CN108520861A - A kind of wafer and sapphire substrate trimming detection device - Google Patents
A kind of wafer and sapphire substrate trimming detection device Download PDFInfo
- Publication number
- CN108520861A CN108520861A CN201810565581.1A CN201810565581A CN108520861A CN 108520861 A CN108520861 A CN 108520861A CN 201810565581 A CN201810565581 A CN 201810565581A CN 108520861 A CN108520861 A CN 108520861A
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- positioning
- sapphire substrate
- detection device
- stepper motor
- wafer
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- 238000009966 trimming Methods 0.000 title claims abstract description 50
- 238000001514 detection method Methods 0.000 title claims abstract description 44
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 37
- 239000010980 sapphire Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims abstract description 36
- 230000003028 elevating effect Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafer and sapphire substrate trimming detection devices, belong to retaining mechanism technical field.Including：Firm banking；Elevating mechanism, elevating mechanism are arranged in the upper end of firm banking；Stepper motor mechanism, stepper motor arrangement of mechanism is in the upper end of elevating mechanism；Rotating mechanism, rotating mechanism are arranged in the upper surface of stepper motor mechanism；Positioning device, positioning device are arranged in the left and right sides of rotating mechanism, and sliding rail is provided with below positioning device, and stepper motor mechanism is set in sliding rail, and stepper motor mechanism can be moved along the length direction of sliding rail；Vacuum slot mechanism, vacuum slot arrangement of mechanism is in the upper surface of rotating mechanism；Trimming detects laser sensor, and trimming detection laser sensor is arranged in the gap between positioning device and rotating mechanism.A kind of wafer and sapphire substrate trimming detection device provided by the invention avoids the damage to detecting material, ensures the stability of detection.
Description
Technical field
The present invention relates to ic manufacturing technology field, it is specifically related to a kind of wafer and sapphire substrate trimming detection
Device.
Background technology
It is mechanically to position that country's prior art, which detects the trimming of wafer and sapphire substrate, at present
Detection, and because of the material characteristic of wafer or sapphire substrate when mechanical system detection and localization, is easy to wafer or process for sapphire-based
Piece causes to damage.Therefore need to provide a kind of novel trimming detection device to ensure to avoid the damage to detecting material, and energy
Ensure the stability of detection.
Invention content
For the above-mentioned problems in the prior art, it is desirable to provide a kind of wafer and sapphire substrate trimming detection device
After being positioned by cylinder drive by positioning device, vacuum slot is opened on platform, and wafer is sucked.Rotating mechanism starts to revolve
Turn, while laser sensor has detected whether signal.When rotating to trimming position, laser sensor detects signal, control
Motor reversely rotates certain step number.Ensure the uniqueness of each test position.The as trimming position of current wafer.It is next
Road technique provides accurate location and guarantee.Specific technical solution is as follows：
A kind of wafer and sapphire substrate trimming detection device, including：
Firm banking；
Elevating mechanism, elevating mechanism are arranged in the upper end of firm banking；
Stepper motor mechanism, stepper motor arrangement of mechanism is in the upper end of elevating mechanism；
Rotating mechanism, rotating mechanism can be rotatably arranged within the upper surface of stepper motor mechanism around its axle center；
Positioning device, positioning device are arranged in the left and right sides of rotating mechanism, are arranged between positioning device and rotating mechanism
Have a gap, the lower end of positioning device is provided with sliding rail, stepper motor mechanism can along sliding rail length direction movably
It is set in sliding rail；
Vacuum slot mechanism, vacuum slot arrangement of mechanism is in the upper surface of rotating mechanism；
Trimming detects laser sensor, between trimming detection laser sensor is arranged between positioning device and rotating mechanism
In gap.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also have the feature that, very
The upper surface of suction nozzle mechanism offers a suction inlet, and vacuum slot is in-house to be provided with air intake passage, and air intake passage with it is negative
Press generation device connection.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also have the feature that, it is fixed
Lower face at left and right sides of the device of position is each provided with a holder, and two stands are connected by two sliding rails disposed in parallel.
It in a kind of wafer provided by the invention and sapphire substrate trimming detection device, also has the feature that, walks
Left and right sides side wall into motor mechanism offers two parallel through-holes, and two through hole is set in the side wall of two sliding rails.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also has the feature that, cut
Frontier inspection surveys laser sensor close to the edge of left side positioning device.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also have the feature that, it is fixed
Position device includes cylinder, left positioning table and right positioning table, and left positioning table, right positioning table are connect with cylinder, and left positioning table and the right side are fixed
Position platform can movably be arranged in the upper end of holder along the length direction of holder.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also have the feature that, it is fixed
Position device further includes positioning signal generator and locating signal receiver, and positioning signal generator is arranged in the upper end of left positioning table
Face, locating signal receiver are arranged in the upper surface of right positioning table.
In a kind of wafer provided by the invention and sapphire substrate trimming detection device, also have the feature that, it is fixed
Position signal generator and locating signal receiver are facing each other.
The good effect of above-mentioned technical proposal is：
A kind of wafer provided by the invention and sapphire substrate trimming detection device will detect wafer by laser sensor
Or the trimming of sapphire substrate, it is ensured that the uniqueness of each test position, and accurate location and guarantee are provided for lower one of technique,
The detection device had not only been avoided that the damage to detecting material, but also can guarantee the stability of detection.
Description of the drawings
Fig. 1 is the overall structure signal of a kind of wafer of the present invention and the embodiment of sapphire substrate trimming detection device
Figure.
In attached drawing：1, rotating mechanism；2, firm banking；3, elevating mechanism；4, stepper motor mechanism；5, vacuum slot machine
Structure；6, positioning device；61, holder；62, sliding rail；7, trimming detects laser sensor.
Specific implementation mode
It is real below in order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand
Example combination attached drawing 1 is applied to be specifically addressed a kind of wafer provided by the invention and sapphire substrate trimming detection device.
Fig. 1 is the overall structure signal of a kind of wafer of the present invention and the embodiment of sapphire substrate trimming detection device
Figure, in the present embodiment, the wafer and sapphire substrate trimming detection device include mainly rotating mechanism 1, firm banking 2, rise
Descending mechanism 3, stepper motor mechanism 4, vacuum slot mechanism 5, positioning device 6, holder 61, sliding rail 62, trimming detect laser
Sensor 7.
Elevating mechanism 3 is arranged in the upper end of firm banking 2, and stepper motor mechanism 4 is arranged in the upper end of elevating mechanism 3, rotation
Rotation mechanism 1 is arranged in the upper surface of stepper motor mechanism 4, and rotating mechanism 1 can be rotated around its axle center, and positioning device 6 is arranged in
The left and right sides of rotating mechanism 1, is provided with gap between positioning device 6 and rotating mechanism 1, the lower end of positioning device 6 is provided with
Sliding rail 62, stepper motor mechanism 4 is set in sliding rail 62, and stepper motor mechanism 4 can be along the length of sliding rail 62
Direction is moved, and vacuum slot mechanism 5 is arranged in the upper surface of rotating mechanism 1, and trimming detection laser sensor 7 is arranged in positioning dress
It sets in the gap between 6 and rotating mechanism 1.
In a preferred embodiment, as shown in Figure 1, the upper surface of vacuum slot mechanism 5 offers a suction inlet, very
Suction nozzle mechanism 5 is internally provided with air intake passage, and air intake passage is connect with negative pressure generating device.
In a preferred embodiment, as shown in Figure 1, the lower face of 6 left and right sides of positioning device is each provided with one
Holder 61, two stands 61 are connected by two sliding rails 62 disposed in parallel.
In a preferred embodiment, as shown in Figure 1, the left and right sides side wall of stepper motor mechanism 4 offers two
Parallel through-hole, two through hole are set in the side wall of two sliding rails 62.
In a preferred embodiment, as shown in Figure 1, trimming detects laser sensor 7 close to left side positioning device 6
Edge.
In a preferred embodiment, as shown in Figure 1, positioning device 6 includes cylinder, left positioning table and right positioning
Platform, left positioning table, right positioning table are connect with cylinder, and left positioning table and right positioning table can be moved along the length direction of holder 61.
In a preferred embodiment, as shown in Figure 1, positioning device 6 further include positioning signal generator (in figure not
Show) and locating signal receiver (not shown), positioning signal generator is arranged in the upper surface of left positioning table, positioning letter
Number receiver is arranged in the upper surface of right positioning table.
In a preferred embodiment, as shown in Figure 1, positioning signal generator and locating signal receiver mutually just
It is right.
Hereinafter, being illustrated with a kind of specific embodiment, it should be pointed out that described in following implementation it
Structure, technique, selection are only to illustrate the feasibility of embodiment, the intention of there is no restriction the scope of the present invention.
A kind of wafer and sapphire substrate trimming detection device provided in this embodiment, elevating mechanism 3 are arranged in fixed bottom
The upper end of seat 2, stepper motor mechanism 4 are arranged in the upper end of elevating mechanism 3, and rotating mechanism 1 is arranged in the upper of stepper motor mechanism 4
End face, and rotating mechanism 1 can be rotated around its axle center, positioning device 6 is arranged in the left and right sides of rotating mechanism 1, and positioning device 6 is wrapped
Cylinder, left positioning table and right positioning table are included, left positioning table, right positioning table are connect with cylinder, left positioning table and right positioning table energy edge
The length direction movement of holder 61, positioning device 6 further includes that positioning signal generator (not shown) and positioning signal connect
Device (not shown) is received, positioning signal generator is arranged in the upper surface of left positioning table, and locating signal receiver is arranged in the right side
The upper surface of positioning table, positioning signal generator and locating signal receiver are facing each other.Positioning device 6 and rotating mechanism 1 it
Between be provided with gap, the lower face of 6 left and right sides of positioning device is each provided with a holder 61, and two stands 61 are arranged in parallel by two
Sliding rail 62 connect, the left and right sides side wall of stepper motor mechanism 4 offers two parallel through-holes, and two through hole is set in two
The side wall of sliding rail 62, and stepper motor mechanism 4 can be moved along the length direction of sliding rail 62,5 cloth of vacuum slot mechanism
It sets in the upper surface of rotating mechanism 1, the upper surface of vacuum slot mechanism 5 offers a suction inlet, the 5 inside setting of vacuum slot mechanism
There is air intake passage, and air intake passage is connect with negative pressure generating device.Trimming detection laser sensor 7 be arranged in positioning device 6 with
In gap between rotating mechanism 1, and trimming detects laser sensor 7 close to the edge of left side positioning device 6.The detection fills
The damage being not only avoided that detecting material is set, but also can guarantee the stability of detection.
Wafer or sapphire substrate will be placed into inspection by the wafer and sapphire substrate trimming detection device by manipulator
It surveys on the platform of mechanism rotating mechanism.After positioning device positions wafer or sapphire substrate by cylinder drive, rotation
The vacuum slot mechanism opening of mechanism upper surface, is sucked wafer or sapphire substrate.Subsequent rotating mechanism starts to rotate, and cuts simultaneously
Frontier inspection surveys laser sensor and has detected whether signal.When wafer or sapphire substrate rotate to trimming position, trimming detection
When laser sensor detects signal, stepper motor mechanism reversely rotates certain step number, so that it is guaranteed that each test position
Uniqueness, the as trimming position of current wafer provides accurate location and guarantee for lower one of technique.
It these are only preferred embodiments of the present invention, be not intended to limit the implementation manners and the protection scope of the present invention, it is right
For those skilled in the art, it should can appreciate that and all be replaced with being equal made by description of the invention and diagramatic content
It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.
Claims (8)
1. a kind of wafer and sapphire substrate trimming detection device, which is characterized in that including：
Firm banking；
Elevating mechanism, the elevating mechanism are arranged in the upper end of the firm banking；
Stepper motor mechanism, the stepper motor arrangement of mechanism is in the upper end of the elevating mechanism；
Rotating mechanism, the rotating mechanism can be rotatably arranged within the upper surface of the stepper motor mechanism around its axle center；
Positioning device, the positioning device are arranged in the left and right sides of the rotating mechanism, the positioning device and the rotation
Gap is provided between mechanism, the lower end of the positioning device is provided with sliding rail, and the stepper motor mechanism can be along described
The length direction of sliding rail is movably set in the sliding rail；
Vacuum slot mechanism, the vacuum slot arrangement of mechanism is in the upper surface of the rotating mechanism；
Trimming detects laser sensor, and the trimming detection laser sensor is arranged in the positioning device and the rotating mechanism
Between gap in.
2. a kind of wafer according to claim 1 and sapphire substrate trimming detection device, which is characterized in that the vacuum
The upper surface of suction nozzle body offers a suction inlet, and the vacuum slot is in-house to be provided with air intake passage, and the air-breathing is logical
Road is connect with negative pressure generating device.
3. a kind of wafer according to claim 2 and sapphire substrate trimming detection device, which is characterized in that the positioning
Lower face at left and right sides of device is each provided with a holder, and two holders are connected by two sliding rails disposed in parallel
It connects.
4. a kind of wafer according to claim 3 and sapphire substrate trimming detection device, which is characterized in that the stepping
The left and right sides side wall of motor mechanism offers two parallel through-holes, and two through-holes are arranged the side wall of two sliding rails.
5. a kind of wafer according to claim 4 and sapphire substrate trimming detection device, which is characterized in that the trimming
Laser sensor is detected close to the edge of the left side positioning device.
6. a kind of wafer according to claim 5 and sapphire substrate trimming detection device, which is characterized in that the positioning
Device includes cylinder, left positioning table and right positioning table, and the left positioning table, the right positioning table are connect with the cylinder, described
Left positioning table and the right positioning table can movably be arranged in the upper end of the holder along the length direction of the holder.
7. a kind of wafer according to claim 6 and sapphire substrate trimming detection device, which is characterized in that the positioning
Device further includes positioning signal generator and locating signal receiver, and the positioning signal generator is arranged in the left positioning table
Upper surface, the locating signal receiver is arranged in the upper surface of the right positioning table.
8. a kind of wafer according to claim 7 and sapphire substrate trimming detection device, which is characterized in that the positioning
Signal generator and the locating signal receiver are facing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565581.1A CN108520861A (en) | 2018-06-04 | 2018-06-04 | A kind of wafer and sapphire substrate trimming detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565581.1A CN108520861A (en) | 2018-06-04 | 2018-06-04 | A kind of wafer and sapphire substrate trimming detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108520861A true CN108520861A (en) | 2018-09-11 |
Family
ID=63428109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810565581.1A Pending CN108520861A (en) | 2018-06-04 | 2018-06-04 | A kind of wafer and sapphire substrate trimming detection device |
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| Country | Link |
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| CN (1) | CN108520861A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794721A (en) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
| KR101347683B1 (en) * | 2012-07-31 | 2014-01-03 | (주)유텍시스템 | Apparatus for inspecting sapphire wafer |
| JP2014003057A (en) * | 2012-06-15 | 2014-01-09 | Atel Corp | Aligner apparatus |
| CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
| CN206271677U (en) * | 2016-12-23 | 2017-06-20 | 中芯国际集成电路制造（天津）有限公司 | Fragmentation arrangement for detecting |
| CN208189547U (en) * | 2018-06-04 | 2018-12-04 | 上海卓晶半导体科技有限公司 | A kind of wafer and sapphire substrate trimming detection device |
-
2018
- 2018-06-04 CN CN201810565581.1A patent/CN108520861A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794721A (en) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | Alignment apparatus for semiconductor wafer |
| JP2014003057A (en) * | 2012-06-15 | 2014-01-09 | Atel Corp | Aligner apparatus |
| KR101347683B1 (en) * | 2012-07-31 | 2014-01-03 | (주)유텍시스템 | Apparatus for inspecting sapphire wafer |
| CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
| CN206271677U (en) * | 2016-12-23 | 2017-06-20 | 中芯国际集成电路制造（天津）有限公司 | Fragmentation arrangement for detecting |
| CN208189547U (en) * | 2018-06-04 | 2018-12-04 | 上海卓晶半导体科技有限公司 | A kind of wafer and sapphire substrate trimming detection device |
Non-Patent Citations (1)
| Title |
|---|
| 廖同庆等: "《物联网概论》", 31 August 2015, 合肥：合肥工业大学出版社, pages: 48 - 49 * |
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