CN108541139A - A kind of PCB via holes production method and PCB - Google Patents
A kind of PCB via holes production method and PCB Download PDFInfo
- Publication number
- CN108541139A CN108541139A CN201810277481.9A CN201810277481A CN108541139A CN 108541139 A CN108541139 A CN 108541139A CN 201810277481 A CN201810277481 A CN 201810277481A CN 108541139 A CN108541139 A CN 108541139A
- Authority
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- China
- Prior art keywords
- hole
- via hole
- pcb
- drilling
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of PCB via holes production methods, include the following steps：The pre- big primary drilling in aperture is carried out in the conducting hole site of the PCB, to the via hole after the primary drilling plate a plated-through-hole of thick copper, secondary drilling is carried out to the via hole of the thick copper of the plating, secondary plated-through-hole is carried out to the via hole after the secondary drilling.A kind of PCB via holes production method of the embodiment of the present invention scheme offer and PCB can solve the problem of the high frequencies such as PI, PTFE plank because hole wall poor flatness plated-through-hole processing procedure is difficult to obtain thickness homogeneous coating after drilling, to improve the reliability qualifications of PCB product.
Description
Technical field
The present invention relates to electronic manufacturing field more particularly to a kind of PCB via holes production method and PCB.
Background technology
High frequency with electronic product and fining, PCB (Printed Circuit Board, printed wiring board) productions
HF link plate, extraordinary base material high-end line plate accounting in industry increase year by year, with PI (Polyimide, polyimides) plank
And the HF link plate that PTFE (Poly Tetra Fluoroethylene, polytetrafluoroethylene (PTFE)) plank is representative has obtained extensively
General popularization and application, at the same time, HF link plate is other than the particular/special requirement for plank, for the flat of transmission conductor
Whole degree, especially via hole hole wall layers of copper flatness also have a more harsh requirement, and the high frequencies plate such as PI planks, PTFE planks
Material usually has preferable toughness, and during drilling to this plank, drill point is easy to pull base material, after leading to drilling
Hole wall flatness it is poor, and the chemical inertness of this high frequency plank is usually relatively strong, the base material that hole wall is pullled out be not easy by
Liquid medicine stings that erosion is smooth, this brings prodigious challenge to subsequent plated-through-hole processing procedure, due to hole wall poor flatness, plated-through-hole processing procedure without
Method obtains coating in homogeneous thickness, this brings the reliability qualifications of circuit panel products larger damage.
Invention content
The embodiment of the present invention provides a kind of PCB via holes production method and PCB, can solve the high frequencies such as PI, PTFE plank because
For hole wall poor flatness after drilling, the problem of plated-through-hole processing procedure is difficult to obtain thickness homogeneous coating, to improve the reliable of PCB product
Property quality.
In a first aspect, a kind of PCB via holes production method provided in an embodiment of the present invention, including：
The pre- big primary drilling in aperture is carried out in the conducting hole site of base material；
To the via hole after once drilling plate a plated-through-hole of thick copper；
Secondary drilling is carried out to the via hole of the thick copper of plating；
Secondary plated-through-hole is carried out to the via hole after secondary drilling.
Second aspect, the embodiment of the present invention provide a kind of PCB, the conducting that the via hole of the PCB passes through aforementioned first aspect
Hole production method obtains.
A kind of PCB via holes production method provided in an embodiment of the present invention and PCB are drilled out by pre- big primary drilling
Aperture is more than the via hole in design aperture, and using a plated-through-hole technique of the thick copper of plating, pre- big via hole hole wall is plated thickness
Copper, then secondary drilling is carried out to the via hole for plating thick copper, smooth bright and clean hole wall is obtained, then secondary plating is carried out to the via hole
Through-hole efficiently solves the high frequencies plates such as aforementioned PI, PTFE in the prior art to obtain via hole conductive copper layer in homogeneous thickness
Via hole present in material makes problem, effectively increases the reliability of such base material PCB.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the invention, for this field skill
For art personnel, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of schematic flow diagram of PCB via holes production method provided in an embodiment of the present invention；
Fig. 2 is a kind of signal engineering drawing of PCB via holes production method provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It should be appreciated that ought use in this specification and in the appended claims, term " comprising " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, element, component and/or its presence or addition gathered.
It is also understood that the term used in this description of the invention is merely for the sake of the mesh for describing specific embodiment
And be not intended to limit the present invention.As description of the invention and it is used in the attached claims, unless on
Other situations are hereafter clearly indicated, otherwise " one " of singulative, "one" and "the" are intended to include plural form.
It will be further appreciated that the term "and/or" used in description of the invention and the appended claims is
Refer to any combinations and all possible combinations of one or more of associated item listed, and includes these combinations.
As shown in Figure 1, the embodiment of the present invention provides a kind of PCB via holes production method, include the following steps：
Step S11 carries out the pre- big primary drilling in aperture in the conducting hole site of PCB；
Step S12 to the via hole after once drilling plate a plated-through-hole of thick copper；
Step S13 carries out secondary drilling to the via hole of the thick copper of plating；
Step S14 carries out secondary plated-through-hole to the via hole after secondary drilling；
By pre- big primary drilling, the via hole that aperture is more than design aperture is drilled out, the primary plating using the thick copper of plating is logical
Pre- big via hole hole wall is plated thick copper, then carries out secondary drilling to the via hole for plating thick copper by hole technique, obtains smooth light
Clean hole wall, then secondary plated-through-hole is carried out to the via hole, to obtain via hole conductive copper layer in homogeneous thickness, effectively solve
Via hole present in the high frequencies planks such as aforementioned PI, PTFE in the prior art makes problem, effectively increases such base material PCB
Reliability.
Alternatively, it refers to, using the increased method of drill point diameter, boring to carry out the pre- big primary drilling in aperture
Go out the via hole that aperture is more than actual design aperture；
Further, by the diameter of drill point increase 0.01mm~0.02mm, drill out it is bigger 0.01mm than actual design aperture~
The via hole of 0.02mm, wherein bore process parameter is set as：Drill point rotating speed 120krpm~150krpm, into needle speed 0.8m/
Min~0.4m/min, withdraw of the needle speed 6m/min~10m/min.
Alternatively, a plated-through-hole for the via hole after once drilling plate thick copper includes：To one
PCB after secondary drilling carries out textures shape production process, and the plating thickness copper process that textures shape production process is used to ensure subsequently to carry out is only
Later the PCB after textures shape production process is carried out plating thick copper in the thick copper of hole wall and through-hole edge attachment of via hole
Journey.
Alternatively, textures shape production process includes：PCB surface after primary drilling pastes dry film, and
Dry film windowing processing is done in conducting hole site, wherein windowing bore dia is compared with the big 0.01mm~0.02mm in aperture after once drilling.
Alternatively, plating thick copper manufacture craft includes：It is plated using high current, prolonged electroplating parameter
Thick copper, wherein current parameters are 25asf~35asf, and electroplating time is 25min~35min, and obtained copper coating thickness is
15um~25um.
Alternatively, carrying out secondary drilling to the via hole after the thick copper of plating includes：Select diameter and via hole
The drill point that actual design aperture matches drills out the through-hole consistent with via hole actual design aperture, wherein drill point rotating speed is
130krpm~150krpm, into needle speed 0.8m/min~0.4m/min, withdraw of the needle speed 5m/min~9m/min.
Alternatively, carrying out secondary plated-through-hole to the via hole after secondary drilling includes：Using normal fine
Electroplating technology carries out the secondary plated-through-hole, wherein current parameters are 16asf~18asf, electroplating time be 16min~
20min。
As shown in Fig. 2, being a kind of signal engineering drawing of PCB via holes production method provided in an embodiment of the present invention, the figure
In be clearly to illustrate via hole production process provided in an embodiment of the present invention, wherein when once being drilled to PCB (21),
By selecting the drill point of larger diameter to drill, the through-hole than actual design aperture bigger is obtained, is d with actual design aperture
For, select larger drill point drilling to obtain the through-hole of d+0.01mm~0.02mm, the technique for carrying out a plated-through-hole later, as before
It states described in background technology, caused by the characteristic of PCB substrate, hole wall typically fails to obtain preferable flatness, hole wall surface
Uneven (not shown) under the conditions of this hole wall, using the plating thickness process for copper of a plated-through-hole, obtains 15um~25um
Relatively thick copper layer (23), during copper-plated, also need under normal conditions to PCB carry out textures shape process, be PCB surface not
It needs the position for adhering to copper to attach dry film 22, secondary drilling technique is carried out to the PCB after a plated-through-hole later, at this point, using
Drill point diameter be design aperture required by drill point diameter, it is drilled design aperture be d through-hole, two bore after, connect down
What is come is exactly the technique of secondary plated-through-hole, wherein it should be noted that usually having been also needed to during secondary plated-through-hole to plating
Thick copper resulting copper layer carries out the process of a microetch, to increase the roughness on the layers of copper surface, convenient in secondary plated-through-hole
It is more easy to adhere to new layers of copper in the process, in addition it is also necessary to leg die process processing is carried out to the increased dry film 22 of institute in foregoing sequence,
After completing above-mentioned two lines process, you can secondary plated-through-hole technique is proceeded by, at this point, through-hole surfaces are because of a plated-through-hole
The attachment of thick copper, surface have had good flatness, and secondary plated-through-hole technique is usually according to conventional electroplating parameter, you can obtains
Very smooth conductive copper layer bright and clean, copper layer thickness uniformity is fabulous is obtained, extremely limited improves the special base material PCB such as high frequency
The via hole quality of coating of product, effectively increases the reliability of product.
The embodiment of the present invention provides a kind of PCB, and the via hole of the PCB is made by the via hole described in previous embodiment
Method obtains.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in various equivalent modifications or replace
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection domain subject to.
Claims (9)
1. a kind of PCB via holes production method, which is characterized in that include the following steps：
The pre- big primary drilling in aperture is carried out in the conducting hole site of the PCB；
To the via hole after the primary drilling plate a plated-through-hole of thick copper；
Secondary drilling is carried out to the via hole of the thick copper of the plating；
Secondary plated-through-hole is carried out to the via hole after the secondary drilling.
2. via hole production method according to claim 1, which is characterized in that the pre- big primary drilling packet in the aperture
It includes：Using the increased method of drill point diameter, the via hole that aperture is more than actual design aperture is drilled out.
3. via hole production method according to claim 2, which is characterized in that the drill point diameter increase 0.01mm~
0.02mm drills out the via hole of 0.01mm~0.02mm bigger than actual design aperture, and drill point rotating speed is 120krpm~150krpm,
Into needle speed 0.8m/min~0.4m/min, withdraw of the needle speed 6m/min~10m/min.
4. via hole production method according to claim 1, which is characterized in that the via hole after the primary drilling into
Plated-through-hole of the thick copper of row plating includes：
To after the primary drilling PCB carry out textures shape production process, the textures shape production process for ensure subsequently into
The thick copper process of capable plating is only in the thick copper of the hole wall and through-hole edge of via hole attachment；
The PCB after textures shape production process is carried out plating thick copper wiring.
5. via hole production method according to claim 4, which is characterized in that the textures shape production process includes：
PCB surface after the primary drilling pastes dry film, and does dry film windowing processing in the conducting hole site, wherein described to open
Big 0.01mm~the 0.02mm in aperture after the primary drilling of fenestra diameter.
6. via hole production method according to claim 4, which is characterized in that the thick copper-clad of the plating includes：Using high current,
Prolonged electroplating parameter carries out plating thick copper, wherein current parameters are 25asf~35asf, electroplating time be 25min~
35min, obtained copper coating thickness are 15um~25um.
7. via hole production method according to claim 1, which is characterized in that carry out two to the via hole of the thick copper of the plating
Secondary drilling includes：The drill point for selecting diameter to match with via hole actual design aperture, drills out and via hole actual design aperture
Consistent through-hole, wherein drill point rotating speed is 130krpm~150krpm, into needle speed 0.8m/min~0.4m/min, withdraw of the needle speed
Spend 5m/min~9m/min.
8. via hole production method according to claim 1, which is characterized in that the via hole after the secondary drilling into
The secondary plated-through-hole of row includes：The secondary plated-through-hole is carried out using normal fine electroplating technology, wherein current parameters 16asf
~18asf, electroplating time are 16min~20min.
9. a kind of PCB, which is characterized in that at least one via hole on the PCB passes through any institute in such as claim 1-8
The via hole production method stated is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810277481.9A CN108541139B (en) | 2018-03-31 | 2018-03-31 | PCB (printed circuit board) via hole manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810277481.9A CN108541139B (en) | 2018-03-31 | 2018-03-31 | PCB (printed circuit board) via hole manufacturing method and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541139A true CN108541139A (en) | 2018-09-14 |
| CN108541139B CN108541139B (en) | 2020-04-17 |
Family
ID=63482082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810277481.9A Active CN108541139B (en) | 2018-03-31 | 2018-03-31 | PCB (printed circuit board) via hole manufacturing method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541139B (en) |
Cited By (6)
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| CN109599385A (en) * | 2018-11-27 | 2019-04-09 | 美龙翔微电子科技（深圳）有限公司 | High frequency IC package substrate and its manufacturing method |
| CN109618492A (en) * | 2018-11-23 | 2019-04-12 | 广东工业大学 | A kind of processing method of PTFE circuit board apertures |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN113836860A (en) * | 2021-09-23 | 2021-12-24 | 苏州悦谱半导体有限公司 | Drilling data analysis method for industrial graphic computer-aided manufacturing |
| CN113873758A (en) * | 2021-08-27 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method for improving interconnection and separation of through holes of PTFE circuit board |
| CN113923866A (en) * | 2021-08-27 | 2022-01-11 | 珠海杰赛科技有限公司 | Machining method for improving blockage of PTFE circuit board through hole |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113873758A (en) * | 2021-08-27 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method for improving interconnection and separation of through holes of PTFE circuit board |
| CN113923866A (en) * | 2021-08-27 | 2022-01-11 | 珠海杰赛科技有限公司 | Machining method for improving blockage of PTFE circuit board through hole |
| CN113836860A (en) * | 2021-09-23 | 2021-12-24 | 苏州悦谱半导体有限公司 | Drilling data analysis method for industrial graphic computer-aided manufacturing |
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| Publication number | Publication date |
|---|---|
| CN108541139B (en) | 2020-04-17 |
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