 42
Cutting fluid.Also, expect that the processing stand contacted to the cutting tool 42 with machined object suitably provides cutting fluid.
But be provided to a part for the cutting fluid of cutting tool 42 with the rotation of cutting tool 42 and servo rotary extremely
The periphery of cutting tool 42.When the peripheral part in cutting tool 42 has the servo rotary liquid with 42 servo rotary of cutting tool
When, the cutting fluid newly provided from cutting fluid ejiction opening 44b can be hindered by the servo rotary liquid, cutting fluid expected without the image of Buddha that
Sample is provided to the processing stand.
Therefore, in cutter hood 44, cutting tool 42 is reached in the cutting fluid than being sprayed from cutting fluid ejiction opening 44b
Nearby locate that protruding portion is arranged by the direction of rotation of the cutting tool 42 in position.Cutter hood 44 with such protruding portion is shown in
Fig. 8.Fig. 8 is the side view for schematically showing the cutter hood 44 with protruding portion 76.Such as shown in figure 8, with cutter hood 44
Cutting fluid provides mouth 44b and has been disposed adjacently protruding portion 76.
Then, a part for the servo rotary liquid of cutting tool 42 knocks the protruding portion 76 and is left from cutting tool 42.
That is, protruding portion 76 prevents the further servo rotary with a part for the cutting fluid of 42 servo rotary of cutting tool.
When the amount of servo rotary liquid of cutting tool 42 can be reduced, the cutting that is newly provided from cutting fluid ejiction opening 44b
Liquid is not easily susceptible to interfere.Therefore, which can be appropriately provided to processing stand, without excessively providing cutting fluid.Cause
This can further save used liquid in cutting apparatus 2.
Embodiment
Then, to confirming that the cutting tool of one embodiment of the present invention and the experiment of the function and effect of mounting flange are said
It is bright.In the present embodiment, cutting is carried out to machined object using the cutting apparatus with the cutting tool and the mounting flange to add
Work observes the machined object after machining and measures the quantity of attachment.
The summary of experiment is illustrated.Cutting apparatus used in this experiment is Co., Ltd. Disike's manufacture
" DFD6362 ", the cutting tool in the cutting apparatus are Co., Ltd. Disike manufacture " ZH05-SD2000-N1-
110GF(HEGF1010)”.In the round base station of the mounting flange and the cutting tool of the installation for the cutting tool, shape
Portion is kept off go back at there is cutting fluid.
Machined object used in this experiment is the Si chips for 8 inch diameters that thickness is 0.73mm.In this experiment,
The band " D-650 " of Lindeke Co., Ltd's manufacture is pasted in the face side of the machined object, and makes the face side court of machined object
Machined object is loaded to the holding workbench of the cutting apparatus, to make the back side of machined object expose.Then, across this
Band is by machined object attracting holding in holding workbench.In addition, in order to be easy to measure the attachment on machined object, it is being processed
The back side of object is formed with resin film.
About the condition of machining, the rotating speed of main shaft is set as 40000rpm, the processing of the machined object is fed into speed
Degree is set as 30mm/s, and the minimum point of cutting tool is set as with the distance between worktable upper surface (cutter height) is kept
0.07mm.The index feed amount (indexable size) of cutting tool is 5mm in a first direction, vertical with the first direction the
It is 5mm on two directions.
It is 1.5L/ to provide the cutting water of the ejiction opening offer of nozzle 44a (referring to Fig.1,6,8 etc.) in cutting fluid from setting
Minute, the cutting water provided from cutting fluid ejiction opening 44b (with reference to Fig. 6,8 etc.) is 1.0L/ minutes.In addition, from being arranged in knife
The injection nozzle (not shown) for having the lower surface of cover sprays cleaning solution to the machined object.The cleaning fluid volume is set as 1.0L/ points
Clock.
Machining is implemented to the machined object according to the clathrate of 5mm × 5mm using such condition.It will be added by cutting
Work is formed by each region of cutting slot division as a chip, and the quantity of attachment is measured in arbitrary 9 chips.It is right
The measurement of attachment has used the microscope " MF-UA1020THD " that Mitutoyo Corp manufactures and particle counter measuring with soft
Part " FV-PIXELLENCE ENG/3310/STD ".
In each chip, in four corners and this central five positions, the visual field of 200 times of the multiplying power of measuring microscope observation
The quantity of attachment more than 1 interior μ m in size.Then, the quantity of attachment measured in total 45 measurements is calculated
Average value.Using the experiment as " embodiment 1 ".
In addition, as shown in figure 8, providing the mouth 44b cutters for being disposed adjacently protruding portion 76 with cutting fluid using being equipped with
The cutting apparatus of cover 44 similarly carries out machining to machined object, similarly the number to the attachment for being attached to machined object
Amount measures.Using the experiment as " embodiment 2 ".In addition, in experiment " embodiment 2 ", also uses and be formed with cutting fluid
Keep off back the mounting flange in portion and the round base station of the cutting tool.
In addition, providing the mouth 44b cuttings for being disposed adjacently the cutter hood 44 of protruding portion 76 with cutting fluid using being equipped with
Device cuts machined object in such a way that the amount of the cutting fluid and cleaning solution that are provided is reduced to above-mentioned 70% or so
Processing is cut, and measures the quantity of attachment.Using the experiment as " embodiment 3 ".In addition, in experiment " embodiment 3 ", also use
Being formed with cutting fluid keeps off back the mounting flange in portion and the round base station of the cutting tool.
In addition, in order to be compared, for forming cutting fluid gear not on the round base station of mounting flange and cutting tool
The portion of returning, the machined object that protruding portion is arranged not in cutter hood and implements same machining similarly measure attachment
Quantity.Using the experiment as " comparative example ".
The result of the measurement of attachment is illustrated.In a comparative example, average attachment number is 418；In embodiment 1
In, average attachment number is 295；In example 2, average attachment number is 64；In embodiment 3, average attachment
Number is 26.
When being compared to the result of comparative example and the result of embodiment 1 it is found that by for the cutting tool
Cutting fluid is formed on the mounting flange of installation and the round base station of the cutting tool and keeps off go back to portion, and machined object can be greatly reduced
Attachment.It understands to keep off go back to portion by forming cutting fluid, cutting fluid increases the effect of the cleaning of machined object.
It is when being compared to the result of embodiment 1 and the result of embodiment 2 it is found that prominent by being arranged in cutter hood 44
Go out portion 76 (with reference to Fig. 8), the attachment of machined object can be greatly reduced.Give following enlightenments：By using the protruding portion
76 prevent the servo rotary of the servo rotary liquid of the periphery of cutting tool, suitably can provide cutting fluid, energy to machined object
Enough by exclusions such as the cutting swarfs before cutting swarf etc. is attached to machined object.
When the result of result and embodiment 3 to comparative example is compared it is found that when in mounting flange and the cutting tool
Round base station on setting cutting fluid keep off go back to portion, in setting protruding portion 76 (reference Fig. 8) in cutter hood 44, even if having saved institute
The amount of the cutting fluid of offer etc., attachment will not increase.
It is arrived by above experimental verification：When making cutting fluid be fallen on machined object using one embodiment of the present invention
When, machined object is cleaned using the cutting fluid, therefore the liquid such as the cleaning solution for being provided to machined object can be saved.
In addition, the present invention is not limited to the record of the above embodiment, various modifications may be made and implements.Such as above-mentioned
In embodiment, cutting fluid is formd on the round base station and mounting flange of cutting tool and keeps off go back to portion, but can also be along solid
Surely nut 60 is used, the periphery of main shaft 54 forms cutting fluid and keeps off go back to portion.Alternatively, it is also possible to only in the round base station and peace of cutting tool
Cutting fluid, which is formed, on a side in dress flange keeps off go back to portion.
In addition to this, in the range of the construction of the above embodiment, method etc. are without departing from the purpose of the present invention, then may be used
To be suitably changed and implemented.
Claims (3)
1. a kind of cutting tool is fixed on the front end of the main shaft of cutting apparatus, to quilt in the state of being provided of cutting fluid
Machining object is cut, which is characterized in that
The cutting tool includes：
Round base station is formed with embedded hole in center, and is formed with wheel axle portion a surface side；And
Cutting blade is formed on the peripheral part of the surface side opposite with a face of the circle base station,
On the circle base station, circumferentially it is formed with cutting fluid and keeps off go back to portion.
2. cutting tool, is fixed on the front end of the main shaft of cutting apparatus by a kind of mounting flange, which is being provided
Machined object cut in the state of cutting fluid, which is characterized in that
The mounting flange has mounting flange main body and fixing nut, wherein
There is the mounting flange main body hub portion and flange part, the hub portion to run through the embedded hole for being inserted into cutting tool, and
It is formed with external screw thread in front end, the flange part is radially protruded from the hub portion, and is had and supported to the cutting tool
Bearing surface,
The fixing nut is clamped the cutting tool together with the flange part and is fixed, the shape in the inner circumferential of the fixing nut
The internal thread of the external thread spiro fastening of the Cheng Youyu hub portions,
On the flange part, circumferentially it is formed with cutting fluid in the back side of the bearing surface and keeps off go back to portion.
3. mounting flange according to claim 2, which is characterized in that
The cutting tool be it is disk-shaped,
The mounting flange also has front flange, which, which has, props up the cutting tool together with the mounting flange main body
The bearing surface held,
The fixing nut carries out the cutting tool together with the flange part by the front flange by fixing the front flange
Clamping,
On the front flange, circumferentially it is formed with cutting fluid in the back side of the bearing surface and keeps off go back to portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-045019 | 2017-03-09 | ||
| JP2017045019A JP6896327B2 (en) | 2017-03-09 | 2017-03-09 | Cutting blade, mount flange |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108568915A true CN108568915A (en) | 2018-09-25 |
| CN108568915B CN108568915B (en) | 2021-12-21 |
Family
ID=63576771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810178284.1A Active CN108568915B (en) | 2017-03-09 | 2018-03-05 | Cutting tool and mounting flange |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6896327B2 (en) |
| KR (1) | KR102394673B1 (en) |
| CN (1) | CN108568915B (en) |
| TW (1) | TWI760433B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220250268A1 (en) * | 2021-02-05 | 2022-08-11 | Disco Corporation | Blade fixture and blade mounter |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6243142A (en) * | 1985-08-20 | 1987-02-25 | Toshiba Corp | Semiconductor device and use thereof |
| JPH0697278A (en) * | 1992-09-09 | 1994-04-08 | Disco Abrasive Syst Ltd | Contaminant preventing dicing device |
| US5322567A (en) * | 1990-06-28 | 1994-06-21 | Applied Materials, Inc. | Particulate reduction baffle with wafer catcher for chemical-vapor-deposition apparatus |
| JPH07256219A (en) * | 1994-03-23 | 1995-10-09 | Sumitomo Metal Mining Co Ltd | Cleaning equipment of lead frame and cleaning |
| JPH09320994A (en) * | 1996-05-28 | 1997-12-12 | Sony Corp | Dicing equipment |
| US6458141B1 (en) * | 2000-03-10 | 2002-10-01 | Gholam A. Peyman | Method and apparatus for creating a flap in the cornea and incisions or shrinkage under the flap to correct vision disorders |
| JP2002299285A (en) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | Dicing device |
| JP2002313752A (en) * | 2001-04-12 | 2002-10-25 | Disco Abrasive Syst Ltd | Dicing device |
| CN1824482A (en) * | 2005-02-25 | 2006-08-30 | 株式会社迪斯科 | Cutting device |
| CN101621026A (en) * | 2009-08-05 | 2010-01-06 | 武汉华工激光工程有限责任公司 | Back laser cutting method of glass passivated silicon wafer |
| JP2011062778A (en) * | 2009-09-18 | 2011-03-31 | Disco Abrasive Syst Ltd | Cutting device |
| CN103991139A (en) * | 2013-02-18 | 2014-08-20 | 株式会社迪思科 | Cutting device |
| CN105856328A (en) * | 2016-06-02 | 2016-08-17 | 新昌县羽林街道上大轴承厂 | Water-saving water jet cutter special for mechanical part cutting |
| CN205799749U (en) * | 2016-06-02 | 2016-12-14 | 新昌县羽林街道上大轴承厂 | The water-saving cutter that the cutting of a kind of machine components is special |
| CN107175774A (en) * | 2017-07-11 | 2017-09-19 | 芜湖泰庆电子科技有限公司 | A kind of ceramic tile cutter simply used |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM340888U (en) * | 2007-09-03 | 2008-09-21 | Shih-Chung Huang | Balance flange |
| MY174975A (en) * | 2011-11-28 | 2020-05-30 | Shinetsu Chemical Co | Saw blade and method for multiple sawing of rare earth magnet |
-
2017
- 2017-03-09 JP JP2017045019A patent/JP6896327B2/en active Active
-
2018
- 2018-02-12 TW TW107104956A patent/TWI760433B/en active
- 2018-03-05 CN CN201810178284.1A patent/CN108568915B/en active Active
- 2018-03-09 KR KR1020180028137A patent/KR102394673B1/en active IP Right Grant
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6243142A (en) * | 1985-08-20 | 1987-02-25 | Toshiba Corp | Semiconductor device and use thereof |
| US5322567A (en) * | 1990-06-28 | 1994-06-21 | Applied Materials, Inc. | Particulate reduction baffle with wafer catcher for chemical-vapor-deposition apparatus |
| JPH0697278A (en) * | 1992-09-09 | 1994-04-08 | Disco Abrasive Syst Ltd | Contaminant preventing dicing device |
| JPH07256219A (en) * | 1994-03-23 | 1995-10-09 | Sumitomo Metal Mining Co Ltd | Cleaning equipment of lead frame and cleaning |
| JPH09320994A (en) * | 1996-05-28 | 1997-12-12 | Sony Corp | Dicing equipment |
| US6458141B1 (en) * | 2000-03-10 | 2002-10-01 | Gholam A. Peyman | Method and apparatus for creating a flap in the cornea and incisions or shrinkage under the flap to correct vision disorders |
| JP2002299285A (en) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | Dicing device |
| JP2002313752A (en) * | 2001-04-12 | 2002-10-25 | Disco Abrasive Syst Ltd | Dicing device |
| CN1824482A (en) * | 2005-02-25 | 2006-08-30 | 株式会社迪斯科 | Cutting device |
| CN101621026A (en) * | 2009-08-05 | 2010-01-06 | 武汉华工激光工程有限责任公司 | Back laser cutting method of glass passivated silicon wafer |
| JP2011062778A (en) * | 2009-09-18 | 2011-03-31 | Disco Abrasive Syst Ltd | Cutting device |
| CN103991139A (en) * | 2013-02-18 | 2014-08-20 | 株式会社迪思科 | Cutting device |
| CN105856328A (en) * | 2016-06-02 | 2016-08-17 | 新昌县羽林街道上大轴承厂 | Water-saving water jet cutter special for mechanical part cutting |
| CN205799749U (en) * | 2016-06-02 | 2016-12-14 | 新昌县羽林街道上大轴承厂 | The water-saving cutter that the cutting of a kind of machine components is special |
| CN107175774A (en) * | 2017-07-11 | 2017-09-19 | 芜湖泰庆电子科技有限公司 | A kind of ceramic tile cutter simply used |
Non-Patent Citations (1)
| Title |
|---|
| 刘志兵等: "微细切割刀具的特征及其制备技术", 《工具技术》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220250268A1 (en) * | 2021-02-05 | 2022-08-11 | Disco Corporation | Blade fixture and blade mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201841713A (en) | 2018-12-01 |
| TWI760433B (en) | 2022-04-11 |
| JP6896327B2 (en) | 2021-06-30 |
| KR20180103768A (en) | 2018-09-19 |
| CN108568915B (en) | 2021-12-21 |
| JP2018148177A (en) | 2018-09-20 |
| KR102394673B1 (en) | 2022-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5877663B2 (en) | Wafer grinding method | |
| JP2009004406A (en) | Working method for substrate | |
| JP2008124292A (en) | Wafer positioning jig of processing apparatus | |
| KR101757932B1 (en) | Wafer transfer mechanism | |
| CN101740442A (en) | Conveying device of sheet-shaped workpiece | |
| JP7098240B2 (en) | Abrasive pad | |
| JP5121390B2 (en) | Wafer processing method | |
| KR101851383B1 (en) | Semiconductor wafer grinder with the same | |
| JP5410940B2 (en) | Grinding equipment | |
| CN108568915A (en) | Cutting tool and mounting flange | |
| JP7139043B2 (en) | cutting equipment | |
| CN110497270A (en) | Cutting apparatus | |
| JP2009094247A (en) | Cleaning device and grinder of wafer | |
| JP5306928B2 (en) | Wafer transfer device | |
| JP6044976B2 (en) | Wafer processing method | |
| JP2019104075A (en) | Cutting device | |
| JP2017019055A (en) | Chuck table and processing device equipped with chuck table | |
| JP2012079911A (en) | Processing method of plate-like object | |
| JP2011023618A (en) | Wafer cleaning apparatus | |
| KR20090068189A (en) | Wafer grinding machine and wafer grinding method | |
| JP5114153B2 (en) | Wafer processing method | |
| JP7158813B2 (en) | grinding wheel | |
| JP2010105067A (en) | Suction pad washing method and suction pad washing device | |
| JP2012119594A (en) | Processing method of plate-like object | |
| JP7126751B2 (en) | Workpiece grinding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |