CN108481734A - 4D micro-nano Method of printings based on three-dimensional laser direct write - Google Patents

4D micro-nano Method of printings based on three-dimensional laser direct write Download PDF

Info

Publication number
CN108481734A
CN108481734A CN201810151527.2A CN201810151527A CN108481734A CN 108481734 A CN108481734 A CN 108481734A CN 201810151527 A CN201810151527 A CN 201810151527A CN 108481734 A CN108481734 A CN 108481734A
Authority
CN
China
Prior art keywords
deformation
micro
substrate
printing
hinge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810151527.2A
Other languages
Chinese (zh)
Other versions
CN108481734B (en
Inventor
黄天云
段慧玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peking University
Original Assignee
Peking University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peking University filed Critical Peking University
Priority to CN201810151527.2A priority Critical patent/CN108481734B/en
Publication of CN108481734A publication Critical patent/CN108481734A/en
Application granted granted Critical
Publication of CN108481734B publication Critical patent/CN108481734B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/268Arrangements for irradiation using laser beams; using electron beams [EB]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/268Arrangements for irradiation using laser beams; using electron beams [EB]
    • B29C64/273Arrangements for irradiation using laser beams; using electron beams [EB] pulsed; frequency modulated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)

Abstract

The invention discloses a kind of flexible 4D micro-nanos Method of printing based on three-dimensional laser direct write, including step:It is ready for the substrate of 4D micro-nanos printing;4D can print material precursor to drop in substrate;Presoma described in laser irradiation is controlled, so that presoma is realized the differentiation deformation of three-dimensional structure, forms the sample of setting shape;Sample is developed.The Method of printing of the present invention realizes the preparation of three-dimension flexible controllable deforming micro-structure using three-dimensional laser direct writing technology.

Description

4D micro-nano Method of printings based on three-dimensional laser direct write
Technical field
The present invention relates to 4D to print field, further to a kind of flexible 4D micro-nanos printing side based on three-dimensional laser direct write Method.
Background technology
In the latest 20 years, with the development of many basic subjects such as physics, chemistry, material, machinery, electronics, people for The understanding in the micro-nano-scale world and exploration obtain unprecedented breakthrough.Manufacture resolution ratio can reach several nanometers Even smaller, however the micro-nano function element of preparation structure complexity, current method mainly have two-dimentional photoetching technique.Have benefited from material The innovation for expecting manufacturing process, observation technology and analysis means, using three-dimensional laser direct writing technology as the advanced minute manufacturing skill of representative The positive rapid rising of art becomes the new hot spot of advanced manufacturing field instantly.Future is with the further development of technology of preparing, 4D micro-nanos Printing technique can print flexible active deformation structure using intellectual material under miniature scale, it will lead next-generation manufacturing technology Towards smaller (Smaller), more soft (Softer), safer (Safer), more intelligent (Smarter), and it is functionally more powerful (Stronger) etc. directions are developed, and have broad application prospects in Meta Materials design, green manufacturing and extraordinary medical field. Technology can not also realize active, quick, reciprocable, predictable malformation switching under minute yardstick at this stage, there are no Method has the Deformation Demands such as large deformation, high controllability and design flexibility.
There is presently no the relevant report for the 4D micro-nanos printing based on three-dimensional laser direct write, existing realization is flexible controllable The defect of the function element printing technique of deformation is as follows:
It, can only be three-dimensional outside plane or face after triggering deformation 1. the print structure reported at present is mostly two-dimension plane structure Movement.A part realizes that three-dimensional structure has to more materials and the cooperation of Alternative step is realized, cannot achieve single material and exists 3 D stereo micro nano structure is printed during unitary system is standby, while deformation process is from three-dimensional to three-dimensional variation.
2. current printing model needs backing material mostly, and is realized by way of stacking (Layer-by-layer) Three-dimensional structure can not eliminate the residual stress in heterojunction structure print procedure, and it is even more impossible to realize on arbitrary three dimensions track Direct write molding.
3. malformation energy force difference, not reproducible deformation after triggering, deformation poor controllability, response time are long, and become Shape degree of freedom is single, and it is even more impossible to realize accurate prediction and Programmable Design optimization to material and structure.
4. certain materials such as Shape Memory Polymer, material itself is hard, and deformable state needs external force total with temperature Same-action could be realized.
Invention content
(1) technical problems to be solved
In view of this, the purpose of the present invention is to provide a kind of 4D micro-nano Method of printings based on three-dimensional laser direct write, with Solve above-described at least partly technical problem.
(2) technical solution
According to an aspect of the present invention, a kind of flexible 4D micro-nanos Method of printing based on three-dimensional laser direct write is provided, including Step:
It is ready for the substrate of 4D micro-nanos printing;
4D can print material precursor to drop in substrate;
Presoma described in laser irradiation is controlled, so that presoma is realized the differentiation deformation of three-dimensional structure, forms setting shape Sample;
Sample is developed.
In further embodiment, the substrate for being ready for the printing of 4D micro-nanos includes:Clean substrate of glass;Baking removal base Bottom water vapour;Plasma surface modification is carried out to substrate.
In further embodiment, controlling presoma described in laser irradiation includes:Build threedimensional model;According to threedimensional model Control laser is scanned presoma, and laser power and sweep speed is adjusted in when scanning.
In further embodiment, the scan mode is successively laser scanning, three-dimensional laser direct write and three-dimensional laser Direct write is mixed with successively laser scanning.
In further embodiment, structure threedimensional model includes:Hinge deformation unit is built, and presses design requirement by hinge Deformation unit fits together, and forms the reconfigurable structures of the large scale of controllable deforming.
In further embodiment, the hinge deformation unit includes:Active deformation is double-deck, including internal layer and outer layer, and two The dilation rate of layer is different;Support construction supports the active deformation double-deck;Rotary joint is set to support construction and change Shape bilayer junction can be rotated along fixed bias circuit, and restrained deformation moves together with the support construction.
In further embodiment, the hinge deformation unit is hollow triangular pyramid, multi-panel pyramid or semiglobe etc. The functional structure of different designs;The size of the preferred hinge deformation unit is between tens microns to hundreds of microns.
In further embodiment, when scanning to laser power and sweep speed be adjusted including:Utilize 30mW- 50mW power prints support construction and active deformation bilayer and Passive deformation layer;It is printed and is led by 5mW-30mW lower-wattages Dynamic deformation layer.
In further embodiment, include by sample development:Sample is put into isopropanol solvent and is developed;With not developing Isopropanol solvent cleaning sample;Isopropanol is replaced using water.
According to another aspect of the present invention, a kind of flexibility 4D micro-nano printed matters are provided, the printing of any description above is passed through Method is prepared.
(3) advantageous effect
(1) Method of printing of the invention realizes three-dimension flexible controllable deforming micro-structure using three-dimensional laser direct writing technology It prepares.The printing precision of sub-micron allows for the deformation of 3D to the 3D of the complex three-dimensional structure of micron level.Homogenous material exists Single preparation process makes preparation process simplify, and deformation process is controllably stablized, and can be realized to 3 D deformation mistake by finite element modelling The prediction of journey.
(2) present invention proposes the method using three dimensions direct write deformation unit, deforms the double-deck normal direction cutting printing Principle can effectively avoid the homogenization problem of residual stress in heterojunction structure print procedure.Meanwhile stacking and direct-write methods are matched It closes, print quality and print speed can be taken into account, realize the technical optimization of 4D micro-nanos printing.
(3) present invention by hinge deformation unit design solve tradition deformation double-layer structure to material swelling character according to Rely, realize the deflection bigger of 4D printing micro-structures, controllability is more preferable, and response speed faster waits technological break-throughs.
(4) present invention forms large scale deformation function system using the assembling of minimum hinge deformation unit, may be implemented to appoint Meaning deformation degree of freedom designs, each unit in system is one degree of freedom, and being assembled in the way of desired design can be real The design and preparation of the distressed structure of existing complexity 3D to 3D.Minimum unit of the hinge deformation unit as printing optimization, and it is multiple The design cell of miscellaneous deformation, and the printing of 4D micro-nanos keeps large scale anamorphotic system design method more square with modularization assembling design Just, effectively, and the deformation list of any desired can spatially, in deformation size, on bending degree and on mechanical characteristic be designed Member.
(5) present invention is directed to super elastic structure, is a kind of particular for the flexibility 4D printed materials such as hydrogel, elastomer Simply, efficiently, the programmable Method of printing of deformation.
Description of the drawings
Fig. 1 is the flexible 4D micro-nanos Method of printing flow chart based on three-dimensional laser direct write of the embodiment of the present invention;
Fig. 2 is the flexible 4D micro-nanos Method of printing process schematic based on three-dimensional laser direct write of the embodiment of the present invention;
Fig. 3 A, Fig. 3 B and Fig. 3 C are hinge deformation unit front view, vertical view and the stereogram of the embodiment of the present invention respectively;
Fig. 4 A and Fig. 4 B are two kinds of design diagrams of the hinge deformation unit in Fig. 3 C.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference Attached drawing, the present invention is described in further detail.
Basic conception according to the present invention can be based on four-dimensional laser writing technology, and providing one kind can touch in extraneous stimulus field Give the micro-nano reconfigurable structures preparation method of flexibility of active deformation.
Fig. 1 is the flexible 4D micro-nanos Method of printing flow chart based on three-dimensional laser direct write of the embodiment of the present invention.In conjunction with Fig. 1 Shown in Fig. 2, the flexible 4D micro-nanos Method of printing according to the ... of the embodiment of the present invention based on three-dimensional laser direct write comprising following step Suddenly:
S110:It is ready for the substrate of 4D micro-nanos printing;
S120:4D can print material precursor to drop in substrate;
S130:Presoma described in laser irradiation is controlled, so that presoma is realized the differentiation deformation of three-dimensional structure, forms setting The sample of shape;
S140:Sample is developed.
Wherein, in step S110, substrate can be various substrates in the prior art, 0.17 mm of thickness of main satisfaction Transparent glass, in special process, it is possible to use thickness bigger and jealous glass substrate;Preferred substrate can be glass Glass substrate;Further it is preferably borate glass (such as Pyrex).Optional substrate thickness is 0.17 micron.
In some embodiments, the substrate pass through pre-treatment step, including but not limited to polishing, liquid rinse, etc. from Daughter bombardment and drying steps.Preferably pre-treatment step includes:Clean substrate of glass;Baking removal substrate steam;And it is right Substrate carries out plasma surface modification.Wherein, it can be used acetone (AECTONE), isopropanol (IPA) and ultra-pure water (such as hinder It is 18.2 megaohms anti-) cleaning substrate of glass;Moisture removal can be removed by toasting substrate in an oven;It can be modified by plasma surface Enhance substrate adhesion.
Wherein, in step S120,4D, which can print material precursor, can be liquid crystal elastic body, Shape Memory Polymer and coagulate Glue material;Preferred presoma can be the gel rubber material of good biocompatibility.Wherein, in step S130, control laser shines Penetrating the presoma may include:Build threedimensional model;Presoma is scanned according to threedimensional model control laser, when scanning Laser power and sweep speed are adjusted.
Building threedimensional model may include:The three-dimensional rigid body structure of micro-nano 4D intelligent devices is defined, and utilizes computer aided manufacturing Design software is helped to carry out three-dimensional modeling to intelligent device.
On the basis of threedimensional model, laser intensity, sweep speed and spatial position of definition deformation heterojunction structure etc. are different Threedimensional model is carried out cutting layering or piecemeal by matter deformation information, and by serial number from bottom to top.
In some embodiments, in above-mentioned print procedure, laser scanning pattern includes three kinds of stacking, direct write and mixing.
The first prints identical heterogeneous deformation information unit according to number order, and each unit is successively superimposed according to level (Layerby Layer) mode is printed, is printed according to adjacent sequential between unit;
Second method prints for laser direct-writing, is cut to threedimensional model in the way of from bottom to up, cutting The direction of heterogeneous deformation is oriented parallel to ensure the uneven to distressed structure of residual stress in print procedure to greatest extent It influences.
The third method is used cooperatively with two methods in print procedure.Matching principle is that printing is three-dimensional non-deformed Usually using laminating method when structure;Usually using laser direct writing method when printing heterogeneous deformation unit.
In some embodiments, laser power and sweep speed are adjusted when scanning.Laser power and scanning speed What degree was adjusted is exposure dose, and the difference of exposure dose directly determines result deflection.In the joint of different designs, expose Light dosage needs are tested or in advance by simulation and prediction malformation amount.And in the joint of same design, utilize different exposures Light dosage carries out deflection design to the joint of different parts.
In some embodiments, it in order to increase the controllability of malformation amount and deformation direction, is designed using linkage Microstructure unit, referred to as hinge deformation unit.Hinge deformation unit is the minimum print unit of 4D micro-nanos printing controllable deforming.Hinge Deformation of chain unit can there are many designs, and fit together all hinges by design requirement, form the large scale of controllable deforming The reconfigurable structures of (millimeter or centimetre rank).It is to break through conventional double structure to rely on first by designing hinge deformation unit In the limitation of deformable material, being effectively compressed for geometric distortion, the especially reality to negative poisson's ratio metamaterial structure are realized by hinge It is existing very helpful, the deflection of print structure can be greatly increased.Secondly, the bending direction that double-layer structure usually deforms is by entirety The deformation of the limitation of structure, standard single module such as ball, square block can not usually determine that hinge arrangement limits single by joint One axis is complete, can effectively promote the deformation direction controllability of distressed structure.Finally, hinge is hollow pore structure, therefore is increased Rate of specific surface area makes the triggering of contact environmental stimuli respond and becomes faster.
The detailed design of minimum hinge deformation unit illustrates that hinge schematic diagram is shown in shown in Fig. 3 A-3C.The hinge of 4D micro-nanos printing Deformation of chain unit generally includes deformation double-deck (including internal layer and outer layer), support construction, rotary joint (actively and passive) etc..Become Shape bilayer provides deformability, drives hinge arrangement deformation;Support construction provides necessary deformation space, is realized together with joint The space of amoeboid movement limits;Joint is the mechanical structure that can be rotated along fixed bias circuit, usually there are a variety of prototypes.This Invent two class joints:Active joint and passive joint.Active joint is to carry certain support force or recovery capacity, in rotary course The certain support of middle holding and when setting back can holding structure integrality;And passive joint is not include actively to support and return The joint designs of reactivation power are common in various design, such as lasso structure.The hollow triangular pyramid of minimum hinge deformation unit The visible Fig. 3 C of design diagram.In hinge design, other than hollow triangular pyramid, multi-panel pyramid, pyramid, hemisphere etc. can It is designed to minimum hinge deformation unit.
In some embodiments, the combined method of minimum hinge deformation unit can there are many, minimum hinge deformation unit The combining form of deformation unit can be designed.By vertex and vertex, vertex and side, while with while be connected, different numbers are combined in connection The combination of the anamorphotic system of duration set, formation is referred to shown in Fig. 4 A and Fig. 4 B.Combining form and hinge number of combinations need It is determined together according to different distortion requirements set different function hinge.
When scanning to laser power and sweep speed be adjusted including:Support knot is printed using 30mW-50mW power Structure, and actively double-deck and joint the hard layer (Passive deformation layer);On the other hand, it is printed and is led by 5mW-30mW lower-wattages Dynamic deformation layer;Laser power is substantially in inverse relation with sweep speed, i.e., the high-power and slow achievable high crosslink density of speed of sweeping is used In the printing of hard layer;Small-power and the printing that the achievable lower crosslink density of speed is used for soft layer is swept soon.
Below by way of with specific example, the present invention is further described, it will be appreciated that concrete technology below is only used for It illustrates the present invention, should not be construed as limiting the present invention.Specific example step includes:(1) borosilicate glass substrate is cleaned. Before three-dimensional laser direct write, using AECTONE, IPA (isopropanol) and ultra-pure water (18.2 megaohms of impedance) are successively to Pyrex Substrate (22mm × 22mm, 0.13-0.17mm are thick, match silent winged generation that science and technology) is cleaned.
(2) baking removal substrate steam.After drying up substrate of glass using nitrogen gun, it is placed on 120 DEG C of ovens 20 minutes.Then It is cooled to room temperature.
(3) plasma surface modification enhancing substrate adhesion.Substrate of glass after drying is put into oxygen gas plasma 15 minutes in generator.
(4) 4D be can print into material precursor drop on the glass sheet, ready-to-print.
(5) print procedure.Laser power (0~50mW) and sweep speed (0~100mm/s) are adjusted by program to control Exposure intensity on all movement locus of laser makes 4D printed materials in three-dimensional arbitrary spatial point there is uneven density to hand over Connection, and then realize the differentiation deformation of three-dimensional structure.
(6) sample develops.Sample is put into IPA solvents at least 20min that develops, is then cleaned at least with fresh IPA Twice, ultra-pure water is recycled to cement out IPA.
Another aspect according to the ... of the embodiment of the present invention also provides a kind of flexibility 4D micro-nano printed matters, by implementing above The Method of printing that example is introduced is prepared.The 4D micro-nanos printed matter can be specifically by three-dimensional spherical, metamaterial microstructure list Mechanical Shape variable umbrella shape structure of member, intravascular stent structure, switch etc..
More than, Method of printing through the embodiment of the present invention, using homogenous material under sub-micron printing precision an only step The labyrinth deformation of 3D to 3D is realized in molding, flexible micro-nano function element have it is high deform degree of freedom, multifunctional all, Precisely it is controllable the advantages that, and using finite element modelling can precisely prediction of distortion process to realize optimization design.Except flexible micro-nano work( Outside energy device, which can also prepare the large scale effector with multistage microstructural using hinge arrangement design method Part, while 4D printed materials have good biocompatibility, also can be used for medical microdevice, targeted therapy, group weaver Numerous biomedical applications fields such as journey.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect Describe in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the protection of the present invention Within the scope of.

Claims (10)

1. a kind of flexible 4D micro-nanos Method of printing based on three-dimensional laser direct write, it is characterised in that including step:
It is ready for the substrate of 4D micro-nanos printing;
4D can print material precursor to drop in substrate;
Presoma described in laser irradiation is controlled, so that presoma is realized the differentiation deformation of three-dimensional structure, forms the sample of setting shape Product;
Sample is developed.
2. Method of printing according to claim 1, which is characterized in that being ready for the substrate that 4D micro-nanos print includes:
Clean substrate of glass;
Baking removal substrate steam;
Plasma surface modification is carried out to substrate.
3. Method of printing according to claim 1, which is characterized in that presoma includes described in control laser irradiation:
Build threedimensional model;
Presoma is scanned according to threedimensional model control laser, when scanning adjusts laser power and sweep speed Section.
4. Method of printing according to claim 3, which is characterized in that the scan mode is successively laser scanning, three-dimensional Laser direct-writing and three-dimensional laser direct write are mixed with successively laser scanning.
5. Method of printing according to claim 3, which is characterized in that building threedimensional model includes:It is single to build hinge deformation Member, and fit together hinge deformation unit by design requirement, form the reconfigurable structures of the large scale of controllable deforming.
6. Method of printing according to claim 5, which is characterized in that the hinge deformation unit includes:
Active deformation is double-deck, including internal layer and outer layer, and two layers of dilation rate is different;
Support construction supports the active deformation double-deck;
Rotary joint is set to support construction and the double-deck junction of deformation, can be rotated along fixed bias circuit, with the support construction Restrained deformation moves together.
7. Method of printing according to claim 1, which is characterized in that the hinge deformation unit is hollow triangular pyramid, more The functional structure of the different designs such as face pyramid or semiglobe;The size of the preferred hinge deformation unit is micro- between tens Rice is to hundreds of microns.
8. Method of printing according to claim 6, which is characterized in that carried out to laser power and sweep speed when scanning Adjusting includes:
Support construction and active deformation bilayer and Passive deformation layer are printed using 30mW-50mW power;By 5mW-30mW compared with Low-power prints active deformation layer.
9. Method of printing according to claim 1, which is characterized in that include by sample development:
Sample is put into isopropanol solvent and is developed;
With the isopropanol solvent cleaning sample that do not developed;
Isopropanol is replaced using water.
10. a kind of flexibility 4D micro-nano printed matters, it is characterised in that by prepared by claim 1-9 any Method of printings At.
CN201810151527.2A 2018-02-14 2018-02-14 4D micro-nano Method of printing based on three-dimensional laser direct write Active CN108481734B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810151527.2A CN108481734B (en) 2018-02-14 2018-02-14 4D micro-nano Method of printing based on three-dimensional laser direct write

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810151527.2A CN108481734B (en) 2018-02-14 2018-02-14 4D micro-nano Method of printing based on three-dimensional laser direct write

Publications (2)

Publication Number Publication Date
CN108481734A true CN108481734A (en) 2018-09-04
CN108481734B CN108481734B (en) 2019-12-03

Family

ID=63340735

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810151527.2A Active CN108481734B (en) 2018-02-14 2018-02-14 4D micro-nano Method of printing based on three-dimensional laser direct write

Country Status (1)

Country Link
CN (1) CN108481734B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111415761A (en) * 2019-01-07 2020-07-14 新奥科技发展有限公司 Plasma-oriented part and fusion device
CN111421228A (en) * 2020-04-08 2020-07-17 华中科技大学 Sample precision clamp for cross-scale two-photon polymerization processing and leveling method
CN112521798A (en) * 2020-11-30 2021-03-19 常州大学 Preparation method of 4D printing liquid crystal elastomer and application of elastomer in actuator
CN112936853A (en) * 2021-01-29 2021-06-11 哈尔滨工业大学 4D printing structure for improving load deformation performance and design method thereof
CN113977943A (en) * 2021-11-19 2022-01-28 吉林大学 4D printing method for controlling deformation of liquid crystal elastomer material
CN115141014A (en) * 2021-03-29 2022-10-04 清华大学深圳国际研究生院 Preparation method of 4D printing ceramic and ceramic part

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150273764A1 (en) * 2014-03-27 2015-10-01 Seiko Epson Corporation Three-dimensional formation apparatus, three-dimensional formation method, and computer program
CN105602213A (en) * 2015-12-29 2016-05-25 哈尔滨工业大学 Preparation of shape memory micro-nano composite material and application of shape memory micro-nano composite material in 4D (four-dimensional) printing
CN107320779A (en) * 2017-06-22 2017-11-07 清华大学深圳研究生院 The preparation method and device of a kind of external three-dimensional tissue's model

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150273764A1 (en) * 2014-03-27 2015-10-01 Seiko Epson Corporation Three-dimensional formation apparatus, three-dimensional formation method, and computer program
CN105602213A (en) * 2015-12-29 2016-05-25 哈尔滨工业大学 Preparation of shape memory micro-nano composite material and application of shape memory micro-nano composite material in 4D (four-dimensional) printing
CN107320779A (en) * 2017-06-22 2017-11-07 清华大学深圳研究生院 The preparation method and device of a kind of external three-dimensional tissue's model

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111415761A (en) * 2019-01-07 2020-07-14 新奥科技发展有限公司 Plasma-oriented part and fusion device
CN111415761B (en) * 2019-01-07 2022-03-11 新奥科技发展有限公司 Plasma-oriented part and fusion device
CN111421228A (en) * 2020-04-08 2020-07-17 华中科技大学 Sample precision clamp for cross-scale two-photon polymerization processing and leveling method
CN112521798A (en) * 2020-11-30 2021-03-19 常州大学 Preparation method of 4D printing liquid crystal elastomer and application of elastomer in actuator
CN112936853A (en) * 2021-01-29 2021-06-11 哈尔滨工业大学 4D printing structure for improving load deformation performance and design method thereof
CN112936853B (en) * 2021-01-29 2022-07-15 哈尔滨工业大学 4D printing structure for improving load deformation performance and design method thereof
CN115141014A (en) * 2021-03-29 2022-10-04 清华大学深圳国际研究生院 Preparation method of 4D printing ceramic and ceramic part
CN113977943A (en) * 2021-11-19 2022-01-28 吉林大学 4D printing method for controlling deformation of liquid crystal elastomer material

Also Published As

Publication number Publication date
CN108481734B (en) 2019-12-03

Similar Documents

Publication Publication Date Title
CN108481734B (en) 4D micro-nano Method of printing based on three-dimensional laser direct write
Li et al. A skin-inspired artificial mechanoreceptor for tactile enhancement and integration
CN108538755B (en) A kind of conformal manufacturing equipment and method of complex-curved electronic system
Leung et al. Challenges and status on design and computation for emerging additive manufacturing technologies
Hiller et al. Design and analysis of digital materials for physical 3D voxel printing
CN103258781B (en) Method and apparatus for forming electric interconnector on Ophthalmoligic instrument
CN104999670B (en) Multi-beam laser interference cross-scale 3D (three dimension) printing system and method
EP0676275B1 (en) Stereolithographic exposure head
Khodambashi et al. Heterogeneous hydrogel structures with spatiotemporal reconfigurability using addressable and tunable voxels
Hu et al. Origami spring–inspired metamaterials and robots: An attempt at fully programmable robotics
Ni et al. Soft shape-programmable surfaces by fast electromagnetic actuation of liquid metal networks
JP7478824B2 (en) Flexible capacitor array and manufacturing method thereof, capacitor array detection system and robot
Wu et al. Bioprinting: an assessment based on manufacturing readiness levels
Li et al. Miniaturization of mechanical actuators in skin-integrated electronics for haptic interfaces
Shen et al. Programming the time into 3D printing: current advances and future directions in 4D printing
CN104866098A (en) Ultrasonic tactile feedback system and method for manufacturing same
Kim et al. Computer-controlled dynamic mode multidirectional UV lithography for 3D microfabrication
Zhakypov et al. FingerPrint: A 3-D printed soft monolithic 4-degree-of-freedom fingertip haptic device with embedded actuation
Malone et al. Multi-material freeform fabrication of active systems
CN105807792B (en) Scan the on piece controller and control method of Ion Conductance Microscope
JP7393304B2 (en) Simulation method, simulation device, program and film formation method
US9195886B2 (en) Rapid prototyping and machine vision for reconfigurable interfaces
Niu et al. Reconfigurable shape-morphing flexible surfaces realized by individually addressable photoactuator arrays
Hiller Digital materials: voxel design, rapid assembly, structural properties, and design methods
CN104802350A (en) Preparation method of intermediate film, intermediate film and nano-generator prepared from intermediate film

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant