CN108511900B

CN108511900B - Manufacturing method of printed antenna assembly, printed antenna assembly and electronic equipment

Info

Publication number: CN108511900B
Application number: CN201810285105.4A
Authority: CN
Inventors: 杨光明
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-04-02
Filing date: 2018-04-02
Publication date: 2020-07-03
Anticipated expiration: 2038-04-02
Also published as: CN108511900A

Abstract

The embodiment of the application provides a manufacturing method of a printed antenna assembly, the printed antenna assembly and electronic equipment. The manufacturing method of the printed antenna assembly comprises the following steps: providing a substrate having a print area on an outer surface of a periphery thereof; performing first printing treatment in the printing area to form a first printing antenna, wherein the first printing antenna comprises a first connecting part, the first connecting part extends along one side of the first printing antenna, and the first connecting part is connected with the outer surface of the substrate; and performing second printing treatment in the printing area to form a second printed antenna, wherein the second printed antenna comprises a second connecting part, the second connecting part is formed on the first connecting part, and the sum of the thicknesses of the first connecting part and the second connecting part is respectively the same as the thicknesses of the first printed antenna and the second printed antenna. The embodiment of the application can improve the radiation signal intensity of the whole antenna of the electronic equipment.

Description

Manufacturing method of printed antenna assembly, printed antenna assembly and electronic equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to a method for manufacturing a printed antenna assembly, and an electronic device.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. During the use of the electronic device, for example, the electronic device is used for conversation. To improve the call quality, the headroom of the antenna structure can be increased inside the electronic device.

However, as the electronic device has more and more functions and the space of the electronic device is more and more limited, increasing the clearance area of the antenna structure inside the electronic device occupies the space of other devices, and if the size of the electronic device is not changed, the function of the electronic device is affected, and the size of the electronic device is increased without affecting the function of the electronic device.

Disclosure of Invention

The embodiment of the application provides a manufacturing method of a printed antenna assembly, the printed antenna assembly and electronic equipment, which can improve the signal intensity of the electronic equipment.

The embodiment of the application provides a manufacturing method of a printed antenna assembly, which comprises the following steps:

providing a substrate having a printed area on its peripheral outer surface;

performing first printing treatment in the printing area to form a first printed antenna, wherein the first printed antenna comprises a first connecting part, the first connecting part extends along one side of the first printed antenna, and the first connecting part is connected with the outer surface of the substrate;

and carrying out second printing treatment on the printing area to form a second printed antenna, wherein the second printed antenna comprises a second connecting part, the second connecting part is formed on the first connecting part, and the sum of the thicknesses of the first connecting part and the second connecting part is respectively the same as the thicknesses of the first printed antenna and the second printed antenna.

The embodiment of the present application further provides a printed antenna assembly, the printed antenna assembly includes: a substrate having a printed area on a peripheral outer surface thereof;

the first printed antenna is formed in the printing area and comprises a first connecting part, the first connecting part extends along one side of the first printed antenna and is connected with the outer surface of the substrate;

the second printed antenna is formed in the printing area and comprises a second connecting part, the second connecting part extends along one side of the second printed antenna and is far away from the substrate;

the second connecting portion is formed on the first connecting portion, and the sum of the thicknesses of the first connecting portion and the second connecting portion is the same as the thicknesses of the first printed antenna and the second printed antenna respectively.

An embodiment of the present application provides an electronic device, including printed antenna assembly and circuit board, the printed antenna assembly be above the printed antenna assembly, the circuit board is coupled with the printed antenna assembly.

According to the manufacturing method of the printed antenna assembly, the printed antenna assembly and the electronic device, the first printed antenna and the second printed antenna are formed in the printing area of the outer surface of the periphery of the base body through the printing processing technology, under the condition that the size of the electronic device is not changed, the clearance area in the electronic device can be increased, and the radiation signal intensity of the whole antenna of the electronic device is improved. In addition, the first printed antenna and the second printed antenna are matched with each other through the first connecting portion and the second connecting portion in the printing process, the sum of the thicknesses of the first connecting portion and the second connecting portion is the same as the thicknesses of the first printed antenna and the second printed antenna, antenna marks are prevented from being formed in the two printing process, the thickness of an antenna joint is reduced, the performance of the electronic equipment antenna is guaranteed, and meanwhile the smoothness of the outer surfaces of the first printed antenna and the second printed antenna is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 4 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 5 is a schematic flow chart illustrating a method for manufacturing a printed antenna assembly according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a substrate according to an embodiment of the present application.

Fig. 7 is another schematic structural diagram of a substrate according to an embodiment of the present disclosure.

Fig. 8 is a cross-sectional view of the first printed antenna of fig. 7 in the direction a-a.

Fig. 9 is another schematic structural diagram of a substrate according to an embodiment of the present disclosure.

Fig. 10 is a cross-sectional view of the first printed antenna and the second printed antenna shown in fig. 9 in the direction B-B.

Fig. 11 is another schematic structural diagram of a substrate according to an embodiment of the present disclosure.

Fig. 12 is a schematic structural diagram of a printed antenna assembly provided in an embodiment of the present application.

Fig. 13 is another schematic structural diagram of a printed antenna assembly according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a manufacturing method of a printed antenna assembly, the printed antenna assembly and electronic equipment.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 10 may include a cover 11, a display 12, a circuit board 13, a battery 14, a housing 15, a front-facing camera 161, a rear-facing camera 162, a fingerprint unlock module 17, and an antenna structure 19. It should be noted that the electronic device 10 shown in fig. 1 is not limited to the above, and may also include other devices, or does not include the front camera 161, or does not include the rear camera 162, or does not include the fingerprint unlocking module 17.

Wherein the cover plate 11 is mounted to the display screen 12 to cover the display screen 12. The cover 1 may be a transparent glass cover so that the display screen transmits light through the cover 11 to display. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.

Wherein the housing 15 may form an outer contour of the electronic device 10. In some embodiments, the housing 15 may include a middle frame 151 and a rear cover 152, the middle frame 151 and the rear cover 152 may be combined with each other to form the housing 15, and the middle frame 151 and the rear cover 152 may form a receiving space to receive the circuit board 13, the display 12, the battery 14, and the like. Further, the cover plate 11 may be fixed to the housing 15, and the cover plate 11 and the housing 15 form a closed space to accommodate the circuit board 13, the display 12, the battery 14, and the like. In some embodiments, the cover plate 11 is disposed on the middle frame 151, the rear cover 152 is disposed on the middle frame 151, the cover plate 11 and the rear cover 152 are disposed on opposite sides of the middle frame 151, and the cover plate 11 and the rear cover 152 are disposed opposite to each other.

In some embodiments, the housing 15 may be a metal housing, such as a metal such as magnesium alloy, stainless steel, and the like. It should be noted that the material of the housing 15 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the housing 15 may be a plastic housing. Also for example: the housing 15 is a ceramic housing. For another example: the housing 15 may include a plastic part and a metal part, and the housing 15 may be a housing structure in which metal and plastic are matched with each other, specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete housing structure. The material and process of the case 15 are not limited to this, and a glass case may be used.

It should be noted that, the structure of the housing in the embodiment of the present application is not limited to this, for example: the rear cover and the middle frame are integrally formed to form a completed housing 15 structure, which directly has a receiving space for receiving the circuit board 13, the display 12, the battery 14, and the like.

The circuit board 13 is mounted in the housing 15, the circuit board 13 may be a main board of the electronic device 10, and one, two or more functional components of a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, a front camera 161, a rear camera 162, a distance sensor, an ambient light sensor, a receiver, a processor, and the like may be integrated on the circuit board 13.

In some embodiments, the circuit board 13 may be secured within the housing 15. Specifically, the circuit board 13 may be screwed to the middle frame 151 by screws, or may be snapped to the middle frame 151 by a snap-fit manner. It should be noted that the way in which the circuit board 13 is specifically fixed to the middle frame 151 in the embodiment of the present application is not limited to this, and other ways, such as a way of fixing by a snap and a screw together, may also be used.

Wherein the battery 14 is mounted in the housing 15, and the battery 14 is electrically connected to the circuit board 13 to supply power to the electronic device 10. The housing 15 may serve as a battery cover for the battery 14. The case 15 covers the battery 14 to protect the battery 14, and particularly, the rear cover covers the battery 14 to protect the battery 14, reducing damage to the battery 14 due to collision, dropping, and the like of the electronic apparatus 10.

Wherein the antenna structure 19 is arranged on an outer surface of the housing 15. In some embodiments, the antenna structure 19 is disposed on the outer surface of the bezel 151, which may increase the headroom of the antenna structure 19 inside the electronic device 10 without changing the size of the electronic device 10.

Wherein the display 12 is mounted in the housing 15, and the display 12 is electrically connected to the circuit board 13 to form a display surface of the electronic device 10. The display screen 12 may include a display area and a non-display area. The display area may be used to display a screen of the electronic device 10 or provide a user with touch control. The top area of the non-display area is provided with an opening for conducting sound and light, and the bottom of the non-display area can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display 12 to cover the display 12, and may form the same display area and non-display area as the display 12 or different display areas and non-display areas.

Note that the structure of the display screen 12 is not limited to this. For example, the display 12 may be a shaped screen.

Referring to fig. 2, fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 20 includes a display 22, a cover 21, a circuit board 23, a battery 24, a housing 25, and an antenna structure 29. The electronic device 20 differs from the electronic device 10 in that: the display screen 22 has a light permeable area 28 formed directly thereon. Such as: the display screen 22 is provided with a through hole penetrating the display screen 22 in the thickness direction, the light permeable region 28 may include the through hole, and the through hole may be provided with functional components such as a front camera 161, an earpiece, a sensor, and the like.

It should be noted that the structure of the display screen is not limited to this, for example: the display screen 22 is provided with non-display areas, which non-display areas may be included in the light permeable area 28, which non-display areas are not displayed. It should be noted that, the housing 25 may refer to the housing 15, the circuit board 23 may refer to the circuit board 13, the battery 24 may refer to the battery 14, and the antenna structure 29 may refer to the antenna structure 19, which are not described herein again.

Referring to fig. 3, fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure, and the electronic device 30 in fig. 3 may include a display screen 32, a cover plate 31, a circuit board 33, a battery 34, a housing 35, and an antenna structure 39. This electronic device 30 differs from the above electronic devices in that: the display screen 32 is provided with a notch 321 at its periphery, and the notch 321 can be used for placing functional components such as the front camera 161, the receiver, and the sensor. The cover 31 is suitable for the structure of the display screen 31, the cover 31 may be provided with a large notch 321, and the cover 31 may cover the notch 321. It should be noted that, the housing 35 may refer to the housing 15, the circuit board 33 may refer to the circuit board 13, the battery 34 may refer to the battery 14, and the antenna structure 39 may refer to the antenna structure 19, which are not described herein again.

It should be noted that, in some embodiments, the display 12 may not include the non-display area, but may be configured as a full-screen structure, and the functional components such as the distance sensor and the ambient light sensor may be disposed below the display or at other positions. Specifically, please refer to fig. 4, and fig. 4 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device 40 may include a display 42, a cover 41, a circuit board 43, a battery 44, a housing 45, and an antenna structure. Wherein the display screen 42 is overlaid on the housing 45 without a non-display area. Wherein, the cover plate 41 is suitable for the size setting of the display screen 42. It should be noted that, the housing 45 may refer to the housing 15, the circuit board 43 may refer to the circuit board 13, the battery 44 may refer to the battery 14, and the antenna structure 49 may refer to the antenna structure 19, which are not described herein again.

It can be understood that, along with the function of the electronic device is more and more, the devices installed inside the electronic device are more and more, and the extra devices installed inside the electronic device can additionally occupy the internal space of the electronic device under the condition that the size of the electronic device is not changed, and can occupy the clearance area of the antenna structure in the electronic device in the actual production process, thereby affecting the radiation signal of the antenna structure. In order to keep the antenna structure with good radiation signals under the condition of not additionally increasing the size of the electronic equipment, the antenna structure is installed on the outer surface of the middle frame or the outer surface of the rear cover to form the antenna assembly. The following description will be made in detail by taking an antenna assembly as an example.

It should be noted that, the antenna structure in the antenna assembly may be formed by a printing process, or may be formed by a metal material. The following description will take the example of a printing process to form a printed antenna assembly.

Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a method for manufacturing a printed antenna assembly according to an embodiment of the present application. The manufacturing method of the printed antenna component comprises the following steps:

in step 101, a substrate is provided. Referring to fig. 6, fig. 6 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure. The substrate 50 has a printed area 501, the printed area 501 being on the peripheral outer surface of the substrate 50. In some embodiments, the substrate 50 is made of a non-metallic material, such as plastic. The substrate 50 may be a back cover of an electronic device. The base may be a middle frame of an electronic device.

The substrate 50 may have a through hole 54 penetrating through the substrate 50, and the through hole 54 may be located in the printing region 501 or adjacent to the printing region 501. In some embodiments, the through-hole 54 may be machined in advance. It is also possible to provide a substrate without through-holes and then to perform a punching process by machining to form the through-holes 54.

In step 102, a first printing process is performed in the printing region 501 to form the first printed antenna 51. Referring to fig. 7 and 8, fig. 7 is another structural schematic diagram of a substrate according to an embodiment of the present disclosure, and fig. 8 is a cross-sectional view of the first printed antenna shown in fig. 7 along a direction a-a. The first printed antenna 51 includes a first connection portion 511, the first connection portion 511 is formed to extend along one side of the first printed antenna 51, and the first connection portion 511 is connected to the outer surface of the substrate 50. Thus, a step structure is formed between the first connection portion 511 and the first printed antenna 51.

In some embodiments, during the first printing process, a pad pasting conductive silver paste may be used for printing. After the first printing is completed, a baking process may be performed for 4 hours at a temperature of about 120 degrees to bake and form the first printed antenna 51.

In step s 103, a second printing process is performed on the printing region 501 to form the second print antenna 52. Referring to fig. 9 and 10, fig. 9 is another schematic structural diagram of a substrate according to an embodiment of the present disclosure, and fig. 10 is a cross-sectional view of the first printed antenna and the second printed antenna shown in fig. 9 in a B-B direction. The second printed antenna 52 includes a second connection portion 521, the second connection portion 521 is formed by extending from one side of the second printed antenna 52, the second connection portion 521 is far away from the outer surface of the substrate 501, and a step structure is formed between the second connection portion 521 and the second printed antenna 52.

In some embodiments, the second connection portion 521 is formed on the first connection portion 511 to form the first printed antenna 51 and the second printed antenna 52 into an integral structure, together forming the printed antenna structure 55. The printed antenna structure 55 may be a strip structure, and the thickness of each location of the printed antenna structure 55 may be the same, such as the thickness of each location of the printed antenna structure 55 is 0.20mm to 0.21 mm. Specifically, the sum of the thicknesses of the first and

second connection portions

511 and 521 is 0.20mm to 0.21mm, the thickness of the first printed antenna 51 is 0.20mm to 0.21mm, and the thickness of the second printed antenna 52 is 0.20mm to 0.21 mm. Therefore, the thickness of each part of the printed antenna structure 55 is basically the same, antenna impressions are prevented from being formed in the two printing process procedures, the thickness of an antenna joint is reduced, and the smoothness of the outer surface of the printed antenna structure 55 is improved while the performance of the printed antenna structure 55 is ensured.

Wherein, the outer surface of the first printed antenna 51 close to the first connection portion 511 and the outer surface of the second connection portion 52 are flush, and the outer surface of the second printed antenna 52 close to the second connection portion 521 and the outer surface of the second connection portion 52 are flush, so that the outer surface of the printed antenna structure 55 is smoother.

Note that the inner surface of the first printed antenna 51 is directly connected to the outer surface of the base 50, and the outer surface of the first printed antenna 51 is away from the base 50. The inner surface of the second printed antenna 52 is directly connected to the outer surface of the substrate 50, and the outer surface of the second printed antenna 52 is remote from the substrate 50. The inner surface of the first connection portion 511 is directly connected to the outer surface of the base 50, and the outer surface of the first connection portion 511 is away from the base 50. The inner surface of the second connecting portion 521 is directly connected to the outer surface of the first connecting portion 511, and the second connecting portion 521 is away from the base 50.

In some embodiments, during the second printing process, a pad pasting conductive silver paste may be used for printing. After the second printing is completed, a baking process may be performed for 4 hours at a temperature of about 120 degrees to bake and form the second printed antenna 52. I.e. forming a printed antenna structure 55.

It should be noted that in the first printing process or the second printing process, conductive silver paste may be formed in the through hole 54 during the printing process by using a pad printing head to adhere the conductive silver paste, and the feeding point 54 may be formed to couple with the circuit board.

In some embodiments, the thickness of the first connection portion 511 and the thickness of the second connection portion 521 may be equal or different. The shape of the first connection portion 511 and the second connection portion 521 may be the same, for example, a flat plate structure. The first connection portion 511 and the second connection portion 521 may have the same size.

It should be noted that, in the actual printing process, the inventor of the present application finds that, since the periphery of the substrate 50 is generally a curved surface, and the printing tool such as a rubber head is generally a convex surface, the coverage of one printing often cannot meet the pattern requirement of the antenna, and therefore, the pattern of the antenna needs to be formed by two or more printing splices. In the two-time printing process, the antenna joint positions printed twice are printed twice, a two-layer structure is formed, the thickness is large, and convex structures such as bosses are often formed. In the printing process of the two times, the printing thickness of the joint position is reduced respectively, for example, the printing thickness of the joint position formed by one-time printing is half of the rest thickness, so that the joint position formed by two-time printing is the same as the thickness of the rest one-time printing position, a protruding structure is prevented from being formed in the printing process, and the printing smoothness can be kept.

In some embodiments, the method of making the printed antenna assembly may further comprise: and performing spraying paint treatment on the substrate after the second printing treatment to form a paint layer 56. Referring to fig. 11, fig. 11 is another schematic structural diagram of a substrate according to an embodiment of the present disclosure. The paint layer 56 is disposed on the outer surface of the substrate 50, and the paint layer 56 covers the first printed antenna 51, the second printed antenna 52, and the outer surface of the substrate 50.

In some embodiments, the step of applying a spray paint to the substrate 50 after the second printing process may include:

performing primer spraying treatment on the substrate 50 after the second printing treatment;

the base body 50 after the primer treatment is subjected to a finish coating treatment, thereby forming a paint layer 56. The spraying primer treatment can improve the adhesion of the finish. It is also possible to perform no spray primer treatment.

Among them, the primer may be a polyurethane (polyurethane) treating agent. Wherein the top coat can be Ultraviolet light Curing Paint (UV Paint).

It should be noted that in some other embodiments, the step of performing the spray painting process on the substrate 50 after the second printing process may also include:

carrying out colored paint spraying treatment on the substrate 50 after the primer spraying treatment;

and carrying out finish paint spraying treatment on the substrate 50 after the colored paint spraying treatment.

The colored paint can be red, blue, black and the like, and can be prepared from polyurethane (polyurethane) and color master batch.

polishing the substrate 50 after the primer spraying treatment;

and spraying finish paint on the polished substrate 50.

In the paint spraying process, the finish paint is polished, so that the adhesive force of the finish paint can be improved. It should be noted that the spray polish treatment may be performed before the polishing, and after the primer is sprayed. The polishing paint can be polyurethane (polyurethane) polishing paint doped with 6% of talcum powder. It should also be noted that the colored paint may be applied after sanding and before the topcoat is applied.

It will be appreciated that the printed antenna structure 55 is located on the peripheral outer surface of the substrate 50 and is exposed to easy touch and damage. Therefore, the paint layer structure can be formed by spraying paint on the substrate 50 according to the embodiment of the present application, and the printed antenna structure 55 can be protected.

In some embodiments, please refer to fig. 12, where fig. 12 is a schematic structural diagram of a printed antenna assembly according to an embodiment of the present application. Fig. 10, in conjunction with fig. 10, may also be formed from the printed antenna structure 55 of fig. 9 in cross-section. The printed antenna assembly 5 may include a substrate 50 and a printed antenna structure 55.

The substrate 50 refers to the above contents, and is not described in detail herein.

The printed antenna structure 55 may include, among other things, a first printed antenna 51 and a second printed antenna 52. The first printed antenna 51 and the second printed antenna 52 can refer to the above contents, and are not described herein again.

In some embodiments, please refer to fig. 13, fig. 13 is another structural schematic diagram of a printed antenna assembly according to an embodiment of the present application. The printed antenna assembly 5 may also include a paint layer 56. The paint layer 56 may protect the printed antenna structure 55. It should be noted that the paint layer 56 can be formed by spraying paint, and specific reference may be made to the above contents, which are not described herein again.

It should be noted that in other embodiments, the printed antenna assembly 5 may also include other printed antenna structures, i.e., there may be two, three or more printed antenna structures.

The method for manufacturing the printed antenna assembly, and the electronic device provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to illustrate the principles and implementations of the present application, and the descriptions of the above embodiments are only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A method of making a printed antenna assembly, comprising:

providing a substrate, wherein the substrate is provided with a printing area on the outer surface of the periphery of the substrate, and the printing area is a curved surface;

2. The method of manufacturing a printed antenna assembly of claim 1, wherein the sum of the thicknesses of the first and second connection portions is in the range of 0.20mm to 0.21 mm.

3. The method of manufacturing a printed antenna assembly of claim 1, wherein the first printed antenna is flush adjacent an outer surface of the first connection portion and an outer surface of the second connection portion, and the second printed antenna is flush adjacent an outer surface of the second connection portion and an outer surface of the second connection portion.

4. The method of claim 1, wherein the first connection portion is of a flat structure and the second connection portion is of a flat structure, and wherein the first connection portion and the second connection portion are the same size.

5. The method of manufacturing a printed antenna assembly of claim 4, wherein the thickness of the first connection portion and the thickness of the second connection portion are equal.

6. A printed antenna assembly, comprising:

a substrate having a print area on an outer surface of a periphery thereof, the print area being a curved surface;

the second printed antenna is formed in the printing area and comprises a second connecting part, the second connecting part extends along one side of the second printed antenna and is far away from the base body along the horizontal direction of the second printed antenna;

7. The printed antenna assembly of claim 6, wherein the sum of the thicknesses of the first and second connection portions is in the range of 0.20mm to 0.21 mm.

8. The printed antenna assembly of claim 6, wherein the first printed antenna is flush adjacent an outer surface of the first connection portion and an outer surface of the second connection portion, and the second printed antenna is flush adjacent an outer surface of the second connection portion and an outer surface of the second connection portion.

9. The printed antenna assembly of claim 6, wherein the first connection portion is of a planar configuration and the second connection portion is of a planar configuration, the first and second connection portions being of the same size.

10. The printed antenna assembly of claim 9, wherein a thickness of the first connection portion and a thickness of the second connection portion are equal.

11. An electronic device comprising a printed antenna assembly according to any one of claims 6 to 10 and a circuit board coupled to the printed antenna assembly.