CN108551748A - Unmanned plane, flight controller and its heat dissipating method - Google Patents
Unmanned plane, flight controller and its heat dissipating method Download PDFInfo
- Publication number
- CN108551748A CN108551748A CN201810553198.4A CN201810553198A CN108551748A CN 108551748 A CN108551748 A CN 108551748A CN 201810553198 A CN201810553198 A CN 201810553198A CN 108551748 A CN108551748 A CN 108551748A
- Authority
- CN
- China
- Prior art keywords
- shell
- main control
- control board
- flight controller
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 15
- 230000008859 change Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D43/00—Arrangements or adaptations of instruments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of unmanned plane, flight controller and its heat dissipating methods.This method includes that a lug boss is arranged on the shell;Flight control circuit board is split as main control board and port circuit plate, main control chip and at least one adding thermal resistance are set on main control board, and main control board is mounted in lug boss, and port circuit plate is mounted in the shell of lower section of lug boss;Main control board and port circuit plate are electrically connected.Present application addresses the technical problems of flight controller shell heat dissipation effect difference in the prior art.
Description
Technical field
This application involves air vehicle technique fields, in particular to a kind of unmanned plane, flight controller and its heat dissipation side
Method.
Background technology
The electronic unit of unmanned plane on the market is divided into following a few classes at present:Flight controller, electron speed regulator, motor,
And some other sensors such as GPS, camera etc..Flight controller (flying control) is the brain of unmanned plane, is responsible for processing and comes
From the information of each sensor, and main control instruction is issued, control signal is issued to electron speed regulator, then by electronics tune by it
The rotating speed of fast device control motor.Flight controller on the market has generally comprised main main control chip, MEMS sensing
Device, and the interface that is connect with other external electronic equipments.In addition, change of the unmanned plane with operating environment or flying height
To change, flight controller internal temperature can change, to ensure the important components ambient temperature such as main control chip in flight controller,
Adding thermal resistance is additionally provided in flight controller.
In the prior art, flight controller includes the shell of rectangular shape, and carries the circuit of whole electric components
Plate, in flight controller, main pyrotoxin is main control chip and is used for temperature controlled adding thermal resistance.
During implementing the embodiment of the present application, the inventor finds that the existing technology has at least the following problems:
In the prior art, when flight controller internal temperature is excessively high, since the shape of flight controller shell is rectangular
Body, and length and width much larger than height, effective radiating surface only it is chlamydate up and down two end faces, so as to cause shell without
Heat dissipation is effectively performed in method, and heat dissipation effect is poor, and then flight controller internal temperature may be caused to be more than that can bear running temperature,
So as to which flight controller is caused to break down, cause unmanned plane that can not use or lose.
Invention content
The main purpose of the application is to provide a kind of unmanned plane, flight controller and its heat dissipating method, existing to solve
The problem of flight controller shell heat dissipation effect difference in technology.
To achieve the goals above, in a first aspect, the embodiment of the present application provides a kind of heat dissipating method of flight controller,
Including:
One lug boss is set on the shell;
Flight control circuit board is split as main control board and port circuit plate, master control core is set on main control board
Piece and at least one adding thermal resistance, and main control board is mounted in lug boss, and port circuit plate is mounted on
In the shell of the lower section of lug boss;
Main control board and port circuit plate are electrically connected.
Optionally, shell includes first shell and second shell;One lug boss is set on the shell, including:
On the first shell by the lower end connection of second shell, and the upper table of first shell is extended in the upper end of second shell
Face forms the lug boss of shell, wherein main control board is mounted in second shell, and the installation site of main control board is higher than
The upper surface of first shell, port circuit plate are mounted in first shell.
Optionally, when the shape of second shell is cuboid or square, the upper surface of main control board and second shell
The upper surface of body is arranged in parallel.
Optionally, the distance of main control board to second shell upper surface is less than or equal to main control board to first shell
The distance of upper surface.
Optionally, at least four adding thermal resistances are set on main control board;
When the shape of main control board is rectangular, the heat dissipating method of this flight controller further includes:
Each corner corresponds to an adding thermal resistance in four corners of main control board, and the adding thermal resistance of corresponding corner is pacified
On main control board on corresponding corner.
Optionally, it is located at the distance phase of two adjacent sides in the adding thermal resistance to second shell of main control board corner
Together.
Optionally, the material of second shell includes aluminium alloy.
Optionally, the lower end of second shell is connected on the first shell, including:
One socket joint slot of end setting on the first shell;
Second shell is plugged in socket joint slot, the material of first shell includes aluminium alloy.
Second aspect, a kind of flight controller provided by the embodiments of the present application, for implementing above-mentioned flight controller
Heat dissipating method.
The third aspect, a kind of unmanned plane provided by the embodiments of the present application, including above-mentioned flight controller.
Led to using lug boss is equipped on its housing in the heat dissipating method of flight controller provided by the embodiments of the present application
It crosses and main control board is mounted in lug boss, main control chip and adding thermal resistance are respectively positioned on main control board, port circuit plate
In the shell and positioned at the lower section of lug boss, main control board is electrically connected with port circuit plate for installation, has been reached and has been controlled flight
The main pyrotoxin such as the main control chip of device and adding thermal resistance is arranged on main control board, other do not generate heat or calorific value is less
Component is arranged on port circuit plate, realizes that main pyrotoxin detaches and main pyrotoxin is arranged to the shell big in heat dissipation area
In lug boss, around the lug boss of the shell and upper surface can effectively be radiated, to strengthen this flight
The heat dissipation effect of the heat dissipating method of controller.And then solves the technology of flight controller shell heat dissipation effect difference in the prior art
Problem.
Description of the drawings
The attached drawing constituted part of this application is used for providing further understanding of the present application so that the application's is other
Feature, objects and advantages become more apparent upon.The illustrative examples attached drawing and its explanation of the application is for explaining the application, not
Constitute the improper restriction to the application.In the accompanying drawings:
Fig. 1 is the structural schematic diagram according to a kind of heat dissipating method of flight controller of the embodiment of the present application;
Fig. 2 is the structural schematic diagram according to a kind of flight controller of the embodiment of the present application;
Fig. 3 is the structural schematic diagram according to a kind of main control board of the embodiment of the present application.
Specific implementation mode
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, technical solutions in the embodiments of the present application are clearly and completely described, it is clear that described embodiment is only
The embodiment of the application part, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model of the application protection
It encloses.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, "
Two " etc. be for distinguishing similar object, without being used to describe specific sequence or precedence.It should be appreciated that using in this way
Data can be interchanged in the appropriate case, so as to embodiments herein described herein.In addition, term " comprising " and " tool
Have " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing series of steps or unit
Process, method, system, product or equipment those of are not necessarily limited to clearly to list step or unit, but may include without clear
It is listing to Chu or for these processes, method, product or equipment intrinsic other steps or unit.
In this application, term "upper", "inner", " in " etc. instructions orientation or positional relationship be side based on ... shown in the drawings
Position or position relationship.These terms are not intended to limit indicated primarily to preferably describe the application and embodiment
Device, element or component must have particular orientation, or constructed and operated with particular orientation.
Also, above-mentioned part term is other than it can be used to indicate that orientation or positional relationship, it is also possible to for indicating it
His meaning, such as term "upper" also are likely used for indicating certain relations of dependence or connection relation in some cases.For ability
For the those of ordinary skill of domain, the concrete meaning of these terms in this application can be understood as the case may be.
In addition, term " setting ", " being equipped with ", " connection ", " connected ", " fixation " shall be understood in a broad sense.For example, " connection " can
To be to be fixedly connected, it is detachably connected or monolithic construction;Can be mechanical connection, or electrical connection;It can be directly connected,
Either indirectly connected through an intermediary, or it is two connections internal between device, element or component.For
For those of ordinary skill in the art, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
As shown in Figure 1 to Figure 3, this application involves a kind of heat dissipating methods of flight controller, including:
One lug boss 11 is set on shell 1;
Flight control circuit board is split as main control board 2 and port circuit plate 3, master is set on main control board 2
Chip 4 and at least one adding thermal resistance 5 are controlled, and main control board 2 is mounted in lug boss 11, and by port circuit plate 3
It is mounted in the shell 1 of the lower section of lug boss 11;
Main control board 2 and port circuit plate 3 are electrically connected.
In the present embodiment, using lug boss 11 is equipped on shell 1, by the way that main control board 2 is mounted on lug boss
In 11, main control chip 4 and adding thermal resistance 5 are respectively positioned on main control board 2, and port circuit plate 3 is mounted in shell 1 and positioned at convex
The lower section in portion 11 is played, main control board 2 is electrically connected with port circuit plate 3, has been reached the main control chip 4 of flight controller and has been added
The main pyrotoxin such as thermal resistance 5 is arranged on main control board 2, and the component that other do not generate heat or calorific value is less is arranged in port
On circuit board 3, realize that main pyrotoxin detaches and main pyrotoxin is arranged in big 1 lug boss 11 of shell of heat dissipation area,
Around the lug boss 11 of the shell 1 and upper surface can effectively be radiated, to strengthen this flight controller
Heat dissipating method heat dissipation effect.
In the present embodiment, the quantity value of adding thermal resistance 5 can be 1,2,3,4 ...
As shown in Fig. 2, optionally, shell 1 includes first shell 12 and second shell 13;One protrusion of setting on shell 1
Portion 11, including:
The lower end of second shell 13 is connected in first shell 12, and first shell is extended in the upper end of second shell 13
12 upper surface forms the lug boss 11 of shell 1, wherein main control board 2 is mounted in second shell 13, and main control board
2 installation site is higher than the upper surface of first shell 12, and port circuit plate 3 is mounted in first shell 12.
In the present embodiment, the part that second shell 13 extends 12 upper surface of first shell is the lug boss of shell 1
11, by be arranged second shell 13 on main control board 2 main control chip 4 and the main pyrotoxin such as adding thermal resistance 5 have
Effect heat dissipation, in this way, the lug boss 11 of shell 1 and the lower part of shell 1 are made of first shell 12 and second shell 13.
Optionally, when the shape of second shell 13 is cuboid or square, the upper surface of main control board 2 and second
The upper surface of shell 13 is arranged in parallel.
In the present embodiment, the upper surface of main control board 2 is parallel with the upper surface of second shell 13, can make master control core
The main pyrotoxin such as piece 4 and adding thermal resistance 5 is located at sustained height, to ensure the main control chip 4 on main control board 2 and heating electricity
The distances of the main pyrotoxin apart from 13 upper surface of second shell such as resistance 5 are identical, more uniform convenient for the upper surface of second shell 13
Heat dissipation.
Optionally, the distance of main control board 2 to 13 upper surface of second shell is less than or equal to main control board 2 to the first
The distance of 12 upper surface of shell.
In the present embodiment, because port circuit plate 3 is located at the lower section of main control board 2, cause in main control board 2
Lower section heat dissipation effect is bad, and main control board 2 to 13 upper surface of second shell distance be less than or equal to main control board 2 to
The distance of 12 upper surface of first shell can so that the main control chip 4 being located on main control board 2 and adding thermal resistance 5 etc. are main
Pyrotoxin more gos deep into second shell 13, accelerates second shell 13 and is generated to the main pyrotoxin such as main control chip 4 and adding thermal resistance 5
Heat absorbed, effectively reduce the temperature around the equal components of main control chip 4, improve the heat dissipating method of this flight controller
Heat dissipation effect.
Optionally, at least four adding thermal resistances 5 are set on main control board 2;
When the shape of main control board 2 is rectangular, the heat dissipating method of this flight controller further includes:
Each corner corresponds to an adding thermal resistance 5 in four corners of main control board 2, by the adding thermal resistance of corresponding corner
5 are mounted on main control board 2 on corresponding corner.
In the present embodiment, adding thermal resistance 5 is arranged on the corner of main control board 2, so that adding thermal resistance 5 is more
Add close to second shell 13, the heat generated to adding thermal resistance 5 convenient for second shell 13 absorbs.
Preferably, the heat dissipating method of this flight controller includes four adding thermal resistances 5.
In the present embodiment, when the heat dissipating method of this flight controller only includes four adding thermal resistances 5, you can to ensure
Adding thermal resistance 5 controls 4 ambient temperature of main control chip, also allows for ensureing when being radiated, by being located at master control
Four heater circuits of 2 corner of circuit board are in time conducted heat by second shell 13.
Optionally, be located at 2 corner of main control board adding thermal resistance 5 to second shell 13 on two adjacent sides away from
From identical.
In the present embodiment, when two adjacent in the adding thermal resistance 5 to second shell 13 positioned at 2 corner of main control board
When the distance of side is identical, the Temperature Distribution inside second shell 13 is more uniform, and second shell 13 can be more rapidly right
The heat that adding thermal resistance 5 generates is absorbed.
Optionally, the material of second shell 13 includes aluminium alloy.
In the present embodiment, because of aluminium alloy good heat conduction effect, can be convenient for using aluminium alloy as the material of second shell 13
The heat dissipation of second shell 13.
Optionally, the lower end of second shell 13 is connected in first shell 12, including:
In 12 upper end of first shell, one socket joint slot is set;
Second shell 13 is plugged in socket joint slot, the material of first shell 12 includes aluminium alloy.
In the present embodiment, it is contacted with first shell 12 by second shell 13 so that the heat of second shell 13 is fast
Speed is conducted to first shell 12, to accelerate the heat dissipation of second shell 13.And the material of first shell 12 may be that aluminium closes
Gold, when first shell 12 can be connected with second shell 13 by inserting mode, under this connection type, 12 He of first shell
The contact area bigger of second shell 13, the effect that the heat of second shell 13 is conducted to first shell 12 are more preferable.
It should be noted that first shell 12 and second shell 13 or one-piece construction, when first shell 12 with
When second shell 13 is that integral type constructs, it can also realize that the heat of second shell 13 is conducted to first shell 12.
As shown in Fig. 2, optionally, the heat dissipating method of this flight control further includes:Data are formed in first shell 12 to connect
First 122, power interface 123 and equipment interface 124, data connector 122 are a kind of realization main control board 2 and port circuit plate 3
The mode electrically connected, power interface 123 is for connecting power supply, and equipment interface 124 is for connecting various equipment and sensor.
In the heat dissipating method of flight controller provided by the embodiments of the present application, using being equipped with lug boss 11 on its shell 1,
By the way that main control board 2 to be mounted in lug boss 11, main control chip 4 and adding thermal resistance 5 are respectively positioned on main control board 2, end
Interface circuit board 3 is mounted on the lower section in shell 1 and positioned at lug boss 11, and main control board 2 is electrically connected with port circuit plate 3, reached
To being arranged the main pyrotoxin such as the main control chip 4 of flight controller and adding thermal resistance 5 on main control board 2, other are not
Fever or the less component of calorific value are arranged on port circuit plate 3, realize that main pyrotoxin detaches and sets main pyrotoxin
It sets in big 1 lug boss 11 of shell of heat dissipation area, around the lug boss 11 of the shell 1 and upper surface can be had
Effect ground heat dissipation, to strengthen this flight controller heat dissipating method heat dissipation effect.And then it solves and flies in the prior art
The technical problem of controller housing 1 heat dissipation effect difference.
Embodiment two
The embodiment of the present application provides a kind of flight controller, as shown in Fig. 2, for the flight control described in embodiment one
The heat dissipating method of device.
In the present embodiment, this flight controller is by implementing the radiator structure described in embodiment one, to reach more
Good heat dissipation effect.This flight controller is not susceptible to failure, the normal work of effective guarantee unmanned plane.
Embodiment three
The embodiment of the present application provides a kind of unmanned plane, including the flight controller described in embodiment two.
In the present embodiment, this unmanned plane is using the flight controller described in embodiment two so that this unmanned plane during flying is more
Add and stablizes, is safer.
The foregoing is merely the preferred embodiments of the application, are not intended to limit this application, for the skill of this field
For art personnel, the application can have various modifications and variations.Within the spirit and principles of this application, any made by repair
Change, equivalent replacement, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of heat dissipating method of flight controller, which is characterized in that including:
One lug boss is set on the shell;
Flight control circuit board is split as main control board and port circuit plate, master control core is set on the main control board
Piece and at least one adding thermal resistance, and the main control board is mounted in the lug boss, and by the port circuit
Plate is mounted in the shell of the lower section of the lug boss;
The main control board and the port circuit plate are electrically connected.
2. the heat dissipating method of flight controller according to claim 1, which is characterized in that the shell includes first shell
And second shell;It is described that a lug boss is set on the shell, including:
The lower end of the second shell is connected in the first shell, and the upper end of the second shell extends described
The upper surface of one shell forms the lug boss of the shell, wherein the main control board is mounted on the second shell
In, and the installation site of the main control board is higher than the upper surface of the first shell, the port circuit plate is mounted on institute
It states in first shell.
3. the heat dissipating method of flight controller according to claim 2, which is characterized in that when the shape of the second shell
For cuboid or square when, the upper surface of the main control board and the upper surface of the second shell are arranged in parallel.
4. the heat dissipating method of flight controller according to claim 3, which is characterized in that the main control board is to described
The distance of second shell upper surface is less than or equal to the main control board to the distance of the first shell upper surface.
5. the heat dissipating method of flight controller according to claim 3, which is characterized in that set on the main control board
Set at least four adding thermal resistances;
When the shape of the main control board is rectangular, the method further includes:
Each corner corresponds to an adding thermal resistance in four corners of the main control board, by the institute of the correspondence corner
Adding thermal resistance is stated on the corresponding corner on the main control board.
6. the heat dissipating method of flight controller according to claim 5, which is characterized in that be located at the governor circuit edges of boards
The distance of two adjacent sides is identical in the adding thermal resistance to the second shell at angle.
7. the heat dissipating method of flight controller according to claim 2, which is characterized in that the material packet of the second shell
Include aluminium alloy.
8. the heat dissipating method of flight controller according to claim 7, which is characterized in that described by the second shell
Lower end is connected in the first shell, including:
In the first shell upper end, one socket joint slot is set;
The second shell is plugged in the socket joint slot, the material of the first shell includes aluminium alloy.
9. a kind of flight controller, which is characterized in that for implementing such as claim 1-8 any one of them flight controllers
Heat dissipating method.
10. a kind of unmanned plane, which is characterized in that including flight controller as claimed in claim 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810553198.4A CN108551748A (en) | 2018-05-31 | 2018-05-31 | Unmanned plane, flight controller and its heat dissipating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810553198.4A CN108551748A (en) | 2018-05-31 | 2018-05-31 | Unmanned plane, flight controller and its heat dissipating method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108551748A true CN108551748A (en) | 2018-09-18 |
Family
ID=63511667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810553198.4A Pending CN108551748A (en) | 2018-05-31 | 2018-05-31 | Unmanned plane, flight controller and its heat dissipating method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108551748A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110678389A (en) * | 2018-09-26 | 2020-01-10 | 深圳市大疆创新科技有限公司 | Unmanned aerial vehicle |
WO2022214033A1 (en) * | 2021-04-09 | 2022-10-13 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control apparatus |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125382A (en) * | 1994-10-26 | 1996-05-17 | Matsushita Electric Ind Co Ltd | Printed-substrate device |
CN1383358A (en) * | 2001-04-25 | 2002-12-04 | 台达电子工业股份有限公司 | Package structure for electronic product |
EP2456294A2 (en) * | 2007-11-28 | 2012-05-23 | voltwerk electronics GmbH | Inverter |
CN202334419U (en) * | 2011-11-15 | 2012-07-11 | 上海三运电机控制技术有限公司 | Low-voltage and high-power brushless direct current motor controller for electric automobile |
KR20140115432A (en) * | 2013-03-19 | 2014-10-01 | (주)에코에너지 기술연구소 | Thermostat apparatus for unmaned aerial vehicle |
CN205179197U (en) * | 2015-11-23 | 2016-04-20 | 深圳市大疆创新科技有限公司 | Image capturing module and aircraft of taking photo by plane |
CN205564420U (en) * | 2016-03-10 | 2016-09-07 | 上海诺倬力机电科技有限公司 | Digit control machine tool resistance heat radiation structure that brings back to life |
CN206394889U (en) * | 2016-12-19 | 2017-08-11 | 重庆零度智控智能科技有限公司 | Unmanned plane |
CN206821134U (en) * | 2017-04-24 | 2017-12-29 | 深圳市大疆创新科技有限公司 | Electron speed regulator and unmanned plane |
US20180014426A1 (en) * | 2016-07-05 | 2018-01-11 | Ku Yong Kim | Pcb module with multi-surface heat dissipation structure, heat dissipation plate used in pcb module, multi-layer pcb assembly, and module case |
CN107846830A (en) * | 2017-12-19 | 2018-03-27 | 成都芯通软件有限公司 | A kind of functional module radiator structure and cabinet |
-
2018
- 2018-05-31 CN CN201810553198.4A patent/CN108551748A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125382A (en) * | 1994-10-26 | 1996-05-17 | Matsushita Electric Ind Co Ltd | Printed-substrate device |
CN1383358A (en) * | 2001-04-25 | 2002-12-04 | 台达电子工业股份有限公司 | Package structure for electronic product |
EP2456294A2 (en) * | 2007-11-28 | 2012-05-23 | voltwerk electronics GmbH | Inverter |
CN202334419U (en) * | 2011-11-15 | 2012-07-11 | 上海三运电机控制技术有限公司 | Low-voltage and high-power brushless direct current motor controller for electric automobile |
KR20140115432A (en) * | 2013-03-19 | 2014-10-01 | (주)에코에너지 기술연구소 | Thermostat apparatus for unmaned aerial vehicle |
CN205179197U (en) * | 2015-11-23 | 2016-04-20 | 深圳市大疆创新科技有限公司 | Image capturing module and aircraft of taking photo by plane |
CN205564420U (en) * | 2016-03-10 | 2016-09-07 | 上海诺倬力机电科技有限公司 | Digit control machine tool resistance heat radiation structure that brings back to life |
US20180014426A1 (en) * | 2016-07-05 | 2018-01-11 | Ku Yong Kim | Pcb module with multi-surface heat dissipation structure, heat dissipation plate used in pcb module, multi-layer pcb assembly, and module case |
CN206394889U (en) * | 2016-12-19 | 2017-08-11 | 重庆零度智控智能科技有限公司 | Unmanned plane |
CN206821134U (en) * | 2017-04-24 | 2017-12-29 | 深圳市大疆创新科技有限公司 | Electron speed regulator and unmanned plane |
CN107846830A (en) * | 2017-12-19 | 2018-03-27 | 成都芯通软件有限公司 | A kind of functional module radiator structure and cabinet |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110678389A (en) * | 2018-09-26 | 2020-01-10 | 深圳市大疆创新科技有限公司 | Unmanned aerial vehicle |
WO2020061838A1 (en) * | 2018-09-26 | 2020-04-02 | 深圳市大疆创新科技有限公司 | Unmanned aerial vehicle |
WO2022214033A1 (en) * | 2021-04-09 | 2022-10-13 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104742960B (en) | Electronic control unit and electric power steering apparatus with electronic control unit | |
US8981259B2 (en) | Heating apparatus for heating electronic components on a printed circuit board in low temperature environment | |
CN107074341B (en) | The rack components of unmanned plane and unmanned plane with the rack components | |
WO2021218170A1 (en) | Charging box and charging system | |
CN108551748A (en) | Unmanned plane, flight controller and its heat dissipating method | |
US10212816B2 (en) | Heat dissipation device for an electronic device | |
TW201737589A (en) | Robust and high current smart-plug | |
CN107006136A (en) | Cooling mechanism and electron speed regulator, electronic installation with the cooling mechanism | |
CN103200805A (en) | Heat radiation structure of electronic devices in sealed shell | |
CN208210563U (en) | Unmanned plane, flight controller and its radiator structure | |
CN208953964U (en) | A kind of flight control assemblies and unmanned vehicle | |
CN206711977U (en) | A kind of power battery module insulation board assembling structure | |
CN108541195A (en) | Unmanned plane, flight controller and its radiator structure | |
CN206340625U (en) | Battery management system | |
CN203353030U (en) | ESC heat dissipation device for aircraft | |
CN205408321U (en) | Air conditioner, electrical apparatus box and electrical apparatus box envelope thereof | |
CN102148431A (en) | Connector | |
CN112532148A (en) | Motor controller and electric automobile | |
CN207488933U (en) | A kind of computer motherboard systems stabilisation | |
CN106114841A (en) | A kind of six rotor wing unmanned aerial vehicle fuselages | |
CN208675648U (en) | A kind of controller for electric vehicle radiator structure | |
WO2024103342A1 (en) | Heat dissipation apparatus, vehicle, and heat dissipation control method | |
CN206196240U (en) | Heat radiation structure assembly of mobile terminal and mobile terminal | |
CN206505994U (en) | A kind of battery and carrier arrangement | |
EP2693851A1 (en) | Heating apparatus for heating electronic components on a printed circuit board in low temperature environment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180918 |