CN108492951A - Smd功率型ntc热敏电阻及其制备工艺 - Google Patents

Smd功率型ntc热敏电阻及其制备工艺 Download PDF

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CN108492951A
CN108492951A CN201810197845.2A CN201810197845A CN108492951A CN 108492951 A CN108492951 A CN 108492951A CN 201810197845 A CN201810197845 A CN 201810197845A CN 108492951 A CN108492951 A CN 108492951A
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copper plate
plate electrode
ntc thermistor
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李骏
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Nanjing Ke Min Electronics Co Ltd
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Abstract

本发明公开了一种SMD功率型NTC热敏电阻及其制备工艺，属于陶瓷半导体应用技术领域。本发明热敏电阻包括矩形电阻瓷片和铜片电极，所述铜片电极为两个，分别焊接于电阻瓷片的两个表面上，然后从封装体中引出电极，应用时，贴覆于PCB上并与PCB焊接在一起。与微电流型贴片电阻相比，本发明产品电流较大，采用铜片电极焊点，增大了导电的横截面积，散热好。同时克服了圆片引线型热敏电阻超高的难题，发热有所改善。

Description

SMD功率型NTC热敏电阻及其制备工艺
技术领域
本发明涉及陶瓷半导体应用技术领域，具体涉及一种SMD功率型NTC热敏电阻及其制备工艺。
背景技术
近年来，随着电子产品的迅猛发展，一些高端的电子产品要求体积小、性能好，对整机的空间有一定的限制，因此，设计者需要减小元器件的占用空间。但目前一些高压器件都是圆片结构带有两根引线，通过引线焊接在PCB上，高度无法减小，导致无法达到降低空间高度的要求，无法满足厂商需求。
发明内容
为了克服现有技术中存在的上述不足之处，本发明的目的在于提供一种SMD功率型NTC热敏电阻及其制备工艺，本发明原材料的选择范围广、方法简单、适宜产业化要求。
为实现上述目的，本发明所采用的技术方案如下：
一种SMD功率型NTC热敏电阻，该热敏电阻包括矩形电阻瓷片和铜片电极，所述铜片电极为两个；所述电阻瓷片的两个表面上先制备银层，然后将两铜片电极分别焊接于电阻瓷片两侧的银层表面上(铜片电极与银层表面相平行)，铜片电极从封装体中引出，使用时，铜片电极贴覆于PCB上并与PCB焊接在一起。
所述电阻瓷片的两个表面上先制备银层，然后将铜片电极分别焊接在瓷片两侧的银层上。
该热敏电阻采用聚苯硫醚(CPPS)通过热熔注塑封装。
所述铜片电极的引出方式为：两个铜片电极从封装体的两端平行引出，应用时，将两极直接焊接在PCB上。
该热敏电阻中，矩形电阻瓷片的规格为：长度6.8mm、宽度4.8mm、厚度1.3-2.0mm；铜片电极为厚度0.2mm、宽度3mm的条带状铜片；铜片电极与矩形电阻瓷片的焊接面的面积为3mm×2.3mm(3mm为铜片电极宽度，2.3mm为铜片在瓷片上焊接长度)。
所述SMD功率型NTC热敏电阻按照如下步骤进行制造：
(1)NTC热敏电阻材料粉体的制备：
将Mn、Ni、Cu、Co元素的金属氧化物粉体和过渡元素的粉体按所需比例混合均匀，金属氧化物粉体中Mn、Ni、Cu和Co元素的氧化物摩尔比例为80:10:7.5:2.5；然后放入高速球磨机(XHM-400)中进行研磨，研磨后取出烘干，获得粒度为2-3μm的电阻材料粉体；
(2)压制成型：将步骤(1)所得电阻材料粉体与聚乙烯醇(PVA)胶体按照100：30的重量比例混合并通过造粒机制备8-10μm颗粒状混合料；将颗粒状混合料采用压片机压制成型。
(3)烧结：将步骤(2)所得片材先在750℃进行去应力的预烧结，然后在1100℃±2℃条件下烧结2.5小时，自然冷却后获得瓷体芯片，即所述矩形电阻瓷片；
(4)制备纯银电极和焊接铜片电极：在所述瓷体芯片上涂刷银浆，烘干后高温还原成纯银电极，即所述银层；在银层上焊接铜片(铜片电极)；
(5)外壳热融压制；将焊接铜带的瓷体芯片放置在模具内，启动热融注塑机，用聚苯硫醚(CPPS)热融注塑,冷却后即获得所述NTC热敏电阻。
上述步骤(1)所述研磨过程中，按照混合料：去离子水＝1：1的重量比例向高速球磨机中加入去离子水，研磨时间为3小时。
上述步骤(2)中，所述聚乙烯醇胶体是按照聚乙烯醇：去离子水＝100：16的重量比例将聚乙烯醇加入去离子水中，搅拌溶解后得到。步骤(2)中的颗粒状混合料制成后需要在75℃烘干后，再进行压制成型；过程为；用旋转式压片机(ZPW-21)换好成型磨具(7.4×9.6)，成型厚度1.5±0.05mm，完成后750℃预烧。颗粒状粉体有流动性，满足成型机高速运转压制填料的一致性。
上述步骤(4)中，在银层上热融焊接铜片，其中：热融温度260±5℃，时间8-10分钟。
本发明具有如下优点：
1、本发明改进了传统负温热敏电阻的工艺制作形式，包括瓷片制作、涂、焊电极、装配外壳等工艺过程及实际使用方面，通过验证产品性能达到了与有引线焊接同类产品的水平；满足了厂商的要求；本发明热敏电阻产品适用于较小电流(不大于10安培)。
2、与微电流型贴片电阻相比，本发明产品电流较大，采用铜片电极焊点，增大了导电的横截面积，散热好。同时克服了圆片引线型热敏电阻超高的难题，发热有所改善。
附图说明
图1为本发明SMD功率型NTC热敏电阻结构示意图。
图2为现有圆片热敏电阻结构示意图。
图3为实施例1中电阻规格。
图4为实施例1与对比例1产品在PCB上高度对比；其中：(a)对比例1；(b)实施例1；L1+L2为高度。
图5为实施例2制备的电阻产品外形及尺寸；其中：(a)和(b)为本产品从不同视角观察的整体外观。
具体实施方式
以下结合附图详述本发明。
本发明SMD功率型NTC热敏电阻的结构如图1所示，其包括矩形电阻瓷片和铜片电极，电阻瓷片的两个表面制备有银电极，所述铜片电极为两个，两个铜片电极分别焊接在瓷片两面的银电极层上；两铜片电极从封装体中引出，铜片电极在使用时直接贴覆于PCB上并与PCB焊接在一起。该热敏电阻采用聚苯硫醚(CPPS)通过热熔注塑封装。
所述铜片电极的引出方式为：两个铜片电极从封装体的两侧(封装体的宽度方向的两侧面上)平行引出，使用时，铜片电极直接焊接在PCB上。
对比例1：
常规圆片电阻结构如图2所示。圆片电阻是用两根直径0.8mm、长度7.5-27mm的裸导线焊圆形瓷片上，引出端焊接在在PCB上，在电流的作用下发热，产生热量的大小和导线的长度、截面积及导体的材料决定；根据R＝δ×L/S(R为电阻，δ为电阻率，L为导线长度，S为导线截面积)，电阻越大，产生热量越大。本例中圆片电阻的各部分规格如图4和表1。
表1
DMax LlMax L2Min F TMax d
10.5 16.0 20 7.5±1.0 5.0 0.8±0.06
表2
Al(mm) A2(mm) W1(mm) B(mm) B1(mm)
4.8±0.2 0.9±0.11 3.0±0.11 6.8±0.2 2.3±0.1
实施例1：
本实施例中SMD功率型NTC热敏电阻是采用厚度0.20mm、宽3mm的条形铜片水平焊在电阻瓷片上，通过用CPPS(聚苯硫醚)热融注塑，在在封装体同一水平面引出铜片电极，该电阻各部分尺寸如图3和表2所示。产品贴在PCB上直接焊接(与PCB“零”接触)，没有空间距离，这样该器件在PCB上变矮。
本实施例产品与对比例1中圆片型器件相比，在PCB上高度大大降低。圆片电阻是由两只裸导线焊接在圆瓷片两侧，按规格长度各不同；以本发明产品对应的圆片直径为9mm(加外包封绝缘材料后在10mm左右)，引线到圆片最短长度27mm，加上片径高度约为36mm。而本发明的SMD产品是长方形瓷片水平位置，电极铜片由轴向两侧引出，同时消除了引线和圆瓷片直径的长度，最后用聚苯硫醚(PPS)热融注塑而成，其整体高度在4±0.5mm之间，与带引线产品(对比例1)相比整体高度大大降低。如图4及表1中数据。
本发明由于导电极采用铜片，横截面增大，而且减少了矩形电阻到PCB的导电距离，故导电发热量减小。
实施例2：
本实施例为SMD功率型NTC热敏电阻的制备工艺，工艺流程为：配料、研磨、造粒、成型、烧制、涂电极、测阻值、焊电极铜片、测试电流、外壳压装和盘封包装；具体包括如下步骤：
(1)NTC热敏电阻材料粉体的制备：
将Mn、Ni、Cu、Co等元素的金属氧化物粉体(依次摩尔比例为80:10:7.5:2.5)和过渡元素的粉体按所需比例混合均匀，所得混合料放入高速球磨机(XHM-400)中进行研磨，研磨后取出烘干，获得粒度为2-3μm的电阻材料粉体；其中：所述研磨过程中，按照混合料：去离子水＝1：1重量比例加入去离子水，研磨时间为3小时。
(2)造粒：将步骤(1)所得电阻材料粉体放入造粒机(YK-16A)内，同时加入PVA胶体搅拌1小时(粉体与PVA胶体重量比例100：30)，获得8-10μm颗粒状混合料；加工成颗粒状的目的是在成型加工过程中颗粒有良好的流动性。
(3)压制成型；用旋转式压片机(ZPW-21)换好成型磨具(7.4×9.6)磨具，成型厚度1.5±0.05mm。
(4)烧结：先在750℃进行去应力的预烧结，然后采用LS-2立式烧结炉，在1100℃±2℃温度条件下烧结2.5小时，自然冷却，获得瓷体芯片。
(5)涂电极；根据所需的阻值，设定好芯片的导电面积，依据R＝δ×L/S(R-电阻，δ-导电率，L-瓷片厚度，S-导电面积)，所述产品为电阻5欧姆时的导电截面积为21.12平方毫米(S＝δ×L/R所述产品料系的导电率δ＝80，L为烧结后产品的厚度1.32mm,R为5欧姆)，涂银面积在6.8×4.8瓷片上设定为5.28×4.00＝21.12平方毫米,试样阻值合格，批量操作，在涂银机(Sx-P5030)上,对好影印模板与所涂产品铝板位置，用电子银浆进行涂刷，烘干后用800℃还原成纯银电极。
(6)对银片电阻值测试，用半自动XP-H测试机，在电脑上设定好阻值合格范围(4-6欧姆)，开机分选出阻值合格产品。
(7)焊接；用0.2mm×3mm一排铜带(整条一排10对)放入铝模板内，将两侧涂有锡膏银片分别***铜带，将整排插好的银片放在铝盘架上，通过265℃±5℃的热融窑10分钟进行热融焊接。
(8)电流测试；用RM1-III型电流冲击仪，调到3安培量程，电容量调到330UF,对每只产品进行检测.
(9)外壳热融压制；启动热融注塑机，将产品线排放置在热融模内，用聚苯硫醚(CPPS)热融注塑,自动推出冷却后,进入包装。
产品的工作应用原理：当电器开启瞬间会产生很大的浪涌电流，会对一些电子器件造成伤害或损坏，大大降低使用寿命，当把该产品串接在电源电路上，开启电源时，由于电阻值的作用，能阻碍瞬间的浪涌电流，使其它的原件受不到巨大的浪涌电流冲击，得到保护。电器开始工作，温度逐步升高，电阻值急剧下降(负温热敏电阻特性；温度升高，阻值减小)，当电流稳定时，其阻值可忽略(与导线相似)，利用该产品的这一特性，有效的阻碍浪涌电流对其他元件的伤害。
本实施例制备的NTC热敏电阻结构和规格如图5和表3所示，产品型号参数如表4图5(a)中，黑色部分是聚苯硫醚外壳(绝缘体)，下方白色是铜片电极也就是图5(b)上的焊接面。
表3
H1为总高度(H1＝H+铜片的厚度)
表4产品型号参数
表4中各参数解释如下：
额定电阻：NTC热敏电阻在基准温度25℃时的电阻值；
最大稳态电流：NTC正常工作时，能承受的工作电流；
残余电阻：电阻工作在最大稳态电流状态下的电阻值(v电阻端电压/Imax)。
耗散系数(δ)：在规定环境温度下，NTC热敏电阻耗散系数是电阻中耗散的功率变化与电阻体相应的温度变化之比值。
热时间常数(τ)：在零功率条件下，当温度突变时，热敏电阻的温度变化了始未两个温度差的63.2％时所需的时间，热时间常数与NTC热敏电阻的热容量成正比，与其耗散系数成反比。
电容量：热敏电阻所能承受抗电流冲击的容量。
以上虽然结合附图描述了本发明的实施方式，但是专利所有者可以在所附权利要求的范围之内做出各种变形或修改，只要不超过本发明的权利要求所描述的保护范围，都应当在本发明的保护范围之内。

Claims (9)

1.一种SMD功率型NTC热敏电阻，其特征在于：该热敏电阻包括矩形电阻瓷片和铜片电极，所述铜片电极为两个；所述电阻瓷片的两个表面上先制备银层，然后将两铜片电极分别焊接于电阻瓷片两侧的银层表面上，铜片电极从封装体中引出，应用时，铜片电极贴覆于PCB上并与PCB焊接在一起。
2.根据权利要求1所述的SMD功率型NTC热敏电阻，其特征在于：该热敏电阻采用聚苯硫醚通过热熔注塑封装。
3.根据权利要求1所述的SMD功率型NTC热敏电阻，其特征在于：所述铜片电极的引出方式为：两个铜片电极从封装体的两端平行引出，应用时，将两极直接焊接在PCB上。
4.根据权利要求1-3任一所述的SMD功率型NTC热敏电阻，其特征在于：该热敏电阻中，矩形电阻瓷片的规格为：长度6.8mm、宽度4.8mm、厚度1.3～2.0mm；铜片电极为厚度0.2mm、宽度3mm的条带状铜片；铜片电极与矩形电阻瓷片的焊接面的面积为3mm×2.3mm。
5.根据权利要求1-3任一所述的SMD功率型NTC热敏电阻的制备工艺，其特征在于，该工艺包括如下步骤：
(1)NTC热敏电阻材料粉体的制备：
将Mn、Ni、Cu、Co元素的金属氧化物粉体和过渡元素的粉体按所需比例混合均匀，然后放入高速球磨机中进行研磨，研磨后取出烘干，获得粒度为2-3μm的电阻材料粉体；
(2)压制成型：将步骤(1)所得电阻材料粉体与聚乙烯醇胶体按照100：30的重量比例混合并通过造粒机制备8-10μm颗粒状混合料；将颗粒状混合料采用压片机压制成型,成型厚度1.5±0.05mm；
(3)烧结：将步骤(2)所得片材先在750℃进行去应力的预烧结，然后在1100℃±2℃条件下烧结2.5小时，自然冷却后获得瓷体芯片，即所述矩形电阻瓷片；
(4)制备纯银电极和焊接铜片电极：在所述瓷体芯片上涂刷银浆，烘干后高温还原成纯银电极，即所述银层；在银层上焊接铜片电极；
(5)外壳热融压制；将焊接铜带的瓷体芯片放置在模具内，启动热融注塑机，用聚苯硫醚热融注塑,冷却后即获得所述NTC热敏电阻。
6.根据权利要求5所述的SMD功率型NTC热敏电阻的制备工艺，其特征在于：步骤(1)所述研磨过程中，按照混合料：去离子水＝1：1的重量比例向高速球磨机中加入去离子水，研磨时间为3小时。
7.根据权利要求5所述的SMD功率型NTC热敏电阻的制备工艺，其特征在于：步骤(2)中，所述聚乙烯醇胶体是按照聚乙烯醇：去离子水＝100：16的重量比例将聚乙烯醇加入去离子水中，搅拌溶解后得到。
8.根据权利要求6所述的SMD功率型NTC热敏电阻的制备工艺，其特征在于：步骤(2)中的颗粒状混合料制成后需要在75℃烘干后，再进行压制成型。
9.根据权利要求5所述的SMD功率型NTC热敏电阻的制备工艺，其特征在于：步骤(4)中，在银层上热融焊接铜带，其中：热融温度260±5℃，时间8-10分钟。
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