CN108511912A - A kind of shielded coil module and preparation method thereof - Google Patents
A kind of shielded coil module and preparation method thereof Download PDFInfo
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- CN108511912A CN108511912A CN201810284860.0A CN201810284860A CN108511912A CN 108511912 A CN108511912 A CN 108511912A CN 201810284860 A CN201810284860 A CN 201810284860A CN 108511912 A CN108511912 A CN 108511912A
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- layer
- coil
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- insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/04—Screened antennas
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of shielded coil modules and preparation method thereof, including：Base material, insulating layer above the coil of substrate surface, coil and the shielding material layer and heat dissipating layer for being covered in surface of insulating layer；Wherein, base material is that PI base materials and EMI inhale wave material or PI one side glues；If base material is PI base materials and EMI inhales wave material, coil, insulating layer are distributed in base material both sides formation dual platen, and one side is equipped with shielding material layer and heat dissipating layer wherein, is located at below solar panel；If base material is PI one side glues, coil, insulating layer form single sided board positioned at no glue side, and shielding material layer heat dissipating layer is located at below solar panel, and integrated level of the present invention is high, thickness is thin, good every magnetic energy power, operating temperature rise is relatively low, and cost is greatly saved.
Description
Technical field
The present invention relates to electronics manufacturing technology field, specially a kind of shielded coil module and its preparation side
Method.
Background technology
NFC (Near Field Communication, near field communication (NFC), abbreviation near-field communication) function will be by
Configuration is in more handheld devices.NFC technology is by non-contact radio-frequency identification (RFID) and the skill that interconnects
Art, which is integrated, to be developed, and combining induction card reader, icah wavw and point-to-point function on one chip can be in short distances
It is identified with compatible equipment and data exchange from interior.For example, the mobile phone with NFC function may be used as airport boarding verification,
Gate inhibition's key of mansion, traffic all-purpose card, credit card, Payment Card etc. bring great convenience to people's life.
Wireless charging technology developed recently is rapid, has been widely applied to intelligent wearable device (wrist-watch), intelligence at present
The fields such as mobile phone plane plate, radio telephone, electric vehicle.But many technical barriers, such as charge efficiency are also encountered in evolution
It is low, of high cost, charging limitation it is larger.
It will produce alternating electromagnetic field during wireless charging, and when alternating electromagnetic field encounters metal, will produce electronics is vortexed,
Thermal energy is generated on metal, causes efficiency of transmission relatively low, waste of energy, if rechargeable battery interior metal plate is by the magnetic field
It influences, the eddy-current loss of generation can cause battery hot, set off an explosion or fire is dangerous, and the magnetic field can interfere surrounding device
Part influences the normal work of entire charger.Therefore shielding material or absorbing material must be used on technological layer, to hinder
The gear magnetic line of force leaks, to ensure the safe and efficient work of entire charging system！Transmitting terminal and reception end line in practical applications
Circle is all placed in shielding, to reach raising efficiency, reduces the purpose of interference！
In traditional NFC antenna application, similarly, the coil of wireless charging module is also required to by an individual base
Material is to be integrated into electronic equipment.Traditional preparation methods coil and the thickness of the insulating layer in traditional shielding material are big, integrate
It is low to change efficiency, especially shielded layer will certainly influence shield effectiveness, operating temperature rise, the final working performance for influencing electronic equipment.
Therefore, the thickness for how reducing, reducing electronic equipment improves the integrated level height of electronic equipment and can improve electronics
The working performance of equipment has become one of those skilled in the art's urgent problem to be solved.
Invention content
The purpose of the present invention is to provide a kind of shielded coil modules and preparation method thereof, to solve in above-mentioned background technology
The problem of proposition.
To achieve the above object, the present invention provides the following technical solutions：A kind of shielded coil module, including：Base material, base material
Insulating layer above the coil on surface, coil and the shielding material layer and heat dissipating layer for being covered in surface of insulating layer, the base material
Wave material is inhaled using PI base materials and EMI, the coil, insulating layer are distributed in base material both sides and form dual platen, be equipped on one side wherein
Shielding material layer and heat dissipating layer are located at below solar panel.
Preferably, the base material uses PI one side glues, the coil, insulating layer to be located at base material and form single side without glue side
Plate is located at equipped with shielding material layer below solar panel.
Preferably, the insulating materials of the insulating layer is anti-welding ink or hot pressing cover film.
Preferably, the material of the shielding material layer includes ferrite, amorphous, a kind of nanocrystalline, in EMI suction wave materials screen
It covers or a variety of, further includes amorphous nano crystal composite material.
Preferably, the heat dissipating layer uses graphite flake, graphite to add a kind of shielding or a variety of of layers of copper, heat dissipation ceramic piece.
Preferably, the thickness of the thickness 5-10um of the insulating layer, the shielding material layer are 60-150um.
Preferably, preparation method includes the following steps：
A, base material is provided, coil is formed in the substrate surface；
B, insulating layer is formed in the coil surface；
C, shielding material layer is formed in the surface of insulating layer；
D, heat dissipating layer is formed in the soft magnetic materials layer surface；
Wherein, the base material is that inhale wave material or PI one side glues its thickness be 5-50um by PI base materials and EMI.
Preferably, the step of forming the coil specifically includes：On base material one side or two sides, printing forms coil
Figure irradiates its ink layer by special light, makes to float on the surface to form micro conductive layer on metallic particles therein, using electrolysis
Depositional mode surface forms conductive metal to form the coil.
Preferably, the step of forming the coil specifically includes：By the way of printing institute is formed in the substrate surface
The catalyzed oil layer of ink for stating coil pattern, in the catalytic ink layer surface electro-deposition of metal to form the coil.
Compared with prior art, the beneficial effects of the invention are as follows：Integrated level of the present invention is high, thickness is thin, the good, work every magnetic energy power
It is relatively low to make temperature liter, cost is greatly saved.
Description of the drawings
Fig. 1 is a kind of a kind of structural schematic diagram of shielded coil module of the present invention.
Fig. 2 is the schematic top plan view of the coil of the present invention；
Fig. 3 is a kind of another structural schematic diagram of shielded coil module of the present invention；
Fig. 4 is another schematic top plan view of the coil of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment one (NFC modules)：
As shown in Figure 1, the present invention provides a kind of shielding a kind of coil module 1, a kind of shielded coil module 1 includes：It is formed
Coil 5 in 2 upper surface of the base material is formed in the insulating layer 10 of 5 upper surface of the coil, is formed on the insulating layer 10
The shielding material layer 11 on surface and the 13 placing battery metallic plate 3 of heat dissipating layer for being formed in 11 upper surface of the shielding material layer
On；Its production method includes the following steps：
A, one base material 2 is provided, coil 5 is formed on 2 surface of the base material；
Specifically, the base material 2 is PI single side gum base materials.Ink layer 12 is formed without glue one side in the base material 2, by beating
Print technique obtains the ink layer 6 on the surface of ink layer 12 and irradiates to form micro conductive layer 7 by light source.Using electrolytic deposition side
Formula forms conductive metal layer 8 on 7 surface of micro conductive layer.Form the coil 5.
B, insulating layer 10 is formed on 5 surface of the coil；
Specifically, the insulating layer 10 is formed using screen printing technique or coating technique, the insulating layer 10 is located at institute
On the region for stating coil 5, the thickness of the insulating layer 10 is 3-10um, and a kind of thickness of shielded coil module can effectively be thinned
Degree.
C, shielding material layer 11 is formed on 10 surface of the insulating layer.
Specifically, the shielding material layer 11, the shielding material layer are formed using screen printing technique or coating technique
11 are located on the region of the coil 5, and the thickness of the shielding material layer 11 is 10-100um, and due to the insulating layer 10
Thickness is 3-10um, and the shielding material layer 11 can be made to be close to the coil 5, greatly improves that reduce its again every magnetic energy power comprehensive
Close laminated thickness.
Above-mentioned a kind of shielded coil module 1 can be used for near-field communication.A kind of shielded coil module is used for near-field communication
(NFC), then the line width of the coil is set as 0.5mm-2mm.
Embodiment two：
As shown in figure 3, preparation method of the present invention at least includes the following steps：
A, one base material 2 is provided, coil 5 is formed on 2 surface of the base material.
Specifically, the base material 2 is that EMI inhales wave material or PI base materials.As shown in Fig. 2, forming oil on 2 two sides of the base material
Layer of ink 12 obtains the coil catalyzed oil layer of ink 9 by silk-screen printing or coating process on the surface of ink layer 12.Such as Fig. 3 institutes
Show, conductive metal layer 8 is formed on 9 surface of catalyzed oil layer of ink using electrolytic deposition mode.As shown in figure 4, forming the line
Circle 5.
B, insulating layer 10 is formed on 5 surface of the coil；
Specifically, the insulating layer 10 is formed using screen printing technique or coating technique, the insulating layer 10 is located at institute
On the region for stating coil 5, the thickness of the insulating layer 10 is 3-10um, and a kind of thickness of shielded coil module can effectively be thinned
Degree.
C, shielding material layer 11 is formed on 10 surface of the insulating layer.
Specifically, the shielding material layer 11, the shielding material layer are formed using screen printing technique or coating technique
11 are located on the region of the coil 5, and the thickness of the shielding material layer 11 is 10-100um, and due to the insulating layer 10
Thickness is 3-10um, and the shielding material layer 11 can be made to be close to the coil 5, greatly improves that reduce its again every magnetic energy power comprehensive
Close laminated thickness.
D, loss when temperature lifts low reduction work when fitting heat dissipating layer 13 makes work on 11 surface of the shielding material layer.
Greatly improve the performance of equipment work.
The thickness of module can be greatly reduced by process above in summary, more traditional thinner thickness is inhaled using EIM
Wave material and independent research high-performance shielding material more increase shielding properties, using the heat dissipating layer, can more reduce work
Wen Sheng reduces loss, improves the working performance of module.
Embodiment three (NFC+WPC)
As shown in figure 4, the present invention provides a kind of preparation method of shielded coil module, the preparation method include at least with
Lower step：
A, one base material 2 is provided, coil 5 is formed on 2 surface of the base material.
Specifically, the base material 2 is that EMI inhales wave material or PI base materials.As shown in Fig. 2, forming oil on 2 two sides of the base material
Layer of ink 12 obtains the coil catalyzed oil layer of ink 9 by silk-screen printing or coating process on the surface of ink layer 12.Such as Fig. 3 institutes
Show, conductive metal layer 8 is formed on 9 surface of catalyzed oil layer of ink using electrolytic deposition mode.As shown in figure 4, forming the line
Circle 5.
B, insulating layer 10 is formed on 5 surface of the coil；
Specifically, the insulating layer 10 is formed using screen printing technique or coating technique, the insulating layer 10 is located at institute
On the region for stating coil 5, the thickness of the insulating layer 10 is 3-10um, and a kind of thickness of shielded coil module can effectively be thinned
Degree.
C, coiled wire-wound coil is welded in the PIN points 15.
Specifically, coiled wire-wound coil is welded on PIN points 15 using soldering method, the line footpath of the coiled wire-wound coil (WPC)
For 1-3.5mm wireless charging work is greatly improved since the metallic copper loss ratio electrodeposit metals copper loss of coiled wire-wound coil is smaller
When energy loss, synthesis laminated thickness is suitable.
D, it is bonded temperature when the shielded layer (composite shielding layer) 11 makes work on 5 surface of the coil layer and lifts low subtract
Loss when small work.
E, loss when temperature lifts low reduction work when fitting heat dissipating layer 13 makes work on 5 surface of the coil layer.
In conclusion a kind of shielded coil module can be used for near-field communication and wireless charging, the line width of the only described coil is not
Together.A kind of shielded coil module is used for near-field communication (NFC), then the line width of the coil is set as 0.5mm-2mm；It is described
A kind of shielded coil module is used for wireless charging (WPC), then the line width or line footpath of the coil are set as 1mm-3.5mm, can
Module overall thickness is reduced, base material inhales wave material along with shielding material layer can more improve shield effectiveness using EMI, when reducing work
Wen Sheng, it is integrated higher, cost is greatly saved.So the present invention effectively overcomes various shortcoming in the prior art and has
High industrial utilization.
Integrated level of the present invention is high, thickness is thin, good every magnetic energy power, operating temperature rise is relatively low, and cost is greatly saved.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. a kind of shielded coil module, including：It base material, the coil of substrate surface, the insulating layer above coil and is covered in absolutely
The shielding material layer and heat dissipating layer on edge layer surface, it is characterised in that：The base material inhales wave material, the line using PI base materials and EMI
Circle, insulating layer are distributed in base material both sides and form dual platen, and one side is equipped with shielding material layer and heat dissipating layer wherein, are located at solar panel
Lower section.
2. a kind of shielded coil module according to claim 1, it is characterised in that：The base material uses PI one side glues, institute
State coil, insulating layer be located at base material without glue side formed single sided board, be equipped with shielding material layer be located at solar panel lower section.
3. a kind of shielded coil module according to claim 1, it is characterised in that：The insulating materials of the insulating layer is anti-
Weld ink or hot pressing cover film.
4. a kind of shielded coil module according to claim 1, it is characterised in that：The material of the shielding material layer includes
Ferrite, amorphous, nanocrystalline, EMI inhale a kind of shielding or a variety of in wave material, further include amorphous nano crystal composite material.
5. a kind of shielded coil module according to claim 1, it is characterised in that：The heat dissipating layer is using graphite flake, stone
Ink plus a kind of shielding or a variety of of layers of copper, heat dissipation ceramic piece.
6. a kind of shielded coil module according to claim 1, it is characterised in that：The thickness 5-10um of the insulating layer,
The thickness of the shielding material layer is 60-150um.
7. realizing a kind of preparation method of shielded coil module described in claim 1, it is characterised in that：Preparation method includes
Following steps：
A, base material is provided, coil is formed in the substrate surface；
B, insulating layer is formed in the coil surface；
C, shielding material layer is formed in the surface of insulating layer；
D, heat dissipating layer is formed in the soft magnetic materials layer surface；
Wherein, the base material is that inhale wave material or PI one side glues its thickness be 5-50um by PI base materials and EMI.
8. a kind of preparation method of shielded coil module according to claim 7, it is characterised in that：Form the coil
Step specifically includes：On base material one side or two sides, printing forms coil pattern and irradiates its ink layer by special light,
Make to float on the surface to form micro conductive layer on metallic particles therein, electrolytic deposition mode surface is used to form conductive metal to be formed
The coil.
9. a kind of preparation method of shielded coil module according to claim 7, it is characterised in that：Form the coil
Step specifically includes：The catalyzed oil layer of ink for forming the coil pattern in the substrate surface by the way of printing, described
Catalytic ink layer surface electro-deposition of metal is to form the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810284860.0A CN108511912A (en) | 2018-04-02 | 2018-04-02 | A kind of shielded coil module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810284860.0A CN108511912A (en) | 2018-04-02 | 2018-04-02 | A kind of shielded coil module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108511912A true CN108511912A (en) | 2018-09-07 |
Family
ID=63379689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810284860.0A Withdrawn CN108511912A (en) | 2018-04-02 | 2018-04-02 | A kind of shielded coil module and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108511912A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256255A (en) * | 2018-11-19 | 2019-01-22 | 北京麦思通科技有限公司 | A kind of composition metal diskette and wireless charging device |
| CN109367406A (en) * | 2018-12-11 | 2019-02-22 | 安洁无线科技（苏州）有限公司 | Receiving end wireless charging device and system |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN116093610A (en) * | 2023-01-19 | 2023-05-09 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
-
2018
- 2018-04-02 CN CN201810284860.0A patent/CN108511912A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN111132531B (en) * | 2018-11-01 | 2022-03-04 | 无锡蓝沛新材料科技股份有限公司 | Wave-absorbing material and laminating process thereof |
| CN109256255A (en) * | 2018-11-19 | 2019-01-22 | 北京麦思通科技有限公司 | A kind of composition metal diskette and wireless charging device |
| CN109256255B (en) * | 2018-11-19 | 2023-12-12 | 宴晶科技(北京)有限公司 | Composite metal soft magnetic sheet and wireless charging device |
| CN109367406A (en) * | 2018-12-11 | 2019-02-22 | 安洁无线科技（苏州）有限公司 | Receiving end wireless charging device and system |
| CN116093610A (en) * | 2023-01-19 | 2023-05-09 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
| CN116093610B (en) * | 2023-01-19 | 2024-03-29 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20201215 Address after: 578-1 Yanxin Road, Wuxi Huishan Economic Development Zone, Wuxi City, Jiangsu Province Applicant after: Wuxi lanpei New Material Technology Co.,Ltd. Address before: 201500 building 3, no.857 Tiangong Road, Jinshan Industrial Zone, Jinshan District, Shanghai Applicant before: LANPEI GUANGXIAN (SHANGHAI) ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180907 |
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