CN108493135B - Silicon wafer rotating device and silicon wafer sorting machine - Google Patents
Silicon wafer rotating device and silicon wafer sorting machine Download PDFInfo
- Publication number
- CN108493135B CN108493135B CN201810365086.6A CN201810365086A CN108493135B CN 108493135 B CN108493135 B CN 108493135B CN 201810365086 A CN201810365086 A CN 201810365086A CN 108493135 B CN108493135 B CN 108493135B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- mounting
- rotary
- driving part
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 139
- 239000010703 silicon Substances 0.000 title claims abstract description 139
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 138
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 230000033001 locomotion Effects 0.000 claims abstract description 7
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 106
- 238000009434 installation Methods 0.000 claims description 23
- 238000009987 spinning Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The application discloses a silicon wafer rotating device and a silicon wafer sorting machine, and belongs to the technical field of silicon wafer sorting. The silicon wafer rotating device comprises a rotating driving part, a lifting driving part and a rotating platform, wherein: the rotary platform is provided with an adsorption hole for adsorbing the silicon wafer; the rotary driving part is connected with the rotary platform and drives the rotary platform to rotate in the horizontal direction; the lifting driving part drives the rotary driving part and the rotary platform to perform lifting motion. The rotary driving part is utilized to lift the rotary platform to jack up the silicon wafer, and is utilized to drive the rotary platform to rotate to drive the silicon wafer to rotate, so that the influence of the rotary platform on the silicon wafer in transmission is avoided, and the effect of automatic rotation of the silicon wafer to be rotated is realized.
Description
Technical Field
The invention belongs to the technical field of silicon wafer sorting, and relates to a silicon wafer rotating device and a silicon wafer sorting machine.
Background
On the silicon wafer sorter, if it is determined that the arrangement direction of the conveyed silicon wafer is incorrect, the silicon wafer needs to be rotated, for example, by 90 degrees or 180 degrees or the like.
At present, a mode of manually rotating and conveying the silicon wafers is usually adopted, but because the silicon wafers are fragile, the mode of manually rotating the silicon wafers is adopted, the efficiency is low, and the silicon wafers are cracked due to uneven manual force application. It is therefore desirable to provide a solution for automatically rotating the transported wafers.
Disclosure of Invention
The invention provides a silicon wafer rotating device and a silicon wafer sorting machine, aiming at solving the problems that the efficiency is low and the silicon wafer is easy to crack due to uneven manual force application when the silicon wafer is manually rotated and conveyed in the related technology. The specific technical scheme is as follows:
in a first aspect, a silicon wafer rotating device is provided, including rotation driving portion, lift driving portion and rotary platform, wherein: the rotary platform is provided with an adsorption hole for adsorbing the silicon wafer; the rotary driving part is connected with the rotary platform and drives the rotary platform to rotate in the horizontal direction; the lifting driving part drives the rotary driving part and the rotary platform to perform lifting motion.
Through setting up rotary drive portion, lift drive portion and revolving platform, when the silicon chip that needs to transmit is rotatory, at first utilize rotary drive portion to promote the revolving platform in order to jack up the silicon chip, then utilize rotary drive portion drive revolving platform rotatory in order to drive the silicon chip and rotate, reached not only avoid the influence of revolving platform to the silicon chip in the transmission, still realized the effect of treating the autogiration of rotatory silicon chip.
Optionally, the silicon wafer rotating device further comprises a mounting frame, the rotating driving part is slidably mounted on the mounting frame, and the lifting driving part drives the rotating driving part to slide up and down along a first group of guide rails arranged on the mounting frame.
Through with rotary drive portion slidable mounting on the mounting bracket, the lift drive portion of being convenient for drives rotary drive portion and goes up and down, saves lift driven drive power.
Optionally, the silicon wafer rotating device further comprises a horizontal driving piece and a sliding part transversely arranged at the driving end of the horizontal driving piece, the lower part of the mounting frame is slidably mounted on the sliding part, and the horizontal driving piece drives the mounting frame to slide on the sliding part.
By arranging the horizontal driving piece, the horizontal driving piece is utilized to transversely drive the rotary platform on the mounting frame, so that when the silicon wafer is not positioned right above the initial position of the rotary platform, the rotary platform can be transversely moved to the right below the silicon wafer by the horizontal driving piece to receive the silicon wafer; in addition, by arranging the transverse sliding part and installing the installation frame on the sliding part, the driving force of the horizontal driving piece is saved when the installation frame is transversely driven by the horizontal driving piece.
Optionally, the sliding part is a screw, a through hole is formed in the lower portion of the mounting frame, and the screw penetrates through the through hole and two ends of the screw are respectively fixed on the driving end of the horizontal driving piece and the fixed mounting plate.
Through set up the through-hole in the bottom of mounting bracket to with lead screw cooperation, for the horizontal drive spare provides the structural design who saves driving force to the drive of mounting bracket, owing to need not dispose conventional slide rail and slider, reduced manufacturing cost.
Optionally, the silicon wafer rotating device further comprises a first mounting plate and a second mounting plate, the second mounting plate is slidably mounted on a guide rail arranged up and down on the first mounting plate through a first group of sliding blocks, and the lifting driving part drives the second mounting plate to slide up and down along the guide rail; the rotary driving part is slidably mounted on the mounting frame and is mounted on a transverse sliding rail of the second mounting plate through a first sliding block.
Through with second mounting panel slidable mounting about on first mounting panel and rotation drive portion slidable mounting about on the mounting bracket for lift drive portion can drive rotation platform and carry out elevating movement under the support of second mounting panel.
Optionally, the rotary driving part includes a rotary driving member, a first mounting side plate, a second mounting side plate and a top plate, where the first mounting side plate and the second mounting side plate are arranged opposite to each other, the rotary driving member is fixedly mounted on the top plate and located below the top plate, and the driving end of the rotary driving member is connected with the rotary platform; the first installation side plate is installed on a first vertical sliding rail of the first side plate of the installation frame through a second sliding block, and the second installation side plate is installed on a second vertical sliding rail of the second side plate of the installation frame through a third sliding block;
the upper end and the roof fixed connection of the third curb plate of mounting bracket, the third curb plate is installed on the horizontal slide rail of second mounting panel through first slider.
Through setting up first installation curb plate and second installation curb plate to the vertical slide rail that sets up on two installation curb plates, thereby make under the fixed circumstances about the mounting bracket, guarantee the lift realization of rotary drive spare.
Optionally, the lifting driving part comprises a lifting motor, an eccentric wheel, a transmission block and a connecting block, wherein: and the driving end of the lifting motor is provided with an eccentric wheel, the eccentric wheel is rotationally connected with the lower end of the transmission block, the upper end of the transmission block is connected with the first end of the conveying connection block, the second end of the connection block is fixedly connected with the conveying second mounting plate, and the lifting motor drives the second mounting plate and a rotary driving part arranged on the second mounting plate to lift through the conveying eccentric wheel.
Through the design, the lifting driving part is changed from vertical direct driving into a mode of transversely converting the vertical driving, so that the occupation of a vertical space structure is reduced.
Optionally, the shape of the rotating platform is circular.
By setting the shape of the rotary platform to be circular, the rotary platform can avoid interference to the transmission belt when rotating.
In a second aspect, there is also provided a silicon wafer sorter comprising a conveyor for conveying silicon wafers and a silicon wafer rotating device as provided in the first aspect and various optional implementations of the first aspect.
Through setting up rotary drive portion, lift drive portion and revolving platform, when the silicon chip that needs to carry conveyor carries rotates, utilize rotary drive portion to promote revolving platform in order to separate the silicon chip from conveyor, utilize rotary drive portion drive revolving platform rotatory in order to drive the silicon chip rotation, reached not only can avoid the influence of revolving platform to the silicon chip in the transmission, still realized the effect of treating the autogiration of rotatory silicon chip.
Optionally, the conveying device at least comprises two conveying belts which are conveyed in parallel and synchronously, and the silicon wafer rotating device is positioned below the two conveying belts.
The silicon wafer rotating device is arranged at the lower position between the two conveying belts, so that the influence on the silicon wafer or the conveying belts is avoided when the silicon wafer is not rotated.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic view of a silicon wafer sorter provided in some embodiments of the present application;
FIG. 2 is a schematic view of a silicon wafer rotating apparatus provided in some embodiments of the present application;
FIG. 3 is a schematic front view of a first mounting plate provided in one embodiment of the present application;
FIG. 4 is a schematic front view of a second mounting plate provided in one embodiment of the present application;
FIG. 5A is a schematic front mounting view of a rotary drive provided in one embodiment of the present application;
FIG. 5B is a rear-mounted schematic view of the rotary drive portion provided in FIG. 5A;
fig. 6 is an installation schematic diagram of a lift drive provided in one embodiment of the present application.
Wherein, the reference numerals are as follows:
10. a conveying device; 11. a conveyor belt; 20. a silicon wafer rotating device; 21. a rotation driving part; 211. a rotary driving member; 212. a first mounting side plate; 213. a second mounting side plate; 214. a top plate; 215. a second slider; 216. a third slider; 22. a lifting driving part; 221. a lifting motor; 222. an eccentric wheel; 223. a transmission block; 224. a connecting block; 23. rotating the platform; 24. a mounting frame; 241. a first side plate; 242. a second side plate; 243. a third side plate; 25. a horizontal driving member; 26. a screw rod; 27. a fixed mounting plate; 28. a first mounting plate; 281. a first set of sliders; 282. a guide rail; 29. a second mounting plate; 291. a first slider; 292. and a transverse slide rail.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the invention. Rather, they are merely examples of apparatus and methods consistent with aspects of the invention as detailed in the accompanying claims.
During sorting of silicon wafers, it is often necessary to rotate the wafers to a predetermined orientation to facilitate subsequent inspection and screening. At present, a manual mode is often adopted to rotate the silicon wafer, but the silicon wafer is fragile, and the silicon wafer is easy to crack due to the manual mode.
To this, this application provides a silicon chip sorter, has increased a silicon chip rotary device in this silicon chip sorter, and this silicon chip rotary device can be with the silicon chip rotation to predetermined direction, has avoided the manual rotation to the manual work of silicon chip. The silicon wafer sorter and the silicon wafer rotating device are exemplified below with reference to fig. 1 to 6.
Fig. 1 is a schematic view of a silicon wafer sorter provided in some embodiments of the present application, the silicon wafer sorter including a conveying device 10 and a silicon wafer rotating device 20.
The transporting device 10 here is used for transporting silicon wafers, and the silicon wafer rotating device 20 is used for rotating the silicon wafers transported on the transporting device 10, for example, the silicon wafer rotating device 20 rotates the transported silicon wafers by 90 °, 180 °, or 270 ° with respect to the transport direction.
In one possible implementation, the conveying device 10 may include at least two conveying belts 11 that are synchronously conveyed in parallel, and the silicon wafer rotating device 20 is located below between the two conveying belts 11, so that the silicon wafer rotating device 20 avoids affecting the silicon wafer or the conveying belts 11 when the silicon wafer is not rotated.
It is obvious that, in order to realize driving, the conveying device 10 further includes a driving portion for driving the two conveying belts 11 to convey, such as a driving motor and a driving wheel, and the mechanical structure for driving the two conveying belts 11 to synchronously convey by using the driving portion belongs to a technology that can be realized by those skilled in the art, and will not be described in detail in this embodiment.
In addition, the silicon wafer separator may include at least one detection device for detecting the silicon wafer, such as a detection device for detecting dirt on the appearance of the silicon wafer, such as a detection device for detecting hidden cracks of the silicon wafer, such as a detection device for detecting breakage on the appearance of the silicon wafer, in addition to the above-described conveying device 10 and the silicon wafer rotating device 20.
In order to realize automatic separation of the silicon chips, the silicon chip separator can also comprise a control module, wherein the control module can be realized through PLC programming so as to control the operation of each device of the silicon chip separator, and can also realize analysis and processing of pictures shot by the detection device.
In order to facilitate the operation of the operator, the silicon wafer sorter may further include a display screen which may display the detection result or the sorting result of each silicon wafer.
Further, the display screen may also be a touch screen, and the touch screen may display some operation controls through the control module, and generate corresponding operation instructions, such as starting up, suspending, shutting down, starting up a detection function of a detection device, shutting down a detection function of a detection device, starting up a rotation function of the silicon wafer rotation device 20, shutting down a rotation function of the silicon wafer rotation device 20, and the like, through a touch screen operation of an operator on the operation controls.
Optionally, the silicon chip sorting machine may further include a physical operation key used in cooperation with the display screen and the control module, and the operator performs physical operation to generate a corresponding operation instruction.
In order to enable the rotation of the silicon wafer conveyed by the conveying device 10, the silicon wafer rotating device 20 is shown in fig. 2, and the silicon wafer rotating device 20 at least includes a rotation driving portion 21, a lifting driving portion 22 and a rotation platform 23, wherein: the rotary platform 23 is provided with adsorption holes for adsorbing the silicon wafers; the rotary driving part 21 is connected with the rotary platform 23, and the rotary driving part 21 drives the rotary platform 23 to rotate in the horizontal direction; the elevation driving part 22 drives the rotation driving part 21 and the rotation platform 23 to perform an elevation movement at the same time.
Through setting up rotary drive portion 21, lift drive portion 22 and rotary platform 23, when the silicon chip that needs to transmit is rotatory, at first utilize rotary drive portion 21 to promote rotary platform 23 in order to jack up the silicon chip, then utilize rotary drive portion 21 drive rotary platform 23 rotatory in order to drive the silicon chip and rotate, reached not only avoid the influence of rotary platform 23 to the silicon chip in transmission, still realized the effect of treating the autogiration of rotatory silicon chip.
In one possible implementation, the wafer spin apparatus 20 is further provided with a vacuum pumping apparatus used in conjunction with the adsorption holes to implement the adsorption function of the adsorption holes.
Alternatively, the shape of the rotary table 23 may be circular, elliptical, polygonal, or the like. In order to avoid interference with the conveyor belt when the rotary table 23 is rotated, the rotary table 23 is set to be circular in shape in the embodiment of the present application.
In practical implementation, in order to avoid the influence of the rotary platform 23 on the silicon wafer when the silicon wafer is lifted, the surface of the rotary platform 23 may be made of a buffer material or an elastic material, such as rubber or soft plastic, and the material of the surface of the rotary platform 23 is not limited in this application.
In order to support the rotating platform 23, the silicon wafer rotating device 20 may further include a mounting frame 24, the rotating driving portion 21 is slidably mounted on the mounting frame 24, and the lifting driving portion 22 drives the rotating driving portion 21 to slide up and down along a first set of guide rails disposed on the mounting frame 24. In this way, the rotation driving part 21 is slidably mounted on the mounting frame 24, so that the lifting driving part 22 can conveniently drive the rotation driving part 21 to lift, and the driving force of lifting driving is saved.
In some implementations, the wafer to be rotated may not be located directly above the rotation stage 23, and in order to enable rotation of the wafer, the wafer rotation device 20 may be provided to be movable in the horizontal direction or in the transport direction of the wafer.
In one possible implementation, the silicon wafer rotating device 20 may further include a horizontal driving member 25 and a sliding portion transversely disposed at a driving end of the horizontal driving member 25, on which the lower portion of the mounting frame 24 is slidably mounted, and the horizontal driving member 25 drives the mounting frame 24 to slide on the sliding portion. In this way, by arranging the horizontal driving piece 25, the horizontal driving piece 25 is utilized to transversely drive the rotary platform 23 on the mounting frame 24, so that when the silicon wafer is not positioned right above the initial position of the rotary platform 23, the rotary platform 23 can be transversely moved to the right below the silicon wafer by the horizontal driving piece 25 to receive the silicon wafer; in addition, by providing a lateral sliding portion and mounting the mounting bracket 24 on the sliding portion, the driving force of the horizontal driving member 25 is saved when the mounting bracket 24 is laterally driven by the horizontal driving member 25.
For example, the sliding portion may be a screw rod 26, in which case, in order to match the screw rod 26 to realize sliding, a through hole may be provided at the lower portion of the mounting frame 24, and the screw rod 26 passes through the through hole and is fixed at both ends to the driving end of the horizontal driving member 25 and the fixed mounting plate 27, respectively. That is, two opposite through holes are provided at the lower portion of the mounting bracket 24, the screw 26 passes through the two through holes, one end of the screw 26 is fixed to the fixed mounting plate 27, and the other end is fixed to the driving end of the horizontal driving member 25.
Thus, through the through hole arranged at the bottom end of the mounting frame 24 to be matched with the screw rod 26, the driving force-saving structural design is provided for driving the mounting frame 24 by the horizontal driving piece 25, and the manufacturing cost is reduced because the conventional sliding rail and sliding block are not required to be configured.
Optionally, the silicon wafer rotating device 20 may further include a first mounting plate 28 and a second mounting plate 29, where the second mounting plate 29 is slidably mounted on a guide rail disposed on the first mounting plate 28 through a first set of sliding blocks, and the lifting driving portion 22 drives the second mounting plate 29 to slide up and down along the guide rail 282, as shown in fig. 3, which is a schematic front view of the first mounting plate provided in one embodiment of the present application, two guide rails, that is, the guide rail 282, are vertically disposed on the first mounting plate 28, and each guide rail is slidably mounted with a sliding block, that is, a first set of sliding blocks 281.
Correspondingly, the rotation driving portion 21 is slidably mounted on the mounting frame 24 and is mounted on a lateral sliding rail of the second mounting plate 29 through a first sliding block, please refer to fig. 4, which is a schematic front view of the second mounting plate provided in one embodiment of the present application, a sliding rail, that is, a lateral sliding rail 292 is laterally disposed on the second mounting plate 29, a sliding block, that is, a first sliding block 291 is slidably mounted on the first lateral sliding rail 292, and the rotation driving portion 21 is mounted on the lateral sliding rail 292 of the second mounting plate 29 through the first sliding block 291.
In the embodiment of the application, the second mounting plate 29 is mounted on the first mounting plate 28 in a vertically sliding manner, and the rotation driving portion 21 is mounted on the mounting frame 24 in a vertically sliding manner, so that the lifting driving portion 22 can drive the rotation platform 23 to perform lifting movement under the support of the second mounting plate 29.
Referring to fig. 5A and 5B, where fig. 5A is a front installation schematic view of a rotary driving part provided in an embodiment of the present application, and fig. 5B is a rear installation schematic view of the rotary driving part provided in fig. 5A, the rotary driving part 21 includes a rotary driving member 211, a first installation side plate 212, a second installation side plate 213, and a top plate 214, the first installation side plate 212 and the second installation side plate 213 are disposed opposite to each other, the rotary driving member 211 is fixedly installed on the top plate 214 and is located below the top plate 214, and a driving end of the rotary driving member 211 is connected to the rotary platform 23; the first mounting side plate 212 is mounted on a first vertical slide rail of a first side plate 241 of the mounting frame 24 by a second slider 215, and the second mounting side plate 213 is mounted on a second vertical slide rail of a second side plate 242 of the mounting frame 24 by a third slider 216. Here, the first vertical slide rail and the second vertical slide rail are disposed in parallel, and generally, the heights of the second slider 215 and the third slider 216 are maintained on the same horizontal line.
Here, the rotation driving member 211 may be a rotation motor or other driving capable of achieving rotation in the horizontal direction.
Here, the first side plate 241 and the second side plate 242 of the mounting frame 24 are two side plates arranged vertically relatively, in order to realize the lateral movement of the mounting frame 24, the mounting frame 24 further includes a third side plate 243 adjacent to the first side plate 241 and the second side plate 242, the upper end of the third side plate 243 of the mounting frame 24 is fixedly connected to the top plate 214, and the third side plate 243 of the mounting frame 24 is mounted on a lateral rail on the second mounting plate 29 through the first slider 291.
By providing the first mounting side plate 212 and the second mounting side plate 213, and vertical slide rails provided on both mounting side plates, lifting of the rotation driving piece 211 is ensured under the condition that the mounting frame 24 is fixed up and down.
In actual implementation, the first side plate 241, the third side plate 243, and the second side plate 242 of the mounting bracket 24 are all located below the top plate 214, and are typically fixedly mounted on three sides of the top plate 214 in sequence.
In one possible implementation, please refer to fig. 6, which is a schematic installation diagram of the lifting driving part 22 provided in one embodiment of the present application, the lifting driving part 22 may include a lifting motor 221, an eccentric 222, a transmission block 223, and a connection block 224, where: an eccentric wheel 222 is installed on the driving end of the lifting motor 221, the eccentric wheel 222 is rotationally connected with the lower end of a transmission block 223, the upper end of the transmission block 223 is connected with the first end of a conveying connection block 224, the second end of the connection block 224 is fixedly connected with a conveying second mounting plate 29, and the lifting motor 221 drives the second mounting plate 29 and a rotary driving part 21 installed on the second mounting plate 29 to lift through the conveying eccentric wheel 222.
Through above-mentioned design in this embodiment for lift drive portion 22 changes from vertical direct drive into the mode of horizontal to vertical drive, has reduced the occupation of vertical spatial structure.
To sum up, the silicon chip sorter that this application provided through setting up rotary drive portion, lift drive portion and revolving platform, when needs rotate the silicon chip that conveyor carried, utilizes rotary drive portion to promote revolving platform in order to separate the silicon chip from conveyor, utilizes rotary drive portion drive revolving platform rotation in order to drive the silicon chip rotation, has reached not only can avoid the influence of revolving platform to the silicon chip in the transmission, has still realized the effect of treating the autogiration of rotatory silicon chip. In addition, the silicon wafer rotating device is arranged at the lower position between the two conveying belts, so that the influence on the silicon wafer or the conveying belts is avoided when the silicon wafer is not rotated.
The silicon wafer rotating device provided by the application, through setting up rotary driving part, lift driving part and rotary platform, when the silicon wafer that needs to transmit is rotated, at first utilize rotary driving part to promote rotary platform in order to jack up the silicon wafer, then utilize rotary driving part drive rotary platform rotatory in order to drive the silicon wafer rotatory, reached not only avoid rotary platform to the influence of silicon wafer in the transmission, still realized the effect of treating the autogiration of rotatory silicon wafer.
In addition, the silicon wafer rotating device transversely drives the rotating platform on the mounting frame by the aid of the horizontal driving piece, so that when the silicon wafer is not located right above the initial position of the rotating platform, the rotating platform can be transversely moved to right below the silicon wafer by the aid of the horizontal driving piece to receive the silicon wafer; in addition, by arranging the transverse sliding part and installing the installation frame on the sliding part, the driving force of the horizontal driving piece is saved when the installation frame is transversely driven by the horizontal driving piece.
It should be noted that, in the embodiments of the present application, the terms "first," "second," "third," and the like are merely used for convenience of understanding to indicate different objects or components, and are not used to limit the order of the objects or components.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It is to be understood that the invention is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (4)
1. A silicon wafer rotating device, characterized in that the silicon wafer rotating device comprises: rotation drive portion, lift drive portion and rotary platform, wherein:
the rotary platform is provided with an adsorption hole for adsorbing the silicon wafer;
the rotary driving part is connected with the rotary platform and drives the rotary platform to rotate in the horizontal direction;
the lifting driving part drives the rotary driving part and the rotary platform to perform lifting movement at the same time;
the silicon wafer rotating device further comprises a mounting frame, the rotating driving part is slidably mounted on the mounting frame, and the lifting driving part drives the rotating driving part to slide up and down along a first group of guide rails arranged on the mounting frame;
the silicon wafer rotating device further comprises a horizontal driving piece and a sliding part transversely arranged at the driving end of the horizontal driving piece, the lower part of the mounting frame is slidably arranged on the sliding part, and the horizontal driving piece drives the mounting frame to slide on the sliding part;
the sliding part is a screw rod, a through hole is formed in the lower portion of the mounting frame, the screw rod penetrates through the through hole, and two ends of the screw rod are respectively fixed on the driving end of the horizontal driving piece and the fixed mounting plate;
the silicon wafer rotating device further comprises a first mounting plate and a second mounting plate, the second mounting plate is slidably mounted on a guide rail arranged up and down on the first mounting plate through a first group of sliding blocks, and the lifting driving part drives the second mounting plate to slide up and down along the guide rail;
the rotary driving part is slidably mounted on the mounting frame and is mounted on a transverse sliding rail of the second mounting plate through a first sliding block;
the rotary driving part comprises a rotary driving piece, a first mounting side plate, a second mounting side plate and a top plate, wherein the first mounting side plate and the second mounting side plate are oppositely arranged, the rotary driving piece is fixedly mounted on the top plate and is positioned below the top plate, and the driving end of the rotary driving piece is connected with the rotary platform;
the first installation side plate is installed on a first vertical sliding rail of the first side plate of the installation frame through a second sliding block, and the second installation side plate is installed on a second vertical sliding rail of the second side plate of the installation frame through a third sliding block;
the upper end of a third side plate of the mounting frame is fixedly connected with the top plate, and the third side plate is mounted on a transverse sliding rail of the second mounting plate through the first sliding block;
the lifting driving part comprises a lifting motor, an eccentric wheel, a transmission block and a connecting block, wherein:
the driving end of the lifting motor is provided with the eccentric wheel, the eccentric wheel is rotationally connected with the lower end of the transmission block, the upper end of the transmission block is connected with the first end of the conveying connecting block, the second end of the connecting block is fixedly connected with the conveying second mounting plate, and the lifting motor drives the second mounting plate and the rotary driving part arranged on the second mounting plate to lift through the conveying eccentric wheel.
2. The wafer spinning apparatus of claim 1 wherein said spinning platform is circular in shape.
3. A silicon wafer sorter comprising a conveying device that conveys silicon wafers and a silicon wafer rotating device according to any one of claims 1 to 2.
4. A silicon wafer sorter as in claim 3 wherein the conveyor comprises at least two conveyor belts that are transported in parallel and in synchrony, the silicon wafer rotating device being located below between the two conveyor belts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810365086.6A CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810365086.6A CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108493135A CN108493135A (en) | 2018-09-04 |
| CN108493135B true CN108493135B (en) | 2024-01-05 |
Family
ID=63313814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810365086.6A Active CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108493135B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001019595A (en) * | 1999-06-29 | 2001-01-23 | Sharp Corp | Rotary cooling member and crystal sheet-producing device using the same |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| KR20130005146A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Single-arm type cassette lifting robot |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN106449509A (en) * | 2016-11-25 | 2017-02-22 | 江苏奥特维自动化科技有限公司 | Lifting and rotating device |
| CN208240623U (en) * | 2018-04-23 | 2018-12-14 | 无锡奥特维科技股份有限公司 | Silicon slice rotating device and silicon wafer sorting machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204913053U (en) * | 2015-08-28 | 2015-12-30 | 李俊豪 | Laser board of two -way processing |
-
2018
- 2018-04-23 CN CN201810365086.6A patent/CN108493135B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001019595A (en) * | 1999-06-29 | 2001-01-23 | Sharp Corp | Rotary cooling member and crystal sheet-producing device using the same |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| KR20130005146A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Single-arm type cassette lifting robot |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN106449509A (en) * | 2016-11-25 | 2017-02-22 | 江苏奥特维自动化科技有限公司 | Lifting and rotating device |
| CN208240623U (en) * | 2018-04-23 | 2018-12-14 | 无锡奥特维科技股份有限公司 | Silicon slice rotating device and silicon wafer sorting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108493135A (en) | 2018-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107487632B (en) | Glass loading and unloading integrated machine | |
| KR101078039B1 (en) | Processing machine of glass sheets | |
| CN212143520U (en) | Mobile phone display screen module detection device | |
| CN211042686U (en) | Drawing force testing machine | |
| CN205650479U (en) | Automatic sorting machine | |
| CN109030506B (en) | LCD automatic detection equipment | |
| CN104332439A (en) | Wafer plate pushing device | |
| CN110601918B (en) | Automatic test equipment for separated wireless module | |
| CN103227134A (en) | Carrying and screening device of battery packs and carrying and screening method | |
| CN208796964U (en) | A kind of twice feeding silicon wafer sorting machine | |
| CN108983014A (en) | A kind of weatherometer | |
| CN209160815U (en) | A kind of mobile phone automatic turning slewing | |
| CN112850145A (en) | Curved surface screen crack check out test set | |
| CN212587399U (en) | Keyboard backlight plate assembly equipment | |
| CN212502847U (en) | Automatic sheet feeding device of glass processing line | |
| CN104555319A (en) | Color detection equipment | |
| CN109001926A (en) | A kind of contraposition module | |
| KR101459297B1 (en) | Reversal device | |
| CN108974892A (en) | A kind of automatic control upper and lower pieces device | |
| CN209912841U (en) | Photovoltaic solar wafer PL detects machine | |
| CN213170136U (en) | A tipping arrangement for electronic product auxiliary scanning | |
| CN108493135B (en) | Silicon wafer rotating device and silicon wafer sorting machine | |
| CN212095190U (en) | Automatic screw locking mechanism for notebook computer shell | |
| CN108735642A (en) | A kind of chip transmission device, silicon chip transmission system and chip transmission method | |
| CN208922000U (en) | A kind of contraposition module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |