CN108550530B - A kind of continuous photoresist coating process of diode lead - Google Patents
A kind of continuous photoresist coating process of diode lead Download PDFInfo
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- CN108550530B CN108550530B CN201810491043.2A CN201810491043A CN108550530B CN 108550530 B CN108550530 B CN 108550530B CN 201810491043 A CN201810491043 A CN 201810491043A CN 108550530 B CN108550530 B CN 108550530B
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- 238000000576 coating method Methods 0.000 title claims abstract description 19
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 146
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 45
- 238000001035 drying Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 230000001680 brushing effect Effects 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 5
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention belongs to diode manufacturing technology fields, specifically a kind of continuous photoresist coating process of diode lead, the process employs diode lead sizers, the diode lead sizer includes that fixed frame, feed opening, glue tank module, belt, belt pulley, gluing head module, pallet module and drying module, glue tank module are fixedly mounted on fixed frame；Glue tank module is for containing glue；Belt is located at the lower section of glue tank module, and belt sleeve is over pulleys carried；Belt pulley is mounted on motor shaft；Gluing head module is for gluing diode lead；Pallet module is mounted on belt；Drying module is mounted on the lower surface of glue tank module, and drying module is located at the right side of gluing head module.Present invention is mainly used for the continuous gluing of batch is carried out to diode, the efficiency of diode gluing is improved, market use demand is met, while the glue for guaranteeing to avoid when gluing diode in glue case solidifies, later period cleaning is inconvenient.
Description
Technical field
The invention belongs to diode manufacturing technology field, specifically a kind of continuous photoresist coating process of diode lead.
Background technique
Diode, (English: Diode), in electronic component, there are two the devices of electrode for a kind of tool, only allow electric current by
Single direction flows through, and many uses are the functions using its rectification.And varactor (Varicap Diode) is then used to work as
Make the adjustable condenser of electronic type.The current direction that most of diode has we normally referred to as " rectification
(Rectifying) " function.The most common function of diode is exactly only electric current to be allowed to be passed through (referred to as forward partially by single direction
Pressure), (referred to as reverse bias) is blocked when reversed.
Diode is that there are two the devices of electrode for a kind of tool, only an electric current is allowed to be flowed through by single direction, many uses are
Using the function that it is rectified, need to glue diode using to gluing machine during diode production.But it is traditional
Diode photoresist coating process all there is a series of defects, such as diode disposably to glue to multiple diodes,
Result in the gluing efficiency of diode too low in this way, so that diode production amount is too low, it is bad for the heat insulation effect of glue, this
Sample will lead to that the glue solidifies, and not convenient enough the problem of the cleaning for gluing machine, the presence of these problems all affects traditional
Photoresist coating process can not meet the demand used to the gluing efficiency of diode, for this purpose, it is proposed that a kind of diode lead is continuous
Photoresist coating process.
Summary of the invention
In order to make up for the deficiencies of the prior art, the invention proposes a kind of continuous photoresist coating process of diode lead, the present invention
It is mainly used for carrying out diode the continuous gluing of batch, improves the efficiency of diode gluing, meet market use demand, protect simultaneously
It demonstrate,proves the glue avoided when gluing diode in glue case to solidify, later period cleaning is inconvenient.
The technical solution adopted by the present invention to solve the technical problems is: a kind of diode lead of the present invention is continuous
Photoresist coating process, the process employs diode lead sizer, which includes fixed frame, charging
Mouth, glue tank module, belt, belt pulley, gluing head module, pallet module and drying module, the glue tank module are fixed
It is mounted on fixed frame；The feed opening is located at the top of glue tank module, and glue tank module is for containing glue；Described
Belt pulley is mounted on motor shaft；The belt is located at the lower section of glue tank module, and belt sleeve is over pulleys carried；Described is upper
Rubber head module is mounted on the lower section of glue case, and gluing head module is for gluing diode lead；The pallet module
Positioned at the lower section of glue tank module, pallet module is mounted on belt；The drying module is mounted under glue tank module
Surface, drying module are located at the right side of gluing head module；
The continuous photoresist coating process of the diode lead includes the following steps:
Step 1: glue is added in glue tank module from feed opening, after glue is added in glue case, in water tank
Heater strip in wall starts to heat the water in water tank, and the water in water tank heats the glue in glue case, makes glue
Liquid is constantly in fluid state, and glue is avoided to solidify；
Step 2: after glue tank module is filled it up in step 1, diode is put into pallet module, diode is put into
In placement plate, the lead of diode is passed through from plugging block, and two leads of diode are respectively put into two pallets, according to
The wire length of diode is different, and the groove inside pallet is truncated in mobile brushing board, saves the usage amount of glue, works as glue
After on drop to diode lead, vibration motor starting shakes pallet, allows the glue in pallet evenly and rapidly to diode
Lead gluing；
Step 3: after diode is put into pallet in step 2, gluing diode lead by gluing head module,
Micromotor drives hemispherical Shell to swing back and forth by shaft, and hemispherical Shell, which is swung, drives circular cone plate to swing, and circular cone plate swings back and forth
Being conducive to the quick drippage of glue and is uniformly taped against on diode lead, glue is flowed into hemispherical Shell by upper sebific duct, then
It is flowed into circular cone plate from the circular hole one of hemispherical Shell, is added drop-wise on diode lead finally by the through-hole on circular cone plate；
Step 4: in step 3 diode lead gluing after the completion of, pallet with belt-conveying to dry up module lower section,
Gear rotates under the drive of motor one, and gear rotation band carry-over bar rises, and rack gear, which moves up, moves up placement plate, places
Strip is moved diode and is moved up, and simultaneous retractable cylinder two moves down, and telescopic cylinder three works, and semi-circular tube draws diode
Line encases, and magnetic patch facilitates the closure of semi-circular tube, and fan cup is rotated driven by the motor, while heating coil works, quickly
Diode lead is carried out to blow sense, improves the glue setting rate of diode lead.
The glue tank module includes water tank, glue case and heater strip, and the water tank is mounted on fixed frame；It is described
Heater strip be located in the inner wall of water tank；The glue case is located at the inside of water tank.After glue is added in glue case, water
Heater strip in chamber interior wall starts to heat the water in water tank, and the water in water tank heats the glue in glue case,
So that glue is constantly in fluid state, glue is avoided to solidify.
The gluing head module includes upper sebific duct, hemispherical Shell, shaft, micromotor, circular cone plate and rubber membrane, described
Upper sebific duct is mounted on the lower section of glue tank module, and upper sebific duct and glue case communicate；The micromotor is mounted on sebific duct
Lower end；The shaft is mounted on the motor shaft of micromotor；The hemispherical Shell is mounted in shaft, the bottom of hemispherical Shell
Circular hole one is offered, hemispherical Shell is with shaft swing；The circular cone plate is mounted on the lower section of hemispherical Shell, and the centre of circular cone plate is opened
Equipped with through-hole；The rubber membrane is connected on hemispherical Shell and upper sebific duct, and rubber membrane is for being sealed upper sebific duct lower end.Work
When making, micromotor drives hemispherical Shell to swing back and forth by shaft, and hemispherical Shell, which is swung, drives circular cone plate to swing, and circular cone plate is back and forth
It swings the quick drippage for being conducive to glue and is uniformly taped against on diode lead, glue is flowed into hemispherical Shell by upper sebific duct
It is interior, then be flowed into circular cone plate from the circular hole one of hemispherical Shell, it is added drop-wise on diode lead finally by the through-hole on circular cone plate.
The hemispherical Shell is also equipped with plectane, rope, ball and electromagnetism locking bearing, and the plectane is located at hemispherical Shell
Circular hole one in, plectane is movably arranged on hemispherical Shell by rotation axis one；The rope is mounted on plectane；The circle
Ball is mounted on rope；The electromagnetism locking bearing is mounted in rotation axis one, and electromagnetism locking bearing is used for locking rotation axis
One.When minitype motor driving hemispherical Shell is swung, ball is swung with hemispherical Shell, and ball swings by rope and pulls plectane pendulum
It is dynamic, the circular hole one of hemispherical Shell is opened, flows out glue from circular hole one；When micromotor stops working, electromagnetism locking axis
Starting is held, locking rotation axis one makes plectane stop swinging, and realizes and blocks to circular hole one.
The pallet module includes pallet, vibration motor, shakes spring, fixed plate, brushing board and plugging block, described
Fixed plate is mounted on belt；The vibration spring is fixedly mounted in fixed plate；The pallet is mounted on vibration spring
The other end, open up inside pallet fluted；The vibration motor is mounted on the lower section of pallet；The brushing board is located at support
In groove inside disk, brushing board is mounted on pallet by helical axis；The plugging block is located in tray slots, plugging block
When centre offers wire lead slot work, diode is put into placement plate, the lead of diode is passed through from plugging block, diode
Two leads be respectively put into two pallets, different according to the wire length of diode, mobile brushing board is to pallet inside
Groove be truncated, save the usage amount of glue, after glue drips on diode lead, vibration motor starting, make pallet
Vibration allows the glue in pallet evenly and rapidly to glue to diode lead；After diode lead gluing, diode quilt
Placement plate is lifted, and helical axis makes brushing board mobile driven by the motor, and extra glue is brought together, and utility tray turns
It is poured out when moving below belt.
It is also provided with groove one and groove two in the pallet, rack gear, gear, motor one are installed on pallet and places
Plate；Rack gear is installed in the groove one；Gear, gear and rack gear engagement are installed in the groove two；The electricity
The gear axis connection of machine one and gear；The placement plate is fixedly connected with rack gear.When work, pallet is arrived with belt-conveying
The lower section of module is dried up, gear rotates under the drive of motor one, and gear rotation band carry-over bar rises, and rack gear, which moves up, to be made to place
Plate moves up, and placement plate drives diode to move up, convenient to dry up to diode lead.
The drying module includes telescopic cylinder two, fan cup, rotation axis, semi-circular tube, heating coil, magnetic patch, flexible gas
Cylinder three and strut, the telescopic cylinder two are mounted on the lower section of glue tank module；The rotation axis is mounted on telescopic cylinder
Two inside, rotation axis are driven by motor；The fan cup is installed on the rotating shaft by cross bar；The semi-circular tube is hinged
In the front end of telescopic cylinder two；The heating coil is located at the inner wall of semi-circular tube；Before the magnetic patch is mounted on semi-circular tube
End；The telescopic cylinder three is mounted on two outer wall of telescopic cylinder；Described strut one end connects telescopic cylinder three, strut
The other end is connected on semi-circular tube.When work, telescopic cylinder two is moved down, and telescopic cylinder three works, and semi-circular tube is by diode
Lead encase, magnetic patch facilitates the closure of semi-circular tube, and fan cup is rotated driven by the motor, while heating coil works,
Quickly diode lead is carried out to blow sense, improves the glue setting rate of diode lead.
The beneficial effects of the present invention are:
1. the continuous photoresist coating process of a kind of diode lead of the present invention, this technique are mainly used for criticizing diode
The continuous gluing of amount, improves the efficiency of diode gluing, meets market use demand, to glue case mould while gluing to diode
Glue in block is kept the temperature, and glue is avoided to solidify.
2. drying module of the present invention is realized by the cooperation of fan cup, semi-circular tube and heating coil to two poles
The drying time is saved in the independent drying of pipe lead, improves drying quality, improves drying efficiency, realizes rapid production, shorten enterprise
Time production cycle of industry.
3. gluing head module of the present invention passes through the mutual of upper sebific duct, hemispherical Shell, shaft, micromotor and circular cone plate
Cooperation realizes the uniform quick gluing to diode lead, while being equipped with brushing board and being brought together extra glue, convenient
Extra glue being poured out and collecting, and the amount of glue is saved, and reduces cost.
Detailed description of the invention
The present invention will be further explained below with reference to the attached drawings.
Fig. 1 is flow chart of the method for the present invention；
Fig. 2 is main view of the invention；
Fig. 3 is the enlarged drawing in Fig. 2 of the present invention at A；
Fig. 4 is the enlarged drawing in Fig. 2 of the present invention at B；
Fig. 5 is the sectional view in Fig. 2 of the present invention at C-C；
In figure: fixed frame 1, feed opening 2, glue tank module 3, water tank 31, glue case 32, belt 4, belt pulley 5, upper rubber head
Module 6, upper sebific duct 61, hemispherical Shell 62, shaft 63, micromotor 64, circular cone plate 65, plectane 67, rope 68, ball 69, electromagnetism
Locking bearing 70, pallet module 7, pallet 71, vibration motor 72, vibration spring 73, fixed plate 74, brushing board 75, plugging block 76,
Rack gear 77, gear 78, placement plate 79, drying module 8, telescopic cylinder 2 81, fan cup 82, rotation axis 83, semi-circular tube 84, heater wire
Enclose 85, telescopic cylinder 3 86, strut 87.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in Figures 1 to 5, the continuous photoresist coating process of a kind of diode lead of the present invention, the process employs two
Pole pipe lead sizer, the diode lead sizer include fixed frame 1, feed opening 2, glue tank module 3, belt 4, skin
Belt wheel 5, gluing head module 6, pallet module 7 and drying module 8, the glue tank module 3 are fixedly mounted on fixed frame 1；
The feed opening 2 is located at the top of glue tank module 3, and glue tank module 3 is for containing glue；The belt pulley 5 is installed
On motor shaft；The belt 4 is located at the lower section of glue tank module 3, and 4 sets of belt on belt pulley 5；The upper rubber head mould
Block 6 is mounted on the lower section of glue case 32, and gluing head module 6 is for gluing diode lead；The pallet module 7
In the lower section of glue tank module 3, pallet module 7 is mounted on belt 4；The drying module 8 is mounted on glue tank module 3
Lower surface, drying module 8 are located at the right side of gluing head module 6；
The continuous photoresist coating process of the diode lead includes the following steps:
Step 1: glue is added in glue tank module 3 from feed opening 2, after glue is added in glue case 32, water
Heater strip in 31 inner wall of case starts to heat the water in water tank 31, the water in water tank 31 to the glue in glue case 32 into
Row heating, makes glue be constantly in fluid state, glue is avoided to solidify；
Step 2: after glue tank module 3 is filled it up in step 1, diode is put into pallet module 7, diode is put
Onto placement plate 79, the lead of diode is passed through from plugging block 76, and two leads of diode are respectively put into two pallets
Different according to the wire length of diode in 71, the groove inside pallet 71 is truncated in mobile brushing board 75, saves glue
Usage amount, after glue drips on diode lead, vibration motor 72 starts, and shakes pallet 71, allows glue in pallet 71
Liquid is evenly and rapidly glued to diode lead；
Step 3: after diode is put into pallet 71 in step 2, diode lead is carried out by gluing head module 6
Glue, micromotor 64 drive hemispherical Shell 62 to swing back and forth by shaft 63, and hemispherical Shell 62, which is swung, drives circular cone plate 65 to swing, circular cone
Swinging back and forth for plate 65 is conducive to the quick drippage of glue and is uniformly taped against on diode lead, and glue is flowed by upper sebific duct 61
Enter into hemispherical Shell 62, then be flowed into circular cone plate 65 from the circular hole one of hemispherical Shell 62, finally by the through-hole on circular cone plate 65
It is added drop-wise on diode lead；
Step 4: in step 3 after the completion of diode lead gluing, pallet 71 has transported drying module 8 with belt 4
Lower section, gear 78 motor one drive under rotate, gear 78 rotation band carry-over bar 77 rise, rack gear 77, which moves up, to be made to place
Plate 79 moves up, and placement plate 79 drives diode to move up, and simultaneous retractable cylinder 2 81 moves down, telescopic cylinder 3 86
Work, semi-circular tube 84 encases the lead of diode, and magnetic patch facilitates the closure of semi-circular tube 84, fan cup 82 driven by the motor into
Row rotation, while heating coil 85 works, and quickly carries out blowing sense to diode lead, improves the glue solidification speed of diode lead
Degree.
As one embodiment of the present invention, the glue tank module 3 includes water tank 31, glue case 32 and heating
Silk, the water tank 31 are mounted on fixed frame 1；The heater strip is located in the inner wall of water tank 31；The glue case 32
Positioned at the inside of water tank 31.After glue is added in glue case 32, the heater strip in 31 inner wall of water tank starts in water tank 31
Water heated, the water in water tank 31 heats the glue in glue case 32, and glue is made to be constantly in fluid state, keeps away
Exempt from glue solidification.
As one embodiment of the present invention, the gluing head module 6 includes upper sebific duct 61, hemispherical Shell 62, shaft
63, micromotor 64, circular cone plate 65 and rubber membrane, the upper sebific duct 61 are mounted on the lower section of glue tank module 3, upper sebific duct 61
It is communicated with glue case 32；The micromotor 64 is mounted on the lower end of sebific duct 61；The shaft 63 is mounted on micro electric
On the motor shaft of machine 64；The hemispherical Shell 62 is mounted in shaft 63, and the bottom of hemispherical Shell 62 offers circular hole one, hemispherical Shell
62 swing with shaft 63；The circular cone plate 65 is mounted on the lower section of hemispherical Shell 62, and the centre of circular cone plate 65 offers through-hole；
The rubber membrane is connected on hemispherical Shell 62 and upper sebific duct 61, and rubber membrane is for being sealed upper 61 lower end of sebific duct.Work
When, micromotor 64 drives hemispherical Shell 62 to swing back and forth by shaft 63, and hemispherical Shell 62, which is swung, drives circular cone plate 65 to swing, circular cone
Swinging back and forth for plate 65 is conducive to the quick drippage of glue and is uniformly taped against on diode lead, and glue is flowed by upper sebific duct 61
Enter into hemispherical Shell 62, then be flowed into circular cone plate 65 from the circular hole one of hemispherical Shell 62, finally by the through-hole on circular cone plate 65
It is added drop-wise on diode lead.
As one embodiment of the present invention, the hemispherical Shell 62 is also equipped with plectane 67, rope 68,69 and of ball
Electromagnetism locking bearing 70, the plectane 67 are located in the circular hole one of hemispherical Shell 62, and plectane 67 passes through one activity installation of rotation axis
On hemispherical Shell 62；The rope 68 is mounted on plectane 67；The ball 69 is mounted on rope 68；The electromagnetism
Locking bearing 70 is mounted in rotation axis one, and electromagnetism locking bearing 70 is used for locking rotation axis one.When micromotor 64 drives half
When spherical shell 62 is swung, ball 69 is swung with hemispherical Shell 62, and ball 69 swings by rope 68 and plectane 67 is pulled to swing, by hemisphere
The circular hole one of shell 62 is opened, and flows out glue from circular hole one；When micromotor 64 stops working, electromagnetism locking bearing 70 is opened
Dynamic, locking rotation axis one makes plectane 67 stop swinging, and realizes and blocks to circular hole one.
As one embodiment of the present invention, the pallet module 7 includes pallet 71, vibration motor 72, vibration bullet
Spring 73, fixed plate 74, brushing board 75 and plugging block 76, the fixed plate 74 are mounted on belt 4；The vibration spring 73
It is fixedly mounted in fixed plate 74；The pallet 71 is mounted on the other end of vibration spring 73, offers inside pallet 71 recessed
Slot；The vibration motor 72 is mounted on the lower section of pallet 71；The brushing board 75 is located in the groove inside pallet 71, brush
Board-washing 75 is mounted on pallet 71 by helical axis；The plugging block 76 is located in 71 groove of pallet, opens among plugging block 76
Equipped with wire lead slot.When work, diode is put into placement plate 79, the lead of diode is passed through from plugging block 76, diode
Two leads be respectively put into two pallets 71, different according to the wire length of diode, mobile brushing board 75 is to pallet
Groove inside 71 is truncated, and the usage amount of glue is saved, and after glue drips on diode lead, vibration motor 72 is opened
It is dynamic, pallet 71 is shaken, the glue in pallet 71 is allowed evenly and rapidly to glue to diode lead；When diode lead has glued
Bi Hou, diode are placed plate 79 and lift, and helical axis makes brushing board 75 mobile driven by the motor, and extra glue is concentrated
To together, utility tray 71 is poured out when turning to 4 lower section of belt.
As one embodiment of the present invention, groove one and groove two, pallet 71 are also provided in the pallet 71
On rack gear 77, gear 78, motor one and placement plate 79 are installed；Rack gear 77 is installed in the groove one；The groove
Gear 78 is installed, gear 78 and rack gear 77 engage in two；The gear axis connection of the motor one and gear 78；Described puts
Plate 79 is set to be fixedly connected with rack gear 77.When work, pallet 71 has transported the lower section of drying module 8 with belt 4, and gear 78 exists
Motor one drives lower rotation, and the rotation band carry-over bar 77 of gear 78 rises, and rack gear 77, which moves up, moves up placement plate 79, puts
Setting plate 79 drives diode to move up, convenient to dry up to diode lead.
As one embodiment of the present invention, the drying module 8 includes telescopic cylinder 2 81, fan cup 82, rotation
Axis 83, semi-circular tube 84, heating coil 85, magnetic patch, telescopic cylinder 3 86 and strut 87, the telescopic cylinder 2 81 are mounted on glue
The lower section of water tank module 3；The rotation axis 83 is mounted on the inside of telescopic cylinder 2 81, and rotation axis 83 is driven by motor；
The fan cup 82 is mounted in rotation axis 83 by cross bar；The semi-circular tube 84 is hinged on the front end of telescopic cylinder 2 81；
The heating coil 85 is located at the inner wall of semi-circular tube 84；The magnetic patch is mounted on the front end of semi-circular tube 84；Described is flexible
Cylinder 3 86 is mounted on 2 81 outer wall of telescopic cylinder；Described 87 one end of strut connects telescopic cylinder 3 86, strut 87 it is another
One end is connected on semi-circular tube 84.When work, telescopic cylinder 2 81 is moved down, and telescopic cylinder 3 86 works, and semi-circular tube 84 will
The lead of diode encases, and magnetic patch facilitates the closure of semi-circular tube 84, and fan cup 82 is rotated driven by the motor, heated simultaneously
Coil 85 works, and quickly carries out blowing sense to diode lead, improves the glue setting rate of diode lead.
Specifically used process is as follows:
Glue is added in glue tank module 3 from feed opening 2, after glue is added in glue case 32, in water tank 31
Heater strip in wall starts to heat the water in water tank 31, and the water in water tank 31 adds the glue in glue case 32
Heat makes glue be constantly in fluid state, and glue is avoided to solidify；Diode is put into pallet module 7, diode is put into
In placement plate 79, the lead of diode is passed through from plugging block 76, and two leads of diode are respectively put into two pallets 71
Interior, different according to the wire length of diode, the groove inside pallet 71 is truncated in mobile brushing board 75, saves glue
Usage amount；After diode is put into pallet 71, diode lead is glued by gluing head module 6, micromotor 64 is logical
Crossing shaft 63 drives hemispherical Shell 62 to swing back and forth, and hemispherical Shell 62, which is swung, drives circular cone plate 65 to swing, and circular cone plate 65 swings back and forth
Be conducive to the quick drippage of glue and be uniformly taped against on diode lead, glue is flowed into hemispherical Shell 62 by upper sebific duct 61
It is interior, then be flowed into circular cone plate 65 from the circular hole one of hemispherical Shell 62, diode is added drop-wise to finally by the through-hole on circular cone plate 65
On lead；After glue drips on diode lead, vibration motor 72 starts, and shakes pallet 71, allows glue in pallet 71
Evenly and rapidly glued to diode lead；After the completion of diode lead gluing, pallet 71 has transported drying mould with belt 4
The lower section of block 8, gear 78 rotate under the drive of motor one, and the rotation band carry-over bar 77 of gear 78 rises, and rack gear 77, which moves up, to be made
Placement plate 79 moves up, and placement plate 79 drives diode to move up, and simultaneous retractable cylinder 2 81 moves down, telescopic cylinder
3 86 work, semi-circular tube 84 encase the lead of diode, and magnetic patch facilitates the closure of semi-circular tube 84, drive of the fan cup 82 in motor
Under rotated, while heating coil 85 works, and quickly dries up to diode lead, and the glue for improving diode lead is solidifying
Gu speed.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (5)
1. a kind of continuous photoresist coating process of diode lead, it is characterised in that: the process employs diode lead sizers, should
Diode lead sizer include fixed frame (1), feed opening (2), glue tank module (3), belt (4), belt pulley (5), on
Rubber head module (6), pallet module (7) and drying module (8), the glue tank module (3) are fixedly mounted on fixed frame (1)
On；The feed opening (2) is located at the top of glue tank module (3), and glue tank module (3) is for containing glue；The skin
Belt wheel (5) is mounted on motor shaft；The belt (4) is located at the lower section of glue tank module (3), and belt (4) is covered in belt pulley
(5) on；The gluing head module (6) is mounted on the lower section of glue case (32), and gluing head module (6) is used for diode lead
It is glued；The pallet module (7) is located at the lower section of glue tank module (3), and pallet module (7) is mounted on belt (4)；
The drying module (8) is mounted on the lower surface of glue tank module (3), and drying module (8) is located at the right side of gluing head module (6)
Side；
The continuous photoresist coating process of the diode lead includes the following steps:
Step 1: glue is added in glue tank module (3) from feed opening (2)；
Step 2: after glue tank module (3) is filled it up in step 1, diode is put on pallet module (7)；
Step 3: after diode is put into pallet (71) in step 2, diode lead is carried out by gluing head module (6)
Glue；
Step 4: in step 3 after the completion of diode lead gluing, as belt (4) is transferred to the lower section of drying module (8), control
System drying module (8) work, dries up diode lead；
The glue tank module (3) includes water tank (31), glue case (32) and heater strip, and the water tank (31) is mounted on solid
Determine on frame (1)；The heater strip is located in the inner wall of water tank (31)；The glue case (32) is located at the interior of water tank (31)
Portion；
The gluing head module (6) includes upper sebific duct (61), hemispherical Shell (62), shaft (63), micromotor (64), circular cone plate
(65) and rubber membrane, the upper sebific duct (61) are mounted on the lower section of glue tank module (3), upper sebific duct (61) and glue case (32)
It communicates；The micromotor (64) is mounted on the lower end of sebific duct (61)；The shaft (63) is mounted on micromotor
(64) on motor shaft；The hemispherical Shell (62) is mounted on shaft (63), and the bottom of hemispherical Shell (62) offers circular hole one,
Hemispherical Shell (62) is swung with shaft (63)；The circular cone plate (65) is mounted on the lower section of hemispherical Shell (62), circular cone plate (65)
Centre offer through-hole；The rubber membrane is connected on hemispherical Shell (62) and upper sebific duct (61), and rubber membrane is used for gluing
Pipe (61) lower end is sealed.
2. the continuous photoresist coating process of a kind of diode lead according to claim 1, it is characterised in that: the hemispherical Shell
(62) it is also equipped with plectane (67), rope (68), ball (69) and electromagnetism locking bearing (70), the plectane (67) is located at half
In the circular hole one of spherical shell (62), plectane (67) is movably arranged on hemispherical Shell (62) by rotation axis one；The rope (68)
It is mounted on plectane (67)；The ball (69) is mounted on rope (68)；The electromagnetism locking bearing (70) is mounted on
In rotation axis one, electromagnetism locking bearing (70) is used for locking rotation axis one.
3. the continuous photoresist coating process of a kind of diode lead according to claim 1, it is characterised in that: the pallet module
(7) include pallet (71), vibration motor (72), shake spring (73), fixed plate (74), brushing board (75) and plugging block (76),
The fixed plate (74) is mounted on belt (4)；The vibration spring (73) is fixedly mounted on fixed plate (74)；It is described
Pallet (71) be mounted on the other end of vibration spring (73), open up inside pallet (71) fluted；The vibration motor
(72) it is mounted on the lower section of pallet (71)；The brushing board (75) is located in the internal groove of pallet (71), brushing board (75)
It is mounted on pallet (71) by helical axis；The plugging block (76) is located in pallet (71) groove, and plugging block (76) is intermediate
Offer wire lead slot.
4. the continuous photoresist coating process of a kind of diode lead according to claim 3, it is characterised in that: the pallet (71)
It is inside also provided with groove one and groove two, rack gear (77), gear (78), motor one and placement plate are installed on pallet (71)
(79)；Rack gear (77) are installed in the groove one；It is equipped in the groove two gear (78), gear (78) and rack gear
(77) it engages；The gear axis connection of the motor one and gear (78)；The placement plate (79) and the fixed company of rack gear (77)
It connects.
5. the continuous photoresist coating process of a kind of diode lead according to claim 1, it is characterised in that: the drying module
It (8) include telescopic cylinder two (81), fan cup (82), rotation axis (83), semi-circular tube (84), heating coil (85), magnetic patch, flexible gas
Cylinder three (86) and strut (87), the telescopic cylinder two (81) are mounted on the lower section of glue tank module (3)；The rotation axis
(83) it is mounted on the inside of telescopic cylinder two (81), rotation axis (83) is driven by motor；The fan cup (82) passes through cross bar
It is mounted on rotation axis (83)；The semi-circular tube (84) is hinged on the front end of telescopic cylinder two (81)；The heating coil
(85) it is located at the inner wall of semi-circular tube (84)；The magnetic patch is mounted on the front end of semi-circular tube (84)；The telescopic cylinder three
(86) it is mounted on telescopic cylinder two (81) outer wall；Described strut (87) one end connects telescopic cylinder three (86), strut (87)
The other end be connected on semi-circular tube (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491043.2A CN108550530B (en) | 2018-05-21 | 2018-05-21 | A kind of continuous photoresist coating process of diode lead |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810491043.2A CN108550530B (en) | 2018-05-21 | 2018-05-21 | A kind of continuous photoresist coating process of diode lead |
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| CN108550530B true CN108550530B (en) | 2019-10-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5567238A (en) * | 1994-12-06 | 1996-10-22 | Coating Machinery Systems, Inc. | Oscillating bed seed coating machine for particulate material |
| KR101967496B1 (en) * | 2011-09-14 | 2019-04-09 | 엠테크스마트 가부시키가이샤 | Led manufacturing method, led manufacturing device, and led |
| CN206215444U (en) * | 2016-11-03 | 2017-06-06 | 天津市景元机电有限公司 | A kind of Mobile telephone shell spray equipment |
| CN206286147U (en) * | 2016-12-15 | 2017-06-30 | 陈新友 | A kind of local hot melt powder coating equipment |
| CN206401360U (en) * | 2017-02-07 | 2017-08-11 | 东莞市易光电子有限公司 | One kind drying glue dispensing and packaging device |
| CN107297303A (en) * | 2017-07-30 | 2017-10-27 | 合肥杰代机电科技有限公司 | A kind of diode gluing machine for being capable of proper alignment diode |
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Effective date of registration: 20190927 Address after: 312030 Shengling Village 631, Anchang Street, Keqiao District, Shaoxing City, Zhejiang Province Applicant after: Shaoxing Lanhai Environmental Protection Technology Co.,Ltd. Address before: 518031 Room 2102, Metropolitan Xuan, Shenzhen Futian District, Shenzhen City, Guangdong Province, Shenzhen Goodwalk Electronics Co., Ltd. Applicant before: Tang Meixia |
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Effective date of registration: 20231109 Address after: 312030 Qixian Street Industrial Community, Keqiao District, Shaoxing City, Zhejiang Province Patentee after: Shaoxing Huawei New Materials Co.,Ltd. Address before: 312030 No. 631, Shengling village, Anchang street, Keqiao District, Shaoxing City, Zhejiang Province Patentee before: Shaoxing Lanhai Environmental Protection Technology Co.,Ltd. |
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Denomination of invention: A continuous gluing process for diode leads Effective date of registration: 20231128 Granted publication date: 20191025 Pledgee: Zhejiang Shaoxing Ruifeng Rural Commercial Bank Co.,Ltd. Binhai sub branch Pledgor: Shaoxing Huawei New Materials Co.,Ltd. Registration number: Y2023980067903 |